Probe pin for integrated circuits testing

USD1127608SActive Publication Date: 2026-05-26HICON CO LTD +2
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
HICON CO LTD
Filing Date
2024-05-03
Publication Date
2026-05-26

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Description

[0001] 1.1: Perspective

[0002] 1.2: Front

[0003] 1.3: Back

[0004] 1.4: Left

[0005] 1.5: Right

[0006] 1.6: Top

[0007] 1.7: Bottom

[0008] The material of the design is metal; This design is a probe pin that contacts the electrodes, terminals, pads, etc. of the subject, and is used to inspect electronic components such as semiconductor devices, semiconductor packages, integrated circuits, and printed circuit boards; The shape of our new design has an integrated body and is in the form of a coil spring for compression recovery; Crown-shaped contact terminals are formed on both sides; Powder and elastic material for electrical conductivity and elastic resilience are mixed inside the coil spring-shaped integrated body; The main point of the design is the shape of the “Probe pin for integrated circuits testing”.

Claims

The ornamental design for a probe pin for integrated circuits testing as shown and described.