PACKAGES, MACHINES, EQUIPMENT INCLUDING PACKAGES, AND METHODS FOR MANUFACTURING PACKAGES
VN10060816BActive Publication Date: 2026-09-03QUALCOMM INC
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Patent Information
- Application Number
- VN1202300291
- Authority / Receiving Office
- VN · VN
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-06-11
- Publication Date
- 2026-09-03
- Estimated Expiration
- 2041-06-11
Abstract
The term "assembly" refers to the package, the machine, the equipment comprising the package, and the method of manufacturing the package. The package includes a substrate, an integrated component, multiple primary wire connections, at least one secondary wire connection, and an envelope. The integrated component is coupled to the substrate. Multiple primary wire connections are coupled to the integrated component and the substrate. Multiple primary wire connections are configured to provide at least one electrical path between the integrated component and the substrate. At least one secondary wire connection is coupled to the integrated component. At least one secondary wire connection is configured to have no electrical connection to the integrated component's circuit. The envelope rests on the substrate and the integrated component. The envelope encloses the integrated component, multiple primary wire connections, and at least one secondary wire connection.
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