Combined polishing and grinding device

USD1112383SActive Publication Date: 2026-02-10HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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Patent Information

Application Number
US35/522630
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2024-07-30
Filing Date
2024-08-29
Publication Date
2026-02-10
Estimated Expiration
2041-02-10

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Description

[0001] The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

[0002] 2. Combined polishing and grinding device

[0003] 2.1: Front

[0004] 2.2: Back

[0005] 2.3: Left

[0006] 2.4: Right

[0007] 2.5: Top

[0008] 2.6: Perspective

[0009] 2.7: Perspective

[0010] 2.8: Perspective

[0011] This design is used for polishing and grinding of wafer substrate.

[0012] The lightened areas with a broken-line boundary depict portions of the combined polishing and grinding device that form no part of the claimed design.

Claims

The ornamental design for a combined polishing and grinding device as shown and described.

Citation Information

Patent Citations

  • Grinding and polishing machine for grinding and / or polishing workpieces to an optical quality

    US20070293128A1

  • Machine tool having workpiece measurement function

    US20140080689A1

  • Grinding type vertical grain polishing machine

    US20140174302A1

  • Machine tool

    US20140319746A1

  • Machine tool

    US20180126567A1