Probe pin for integrated circuits testing
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- HICON CO LTD
- Filing Date
- 2024-05-03
- Publication Date
- 2026-05-26
Smart Images

Figure USD1127608-D00000_ABST
Description
[0001] 1.1: Perspective
[0002] 1.2: Front
[0003] 1.3: Back
[0004] 1.4: Left
[0005] 1.5: Right
[0006] 1.6: Top
[0007] 1.7: Bottom
[0008] The material of the design is metal; This design is a probe pin that contacts the electrodes, terminals, pads, etc. of the subject, and is used to inspect electronic components such as semiconductor devices, semiconductor packages, integrated circuits, and printed circuit boards; The shape of our new design has an integrated body and is in the form of a coil spring for compression recovery; Crown-shaped contact terminals are formed on both sides; Powder and elastic material for electrical conductivity and elastic resilience are mixed inside the coil spring-shaped integrated body; The main point of the design is the shape of the “Probe pin for integrated circuits testing”.
Claims
The ornamental design for a probe pin for integrated circuits testing as shown and described.