Semiconductor module
USD1114753SActive Publication Date: 2026-02-24FUJI ELECTRIC CO LTD
Patent Information
- Application Number
- US29/971220
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2024-06-07
- Filing Date
- 2024-11-01
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2041-02-24
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Figure USD1114753-D00000_ABST
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Description
[0001] FIG. 1 is a front perspective view of the semiconductor module, showing the new design;
[0002] FIG. 2 is a rear perspective view of the semiconductor module;
[0003] FIG. 3 is a front view of the semiconductor module;
[0004] FIG. 4 is a rear view of the semiconductor module;
[0005] FIG. 5 is a left side view of the semiconductor module;
[0006] FIG. 6 is a right view of the semiconductor module;
[0007] FIG. 7 is a top view of the semiconductor module; and,
[0008] FIG. 8 is a bottom view of the semiconductor module.
Claims
The ornamental design for a semiconductor module as shown and described.
Citation Information
Patent Citations
Power semiconductor device and manufacturing method therefor
EP2216814A2
Power semiconductor device and manufacturing method therefor
EP2216814A3
Power semiconductor device and manufacturing method therefor
EP2816599A2
Power semiconductor device and manufacturing method therefor
EP2816599A3
Power semiconductor device
EP2816599B1