Laser equipment

USD1120995SActive Publication Date: 2026-03-31MAKEBLOCK CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2024-07-18
Publication Date
2026-03-31

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Description

[0001] FIG. 1 is a front, right and top perspective view of a laser equipment according to a first embodiment showing my new design;

[0002] FIG. 2 is a rear, left and bottom perspective view thereof;

[0003] FIG. 3 is a front elevational view thereof;

[0004] FIG. 4 is a rear elevational view thereof;

[0005] FIG. 5 is a left side elevational view thereof;

[0006] FIG. 6 is a right side elevational view thereof;

[0007] FIG. 7 is a top plan view thereof;

[0008] FIG. 8 is a bottom plan view thereof;

[0009] FIG. 9 is an enlarged view taken from detail circle ‘9’ in FIG. 1;

[0010] FIG. 10 is an enlarged view taken from detail circle ‘10’ in FIG. 2;

[0011] FIG. 11 is a front, right and top perspective view of a laser equipment according to a second embodiment;

[0012] FIG. 12 is a rear, left and bottom perspective view of FIG. 11;

[0013] FIG. 13 is a front elevational view of FIG. 11;

[0014] FIG. 14 is a rear elevational view of FIG. 11;

[0015] FIG. 15 is a left side elevational view of FIG. 11;

[0016] FIG. 16 is a right side elevational view of FIG. 11;

[0017] FIG. 17 is a top plan view of FIG. 11;

[0018] FIG. 18 is a bottom plan view of FIG. 11;

[0019] FIG. 19 is an enlarged view taken from detail circle ‘19’ in FIG. 11; and,

[0020] FIG. 20 is an enlarged view taken from detail circle ‘20’ in FIG. 12.

[0021] The dash-dash broken lines in the drawings depict the portions of the laser equipment that form no part of the claimed design.

[0022] The dot-dash broken lines in the drawings depict the boundaries of the enlarged views and form no part of the claimed design.

Claims

The ornamental design for a laser equipment, as shown and described.

Citation Information

Patent Citations

  • Glass Separating and Cutting System for Electronic Mobile Device Repair

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  • Laser processing device, laser processing method, and electronic device manufacturing method

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