Packaged integrated equipment and machines and methods for manufacturing them

Abstract

The invention relates to a device and machine for the construction of an integrated circuit in the form of a bundle and a method for constructing such a device. The device consists of a circuit board, a bundle and a connecting base. The circuit board consists of a compartment. The bundle is attached to the first face of the circuit board. This bundle consists of a base and an integrated component attached to the base. The integrated component is placed at least partially in the compartment of the circuit board. The connecting base is attached to the second face of the circuit board. The connecting base is placed on the compartment of the circuit board. The circuit connection is configured to act as an electromagnetic interference (EMI) shield for the packet.