Power package
USD1155501SActive Publication Date: 2026-10-27WOLFSPEED INC
Patent Information
- Application Number
- US30/052071
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2026-03-13
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2041-10-27
Smart Images
Figure USD1155501-D00000_ABST
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Description
[0001] FIG. 1 is a top perspective view of a power package, showing our new design;
[0002] FIG. 2 is a top view of the power package of FIG. 1;
[0003] FIG. 3 is a bottom view of the power package of FIG. 1;
[0004] FIG. 4 is a left side view of the power package of FIG. 1;
[0005] FIG. 5 is a right side view of the power package of FIG. 1;
[0006] FIG. 6 is a rear view of the power package of FIG. 1; and,
[0007] FIG. 7 is a front view of the power package of FIG. 1.
Claims
The ornamental design for a power package, as shown and described.
Citation Information
Patent Citations
Matching system
JP2021022271A
Power semiconductor package
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US10790245B2
Semiconductor packages with increased power handling
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Semiconductor device and semiconductor module
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