RADIO FREQUENCY FLIP CHIP DIE, RADIO FREQUENCY DIE, AND RADIO FREQUENCY SIGNALING METHOD

Abstract

The invention relates to a radio frequency (RF) flip-flop chip mold and a method for RF signaling. The proposed RF flip-flop chip is a local ball region adjacent to a mold corner containing a balun with a ball placed in the center. The ball placed in the center is capable of carrying the signal inside the balun. The local ball region includes a crack region at the mold corner which does not contain balls. The local ball region also includes at least one output ball for the balun.