Power semiconductor module
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- LIN CHIN FENG
- Filing Date
- 2024-11-11
- Publication Date
- 2026-04-21
Smart Images
Figure USD1122883-D00000_ABST
Description
[0001] FIG. 1 is a front perspective view of a power semiconductor module showing my new design;
[0002] FIG. 2 is a front elevational view thereof;
[0003] FIG. 3 is a rear elevational view thereof;
[0004] FIG. 4 is a left side elevational view thereof;
[0005] FIG. 5 is a right side elevational view thereof;
[0006] FIG. 6 is a top plan view thereof;
[0007] FIG. 7 is a bottom plan view thereof; and,
[0008] FIG. 8 is an exploded perspective view of a power semiconductor module showing my new design.
[0009] The broken lines illustrate portions of the power semiconductor module and form no part of the claimed design.
Claims
The ornamental design for power semiconductor module as shown.
Citation Information
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