Semiconductor devices and manufacturing methods

Abstract

The invention relates to a semiconductor device and a method for its manufacture. The semiconductor device comprises: a substrate; a chip mounted on the substrate, the chip comprising a chip body and electrodes mounted on the chip body; and an electrode extension layer mounted on the substrate, the electrode extension layer comprising a conductive material, and an electrode strip conductive layer and at least one electrode mounted on the same face of the chip body. The semiconductor device also comprises expansion strips mounted on the electrode extension layer. The expansion strips are electrically connected to the electrodes in turn, to extend the electrodes. The orthogonal protrusion of at least one expansion on the substrate completely covers the orthogonal protrusion of the electrode connected to the expansion on the substrate.