Sensing module
USD1111879SActive Publication Date: 2026-02-10TAIWAN ASIA SEMICONDUCTOR CORPORATION
Patent Information
- Application Number
- US29/941614
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2024-01-16
- Filing Date
- 2024-05-10
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2041-02-10
Smart Images
Figure USD1111879-D00000_ABST
Need to check novelty before this filing date? Find Prior Art
Description
[0001] FIG. 1 is a perspective view of a sensing module showing the claimed design;
[0002] FIG. 2 is a front elevational view thereof;
[0003] FIG. 3 is a rear elevational view thereof;
[0004] FIG. 4 is a left side elevational view thereof;
[0005] FIG. 5 is a right side elevational view thereof;
[0006] FIG. 6 is a top plan view thereof; and,
[0007] FIG. 7 is a bottom plan view thereof.
[0008] The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.
Claims
The ornamental design for a sensing module as shown and described.
Citation Information
Patent Citations
Wearable sensor
USD1068516S
Module for oxygen sensor
USD1084892S
Combination gas leak sensor and communication device
USD867911S
Disposable sensor attachment design
USD903125S