Precursor flow offset blocker plate
Patent Information
- Application Number
- US29/995943
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2041-10-27
Smart Images

Figure USD1155500-D00000_ABST
Description
[0001] FIG. 1 is a top perspective view of the precursor flow offset blocker plate showing our new design according to a first embodiment;
[0002] FIG. 2 is a bottom view thereof;
[0003] FIG. 3 is a top plan view thereof;
[0004] FIG. 4 is a bottom plan view thereof;
[0005] FIG. 5 is an enlarged detail view of area 5 circumscribed in FIG. 1;
[0006] FIG. 6 is an enlarged detail view of area 6 circumscribed in FIG. 2;
[0007] FIG. 7 is a top perspective view of the precursor flow offset blocker plate showing my new design according to a second embodiment;
[0008] FIG. 8 is a bottom view thereof;
[0009] FIG. 9 is a top plan view thereof;
[0010] FIG. 10 is a bottom plan view thereof;
[0011] FIG. 11 is an enlarged detail view of area 11 circumscribed in FIG. 7;
[0012] FIG. 12 is an enlarged detail view of area 12 circumscribed in FIG. 8;
[0013] FIG. 13 is a front view of the precursor flow offset blocker plate shown in FIG. 1 and FIG. 7, the back view being the mirror image thereof;
[0014] FIG. 14 is a side view of the precursor flow offset blocker plate shown in FIG. 1 and FIG. 7, the opposite side view being the mirror image thereof;
[0015] FIG. 15 is a cross-section view taken through cross-section line 15-15 shown in FIG. 3 and FIG. 9; and,
[0016] FIG. 16 is an enlarged detail view of area 16 circumscribed in FIG. 15.
[0017] The broken lines denote the boundaries of the detail areas and form no part of the claimed design.
Claims
The ornamental design for a precursor flow offset blocker plate as shown and described.
Citation Information
Patent Citations
Packaging material and manufacturing method thereof
JP2025019458A
Resin composition
JP2025019459A
Electrode plates for semiconductor manufacturing equipment
CN303815720S
Electrodes for substrate processing equipment
CN307348240S
Wafer chuck
US20210242069A1