Mainframe with integrated lid
Patent Information
- Application Number
- US29/969923
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2041-02-10
Smart Images

Figure USD1112395-D00000_ABST
Description
[0001] FIG. 1 is a top, front perspective view of a mainframe with integrated lid showing our new design;
[0002] FIG. 2 is a side view thereof;
[0003] FIG. 3 is an opposite side view thereof;.
[0004] FIG. 4 is a front view thereof;
[0005] FIG. 5 is a rear view thereof;
[0006] FIG. 6 is a top view thereof;
[0007] FIG. 7 is a bottom view thereof; and,
[0008] FIG. 8 is another top, front perspective view thereof, shown in a used condition with unclaimed components attached.
[0009] The broken lines shown in the figures are directed to unclaimed portions of the mainframe in FIGS. 1-8 and unclaimed components attached to the mainframe in FIG. 8 that form no part of the claimed design.
Claims
The ornamental design for a mainframe with integrated lid, as shown and described.
Citation Information
Patent Citations
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US10512552B2
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US10994480B2
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US11749542B2
Substrate processing module and method of moving a workpiece
US12080571B2