Power semiconductor module
USD1099055SActive Publication Date: 2025-10-21XPT EDS (HEFEI) CO LTD
Patent Information
- Application Number
- US29/901352
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2023-08-31
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2040-10-21
Smart Images
Figure USD1099055-D00000_ABST
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Description
[0001] FIG. 1 is a perspective view of a power semiconductor module;
[0002] FIG. 2 is a front elevation view of the power semiconductor module;
[0003] FIG. 3 is a rear elevation view of the power semiconductor module;
[0004] FIG. 4 is a left side elevation view of the power semiconductor module;
[0005] FIG. 5 is a right side elevation view of the power semiconductor module;
[0006] FIG. 6 is a top plan view of the power semiconductor module; and,
[0007] FIG. 7 is a bottom plan view of the power semiconductor module.
Claims
The ornamental design for a power semiconductor module as shown and described.
Citation Information
Patent Citations
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US11710687B2
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Semiconductor power module for vehicles
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