Wiring boards and methods of manufacturing wiring boards

Abstract

The invention relates to a wiring circuit (1) comprising an insulating substrate (2), a conductive layer (3) arranged on one side in the thickness direction of the insulating substrate (2), and an insulating coating (4) arranged on one side in the thickness direction of the insulating substrate (2) to cover the conductive layer (3). and protective sheath (5) is arranged on the other side in the direction of the thickness of the insulating base layer (2) and on both sides in the direction of the width of the insulating base layer (2) and on one side in the direction of the thickness of the insulating cover layer (4) and on both sides in the direction of the width of the insulating cover layer (4). At least one of the insulating base layer (2) and the insulating cover layer (4) has a hollow plastic layer (10).