Power module package

USD1098055SActive Publication Date: 2025-10-14SEMICON COMPONENTS IND LLC
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Patent Information

Application Number
US29/861844
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2022-12-02
Publication Date
2025-10-14
Estimated Expiration
2040-10-14

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Description

[0001] FIG. 1 is a perspective view of a first embodiment of a power module package showing our new design;

[0002] FIG. 2 is a top plan view thereof;

[0003] FIG. 3 is a bottom plan view thereof;

[0004] FIG. 4 is a front view thereof;

[0005] FIG. 5 is a rear view thereof;

[0006] FIG. 6 is a side view thereof;

[0007] FIG. 7 is an opposite side view thereof;

[0008] FIG. 8 is a perspective view of a second embodiment of a power module package showing our new design;

[0009] FIG. 9 is a top plan view thereof;

[0010] FIG. 10 is a bottom plan view thereof;

[0011] FIG. 11 is a front view thereof;

[0012] FIG. 12 is a rear view thereof;

[0013] FIG. 13 is a side view thereof; and,

[0014] FIG. 14 is an opposite side view thereof.

[0015] Evenly spaced broken lines depict unclaimed portions of the environmental structure, and form no part of the claimed design. Dot-dash lines depict boundaries of the claimed design, and form no part of the claimed design.

[0016] The shading in FIGS. 1-14 indicates claimed surface areas on the power module package.

Claims

The ornamental design for a power module package, as shown and described.

Citation Information

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