Sensing module

USD1119797SActive Publication Date: 2026-03-24TAIWAN ASIA SEMICONDUCTOR CORPORATION

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[0001] FIG. 1 is a perspective view of a sensing module showing the claimed design;

[0002] FIG. 2 is front elevational view thereof; a rear elevational view being symmetric to the front elevational view;

[0003] FIG. 3 is a left side elevational view thereof; a right side elevational view being symmetric to the left side elevational view;

[0004] FIG. 4 is a top plan view thereof; and,

[0005] FIG. 5 is a bottom plan view thereof.

[0006] The broken lines are directed to environment and are for illustrative purpose only; the broken lines form no part of the claimed design.

The ornamental design for a sensing module as shown and described.

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