Multi EMV chip card

USD1114807SActive Publication Date: 2026-02-24LION IP HOLDINGS LLC
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Patent Information

Application Number
US29/843198
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2022-06-18
Publication Date
2026-02-24
Estimated Expiration
2041-02-24

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Description

[0001] FIG. 1 is a front perspective view of an embodiment of a multi emv chip card shown in accordance with my new design;

[0002] FIG. 2 is a rear perspective view of the multi emv chip card shown in FIG. 1;

[0003] FIG. 3 is a front elevation view of the multi emv chip card shown in FIG. 1;

[0004] FIG. 4 is a rear elevation view of the multi emv chip card shown in FIG. 1;

[0005] FIG. 5 is a top plan view of the multi emv chip card shown in FIG. 1, the bottom plan view being a mirror image thereof;

[0006] FIG. 6 is a left side elevation view of the multi emv chip card shown in FIG. 1, the right side elevation view being a mirror image thereof; and

[0007] FIG. 7 is a front perspective view of another embodiment of a multi emv chip card shown in accordance with my new design;

[0008] FIG. 8 is a rear perspective view of the multi emv chip card shown in FIG. 7;

[0009] FIG. 9 is a front elevation view of the multi emv chip card shown in FIG. 7;

[0010] FIG. 10 is a rear elevation view of the multi emv chip card shown in FIG. 7;

[0011] FIG. 11 is a top plan view of the multi emv chip card shown in FIG. 7, the bottom plan view being a mirror image thereof; and,

[0012] FIG. 12 is a left side elevation view of the multi emv chip card shown in FIG. 7, the right side elevation view being a mirror image thereof.

[0013] The features shown in broken lines are for the purposes of showing environmental structure and form no part of the claimed design.

Claims

The ornamental design for a multi emv chip card, as shown and described.

Citation Information

Patent Citations

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