Biothermal-controlled electronic equipment enclosure
VN10059452BActive Publication Date: 2026-07-15WEN SUNG HU
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Patent Information
- Application Number
- VN1202100853
- Authority / Receiving Office
- VN · VN
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-02-19
- Publication Date
- 2026-07-15
- Estimated Expiration
- 2041-02-19
Abstract
The invention relates to an electronic device enclosure with a biologically controlled temperature that is adjusted to form the outer and / or middle shell of an electronic product such as a mobile phone, tablet computer, laptop, smart wearable and similar.1 The heat source is provided in the electronic product. The enclosure (10) includes the outer shell (12) and the outer heat conduction plate (14). The outer shell (12) consists of at least one hole (24) extending across its inner (20) and outer (22) surfaces. The outer heat conductive plate (14) corresponds to the heat source (18) and is combined with the outer shell (12) consisting of the heat conductive part (30) corresponding to the hole (24). Radiant heat generated by the heat source can be absorbed and dispersed through the outer heat conductive plate (14) and conducted through the skin of the user in contact with the heat conductive part (30).
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