Electronic devices include speaker structures.

VN100606AActive Publication Date: 2024-01-25SAMSUNG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
VN1202306026
Authority / Receiving Office
VN · VN
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-03-10
Filing Date
2022-02-25
Publication Date
2024-01-25
Estimated Expiration
2042-02-25

AI Technical Summary

Technical Problem

The arrangement of speaker modules and camera modules in electronic devices, particularly in foldable designs, can lead to overlap issues, resulting in compromised sound quality due to the restricted volume of sound pipes.

Method used

Incorporating a pipe structure with an expansion part in the sound pipe system, where the upper pipe includes a first pipe extending in one direction and a second pipe extending perpendicular to it, allowing for increased volume and preventing overlap between the speaker and camera modules while maintaining aesthetic symmetry.

Benefits of technology

This design enhances sound quality by expanding the pipe volume, preventing overlap and ensuring optimal placement of both speaker and camera modules, thereby improving acoustic performance without compromising the device's aesthetics.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure VN1202306026_0
    Figure VN1202306026_0
Patent Text Reader

Abstract

The invention relates to an electronic device comprising: a first enclosure; a display module mounted on the front of the first enclosure; a camera module mounted at the top end of the first enclosure; a loudspeaker module mounted in the first enclosure adjacent to the camera module; an acoustic orifice formed in the side of the first enclosure such that sound produced by the loudspeaker module is emitted outside the electronic device; a conduit comprising a first conduit formed in the first enclosure and extending in the direction from the loudspeaker module to the acoustic orifice and a second conduit formed in the first enclosure and extending in a direction perpendicular to the direction of extension of the first conduit; and an extension formed in at least part of the conduit to expand the volume of the conduit. Other options may be possible.
Need to check novelty before this filing date? Find Prior Art

Description

Electronic device comprising a speaker structure

[0001] Various embodiments described in this document relate to electronic devices including a speaker structure.

[0002] The proliferation of electronic devices continues to grow. In addition to traditional bar-type electronic devices, various forms of electronic devices, such as foldable and rollable electronic devices, are being released.

[0003] In electronic devices, dual speakers may be provided that are installed on both the top and bottom sides of the portable electronic device.

[0004] For electronic devices, there may be a front camera in addition to a rear camera.

[0005] For the aesthetic appeal of the electronic device, sound holes for radiating sound output from the speaker to the outside of the electronic device may be formed symmetrically in the electronic device housing.

[0006] For example, the upper sound hole and the lower sound hole may be positioned in the center of the upper and lower portions of the electronic device, respectively, to be symmetrical to each other, and the speaker module connected to the upper sound hole and the speaker module connected to the lower sound hole may also be positioned in the center of the upper and lower portions of the housing, respectively. Meanwhile, the camera module may also be positioned in the center of the upper portion so that the camera hole can be located in the center of the upper portion of the display for aesthetic purposes.

[0007] In this case, overlap between the camera module and the upper speaker module may occur.

[0008] If the volume of the conduit guiding the sound of the speaker module decreases, the sound quality may deteriorate.

[0009] Various embodiments disclosed in this document can provide an electronic device including a speaker module that solves or improves the above problems.

[0010] An electronic device according to various embodiments disclosed in the present document may include a first housing, a display module positioned on a front side of the first housing, a camera module positioned on an upper side of the first housing, a speaker module positioned in the first housing adjacent to the camera module, a sound hole formed on a side surface of the first housing so that sound generated from the speaker module is emitted to the outside of the electronic device, a first conduit formed in the first housing so as to extend from the speaker module toward the sound hole, and a second conduit formed in the first housing so as to extend in a direction perpendicular to an extension direction of the first conduit, and an extension part formed in at least a portion of the conduit to expand the volume of the conduit.

[0011] An electronic device according to various embodiments disclosed in the present document may include a first housing, a display module positioned on a front side of the first housing, a camera module positioned on an upper side of the first housing, an upper speaker module positioned on an upper side of the first housing adjacent to the camera module, a lower speaker module positioned on a lower side of the first housing, an upper sound hole formed on an upper side of the first housing, a lower sound hole formed on a lower side of the first housing, an upper conduit including a first conduit extending from the upper speaker module toward the upper sound hole and a second conduit extending in a direction perpendicular to an extension direction of the first conduit, a lower conduit extending from the lower speaker module toward the lower sound hole, and an extension part formed on at least a portion of the upper conduit for expanding the volume of the upper conduit.

[0012] According to various embodiments disclosed in this document, a structure can be proposed in which a speaker module and a camera module are positioned at a central portion of the electronic device in consideration of the aesthetics of the electronic device.

[0013] Additionally, the sound quality problem caused by the adjacent arrangement of the speaker module and camera module can be solved by changing the shape of the speaker module's duct.

[0014] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0015] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0016] FIG. 2A is a diagram illustrating an unfolded stage of an electronic device according to various embodiments of the present invention.

[0017] FIG. 2B is a diagram illustrating a folded state of the electronic device of FIG. 2A according to various embodiments of the present invention.

[0018] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0019] FIG. 4a is a schematic diagram of the front surface of the housing and its surrounding components according to various embodiments disclosed in this document.

[0020] FIG. 4b is a plan view showing the front upper portion of a housing according to various embodiments disclosed in this document.

[0021] Figure 4c is a cross-sectional view taken along line BB of Figure 4b.

[0022] Figure 4d is a cross-sectional view taken along line CC of Figure 4b.

[0023] FIG. 5A is a rear perspective view of a housing according to various embodiments disclosed in this document.

[0024] Fig. 5b is a cross-sectional view of the housing taken along line AA of Fig. 4a.

[0025] Figure 5c is a plan view of a soundproofing material attached to an extension according to various embodiments disclosed in this document.

[0026] Figure 5d is a cross-sectional view of the soundproofing material shown in Figure 5c cut along the line DD.

[0027] FIG. 6 is a plan view of a bar-shaped electronic device according to various embodiments disclosed in this document.

[0028] It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather to include various modifications, equivalents, or substitutes of the embodiments.

[0029] In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0030] In this document, the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0031] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] FIG. 2A is a diagram illustrating an unfolded state of an electronic device (200) according to various embodiments of the present invention. FIG. 2B is a diagram illustrating a folded state of the electronic device (200) of FIG. 2A according to various embodiments of the present invention.

[0054] Referring to FIGS. 2A and 2B, the electronic device (200) may include a pair of housings (210, 220) (e.g., foldable housings) that are rotatably coupled about a folding axis (A1) via a hinge device (e.g., hinge device (264) of FIG. 3) to be folded relative to each other, a first display (230) (e.g., a flexible display, a foldable display, or a main display) and / or a second display (400) (e.g., a sub-display) that are arranged via the pair of housings (210, 220). According to one embodiment, the hinge device (e.g., the hinge device (264) of FIG. 3) may be arranged so as to be invisible from the outside through the first housing (210) and the second housing (220) in the folded state, and may be arranged so as to be invisible from the outside through a hinge cover (265) that protects the hinge device and covers the foldable portion in the unfolded state. In this document, the surface on which the first display (230) is arranged may be defined as the front surface of the electronic device (200), and the surface opposite the front surface may be defined as the back surface of the electronic device (200). In addition, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (200).

[0055] According to various embodiments, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via a hinge device (e.g., a hinge device (264) of FIG. 3). In one embodiment, the pair of housings (210, 220) are not limited to the shapes and combinations illustrated in FIGS. 2A and 2B, and may be implemented by other shapes or combinations and / or combinations of parts. In one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides with respect to a folding axis (A1) and may have an overall symmetrical shape with respect to the folding axis (A1). In some embodiments, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (A1). According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0056] According to various embodiments, the first housing (210) may be connected to a hinge device (e.g., hinge device (264) of FIG. 3) in an unfolded state of the electronic device (200), and may include a first side member (211) arranged to face the front of the electronic device (200), a second side member (212) facing in an opposite direction to the first side member (211), and / or a first side member (213) surrounding at least a portion of a first space between the first side member (211) and the second side member (212). According to one embodiment, the second housing (220) may be connected to a hinge device (e.g., hinge device (264) of FIG. 3) in an unfolded state of the electronic device (200) and may include a third surface (221) arranged to face the front of the electronic device (200), a fourth surface (222) facing in an opposite direction to the third surface (221), and / or a second side member (223) surrounding at least a portion of a second space between the third surface (221) and the fourth surface (222). According to one embodiment, the first surface (211) may face substantially in the same direction as the third surface (221) in an unfolded state and may face the third surface (221) in a folded state. According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through a structural combination of a first housing (210) and a second housing (220). According to one embodiment, the recess (201) may have substantially the same size as the first display (230).

[0057] According to various embodiments, the hinge cover (265) may be positioned between the first housing (210) and the second housing (220) so as to cover the hinge device (e.g., the hinge device (264) of FIG. 3). According to one embodiment, the hinge cover (265) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the unfolded state, the folded state, or the intermediate state of the electronic device (200). For example, when the electronic device (200) is in the unfolded state, the hinge cover (265) may be covered by the first housing (210) and the second housing (220) and may not be substantially exposed. According to one embodiment, when the electronic device (200) is in a folded state, the hinge cover (265) may be exposed to the outside between the first housing (210) and the second housing (220). According to one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge cover (265) may be at least partially exposed to the outside of the electronic device (200) between the first housing (210) and the second housing (220). For example, the area where the hinge cover (265) is exposed to the outside may be less than that in a completely folded state. According to one embodiment, the hinge cover (265) may include a curved surface.

[0058] According to various embodiments, when the electronic device (200) is in an unfolded state (e.g., the state of FIG. 2a), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the folding region (230c), and the second region (230b) of the first display (230) form the same plane and may be arranged to face substantially the same direction. In another embodiment, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated at an angle of about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (out folding method).

[0059] According to various embodiments, when the electronic device (200) is in a folded state (e.g., the state of FIG. 2b), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may be arranged to face each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with respect to each other through the folding region (230c). According to one embodiment, the folding region (230c) may be formed as a curved surface having at least a predetermined radius of curvature. According to one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a predetermined angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the folded state and smaller than the unfolded state, and the radius of curvature of the folding region (230c) may be larger than the folded state. In some embodiments, the first housing (210) and the second housing (220) may form an angle that can stop at a designated folding angle between the folded state and the unfolded state through a hinge device (e.g., the hinge device (264) of FIG. 3) (free stop function). In some embodiments, the first housing (210) and the second housing (220) may operate while being pressed in the unfolding direction or the folding direction based on the designated inflection angle through a hinge device (e.g., the hinge device (264) of FIG. 3).

[0060] According to various embodiments, the electronic device (200) may include at least one of a display (230, 400), an input device (215), an audio output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may omit at least one of the components or may additionally include at least one other component.

[0061] According to various embodiments, at least one display (230, 400) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third side (221) of a second housing (220) via a hinge device (e.g., a hinge device (264) of FIG. 3) from a first side (211) of a first housing (210), and a second display (400) that is arranged to be visible from the outside through a fourth side (222) in an internal space of the second housing (220). As another example, the second display (400) may be arranged to be visible from the outside through the second side (212) in an internal space of the first housing (210). According to one embodiment, the first display (230) may be primarily used in the unfolded state of the electronic device (200), and the second display (400) may be primarily used in the folded state of the electronic device (200). According to one embodiment, in the intermediate state, the electronic device (200) may use the first display (230) and / or the second display (400) based on the folding angles of the first housing (210) and the second housing (220).

[0062] According to various embodiments, the first display (230) may be placed in a space formed by a pair of housings (210, 220). For example, the first display (200) may be placed in a recess (201) formed by a pair of housings (210, 220) and may be placed to occupy substantially most of the front surface of the electronic device (200). According to one embodiment, the first display (230) may include a flexible display in which at least a portion of the first display (230) may be transformed into a flat or curved surface. According to one embodiment, the first display (230) may include a first area (230a) facing the first housing (210), a second area (230b) facing the second housing (220), and a folding area (230c) connecting the first area (230a) and the second area (230b) and facing a hinge device (e.g., the hinge device (264) of FIG. 3). According to one embodiment, the division of the areas of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and a hinge device (e.g., a hinge device (264) of FIG. 3), and in reality, the first display (230) can be displayed as a seamless, full screen through a pair of housings (210, 220) and a hinge device (e.g., a hinge device (264) of FIG. 3). According to one embodiment, the first area (230a) and the second area (230b) may have an overall symmetrical shape with respect to the folding area (230c), or may have a partially asymmetrical shape.

[0063] According to various embodiments, the electronic device (200) may include a first rear cover (240) disposed on a second surface (212) of the first housing (210) and a second rear cover (250) disposed on a fourth surface (222) of the second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223). In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the second rear cover (250) may be formed by a substantially transparent plate, such as, for example, glass or polymer. Accordingly, the second display (400) may be arranged so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220). In one embodiment, the second rear cover (250) may be included in the second display (400).

[0064] According to various embodiments, the input device (215) may include a microphone. In some embodiments, the input device (215) may include a plurality of microphones arranged to detect the direction of sound. According to one embodiment, the audio output device (227, 228) may include speakers. According to one embodiment, the audio output device (227, 228) may include a call receiver (227) arranged through the fourth side (222) of the second housing (220) and an external speaker (228) arranged through a side member of the second housing (220). In some embodiments, the input device (215), the audio output device (227, 228), and the connector (229) are disposed in spaces of the first housing (210) and / or the second housing (220) and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In some embodiments, the holes formed in the first housing (210) and / or the second housing (220) can be used in common for the input device (215) and the audio output device (227, 228). In some embodiments, the audio output device (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220).

[0065] According to various embodiments, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first surface (211) of the first housing (210), a second camera module (216b) disposed on a second surface (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth surface (222) of the second housing (220). According to one embodiment, the electronic device (200) may include a flash (218) disposed near the second camera module (216b). According to one embodiment, the flash (218) may include, for example, a light emitting diode or a xenon lamp. According to one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (wide-angle and telephoto lenses) and image sensors, and may be arranged together on either side of the first housing (210) and / or the second housing (220).

[0066] According to various embodiments, the sensor modules (217a, 217b, 226) may generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (200) or the external environmental state. According to one embodiment, the sensor modules (217a, 217b, 226) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220). In some embodiments, the sensor module (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (a TOF sensor or a RiDAR scanner).

[0067] According to various embodiments, the electronic device (200) may further include at least one sensor module not shown, for example, a pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In some embodiments, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0068] According to various embodiments, the key input device (219) may be arranged to be exposed to the outside through the first side member (213) of the first housing (210). In some embodiments, the key input device (219) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). In some embodiments, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 400). In another embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 400).

[0069] According to various embodiments, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In some embodiments, the connector port (229) may also perform a function for transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0070] According to various embodiments, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 400). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 400) in the interior space of at least one housing (210, 220), below an active area of ​​a display (230, 240), and may be arranged to be in contact with an external environment through an opening or transparent area perforated up to a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)). According to one embodiment, an area where the display (230, 240) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. This transparent area may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by an image sensor to create an image. For example, the transparent area of ​​the display (230, 240) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC). In another embodiment, some camera modules or sensor modules (204) may be arranged to perform their functions without being visually exposed through the display.For example, the area of ​​the display (201) (e.g., display panel) facing the camera module and / or sensor module may not require a perforated opening.

[0071] According to various embodiments, the electronic device (200) may include at least one antenna configured through at least a portion of the first conductive side member (213) of the first housing (210). According to one embodiment, the at least one antenna may be disposed in an upper region (e.g., region A) and / or a lower region (e.g., region B) of the first housing (210).

[0072] According to exemplary embodiments of the present invention, at least one antenna may be additionally implemented using a second conductive side member (223) of a second housing (220) including a second display (400). According to one embodiment, at least one antenna may be additionally disposed in an upper region (region C) and / or a lower region (region D) of the second conductive side member (223). In this case, the conductive sheet (e.g., the conductive sheet (444) of FIG. 4A) of the second display (400) and a surrounding conductive structure (e.g., a substrate or a conductive electrical structure) used as a common ground are electrically connected (grounded) at at least one designated location near the feeding point of the antenna, thereby helping to prevent a degradation in radiation performance of the antenna using the second side member (223).

[0073] FIG. 3 is an exploded perspective view of an electronic device (200) according to various embodiments of the present invention.

[0074] Referring to FIG. 3, the electronic device (200) may include a first display (230), a second display (400), a support member assembly (260), at least one printed circuit board (270), a first housing (210), a second housing (220), a first rear cover (240), and / or a second rear cover (250).

[0075] According to various embodiments, the first display (230) may include a display panel (231) (e.g., a flexible display panel) and one or more plates (232) or layers on which the display panel (231) (e.g., a flexible display panel) is mounted. According to one embodiment, the one or more plates (232) may include a conductive plate (e.g., a Cu sheet or a SUS sheet) disposed between the display panel (231) and the support member assembly (260). According to one embodiment, the one or more plates (232) may be formed to have substantially the same area as the first display (230), and may be formed such that an area facing the folding area (230c) of the first display (230c) is bendable. According to one embodiment, the one or more plates (232) may include at least one auxiliary material layer (e.g., a graphite member) disposed on a back surface of the display panel (231). According to one embodiment, one or more plates (232) may be formed in a shape corresponding to the display panel (231).

[0076] According to various embodiments, the second display (400) may be positioned in the space between the second housing (220) and the second rear cover (250). According to one embodiment, the second display (400) may be positioned in the space between the second housing (220) and the second rear cover (250) so as to be visible from the outside through substantially the entire area of ​​the second rear cover (250).

[0077] According to various embodiments, the support member assembly (260) may include a first support member (261) (e.g., a first support plate), a second support member (262) (e.g., a second support plate), a hinge device (264) disposed between the first support member (261) and the second support member (262), a hinge cover (265) covering the hinge device (264) when viewed from the outside, and / or at least one wiring member (263) (e.g., a flexible printed circuit board (FPCB)) crossing the first support member (261) and the second support member (262). In one embodiment, the support member assembly (260) may be disposed between one or more plates (232) and at least one printed circuit board (270). According to one embodiment, the first support member (261) may be disposed between the first region (231a) of the first display (230) and the first printed circuit board (271). According to one embodiment, the second support member (262) may be disposed between the second region (231b) of the first display (230) and the second printed circuit board (272). According to one embodiment, at least one wiring member (263) and at least a portion of a hinge device (264) may be disposed inside the support member assembly (260). The at least one wiring member (263) may be disposed in a direction (e.g., an x-axis direction) crossing the first support member (261) and the second support member (262). According to one embodiment, at least one wiring member (263) may be arranged in a direction perpendicular to a folding axis (e.g., y-axis or folding axis (A) of FIG. 2A) of the folding region (230c) (e.g., x-axis direction).

[0078] According to various embodiments, at least one printed circuit board (270) may include a first printed circuit board (271) arranged to face the first support member (261), or a second printed circuit board (272) arranged to face the second support member (262). According to one embodiment, the first printed circuit board (271) and the second printed circuit board (272) may be arranged in an internal space formed by the support member assembly (260), the first housing (210), the second housing (220), the first rear cover (240), and / or the second rear cover (250). According to one embodiment, the first printed circuit board (271) and the second printed circuit board (272) may include a plurality of electronic components arranged to implement various functions of the electronic device (200).

[0079] According to various embodiments, the electronic device may include a first printed circuit board (271) disposed in a space formed through a first support member (261) in a first space of a first housing (210), a first battery (291) disposed at a position facing a first swelling hole (2611) of the first support member (261), at least one camera module (282) (e.g., the first camera module (216a) and / or the second camera module (216b) of FIG. 1) or at least one sensor module (281) (e.g., the first sensor module (217a) and / or the second sensor module (217b) of FIG. 1). According to one embodiment, the second space of the second housing (220) may include a second printed circuit board (272) disposed in the second space formed through the second support member (262), or a second battery (292) disposed at a position facing the second swelling hole (2621) of the second support member (262). According to one embodiment, the first housing (210) and the first support member (261) may be formed integrally. According to one embodiment, the second housing (220) and the second support member (262) may also be formed integrally.

[0080] According to various embodiments, the first housing (210) may include a first rotation support surface (214), and the second housing (220) may include a second rotation support surface (224) corresponding to the first rotation support surface (214). According to one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may include curved surfaces corresponding to (naturally connected to) curved surfaces included in the hinge cover (265). According to one embodiment, when the electronic device (200) is in an unfolded state, the first rotation support surface (214) and the second rotation support surface (224) may cover the hinge cover (265) so that the hinge cover (265) is not exposed to the rear surface of the electronic device (200) or is only partially exposed. According to one embodiment, the first rotational support surface (214) and the second rotational support surface (224) can rotate along the curved surface included in the hinge cover (265) when the electronic device (200) is in a folded state to expose the hinge cover (265) to the rear of the electronic device (200).

[0081] FIG. 4a is a schematic diagram of the front surface of a housing and its peripheral components according to various embodiments disclosed in the present document. FIG. 4b is a plan view illustrating the front upper portion of a housing according to various embodiments disclosed in the present document. FIG. 4c is a cross-sectional view taken along line BB of FIG. 4b. FIG. 4d is a cross-sectional view taken along line CC of FIG. In the following description, the same or similar components described above are omitted from detailed description and the same reference numerals are used for the components described below.

[0082] According to various embodiments, as illustrated in FIG. 4A, a housing (220) (e.g., the second housing (220) of FIG. 2A), which is a body of an electronic device (200) (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2A), has an upper speaker module (301) (e.g., the sound output module (155) of FIG. 1, the sound output device (228) of FIG. 2A), a lower speaker module (302) (e.g., the sound output module (155) of FIG. 1, the sound output device (228) of FIG. 2A), an upper conduit (305), a lower conduit (306), a camera module (225) (e.g., the camera module (180) of FIG. 1, the third camera module (225) of FIG. 2A), a printed circuit board (272) (e.g., the second printed circuit board (272) of FIG. 3)) on a front surface (222) (e.g., the fourth surface (222) of FIG. 2A). A circuit board (272)), a battery (292) (e.g., the battery (189) of FIG. 1 or the second battery (292) of FIG. 3), a display module (160) (e.g., the display module (160) of FIG. 1, the first display (230) of FIG. 2A, or the second display (400) of FIG. 2A) may be arranged or formed. The housing (220) described below may be a concept including a support member (262) (e.g., the second support member (262) of FIG. 3).

[0083] According to various embodiments, the housing (220) of the electronic device (200) may collectively refer to a mechanism in which various electronic components included in the electronic device (200) are arranged and at least a portion of which forms the exterior of the electronic device (200). According to one embodiment, a printed circuit board (272), a camera module (225), and speaker modules (301, 302) may be arranged in the housing (220). In addition, various electronic components may be arranged in the housing (220).

[0084] According to various embodiments, at least one of the electronic components included in the electronic device (200) may be electrically connected to the printed circuit board (272). For example, the speaker modules (301, 302) and the camera module (225) may be electrically connected to the printed circuit board (272).

[0085] According to various embodiments, the upper speaker module (301) and the lower speaker module (302) may be devices arranged in the electronic device (200) to output sound. The upper speaker module (301) and the lower speaker module (302) may output sound depending on the execution of an application or function. For example, an audio signal processed through an audio module (e.g., the audio module (170) of FIG. 1) may be received and the signal may be output as sound.

[0086] According to various embodiments, referring to FIG. 2B, the upper speaker module (301) can be used as a call receiver (227). In a call operation, the call sound of an incoming call can be transmitted to the user through the upper speaker module (301). In the case of a foldable electronic device (200), the user can fold the electronic device (200) so that the user can easily hold the electronic device (200) in the call operation. In the operation of the user holding the folded electronic device (200) to make a call, the user's ear can be close to the upper center portion of the electronic device (200), and thus, the portion from which the call sound is emitted can be located at the upper center portion of the electronic device (200). For example, a receiver hole (not shown) through which the call sound generated from the upper speaker module (301) is emitted can be formed at the upper center portion of the second rear cover (250). Accordingly, the upper speaker module (301) connected to the receiver hole can be placed at the upper center of the front (222) of the housing (220). According to another embodiment, the receiver (227) and the upper speaker module (301) can be separate components.

[0087] According to various embodiments, as illustrated in FIG. 4A, sound holes (303, 304) may be formed at the top and / or bottom of the housing (220) of the electronic device (200). The sound holes (303, 304) may include an upper sound hole (303) formed at the top (e.g., +Y direction of FIG. 4A) side of the housing (220) and a lower sound hole (304) formed at the bottom (e.g., -Y direction of FIG. 4A) side of the housing (220). The upper sound hole (303) and the lower sound hole (304) may be respectively arranged at the center of the top side and the center of the bottom side of the housing (220) to be symmetrical with respect to the X-axis of FIG. 4A. Sound generated from the speaker modules (301, 302) may be radiated to the outside of the electronic device (200) through the sound holes (303, 304).

[0088] According to various embodiments, the upper conduit (305) may be connected to the upper speaker module (301) and the upper sound hole (303) and may be a part of the upper speaker module (301). The upper conduit (305) may guide sound output from the upper speaker module (301) to the upper sound hole (303).

[0089] According to various embodiments, the lower conduit (306) may be connected to the lower speaker module (302) and the lower sound hole (304) and may be a part of the lower speaker module (302). The lower conduit (306) may guide sound output from the lower speaker module (302) to the lower sound hole (304). As illustrated in FIG. 4A, the lower conduit (306) may extend from the lower speaker module (302) in the direction of the lower sound hole (304) (e.g., the -Y direction in FIG. 4A).

[0090] According to various embodiments, a user can take a self-portrait through the camera module (225). The electronic device (200) can be folded to facilitate taking a self-portrait through a specific camera in the foldable electronic device (200). For example, referring to FIG. 2B, when taking a self-portrait using the camera module (225), the user can fold the electronic device (200). The lens of the camera module (225) can be placed at the top center of the display module (160) to facilitate the user's appearance previewed on the display module (160) through the camera module (225) and adjusting the shooting composition. In one embodiment, the display module (160) has a transparent area through which light can be incident to the lens of the camera module (225), and the lens can face this transparent area. Placing the lens at the top center of the display module (160) may mean that the transparent area of ​​the display module (160) is located at the top center of the display module (160). In addition, the lens may be positioned at the top center of the display module (160) in various other ways. Meanwhile, by arranging the lens of the camera module (225) at the center of the display module (160), a symmetrical design can be implemented.

[0091] According to various embodiments, when the upper speaker module (301) and the camera module (225) are arranged at the upper center of the front surface (222) of the housing (220) as illustrated in FIGS. 4A and 4B, an overlap may occur between the upper speaker module (301) and the camera module (225) in the Z-axis direction as illustrated in FIG. 4B. To address this, the shape of the upper conduit (305) connected to the upper speaker module (301) may be changed. This will be described in detail later.

[0092] According to various embodiments, as illustrated in FIG. 4b, the camera module (225) and the upper speaker module (301) may be positioned adjacent to each other at the top center of the housing (220).

[0093] When arranged adjacent to each other, the upper speaker module (301) may be arranged in a first direction (e.g., the first direction in FIG. 4b) with respect to a line (310) extending in the longitudinal direction of the housing (220). The camera module (225) may be arranged in a second direction (e.g., the second direction in FIG. 4b) with respect to a line (310) extending in the longitudinal direction of the housing (220).

[0094] According to various embodiments, as illustrated in FIG. 4b, the first conduit (305-1) and the second conduit (305-2) among the upper conduits (305) may be connected. The first conduit (305-1) among the upper conduits (305) may be arranged in a first direction (e.g., the first direction in FIG. 4b) with respect to a line (310) extending in the longitudinal direction of the housing (220). The second conduit (305-2) among the upper conduits (305) may be arranged in a second direction (e.g., the second direction in FIG. 4b) with respect to a line (310) extending in the longitudinal direction of the housing (220). The first conduit (305-1) may extend from the upper speaker module (301) toward the upper sound hole (303) (e.g., the +Y direction in FIG. 4b). The second conduit (305-2) may extend in a direction perpendicular to the extension direction of the first conduit (305-1) at least in part (e.g., the X-axis direction or the second direction in FIG. 4b).

[0095] According to various embodiments, as illustrated in FIG. 4b, the width (W1) of the first conduit (305-1) and the width (W2) of the second conduit (305-2) may be different. For example, the width (W2) of the second conduit (305-2) may be smaller than the width (W1) of the first conduit (305-1). Here, the width (W1) of the first conduit (305-1) may refer to the Y-axis direction length of the first conduit (305-1) illustrated in FIG. 4b. In addition, the width (W2) of the second conduit (305-2) may refer to the Y-axis direction length of the second conduit (305-2) illustrated in FIG. 4b. At least a part of the camera module (225) may be placed in a portion corresponding to the difference between the width (W1) of the first conduit (305-1) and the width (W2) of the second conduit (305-2) in the housing (220). Due to the shape of the upper conduit (305), the upper conduit (305) of the upper speaker module (301) and the camera module (225) may be placed in the upper center of the front surface (222) of the housing (220) without overlapping. For example, as illustrated in FIGS. 4c and 4d, a part of the camera module (225) may be placed in a portion corresponding to the difference between the width (W1) of the first conduit (305-1) and the width (W2) of the second conduit (305-2). Therefore, when cutting along the CC line of FIG. 4b, a part of the upper sound hole (303) may be covered by a part of the camera module (225).

[0096] According to various embodiments, as illustrated in FIGS. 4A and 4C, the upper sound hole (303) and the lower sound hole (304) may include at least one hole (303-1, 304-1).

[0097] Sound generated from the speaker module (301, 302) can be radiated to the outside of the electronic device (200) through the holes (303-1, 304-1). The holes (303-1, 304-1) can be arranged in a direction parallel to the direction in which the second conduit (305-2) extends (e.g., the X-axis direction of FIG. 4b).

[0098] The shape, structure, and position of the housing (220), upper speaker module (301), upper conduit (305), lower speaker module (302), lower conduit (306), camera module (225), upper sound hole (303), and lower sound hole (304) illustrated in FIG. 4a are merely examples, and the housing (220), upper speaker module (301), upper conduit (305), lower speaker module (302), lower conduit (306), camera module (225), upper sound hole (303), and lower sound hole (304) described below are not limited to the shape, structure, and position illustrated in FIG. 4a.

[0099] The width (W1) of the first conduit (305-1) and the width (W2) of the second conduit (305-2) illustrated in FIG. 4b are merely examples and may be varied in various ways. In addition, the shape and number of holes (303-1, 304-1) illustrated in FIGS. 4a to 4d are merely examples and may be varied in various ways.

[0100] FIG. 5A is a rear perspective view of a housing according to various embodiments disclosed in the present document. FIG. 5B is a cross-sectional view of the housing taken along line AA of FIG. 4A. FIG. 5C is a plan view of an expansion portion with soundproofing material attached thereto according to various embodiments disclosed in the present document. FIG. 5D is a cross-sectional view of the soundproofing material illustrated in FIG. 5C taken along line DD.

[0101] Here, the front surface (222) (e.g., the fourth surface (222) of FIG. 2A) of the housing (220) (e.g., the second housing (220) of FIG. 2A), which is the body of the electronic device (200) (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2A), may be in the +Z direction of FIG. 5A, and the back surface (221) (e.g., the third surface (221) of FIG. 2A) may be in the -Z direction of FIG. 5A. In addition, the display module (160) below may be a concept including the display module (160) of FIG. 1, the first display (230) of FIG. 2A, or the second display (400) of FIG. 2A.

[0102] According to various embodiments, the extension (307) may be formed at the top of the housing (220). An opening (307-1), which is a part of the extension (307), may be formed at the top of the back surface (221) of the housing (220). The extension (307) may refer to a space formed in the housing (220) in a direction from the back surface (221) of the housing (220) to the front surface (222) (e.g., the +Z direction in FIGS. 5A and 5B) through the opening (307-1). According to one embodiment, the upper conduit (305) may be formed through the opening (307-1), which is a part of the extension (307). The extension (307) may refer to a space connecting the opening (307-1) and the upper conduit (305).

[0103] According to various embodiments, as illustrated in FIGS. 5A and 5B, the expansion portion (307) may be formed in the upper conduit (305). As the volume of the upper conduit (305) decreases, the sound quality radiated from the upper sound hole (303) may deteriorate.

[0104] According to various embodiments, the upper conduit (305) can be formed through the extension portion (307). In addition, as the extension portion (307) is connected to the upper conduit (305), the volume of the upper conduit (305) can increase by the space in which the extension portion (307) is formed, so that the sound quality of the upper conduit (305) can be improved.

[0105] According to various embodiments, as illustrated in FIG. 5b, the guide surfaces (312-1, 312-2) may be inclined to have an expanded cross-sectional area along the sound propagation direction (e.g., +Y direction in FIG. 5b) at the exit (311) through which sound generated from the upper speaker module (301) is emitted. As the cross-sectional area expands along the sound propagation direction, the first conduit (305-1) can secure additional space.

[0106] According to various embodiments, as illustrated in FIG. 5b, a waterproof member (309) may be attached to a portion of the end of the guide surface (312-1, 312-2). The waterproof member (309) may protect the upper speaker module (301) from liquid flowing in through the upper sound hole (303).

[0107] According to various embodiments, as illustrated in FIG. 5B, a soundproofing material (309) may be placed in the opening (307-1). The soundproofing material (309) may close the opening (307-1). The expansion portion (307) may be partitioned by the soundproofing material (309). For example, the soundproofing material (309) may be attached to the opening (307-1) to close the opening (307-1). This may prevent sound generated from the speaker module (301) from being emitted through the opening (307-1). In addition, the soundproofing material (309) may be placed in the opening (307-1) in various ways. For example, the soundproofing material (309) may be placed in the opening (307-1) in a manner such as soldering or bolting.

[0108] According to various embodiments, as illustrated in FIG. 5c, the soundproofing material (309) may be manufactured to have a shape similar to the upper conduit (305) of FIG. 4a and to have a larger area than the upper conduit (305).

[0109] According to various embodiments, the soundproofing material (309) may include two or more different materials, as illustrated in FIG. 5d. For example, it may include a structure in which an adhesive member (401) - an intermediate member (402) - a buffer member (403) are laminated in that order, as illustrated in FIG. 5d. One side (404) of the intermediate member (402) of the soundproofing material (309) may close the opening (307-1) through the adhesive member (401).

[0110] According to various embodiments, the adhesive member (401) can also be attached to the other side (405) of the buffer member (403). The other side (405) of the buffer member (403) can be attached to the display module (160) via the adhesive member (401). The buffer member (403) can alleviate impact applied to the display module (160).

[0111] According to various embodiments, the other side (405) of the buffer member (403) may be a rough surface. An adhesive member (401) may be attached to the other side (405) of the buffer member (403). When the adhesive member (401) is a thin film, the surface roughness of the side attached to the display module (160) may also increase. Accordingly, the display module (160) may be maintained in a fixed position on the other side (405) of the buffer member (403).

[0112] The expansion portion (307), the opening (307-1), and the soundproofing material (309) illustrated in FIGS. 5a, 5b, and 5c are merely examples, and the expansion portion (307), the opening (307-1), and the soundproofing material (309) are not limited to the shapes and structures illustrated in FIGS. 5a, 5b, and 5c. The degree of inclination of the guide surfaces (312-1, 321-2) illustrated in FIG. 5b is merely an example, and the degree of inclination may vary. The number and types of the members constituting the soundproofing material (309) illustrated in FIG. 5d are merely examples, and the adhesive member (401), the intermediate member (402), and the buffer member (403) may vary.

[0113] FIG. 6 is a plan view of a bar-shaped electronic device according to various embodiments disclosed in this document. According to various embodiments, the arrangement structure and electronic component configuration of the electronic device shown in FIGS. 4A to 6 can also be applied to a bar-shaped electronic device.

[0114] According to various embodiments disclosed in this document, in an electronic device (200) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A), as illustrated in FIG. 6, an upper speaker module (301) (e.g., the sound output module (155) of FIG. 1, the sound output device (228) of FIG. 2A) is provided on the front surface (222) (e.g., the fourth surface (222) of FIG. 2A) of a housing (220) (e.g., the second housing (220) of FIG. 2A), a lower speaker module (302) (e.g., the sound output module (155) of FIG. 1, the sound output device (228) of FIG. 2A), an upper conduit (305), a lower conduit (306), a camera module (225) (e.g., the camera module (180) of FIG. 1, the third camera module (225) of FIG. 2A), a printed circuit board (272) (e.g., the first printed circuit board of FIG. 3) A substrate (271) or a second printed circuit board (272)), a battery (292) (e.g., the battery (189) of FIG. 1, the first battery (291) or the second battery (292) of FIG. 3), a display module (160) (e.g., the display module (160) of FIG. 1, the first display (230) of FIG. 2A, or the second display (400) of FIG. 2A) (not shown) may be placed. The housing (220) described below may be a concept including a support member (262) (e.g., the second support member (262) of FIG. 3).

[0115] According to various embodiments, referring to FIG. 2b, the upper speaker module (301) can be used as a call receiver (227). In a call operation, the sound of an incoming call can be transmitted to the user through the upper speaker module (301).

[0116] When the user holds the electronic device (200) to make a call, the user's ear may be close to the upper center of the electronic device (200), and thus the portion from which the call sound is emitted may be located at the upper center of the electronic device (200). For example, a receiver hole (not shown) through which the call sound generated from the upper speaker module (301) is emitted may be formed at the upper center of the second rear cover (250). Accordingly, the upper speaker module (301) connected to the receiver hole may be placed at the upper center of the front surface (222) of the housing (220). According to another embodiment, the receiver (227) and the upper speaker module (301) may be separate components.

[0117] According to various embodiments, as illustrated in FIG. 6, sound holes (303, 304) may be formed at the top and / or bottom of the housing (220) of the electronic device (200). The sound holes (303, 304) may include an upper sound hole (303) formed at the top (e.g., +Y direction of FIG. 6) side of the housing (220) and a lower sound hole (304) formed at the bottom (e.g., -Y direction of FIG. 6) side of the housing (220). The upper sound hole (303) and the lower sound hole (304) may be respectively arranged at the center of the top side and the center of the bottom side of the housing (220) to be symmetrical with respect to the X-axis of FIG. 6. Sound generated from the speaker modules (301, 302) may be radiated to the outside of the electronic device (200) through the sound holes (303, 304).

[0118] According to various embodiments, the user can take a self-portrait through the camera module (225). The lens of the camera module (225) may be positioned at the top center of the display module (160) so that the user can easily adjust the shooting composition by checking the user's appearance previewed on the display module (160) through the camera module (225). In one embodiment, the display module (160) has a transparent area through which light can be incident on the lens of the camera module (225), and the lens may face this transparent area. Positioning the lens at the top center of the display module (160) may mean that the transparent area of ​​the display module (160) is positioned at the top center of the display module (160). In addition, the lens may be positioned at the top center of the display module (160) in various ways. Meanwhile, by positioning the lens of the camera module (225) at the center of the display module (160), a symmetrical design may be implemented.

[0119] According to various embodiments, when the upper speaker module (301) and the camera module (225) are arranged at the upper center of the front surface (222) of the housing (220) as illustrated in FIG. 6, an overlap may occur between the upper speaker module (301) and the camera module (225) in the Z-axis direction as illustrated in FIG. 4b. To address this, the shape of the upper conduit (305) connected to the upper speaker module (301) may be changed. This will be described in detail later.

[0120] According to various embodiments, as illustrated in FIG. 6, the width (W2) of the second conduit (305-2) may be smaller than the width (W1) of the first conduit (305-1). Here, the width (W1) of the first conduit (305-1) may refer to the length in the Y-axis direction of the first conduit (305-1) illustrated in FIG. 6. In addition, the width (W2) of the second conduit (305-2) may refer to the length in the Y-axis direction of the second conduit (305-2) illustrated in FIG. 6. At least a portion of the camera module (225) may be arranged in a portion corresponding to the difference between the width (W1) of the first conduit (305-1) and the width (W2) of the second conduit (305-2) in the housing (220). Due to the shape of the upper conduit (305), the upper conduit (305) and the camera module (225) can be placed in the upper central portion of the housing (220) without overlapping.

[0121] According to various embodiments, the extension (307) may be formed at the top of the housing (220). An opening (307-1), which is a part of the extension (307), may be formed at the top of the back surface (221) of the housing (220), as illustrated in FIG. 5A. The extension (307) may refer to a space formed in the housing (220) in the direction from the back surface (221) of the housing (220) to the front surface (222) (e.g., the +Z direction in FIGS. 5A and 5B) through the opening (307-1). In another embodiment, the opening (307-1) may be formed at the top of the front surface (222) of the housing (220). An extension (307) may be formed in the housing (220) from the front (222) to the back (221) of the housing (220) through an opening (307-1) (e.g., the -Z direction in FIG. 5A). An upper conduit (305) may be formed through an opening (307-1) that is part of the extension (307). The extension (307) may refer to a space connecting the opening (307-1) and the upper conduit (305).

[0122] As illustrated in FIGS. 5a and 5b, an extension (307) may be formed in the upper conduit (305). As the volume of the upper conduit (305) decreases, the sound quality radiated from the upper sound hole (303) may deteriorate.

[0123] According to various embodiments, the upper conduit (305) can be formed through the extension portion (307). In addition, as the extension portion (307) is connected to the upper conduit (305), the volume of the upper conduit (305) can increase by the space in which the extension portion (307) is formed, so that the sound quality of the upper conduit (305) can be improved.

[0124] According to various embodiments, as illustrated in FIG. 5b, the guide surfaces (312-1, 312-2) may be inclined to have an expanded cross-sectional area along the sound propagation direction (e.g., +Y direction in FIG. 5b) at the exit (311) through which sound generated from the upper speaker module (301) is emitted. As the cross-sectional area expands along the sound propagation direction, the first conduit (305-1) can secure additional space.

[0125] According to various embodiments, as illustrated in FIG. 5b, a waterproof member (309) may be attached to a portion of the end of the guide surface (312-1, 312-2). The waterproof member (309) may protect the upper speaker module (301) from liquid flowing in through the upper sound hole (303).

[0126] According to various embodiments, the opening (307-1) of FIG. 5b may be formed on the back surface (221) of the housing (220) of FIG. 5a and may be connected to the expansion portion (307). In another embodiment, the opening (307-1) may be formed on the front surface (222) of the housing (220) and may be connected to the expansion portion (307). The opening (307-1) may be closed by the soundproofing material (309) of FIG. 5a. Accordingly, sound generated from the upper speaker module (301) may be prevented from being emitted through the opening (307-1).

[0127] According to various embodiments, the soundproofing material (309) may include two or more different materials, as illustrated in FIG. 5d. For example, it may include a structure in which an adhesive member (401) - an intermediate member (402) - a buffer member (403) are laminated in that order, as illustrated in FIG. 5d. One side (404) of the intermediate member (402) of the soundproofing material (309) may close the opening (307-1) through the adhesive member (401).

[0128] According to various embodiments, the adhesive member (401) illustrated in FIG. 5d may also be attached to the other side (405) of the buffer member (403). The other side (405) of the buffer member (403) may be attached to the display module (160) via the adhesive member (401). The buffer member (403) may alleviate impact applied to the display module (160).

[0129] According to various embodiments, the other side (405) of the buffer member (403) may be a rough surface. An adhesive member (401) may be attached to the other side (405) of the buffer member (403). When the adhesive member (401) is a thin film, the surface roughness of the side attached to the display module (160) may also increase. Accordingly, the display module (160) may be maintained in a fixed position on the other side (405) of the buffer member (403).

[0130] An electronic device according to various embodiments disclosed in the present document (e.g., an electronic device (200) of FIG. 2A) comprises: a first housing (e.g., a second housing (220) of FIG. 2A), a display module (e.g., a first display (230) of FIG. 2A or a second display (400) of FIG. 2A) positioned on the front side of the first housing (e.g., a front side (222) of FIG. 4A), a camera module (e.g., a camera module (225) of FIG. 4A) positioned on the top of the first housing, a speaker module (e.g., an upper speaker module (301) of FIG. 4A) positioned on the first housing adjacent to the camera module, an acoustic hole (e.g., an upper acoustic hole (303) of FIG. 4A) formed on a side surface of the first housing so that sound generated from the speaker module is emitted to the outside of the electronic device, a first conduit (e.g., a first conduit (305-1) of FIG. 4B) extending from the speaker module in the direction of the acoustic hole, and a first conduit of the first conduit. A conduit including a second conduit extending in a direction perpendicular to the extension direction (e.g., the second conduit (305-2) of FIG. 4b), and an expansion portion formed in at least a portion of the conduit for volume expansion of the conduit (e.g., the expansion portion (307) of FIG. 5a) may be included.

[0131] Additionally, the speaker module may be disposed in the first housing in a first direction (e.g., the first direction in FIG. 4b) with respect to a straight line passing through the sound hole and extending in the longitudinal direction of the display module, and the camera module may be disposed in the first housing in a second direction (e.g., the second direction in FIG. 4b) opposite to the first direction with respect to the straight line.

[0132] In addition, the first conduit of the conduit may be located in the first direction with respect to the straight line, and the second conduit of the conduit may be located in the second direction with respect to the straight line.

[0133] Additionally, the second conduit may include a conduit that is relatively narrower than the first conduit.

[0134] In addition, the sound hole includes at least one hole (e.g., hole (303-1) of FIG. 4a), and at least one hole of the sound hole can be arranged in a direction parallel to the direction in which the second pipe extends.

[0135] In addition, the first conduit may include a structure inclined with respect to the radiation direction of the sound hole (e.g., the guide surface (312-1, 312-2) of FIG. 5b).

[0136] Additionally, a second housing (e.g., the first housing (210) of FIG. 2A) may be further included, wherein the first housing may be foldably connected to the second housing.

[0137] In addition, the display module includes a first region (e.g., the second region (231b) of FIG. 3) disposed in the first housing, a second region (e.g., the first region (231a) of FIG. 3) disposed in the second housing, and a third region (e.g., the third region (231c) of FIG. 3) connecting the first region and the second region, and the third region of the display module may be formed so that at least a portion thereof can be folded by folding the first housing relative to the second housing.

[0138] Additionally, the extension portion is connected to an opening (e.g., opening (307-1) of FIG. 5b) formed in the back surface (e.g., back surface (221) of FIG. 5a) of the first housing, and the electronic device may further include a soundproofing material (e.g., soundproofing material (309) of FIG. 5b) arranged to close the opening.

[0139] Additionally, the soundproofing material may include a buffer member (e.g., a buffer member (403) of FIG. 5d) at least in part.

[0140] An electronic device (e.g., an electronic device (200) of FIG. 2A) according to various embodiments disclosed in the present document comprises: a first housing (e.g., a second housing (220) of FIG. 2A), a display module (e.g., a first display (230) of FIG. 2A or a second display (400) of FIG. 2A) positioned on the front side of the first housing (e.g., a front side (222) of FIG. 4A), a camera module (e.g., a camera module (225) of FIG. 4A) positioned on the top of the first housing, an upper speaker module (e.g., an upper speaker module (301) of FIG. 4A) positioned on the top of the first housing adjacent to the camera module, a lower speaker module (e.g., a lower speaker module (302) of FIG. 4A) positioned on the bottom of the first housing, an upper sound hole (e.g., an upper sound hole (303) of FIG. 4A) formed on the top side of the first housing, a lower sound hole (e.g., a lower sound hole (304) of FIG. 4A) formed on the bottom side of the first housing The upper pipe may include a first pipe (e.g., the first pipe (305-1) of FIG. 4b) extending from the upper speaker module in the direction of the upper sound hole (304)) and a second pipe (e.g., the second pipe (305-2) of FIG. 4b) extending in a direction perpendicular to the extension direction of the first pipe, a lower pipe (e.g., the lower pipe (306) of FIG. 4a) extending from the lower speaker module in the direction of the lower sound hole, and an expansion portion (e.g., the expansion portion (307) of FIG. 5a) formed on at least a portion of the upper pipe for expanding the volume of the upper pipe.

[0141] In addition, the upper speaker module may be disposed in the first housing in a first direction (e.g., the first direction in FIG. 4b) with respect to a straight line passing through the upper sound hole and extending in the longitudinal direction of the display module, and the camera module may be disposed in the first housing in a second direction (e.g., the second direction in FIG. 4b) opposite to the first direction with respect to the straight line.

[0142] In addition, the first conduit of the upper conduit may be positioned in the first direction with respect to the straight line, and the second conduit of the upper conduit may be positioned in the second direction with respect to the straight line.

[0143] Additionally, the second conduit may be a relatively narrow conduit compared to the first conduit.

[0144] In addition, the upper sound hole and the lower sound hole each include at least one hole, and at least one hole of the upper sound hole and the lower sound hole (e.g., holes (303-1, 304-1) of FIG. 4a) can be arranged in a direction parallel to the direction in which the second pipe extends.

[0145] Additionally, the first conduit may include a structure inclined with respect to the radiation direction of the upper sound hole (e.g., the guide surface (312-1, 312-2) of FIG. 5b).

[0146] Additionally, a second housing (e.g., the first housing (210) of FIG. 2A) may be further included, wherein the first housing may be foldably connected to the second housing.

[0147] In addition, the display module includes a first region (e.g., the second region (231b) of FIG. 3) disposed in the first housing, a second region (e.g., the first region (231a) of FIG. 3) disposed in the second housing, and a third region (e.g., the third region (231c) of FIG. 3) connecting the first region and the second region, and the third region of the display module may be formed so that at least a portion thereof can be folded by folding the first housing relative to the second housing.

[0148] Additionally, the extension portion may be connected to an opening formed on the back surface of the first housing (e.g., opening (307-1) of FIG. 5b), and the electronic device may further include a soundproofing material (e.g., soundproofing material (309) of FIG. 5b) arranged to close the opening.

[0149] Additionally, the soundproofing material may include a buffer member (e.g., a buffer member (403) of FIG. 5d) at least in part.

[0150] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, 1st housing; A display module located on the front of the first housing; A camera module disposed on the upper part of the first housing; An upper speaker module disposed on the upper side of the first housing adjacent to the camera module; An upper sound hole formed on the upper side of the first housing so that sound generated from the upper speaker module is emitted to the outside of the electronic device; An upper conduit including a first conduit extending from the upper speaker module toward the upper sound hole and a second conduit extending in a direction perpendicular to the extension direction of the first conduit; An electronic device comprising an expansion portion formed in at least a portion of the upper conduit for expanding the volume of the upper conduit.

2. In paragraph 1, The above upper speaker module, It is arranged in the first housing in a first direction with respect to a straight line extending in the longitudinal direction of the display module and passing through the upper sound hole, The above camera module, An electronic device disposed in the first housing in a second direction opposite to the first direction with respect to the straight line.

3. In paragraph 2, The first conduit of the above upper conduit is, Located in the first direction with respect to the above straight line, The second conduit of the above upper conduit is, An electronic device positioned in the second direction with respect to the above straight line.

4. In paragraph 3, The above second conduit is, An electronic device having a relatively narrow conduit compared to the first conduit above.

5. In paragraph 1, The upper sound hole above is, Contains at least one hole, At least one hole of the upper sound hole, An electronic device arranged in a direction parallel to the direction in which the second conduit extends.

6. In paragraph 1, The above first conduit is, An electronic device comprising a structure inclined with respect to the radiation direction of the upper sound hole.

7. In paragraph 1, including a second housing; The above first housing, An electronic device foldably connected to the second housing.

8. In paragraph 7, The above display module, It includes a first region arranged in the first housing, a second region arranged in the second housing, and a third region connecting the first region and the second region, The third area of ​​the above display module is, An electronic device formed so that at least a portion of the first housing can be folded by folding the second housing.

9. In paragraph 1, The above extension part, Connected to the opening formed on the back surface of the first housing, The above electronic device, An electronic device further comprising a soundproofing material arranged to close the opening.

10. In paragraph 9, The above soundproofing material is, An electronic device comprising a buffer member in at least one portion thereof.

11. In paragraph 1, A lower speaker module disposed at the bottom of the first housing; A lower sound hole formed on the lower side of the first housing; and An electronic device comprising a lower conduit extending from the lower speaker module toward the lower sound hole.

12. In paragraph 11, The above lower sound hole is, Each of which contains at least one hole, At least one hole of the above lower sound hole, An electronic device arranged in a direction parallel to the direction in which the second conduit extends.