Solder alloys, solder paste, and solder joints

Abstract

The invention relates to a solder alloy, solder paste, and solder joint that exhibits a suitable melting temperature, excellent wettability, high tensile and shear strength, and excellent drop impact strength. The solder alloy has the following alloy composition. This alloy composition includes, by mass percentage, Ag: 0.1 to 3.9%, Cu: 0.1 to 1.0%, Bi: 0.6 to 1.4%, Sb: 5.1 to 7.9%, Ni: 0.01 to 0.30%, Co: 0.001 to less than or equal to 0.100%, with the remainder being Sn.