Semiconductor module

USD1114754SActive Publication Date: 2026-02-24FUJI ELECTRIC CO LTD
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Patent Information

Application Number
US29/971235
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2024-06-07
Filing Date
2024-11-01
Publication Date
2026-02-24
Estimated Expiration
2041-02-24

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Description

[0001] FIG. 1 is a front perspective view of the semiconductor module, showing the new design;

[0002] FIG. 2 is a rear perspective view of the semiconductor module;

[0003] FIG. 3 is a front view of the semiconductor module;

[0004] FIG. 4 is a rear view of the semiconductor module;

[0005] FIG. 5 is a left side view of the semiconductor module;

[0006] FIG. 6 is a right view of the semiconductor module;

[0007] FIG. 7 is a top view of the semiconductor module; and,

[0008] FIG. 8 is a bottom view of the semiconductor module.

Claims

The ornamental design for a semiconductor module as shown and described.

Citation Information

Patent Citations

  • Power semiconductor device and manufacturing method therefor

    EP2216814A2

  • Power semiconductor device and manufacturing method therefor

    EP2216814A3

  • Power semiconductor device and manufacturing method therefor

    EP2816599A2

  • Power semiconductor device and manufacturing method therefor

    EP2816599A3

  • Power semiconductor device

    EP2816599B1