The connector has a semiconductor cooling device, and it's for automobiles.

Abstract

The invention relates to a connector with a semiconductor cooling device and an automotive. The connector consists of a lead wire (22), a terminal (23) and a semiconductor cooling device (30). One end of the terminal (23) is connected to the lead wire (22) and the other end is used to connect to an external electrical structure. The semiconductor cooling device (30) consists of a cooling part (31) which absorbs the heat of the terminal and a heat dissipation part (32). The invention minimizes the technical problems of high heat generation at the connection point between the lead wire and the terminal as well as the connection point being frequently short-circuited.

Description

Connector and automobile with semiconductor cooling device

[0001] Related applications

[0002] This application claims priority to the Chinese invention patent with patent application number CN202110821575.X, application date July 20, 2021, and invention name “Connector and automobile with semiconductor cooling device”. Technical Field

[0003] The present invention relates to the technical field of electric devices, in particular to a connector with a semiconductor cooling device and a car. Background Art

[0004] The starting current of a car is relatively high, reaching 150A to 250A, placing high demands on the current carrying capacity of wires and connectors. The operating and charging currents of electric vehicles are also relatively high, placing high demands on the current carrying capacity of wires and connectors. Typically, wires have a set rated current and generate relatively stable heat. Using wires with a rated current that meets these requirements ensures the proper current transmission.

[0005] However, due to the high contact resistance at the connection point between the wire and the terminal, there is a large voltage drop between the terminal and the wire. Therefore, the heat generated at the connection point between the wire and the terminal is generally large, resulting in a high incidence of burning of the connection point, which may lead to major safety accidents.

[0006] Therefore, the technical field of electrical devices urgently needs a connector that can alleviate the technical problem that the connection points between wires and terminals generate a lot of heat and the connection points are often burned out.

[0007] Summary of the Invention

[0008] The purpose of the present invention is to provide a connector and a car with a semiconductor cooling device to alleviate the technical problem that the connection point between the wire and the terminal generates a large amount of heat and the connection point is often burned out.

[0009] The above-mentioned purpose of the present invention can be achieved by adopting the following technical solutions:

[0010] The present invention provides a connector with a semiconductor cooling device, which includes: a wire, a terminal and a semiconductor cooling device, wherein the terminal is constructed so that one end thereof is connected to the wire and the other end thereof is used to be connected to an external electrical structure; the semiconductor cooling device has a refrigeration part and a heat dissipation part, and the refrigeration part absorbs the heat of the terminal.

[0011] The present invention provides an automobile, comprising: the above-mentioned connector with the semiconductor cooling device.

[0012] The characteristics and advantages of the present invention are:

[0013] The external electrical structure is connected to the connector with the semiconductor cooling device through the terminal, and is electrically connected to the wire to realize the transmission of electric energy. There is usually a large contact resistance between the external electrical structure and the terminal, and the connection process will continue to generate heat. In this connector, the semiconductor cooling device is electrically connected to the wire and can obtain electric energy from the wire. When the semiconductor cooling device starts to operate, heat is transferred from the cooling part to the heat dissipation part, and the heat of the heat dissipation part is dissipated to the outside, and the temperature of the cooling part gradually decreases. Therefore, the cooling part absorbs the heat of the terminal, so that the terminal and the external electrical structure maintain a safe and stable temperature, achieve stable temperature control, and reduce safety accidents such as burning of the connection point. The use of this connector can solve the problem of excessive temperature of the connection point when the charging current of the electric vehicle is large, which helps to realize high-current and fast charging of the electric vehicle charging harness.

[0014] This connector uses a semiconductor cooling device to cool the terminals. It doesn't use refrigerants or include a moving mechanism, thus avoiding additional vibration and noise. It is safe, stable, and has a long service life. The current in the wires is shunted to power the semiconductor cooling device, eliminating the need for an additional power supply or the installation and replacement of a battery pack. This connector is convenient and durable, ensuring continuous operation and reducing maintenance time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The following drawings are intended only to illustrate and explain the present invention, and are not intended to limit the scope of the present invention.

[0016] FIG1 is a schematic structural diagram of an embodiment of a connector with a semiconductor cooling device provided by the present invention;

[0017] FIG2 is a schematic structural diagram of another embodiment of a connector with a semiconductor cooling device provided by the present invention;

[0018] 3 and 4 are cross-sectional views of a connector with a semiconductor cooling device provided by the present invention;

[0019] 5 to 8 are schematic structural diagrams of another embodiment of a connector with a semiconductor cooling device provided by the present invention;

[0020] 9 to 17 are schematic diagrams of terminals and wires in a connector with a semiconductor cooling device provided by the present invention;

[0021] 18-20 are schematic structural diagrams of another embodiment of a connector with a semiconductor cooling device provided by the present invention;

[0022] FIG21 is a structural diagram of a semiconductor cooling device in a connector with a semiconductor cooling device provided by the present invention. DETAILED DESCRIPTION

[0023] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described with reference to the accompanying drawings. In the description of the present invention, unless otherwise specified, the meaning of "multiple" is two or more.

[0024] Example 1

[0025] The present invention provides a connector with a semiconductor cooling device, as shown in Figure 1, the connector includes: a wire 22, a terminal 23 and a semiconductor cooling device 30, the wire 22 is connected to the terminal 23, and the terminal 23 is configured to be connected to an external electrical structure; the semiconductor cooling device 30 has a cooling part 31 and a heat dissipation part 32, the cooling part 31 absorbs heat from the terminal 23; and the semiconductor cooling device 30 is electrically connected to the wire 22.

[0026] Specifically, in principle, the semiconductor cooling device 30 is a heat transfer tool. When current flows through a thermocouple pair composed of an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, creating a temperature difference between the hot and cold ends. The semiconductor cooling device 30 described herein includes not only a cooling end but also a hot end, located opposite the cooling end. The semiconductor cooling device 30 can utilize existing semiconductor cooling devices and can also be customized based on the size of the conductor.

[0027] The external electrical structure is connected to the connector through the terminal 23 and is electrically connected to the wire 22 to achieve the transmission of electrical energy. There is usually a large contact resistance between the external electrical structure and the terminal 23, and the connection process will continue to generate heat. In this connector, the semiconductor cooling device 30 is electrically connected to the wire 22 and can obtain electrical energy from the wire 22. The semiconductor cooling device 30 starts to operate, and heat is transferred from the refrigeration part 31 to the heat dissipation part 32. The heat of the heat dissipation part 32 is dissipated to the outside, and the temperature of the refrigeration part 31 gradually decreases. Therefore, the refrigeration part 31 absorbs the heat of the terminal 23, so that the terminal 23 and the external electrical structure maintain a safe and stable temperature, achieve stable temperature control, and reduce safety accidents such as burning of the connection point. The use of this connector can solve the problem of excessive temperature of the connection point when the charging current of the electric vehicle is large, which helps to achieve high-current and fast charging of the electric vehicle charging harness.

[0028] This connector uses a semiconductor cooling device 30 to cool the terminal 23. It does not use refrigerants or include a moving mechanism, thus avoiding additional vibration and noise. It is safe, stable, and has a long service life. The current in the conductor 22 is shunted to provide power to the semiconductor cooling device 30. This eliminates the need for an additional power supply and the installation and replacement of a battery pack. This connector is convenient and durable, facilitating continuous operation and reducing maintenance time.

[0029] In one embodiment, the connector further includes a protective structure device 10. As shown in FIG2 , the terminals 23 are disposed within the protective structure device 10. In certain high-current environments, the terminals 23 require insulation protection. The protective structure device 10 is disposed on the periphery of the terminals 23 to insulate the terminals 23 from the external environment. In addition, when there are a large number of terminals 23, when connecting to an external electrical structure, the terminals 23 need to be plugged in one by one, which is complicated and time-consuming. Multiple terminals 23 are placed in the protective structure device 10 at intervals. By plugging the protective structure device 10 into the external electrical structure, the internal terminals 23 are plugged in one by one. This is simple to operate, and it is less likely that the wrong terminal will be plugged in, thereby ensuring the correctness and safety of the circuit. The protective structure device 10 may be a sheath.

[0030] In one embodiment, the connector includes a rectifier 51. One end of the rectifier 51 is electrically connected to the semiconductor cooling device 30 via a connecting wire 54, and the other end of the rectifier 51 is electrically connected to the conductor 22 via the connecting wire 54. The rectifier 51 can be electrically connected to the connecting portion 21 via the connecting wire 54, thereby achieving electrical connection with the conductor 22. The current in the conductor 22 is split to power the semiconductor cooling device 30. The rectifier 51 adjusts the current and voltage to match the operating current and voltage of the semiconductor cooling device 30, ensuring stable operation of the semiconductor cooling device 30.

[0031] Furthermore, the connector's control unit 50 includes a control device 52 connected to a rectifier 51. The control device 52 is configured to regulate the current flowing through the rectifier 51 to the semiconductor cooling device 30. By regulating the current flowing through the semiconductor cooling device 30 through the control device 52, the temperature of the cooling portion 31 of the semiconductor cooling device 30 is adjusted, thereby regulating the temperature of the connecting portion 21. Specifically, one end of the rectifier 51 is electrically connected to the wire 22, and the other end of the rectifier 51 is electrically connected to the control device 52 and the semiconductor cooling device 30, respectively, to provide power to the control device 52 and the semiconductor cooling device 30.

[0032] As shown in Figure 3, the connector includes a temperature sensor 53 connected to a control device 52. The temperature sensor 53 is in contact with the terminal 23 and / or the cooling unit 31. The temperature sensor 53 detects the temperature of the connector and transmits a temperature signal to the control device 52. The control device 52 controls the rectifier 51 based on the detected temperature to adjust the supply current of the semiconductor cooling device 30, thereby adjusting the temperature of the cooling unit 31 of the semiconductor cooling device 30 and ensuring a stable operating temperature of the connector 21. For example, when the temperature rises, the control device 52 controls the rectifier 51 to increase the supply current, accelerating the efficiency of heat dissipation from the semiconductor cooling device 30. When the temperature drops, the control device 52 controls the rectifier 51 to decrease the supply current, slowing the efficiency of heat dissipation from the semiconductor cooling device 30. The temperature sensor 53, the control device 52, and the rectifier 51 cooperate to regulate the current of the semiconductor cooling device 30, thereby maintaining a constant temperature of the connector and preventing temperature fluctuations caused by current fluctuations in the wire 22. Preferably, the temperature sensor 53 is in contact with the connection portion 21 , and the temperature sensor 53 is used to detect the temperature of the connection portion 21 .

[0033] The control device 52 can be a mechanical control device, comprising at least two alloy plates with different thermal expansion coefficients. The alloy plates bend and deform in response to temperature changes, driving the closing and opening of contacts to power the mechanical control device on and off. The control device 52 can also be an electronic control device, which receives electrical signals from the temperature sensor 53, analyzes them on a chip, and then controls the power on and off of the semiconductor cooling device 30.

[0034] The rectifier 51 integrates the unstable large current in the wire 22 into a stable small current that can be used by the control device 52 and the temperature sensor 53 through a combination of resistors, diodes and other electronic components, thereby achieving continuous and stable power supply.

[0035] The temperature sensor 53 can be a contact temperature sensor, specifically a bimetallic thermometer, a pressure thermometer, a resistance thermometer, a thermistor or a thermocouple. The temperature sensor 53 can convert the real-time temperature of the connecting part 21 or the refrigeration part 31 into an electrical signal and transmit it to the control device 52.

[0036] In one embodiment, the semiconductor cooling device 30 includes multiple semiconductor cooling devices 30. In order to accurately control the temperature of each semiconductor cooling device 30, the multiple semiconductor cooling devices 30 are electrically connected to the rectifier device 51 in parallel, so that the power supply current of each semiconductor cooling device 30 can be individually controlled.

[0037] Furthermore, when the models and powers of the plurality of semiconductor cooling devices 30 are completely consistent, the plurality of semiconductor cooling devices 30 are electrically connected in series to the rectifier device 51 , so that the power supply current of each semiconductor cooling device 30 is consistent.

[0038] Furthermore, the semiconductor cooling device 30 is embedded in the side wall of the protective structure device 10, and the refrigeration part 31 is located inside the side wall of the protective structure device 10, and the heat dissipation part 32 is at least partially exposed to the outside of the protective structure device 10, so as to facilitate the refrigeration part 31 of the semiconductor cooling device 30 to absorb heat from the terminal 23 and dissipate heat to the outside through the heat dissipation part 32.

[0039] In one embodiment, the heat of the terminal 23 is transferred to the cooling portion 31 by radiation. In another embodiment, the cooling portion 31 is connected to the terminal 23 to absorb the heat of the terminal.

[0040] As shown in Figures 2 to 5, the cooling unit 31 is in contact with the terminal 23, which is conducive to the rapid transfer of heat from the terminal 23 to the cooling unit 31, so that the heat is dissipated outward in time, and can fully take away the heat generated by the terminal 23, reduce the temperature, and achieve the purpose of rapid cooling.

[0041] Furthermore, the cooling portion 31 is provided with a receiving groove 311, and the terminal 23 is at least partially embedded in the receiving groove 311. The shape of the receiving groove 311 is adapted to the outer contour of the terminal 23. The terminal 23 contacts the inner wall of the receiving groove 311, so that the cooling portion 31 and the terminal 23 are kept in close contact, increasing the contact area and facilitating the transfer of heat from the terminal 23 to the cooling portion 31. Preferably, as shown in FIG4 , the receiving groove 311 is semi-cylindrical.

[0042] As shown in Figures 6, 7, and 18, the connector includes a heat-conducting portion 41, which is in contact with and connected to the terminal 23, and the cooling portion 31 is in contact with and connected to the heat-conducting portion 41. Heat from the connecting portion 21 is transferred to the cooling portion 31 via the heat-conducting portion 41. The heat-conducting portion 41 facilitates close contact between the terminal 23, the heat-conducting portion 41, and the cooling portion 31, facilitating rapid transfer of heat generated by the terminal 23 to the cooling portion 31, thereby lowering the temperature, improving heat dissipation performance, achieving rapid cooling, and ensuring a constant temperature at the terminal 23. The heat-conducting portion 41 can be made of a thermally conductive and non-conductive material; the heat-conducting portion 41 can be formed by filling the space between the terminal 23 and the cooling portion 31 with a thermally conductive and non-conductive material. The material of the heat-conducting portion 41 can be one or a combination of thermally conductive silicone grease, thermally conductive mica sheets, thermally conductive ceramic sheets, and thermally conductive silicone sheets.

[0043] Furthermore, the heat conducting portion 41 surrounds the terminal 23, and the cooling portion 31 contacts the terminal 23 through the heat conducting portion 41. The heat conducting portion 41 can be configured as a cylinder to facilitate absorption of heat generated at different positions of the terminal 23. In some cases, the connector includes multiple terminals 23, and multiple heat conducting portions 41 can be provided for each terminal. The heat conducting portions 41 are sleeved outside the terminal 23 in a one-to-one correspondence, and the multiple heat conducting portions 41 are all in contact with the cooling portion 31 of a semiconductor cooling device 30. Alternatively, a single heat conducting portion 41 surrounds multiple terminals 23, and heat from the multiple terminals 23 is transferred to the cooling portion 31 through the heat conducting portion 41.

[0044] In one embodiment of the present invention, the connector includes at least two semiconductor cooling devices 30, located on either side of the terminal 23. These two semiconductor cooling devices 30 absorb heat from both sides of the terminal 23, improving cooling efficiency. As shown in Figures 5 and 7 , the two semiconductor cooling devices 30 can be located on opposite sides of the terminal 23.

[0045] As shown in Figure 8, the connector includes multiple terminals 23, each with a connecting portion 21 connected to a wire 22. The connector also includes multiple semiconductor cooling devices 30, each comprising a first cooling device 301 and a second cooling device 302. The first cooling device 301, the multiple connecting portions 21, and the second cooling device 302 are sequentially arranged. In one embodiment, the multiple terminals 23 are arranged in a left-right direction, with the first cooling device 301 located at the left end and the second cooling device 302 located at the right end. Furthermore, semiconductor cooling devices 30 are provided on the upper and lower sides of the terminals 23.

[0046] In one embodiment, the cooling portion 31 is provided with a receiving hole 312, through which the terminal 23 is inserted. The receiving hole 312 accommodates the terminal 23, thereby achieving contact and connection between the cooling portion 31 and the terminal 23. This improves the spatial arrangement of the terminal 23 and the wire 22, increases the contact area, and facilitates heat transfer from the terminal 23 to the cooling portion 31. In particular, when the connector includes multiple terminals 23 and wires 22, they can be arranged in a smaller space, ensuring heat dissipation from each terminal 23.

[0047] Furthermore, the semiconductor cooling device 30 includes multiple heat dissipation portions 32, which are distributed around the cooling portion 31 to facilitate heat dissipation. As shown in Figure 19, the cooling portion 31 is provided with multiple accommodating holes 312; the connector includes multiple terminals 23, which are correspondingly inserted into the accommodating holes 312. Preferably, the cooling portion 31 is generally square in shape, with the heat dissipation portions 32 distributed on the four sides of the cooling portion 31.

[0048] In one embodiment, the cooling part 31 is provided with a plurality of accommodating holes 312; the connector includes a plurality of terminals 23, and the terminals 23 are respectively inserted into the accommodating holes 312. As shown in FIG19 , the terminals 23 are inserted into the cooling part 31, and the heat dissipation part 32 is sleeved outside the cooling part 31, which is conducive to full contact between the cooling part 31 and the terminals 23, and promotes the heat on the terminals 23 to be transferred to the heat dissipation part 32 through the cooling part 31 with higher efficiency, thereby improving the compactness of the structure and facilitating the arrangement of multiple terminals 23 and semiconductor cooling devices 30.

[0049] In one embodiment, both the cooling section 31 and the heat dissipation section 32 are cylindrical. As shown in Figure 20 , the terminals 23 are inserted into the cooling section 31, and the heat dissipation section 32 is sleeved outside the cooling section 31. The cylindrical shapes of the cooling section 31 and the heat dissipation section 32 are easy to manufacture and have a large contact area, making it easier to transfer heat from the terminals 23 to the heat dissipation section. Furthermore, both the cooling section 31 and the heat dissipation section 32 are cylindrical.

[0050] In one embodiment, the terminal 23 includes a terminal portion 231 and a connecting portion 21. The terminal portion 231 is configured to connect to an external electrical structure, and the connecting portion 21 is configured to connect to the wire 22. The shape of the connecting portion 21 is not limited to one. For example, as shown in FIG9 , the initial shape of the connecting portion 21 is U-shaped, having a U-shaped groove in which the wire 22 is disposed. As shown in FIG10 , the sidewalls of the U-shaped groove are bent inward, which can compress the wire 22, thereby connecting the terminal 23 and the wire 22 together. As shown in FIG11-14 , the connecting portion 21 can be a cylindrical body, in which the wire 22 is disposed. As shown in FIG15-17 , the connecting portion 21 can be plate-shaped, with the wire 22 disposed on one side of the connecting portion 21. The wire 22 and the connecting portion 21 can be fixedly connected by welding or crimping. The terminal portion 231 and the connecting portion 21 can be integral or separate structures, and the two can be fixed together by welding. Preferably, the location where the terminal 23 is connected to the cooling unit 31 is the connecting portion 21 , which is beneficial for the cooling unit 31 to absorb heat from the terminal 23 .

[0051] Furthermore, the contact area between the cooling portion 31 and the connecting portion 21 accounts for at least 3% of the surface area of ​​the connecting portion 21 to ensure the efficiency of heat absorption.

[0052] In order to verify the influence of the contact area between the cooling part 31 and the connecting part 21 and the ratio range of the contact area between the cooling part 31 and the connecting part 21 to the surface area of ​​the connecting part 21 on the temperature rise of the terminal 23, the inventor selected 11 groups of wires 22 with the same cross-sectional area, the same material, and the same length, and the same terminal 23, and passed the same current. Different ratios of the contact area between the cooling part 31 and the connecting part 21 to the surface area of ​​the connecting part 21 were used, and the corresponding temperature rise values ​​were read and recorded in Table 1.

[0053] The experimental method involves passing the same current through connectors in a closed environment, each with a different ratio of the contact area between the cooling portion 31 and the connecting portion 21 to the surface area of ​​the connecting portion 21. The temperature before power is applied and the temperature after power is applied, when the temperature stabilizes, are recorded, and the absolute value of the difference is taken. In this embodiment, a temperature rise of less than 50K is considered acceptable.

[0054] Table 1: Effect of different contact areas between the cooling unit 31 and the connecting unit 21 and the ratio of the contact area to the surface area of ​​the connecting unit 21 on the connector temperature rise

[0055]

[0056] As can be seen from Table 1, when the contact area between the cooling unit 31 and the connecting portion 21 accounts for less than 3% of the surface area of ​​the connecting portion 21, the connector's temperature rise falls below the acceptable value. A larger coverage area indicates a lower temperature rise. Therefore, the inventors set the contact area between the cooling unit 31 and the connecting portion 21 to at least 3% of the surface area of ​​the connecting portion 21.

[0057] The wire 22 includes an internal conductor 221 and an insulating layer 222 surrounding the conductor 221. The terminal end of the conductor 221 is connected to the terminal 23. The semiconductor cooling device 30 is fixed to the protective structure 10, with the cooling portion 31 facing inward and the heat dissipation portion 32 facing outward. The surface of the cooling portion 31 is disposed on the surface of the protective structure 10 or outside the protective structure 10. The external electrical structure can be a wiring harness or terminal that is compatible with the terminal 23.

[0058] In one embodiment of the present invention, as shown in FIG. 21 , the semiconductor cooling device 30 includes an alumina substrate 1011 , a waterproof protective layer 1012 , a semiconductor P / N layer 1013 , and a power interface 1014 .

[0059] The alumina substrate 1011 , the waterproof protection layer 1012 , and the semiconductor P / N layer 1013 are sequentially provided. The power interface 1014 is electrically connected to the semiconductor P / N layer 1013 .

[0060] The alumina substrate 1011 constitutes the hot end of the semiconductor cooling device 30 , namely the heat dissipation portion 32 . The semiconductor P / N layer 1013 constitutes the cold end of the semiconductor cooling device 30 , namely the cooling portion 31 .

[0061] This embodiment utilizes an alumina substrate 1011 as the surface of the semiconductor cooling device 30, improving thermal conductivity and enabling faster heat transfer, shorter cooling times, and greater endurance strength. Flexible connections allow for better adhesion to conductors, effectively absorbing surface stress at bends in the conductor, and resisting breakage during installation and use. The core of the semiconductor cooling device 30 utilizes a PN junction constructed from a specialized semiconductor material. When current flows through a thermocouple pair formed by connecting an N-type semiconductor material to a P-type semiconductor material, heat transfer occurs between the two ends, creating a temperature difference between the hot and cold ends. This allows for cooling control by controlling the DC current.

[0062] In one embodiment of the present invention, the cooling rate of the semiconductor cooling device 30 is 0.05K / s-5K / s.

[0063] In order to verify the effect of the cooling rate of the semiconductor cooling device 30 on the temperature rise of the connector, the inventor selected 10 wires 22 of the same cross-sectional area, the same material, and the same length, and the same terminals 23, and passed the same current. The semiconductor cooling devices 30 with different cooling rates were used to cool the connector, and the corresponding temperature rise values ​​were read and recorded in Table 2.

[0064] Table 2: Effect of different cooling rates of semiconductor cooling device 30 on connector temperature rise

[0065]

[0066] The experimental method involves passing the same current through connectors with different cooling rates in a closed environment. The temperature before and after power is applied is recorded, and the absolute value of the difference is calculated. In this embodiment, a temperature rise of less than 50K is considered acceptable.

[0067] As can be seen from Table 2, when the cooling rate of the semiconductor cooling device 30 is less than 0.05K / s, the temperature rise of the connector is less than the acceptable value. The higher the cooling rate of the semiconductor cooling device 30, the lower the temperature rise. However, when the cooling rate of the semiconductor cooling device 30 exceeds 5K / s, the temperature rise does not decrease significantly due to the heat generated by the connector itself and the power of the semiconductor cooling device 30 itself. However, the power of the semiconductor cooling device 30 increases, which is not economical. Therefore, the inventors set the cooling rate of the semiconductor cooling device 30 to 0.05K / s-5K / s.

[0068] In one embodiment of the present invention, the connector includes a heat sink 42 connected to the heat sink 32 to improve heat dissipation, facilitate heat dissipation from the heat sink 32 of the semiconductor cooling device 30, and ensure rapid cooling. Specifically, the heat sink 42 can be a fan, a heat exchanger, or a liquid cooling device. As shown in Figures 3 and 4, the heat sink 42 can also be heat fins 421, preferably made of metal.

[0069] The connector has the following advantages: (1) The cooling time is short. When the temperature of the connection part 21 rises, the connection part 21 can be cooled in a relatively short time; (2) The temperature of the connector can be controlled relatively stably to prevent the connection point from burning out due to overload, thereby reducing safety accidents; (3) By reducing the temperature of the connection point, it is possible to design the cable without increasing the wire diameter. When designing the cable, the wire diameter at the rated heating curve can be used. It is not necessary to consider increasing the wire diameter of the cable to reduce the resistance of the connection part during design, thereby reducing the wire diameter of the cable and reducing the cost of the cable; (4) By using the connector, the problem of excessive temperature of the connection point when the charging current of the electric vehicle is large can be solved, which helps to achieve high-current and fast charging of the electric vehicle charging harness; (5) The heat dissipation part 32 of the semiconductor cooling device 30 can be connected to other components that need to be heated, thereby improving energy utilization.

[0070] Example 2

[0071] The present invention provides a car, comprising the above-mentioned connector with a semiconductor cooling device. The connector in the car has the above-mentioned structure, function and beneficial effects, which will not be described in detail here.

[0072] The above description is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A connector having a semiconductor cooling device, wherein, The connector includes: wires, terminals, and a semiconductor cooling device, wherein the terminals are configured such that one end is connected to the wires and the other end is used for connection to an external electrical structure; The semiconductor cooling device has a cooling section and a heat dissipation section, wherein the cooling section absorbs heat from the terminal.

2. The connector as claimed in claim 1, wherein, The semiconductor cooling device is electrically connected to the wire.

3. The connector as claimed in claim 1, wherein, include: A protective structure device, wherein the terminal is disposed within the protective structure device.

4. The connector as claimed in claim 1, wherein, The connector includes a rectifier, one end of which is electrically connected to the semiconductor cooling device, and the other end of which is electrically connected to the wire.

5. The connector as claimed in claim 4, wherein, The connector includes a control device connected to the rectifier, the control device being used to regulate the current flowing from the rectifier to the semiconductor cooling device.

6. The connector as claimed in claim 5, wherein, The connector includes a temperature sensor connected to the control device, the temperature sensor being in contact with the terminal, and / or the temperature sensor being in contact with the cooling unit.

7. The connector as claimed in claim 4, wherein, The semiconductor cooling device includes multiple semiconductor cooling devices, and the multiple semiconductor cooling devices are electrically connected to the rectifier.

8. The connector as claimed in claim 3, wherein, The semiconductor cooling device is embedded in the side wall of the protective structure device, and the cooling part is located inside the side wall of the protective structure device, while at least a portion of the heat dissipation part is exposed outside the protective structure device.

9. The connector as claimed in claim 1, wherein, The cooling unit is in contact with the terminal.

10. The connector as claimed in claim 1, wherein, The heat from the terminals is transferred to the cooling unit via radiation.

11. The connector as claimed in claim 9, wherein, The cooling section is provided with a receiving groove, and the terminal is at least partially embedded in the receiving groove.

12. The connector as claimed in claim 1, wherein, The connector includes a heat-conducting part that is in contact with the terminal, and a cooling part that is in contact with the heat-conducting part; the heat-conducting part is made of one or a combination of thermal grease, thermal mica sheet, thermal ceramic sheet and thermal silicone sheet.

13. The connector of claim 12, wherein, The heat-conducting part surrounds the terminal.

14. The connector as claimed in claim 1, wherein, The connector includes at least two semiconductor cooling devices, which are distributed on both sides of the terminal.

15. The connector as claimed in claim 1, wherein, The cooling unit is provided with a receiving hole, and the terminal passes through the receiving hole.

16. The connector as claimed in claim 1, wherein, The semiconductor cooling device includes a plurality of heat dissipation sections, which are arranged around the cooling section.

17. The connector of claim 15, wherein, The cooling section is provided with a plurality of the receiving holes; the connector includes a plurality of the terminals, each of which is correspondingly inserted through the receiving hole.

18. The connector as claimed in claim 1, wherein, Both the cooling section and the heat dissipation section are cylindrical, with the terminal passing through the cooling section and the heat dissipation section sleeved outside the cooling section.

19. The connector of claim 18, wherein, Both the cooling section and the heat dissipation section are cylindrical.

20. The connector as claimed in claim 1, wherein, The terminal has a terminal portion and a connection portion for connecting to the wire, and the cooling portion is connected to the connection portion.

21. The connector of claim 20, wherein, The contact area between the cooling unit and the connecting unit accounts for at least 3% of the surface area of ​​the connecting unit.

22. The connector as claimed in claim 1, wherein, The semiconductor cooling device includes: an alumina substrate, a waterproof protective layer, a semiconductor P / N layer, and a power interface; The alumina substrate, the waterproof protective layer, and the semiconductor P / N layer are sequentially arranged. The power interface is electrically connected to the semiconductor P / N layer.

23. The connector of claim 22, wherein, The cooling rate of the semiconductor cooling device is 0.05K / s-5K / s.

24. The connector as claimed in claim 1, wherein, The connector includes a heat dissipation device connected to the heat dissipation section.

25. A type of automobile, wherein, include: The connector with a semiconductor cooling device according to any one of claims 1-24.

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