Electromagnetic shielding film and printed circuit board are shielded
VN10059823BActive Publication Date: 2026-08-03TATSUTA ELECTRICWIRE & CABLE
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Patent Information
- Application Number
- VN1202304669
- Authority / Receiving Office
- VN · VN
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-12-13
- Publication Date
- 2026-08-03
- Estimated Expiration
- 2041-12-13
Abstract
The invention describes an electromagnetic shielding film with high adhesion of the shielding layers and excellent bending strength. The electromagnetic shielding film of the invention consists of an oriented conductive adhesive layer, an insulating layer, and a metal layer stacked in sequence. The insulating layer and the metal layer have a total thickness not less than 0.5 μm i but less than 20 μm i.
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