Welding alloys, welding balls, welding paste, and welding joints

VN10060173BActive Publication Date: 2026-08-17SENJU METAL IND CO LTD

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Patent Information

Application Number: VN1202506127
Authority / Receiving Office: VN · VN
Patent Type: Patents
Current Assignee / Owner
Filing Date: 2024-02-20
Publication Date: 2026-08-17
Estimated Expiration: 2044-02-20

Application Information

Patent Timeline

20 Feb 2024

Application

VN1202506127

17 Aug 2026

Publication

VN10060173B

Inventors: Takahiro YOKOYAMA; Shunsaku YOSHIKAWA

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Abstract

The term refers to solder alloys, solder pastes, solder pastes, and solder joints that excel in thermal conductivity, drop impact strength, and thermal cycle strength. The solder alloys have an alloy composition including, by weight percentage, Ag: 1.0 to 4.0%, Cu: 0.10 to 1.00%, Sb: 1.0 to 7.0%, Co: 0.001 to 0.030%, Fe: 0.005 to 0.050%, with the remainder being Sn.

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