Semiconductor device

USD1156338SActive Publication Date: 2026-11-03MITSUBISHI ELECTRIC CORP
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Patent Information

Application Number
US30/006582
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2025-06-03
Publication Date
2026-11-03
Estimated Expiration
2041-11-03

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Description

[0001] FIG. 1 is a front, bottom, right side perspective view of a semiconductor device showing our new design;

[0002] FIG. 2 is a rear, top, right side perspective view thereof;

[0003] FIG. 3 is a front view thereof;

[0004] FIG. 4 is a rear view thereof;

[0005] FIG. 5 is a left side view thereof;

[0006] FIG. 6 is a right side view thereof;

[0007] FIG. 7 is a top view thereof; and,

[0008] FIG. 8 is a bottom view thereof.

[0009] The dashed broken lines are for the purpose of illustrating portions of the semiconductor device and form no part of the claimed design.

[0010] The dot-dash broken lines define the bounds of the claimed design and form no part thereof.

Claims

The ornamental design for a semiconductor device as shown and described.

Citation Information

Patent Citations

  • Semiconductor device

    US20230063024A1

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    US20250246525A1

  • Semiconductor device

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