Solder pad
USD1100004SActive Publication Date: 2025-10-28SHENZHEN HENNSERY CRAFT LTD
Patent Information
- Application Number
- US29/934802
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2040-10-28
Smart Images

Figure USD1100004-D00000_ABST
Need to check novelty before this filing date? Find Prior Art
Description
[0001] FIG. 1 is a first perspective view of a solder pad showing my new design;
[0002] FIG. 2 is a second perspective view thereof;
[0003] FIG. 3 is a front view of FIG. 1;
[0004] FIG. 4 is a rear view of FIG. 1;
[0005] FIG. 5 is a left side view of FIG. 1;
[0006] FIG. 6 is a right side view of FIG. 1;
[0007] FIG. 7 is a top plan view of FIG. 1;
[0008] FIG. 8 is a bottom plan view of FIG. 1; and,
[0009] FIG. 9 is an explosion view thereof.
[0010] The broken lines in the drawings depict portions of the solder pad that form no part of the claimed design.
Claims
The ornamental design for a solder pad, as shown and described.
Citation Information
Patent Citations
Surface mount technology (SMT) pad design having contact strips with converging narrowing contact surfaces
US20180368259A1
Interconnected solder pads and the method of soldering
US4557411A
Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices
US5839641A
Bar mat
USD1069457S
Draining mat
USD1071464S