Probe pin for integrated circuit testing

USD1142241SActive Publication Date: 2026-08-18HICON CO LTD +2
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Patent Information

Application Number
US35/525822
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2024-01-18
Filing Date
2024-07-17
Publication Date
2026-08-18
Estimated Expiration
2041-08-18

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Description

[0001] 1.1 : Perspective

[0002] 1.2 : Front

[0003] 1.3 : Back

[0004] 1.4 : Left

[0005] 1.5 : Right

[0006] 1.6 : Top

[0007] 1.7 : Bottom

Claims

The ornamental design for a probe pin for integrated circuit testing as shown and described.

Citation Information

Patent Citations

  • Contact pins for Ball Grid Array (BGA) type semiconductor test sockets

    KR300582831S

  • IC test probes

    TWD237593S

  • Probe for IC testing

    TWD238555S

  • Probes for IC testing

    TWD238557S

  • Contact probe pin for wafer probing apparatus

    US20020113612A1