Thermometer for semiconductor manufacturing apparatus

Description

[0001] FIG. 1 is a front, top and right-side perspective view of a thermometer for semiconductor manufacturing apparatus showing my new design;

[0002] FIG. 2 is a front elevational view thereof;

[0003] FIG. 3 is a left side elevational view thereof;

[0004] FIG. 4 is a right-side elevational view thereof;

[0005] FIG. 5 is a top plan view thereof;

[0006] FIG. 6 is a bottom plan view thereof;

[0007] FIG. 7 is a rear elevational view thereof;

[0008] FIG. 8 is an enlarged view taken from the double-dotted line box labeled FIG. 8 in FIG. 1 thereof;

[0009] FIG. 9 is an enlarged view taken from the double-dotted line box labeled FIG. 9 in FIG. 2 thereof;

[0010] FIG. 10 is an enlarged view taken from the double-dotted line box labeled FIG. 10 in FIG. 4 thereof; and,

[0011] FIG. 11 is an enlarged view taken from the double-dotted line box labeled FIG. 11 in FIG. 5.

[0012] The dash-dash broken lines shown are included for the purpose of illustrating portions of the thermometer for semiconductor manufacturing apparatus that form no part of the claimed design.

[0013] The dash-dot broken lines immediately adjacent the shaded areas represent the bounds of the claimed design and form no part of the claimed design.

[0014] The double-dotted lines in FIGS. 1, 2, 4, 5, and 8-10 show the periphery of the enlarged views and form no part of the claimed design.

Claims

The ornamental design for a thermometer for semiconductor manufacturing apparatus, as shown and described.

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