Stamp component for transferring microstructure

Description

[0001] FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;

[0002] FIG. 2 is a front elevational view thereof, the rear elevational view being identical thereto;

[0003] FIG. 3 is a left side elevational view thereof, the right side elevational view being identical thereto;

[0004] FIG. 4 is a top plan view thereof;

[0005] FIG. 5 is a bottom plan view thereof;

[0006] FIG. 6 is an enlarged portion view labeled, “6,” in FIG. 1;

[0007] FIG. 7 is an enlarged portion view labeled, “7,” in FIG. 6;

[0008] FIG. 8 is an enlarged portion view labeled, “8,” in FIG. 2; and,

[0009] FIG. 9 is an enlarged portion view labeled, “9,” in FIG. 8.

[0010] The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 6-9 in FIGS. 1, 2, and 6-9 and form no part of the claimed design.

Claims

The ornamental design for a stamp component for transferring microstructure, as shown and described.

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