Power semiconductor module

Description

[0001] FIG. 1 is a perspective view of a power semiconductor module according to a first embodiment;

[0002] FIG. 2 is a front elevation view of the power semiconductor module of the first embodiment;

[0003] FIG. 3 is a rear elevation view of the power semiconductor module of the first embodiment;

[0004] FIG. 4 is a left side elevation view of the power semiconductor module of the first embodiment;

[0005] FIG. 5 is a right side elevation view of the power semiconductor module of the first embodiment;

[0006] FIG. 6 is a top plan view of the power semiconductor module of the first embodiment;

[0007] FIG. 7 is a bottom plan view of the power semiconductor module of the first embodiment;

[0008] FIG. 8 is a perspective view of a power semiconductor module according to a second embodiment;

[0009] FIG. 9 is a front elevation view of the power semiconductor module of the second embodiment;

[0010] FIG. 10 is a rear elevation view of the power semiconductor module of the second embodiment;

[0011] FIG. 11 is a left side elevation view of the power semiconductor module of the second embodiment;

[0012] FIG. 12 is a right side elevation view of the power semiconductor module of the second embodiment;

[0013] FIG. 13 is a top plan view of the power semiconductor module of the second embodiment; and,

[0014] FIG. 14 is a bottom plan view of the power semiconductor module of the second embodiment.

[0015] The broken lines in the drawings are for the purpose of illustrating portions of the power semiconductor module that form no part of the claimed design.

Claims

The ornamental design for a power semiconductor module as shown and described.

Images