Power semiconductor module

USD1125096SActive Publication Date: 2026-05-05ROHM CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
ROHM CO LTD
Filing Date
2024-01-29
Publication Date
2026-05-05

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Description

[0001] FIG. 1 is a front, top and right side perspective view of a power semiconductor module according to our new design;

[0002] FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2;

[0003] FIG. 3 is a top plan view thereof;

[0004] FIG. 4 is a bottom plan view thereof; and,

[0005] FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5.

Claims

The ornamental design for a power semiconductor module, as shown and described.

Citation Information

Patent Citations

  • semiconductor elements

    JP1664282S

  • Semiconductor device

    US10262928B2

  • Semiconductor device with field plate electrode

    US11522058B2

  • Semiconductor device

    US11538936B2

  • Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

    US20080197471A1