EQUIPMENT AND PROCESS FOR HOT PRESSING OF ANTHOGROLOGICALLY BONDSTICK FILM (ACF) STRUCTURES

Abstract

The invention relates to a device and process for hot pressing anisotropic conductive array (ACF) structures. The hot pressing device comprises a transfer module and a first mounting plate connected to the transfer module. Negative pressure suction modules, at least one positioning module and a lifting module are arranged in front of the first mounting plate. The pressing modules with hot pressing assemblies are arranged at the four corners near the second mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The invention can quickly remove excess adhesive on the hot-pressing heat-conducting part of the hot-pressing module by means of a cleaning module to ensure the surface flatness of the second part of the heat-pressing heat-conducting part and to ensure the required strength of the ACF connected to the substrate after hot pressing. The invention realizes a highly automated cleaning process, saving time and effort, reducing labor costs, and avoiding the problems associated with traditional manual cleaning.