Multilayer integrated circuit carrier board

Description

[0001] FIG. 1 is a front, right perspective view of a multilayer integrated circuit carrier board, showing our new design;

[0002] FIG. 2 is a rear, left perspective view thereof;

[0003] FIG. 3 is a front view thereof;

[0004] FIG. 4 is a rear view thereof;

[0005] FIG. 5 is a left view thereof;

[0006] FIG. 6 is a right view thereof;

[0007] FIG. 7 is a top view thereof;

[0008] FIG. 8 is a bottom view thereof;

[0009] FIG. 9 is an exploded view thereof; and,

[0010] FIG. 10 is a perspective view thereof, shown in a used condition with adjacent multilayer IC carrier boards in broken lines.

[0011] The broken lines shown on the drawings depict portions of a multilayer integrated circuit carrier board that form no part of the claimed design. The broken lines of the adjacent multilayer IC carrier boards in FIG. 10 form no part of the claimed design.

Claims

The ornamental design for a multilayer integrated circuit carrier board as shown and described.

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