Housing package for electronic component
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- KYOCERA CORP
- Filing Date
- 2023-07-31
- Publication Date
- 2026-06-16
Smart Images

Figure USD1130113-D00000_ABST
Description
[0001] FIG. 1 is a front-bottom-right perspective view of a housing package for electronic component according to our new design;
[0002] FIG. 2 is a rear-bottom-right perspective view thereof;
[0003] FIG. 3 is a perspective cross-sectional view, taken along line 3-3 in FIG. 1;
[0004] FIG. 4 is a front view thereof;
[0005] FIG. 5 is a rear view thereof;
[0006] FIG. 6 is a top view thereof;
[0007] FIG. 7 is a bottom view thereof;
[0008] FIG. 8 is a right side view thereof;
[0009] FIG. 9 is a left side view thereof; and,
[0010] FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 4.
[0011] The broken lines show portions of the housing package for electronic component that form no part of the claimed design.
Claims
The ornamental design for a housing package for electronic component as shown and described.