Power module package
USD1113776SActive Publication Date: 2026-02-17SEMICON COMPONENTS IND LLC
Patent Information
- Application Number
- US29/997703
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2041-02-17
Smart Images
Figure USD1113776-D00000_ABST
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Description
[0001] FIG. 1 is a perspective view of a power module package showing our new design;
[0002] FIG. 2 is a top plan view thereof;
[0003] FIG. 3 is a bottom plan view thereof;
[0004] FIG. 4 is a front view thereof;
[0005] FIG. 5 is a rear view thereof;
[0006] FIG. 6 is a first side view thereof; and,
[0007] FIG. 7 is a second side view thereof.
[0008] Evenly spaced broken lines depict unclaimed portions of the environmental structure and form no part of the claimed design. Dot-dash lines depict boundaries of the claimed design and form no part of the claimed design.
Claims
The ornamental design for a power module package, as shown and described.
Citation Information
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