METHODS, SYSTEMS, AND EQUIPMENT FOR PROCESSING SEMICONDUCTOR GUNS

VN10061288BActive Publication Date: 2026-10-01MEERE CO INC

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Patent Information

Application Number: VN1202302988
Authority / Receiving Office: VN · VN
Patent Type: Patents
Current Assignee / Owner
Filing Date: 2021-10-15
Publication Date: 2026-10-01
Estimated Expiration: 2041-10-15

Application Information

Patent Timeline

15 Oct 2021

Application

VN1202302988

01 Oct 2026

Publication

VN10061288B

Inventors: JUNG, Il Jun; KIM, Ki Ho

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Abstract

The invention relates to a method, system and apparatus for processing semiconductor wafers, wherein the method comprises the following steps: preparing a semiconductor wafer with notches on one side, aligning the semiconductor wafer by analyzing the image information of the notch recorded by a camera, and processing the notch by using a wafer to shape the notch so that the notched edge has a predetermined thickness.

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