Semiconductor module
USD1139186SActive Publication Date: 2026-08-04SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- SHINDENGEN ELECTRIC MANUFACTURING CO LTD
- Filing Date
- 2024-07-17
- Publication Date
- 2026-08-04
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Figure USD1139186-D00000_ABST
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Description
[0001] 1.1 Perspective
[0002] 1.2 Perspective
[0003] 1.3 Front
[0004] 1.4 Back
[0005] 1.5 Left
[0006] 1.6 Right
[0007] 1.7 Top
[0008] 1.8 Bottom
Claims
The ornamental design for a semiconductor module as shown and described.