Solder pad

USD1100004SActive Publication Date: 2025-10-28SHENZHEN HENNSERY CRAFT LTD
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Patent Information

Application Number
US29/934802
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2024-03-27
Publication Date
2025-10-28
Estimated Expiration
2040-10-28

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Description

[0001] FIG. 1 is a first perspective view of a solder pad showing my new design;

[0002] FIG. 2 is a second perspective view thereof;

[0003] FIG. 3 is a front view of FIG. 1;

[0004] FIG. 4 is a rear view of FIG. 1;

[0005] FIG. 5 is a left side view of FIG. 1;

[0006] FIG. 6 is a right side view of FIG. 1;

[0007] FIG. 7 is a top plan view of FIG. 1;

[0008] FIG. 8 is a bottom plan view of FIG. 1; and,

[0009] FIG. 9 is an explosion view thereof.

[0010] The broken lines in the drawings depict portions of the solder pad that form no part of the claimed design.

Claims

The ornamental design for a solder pad, as shown and described.

Citation Information

Patent Citations

  • Surface mount technology (SMT) pad design having contact strips with converging narrowing contact surfaces

    US20180368259A1

  • Interconnected solder pads and the method of soldering

    US4557411A

  • Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices

    US5839641A

  • Bar mat

    USD1069457S

  • Draining mat

    USD1071464S