Cables are used in cooling systems, power transmission devices, and electric vehicles.

Abstract

The invention relates to a cooling cable, current transmission device, and electric vehicle, in the field of current transmission, where the cooling cable comprises: a semiconductor cooling module, conductors, and a control module; the cooling end of the semiconductor cooling module is arranged on at least one side of the conductor to absorb heat dissipated from the conductor; the semiconductor cooling module is electrically connected to the control module, and the control module is constructed to control the electrical signal supplied to the semiconductor cooling module. The cooling cable proposed in the invention has the advantages of simple structure, flexible size, reliable performance, no noise, and no pollution from the refrigerant.

Description

Cable, current transmission equipment and electric vehicle with cooling function

[0001] This application claims priority to Chinese patent application number 202110821578.3, filed on July 20, 2021, entitled “Cable, current transmission device and electric vehicle with cooling function”, all contents of which are incorporated herein by reference. This application also claims priority to Chinese patent application number 202121653535.0, filed on July 20, 2021, entitled “Cable, current transmission device and electric vehicle with cooling function”, all contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to the field of current transmission, and in particular to a cable with cooling function, a current transmission device and an electric vehicle. Background Art

[0003] With the global energy crisis and the impact of increasingly severe global warming, the new energy vehicle industry has become a rapidly developing industry, such as the electric vehicle industry. However, the long charging time of electric vehicles has become a bottleneck restricting the widespread use of electric vehicles. Currently, the current for fast charging electric vehicles reaches 150A to 400A. This high current causes high heat in the charging cable, which is also the main reason for limiting the charging current of electric vehicles.

[0004] To solve this problem, one approach is to increase the cross-sectional area of ​​the cable to reduce the heat generated, but this will significantly increase the cost of the cable. Another approach is to use cooling technology to cool the cable.

[0005] Currently, high-current charging cables are mostly cooled using liquid and air cooling technologies. While liquid cooling offers excellent cooling performance, it requires additional cooling lines, water pumps, and heat sinks, leading to complex system structures, extremely high safety and stability requirements, and increased costs. Air cooling, however, is limited by installation dimensions and space, resulting in low cooling efficiency and the generation of additional noise, which impacts the vehicle's NVH (Noise, Vibration, and Harshness) performance.

[0006] Therefore, the field of current transmission urgently needs a cable with a cooling function that can quickly cool the cable, increase the charging current, and reduce the cross-sectional area of ​​the cable.

[0007] Summary of the Invention

[0008] This paper aims to solve the problems of complex structure and high cost of conductor cooling using liquid cooling technology in the existing technology, and the problems of low cooling efficiency and high noise using air cooling technology in the existing technology.

[0009] In order to solve the above technical problems, a first aspect of this invention provides a cable with a cooling function, comprising: a semiconductor cooling module 101, a conductor 102 and a control module 103;

[0010] The cooling end of the semiconductor cooling module 101 is disposed on at least one side of the conductor 102 to absorb heat dissipated by the conductor 102;

[0011] The semiconductor cooling module 101 is electrically connected to the control module 103 , and the control module 103 is used to control the electrical signal supplied to the semiconductor cooling module 101 .

[0012] A second aspect of this document provides a current transmission device, comprising: the cable 100 with a cooling function, a charging module 200, and a battery module 300 according to any of the aforementioned embodiments;

[0013] Two ends of the cable 100 with a cooling function are respectively connected to the charging module 200 and the battery module 300 , so as to transmit the electric energy obtained by the charging module 200 to the battery module 300 .

[0014] As a further embodiment of this document, the control module 103 is connected to the charging module 200 , and the charging module 200 is used to provide power to the control module 103 .

[0015] A third aspect of this document provides an electric vehicle comprising the current transmission device described in any of the aforementioned embodiments.

[0016] The cable with cooling function provided herein, the current transmission equipment and the electric vehicle, by arranging the cooling layer structure made of the semiconductor cooling module on the side of the conductor, the semiconductor cooling module is powered by the control module, and can absorb the heat generated by the semiconductor cooling module when the conductor passes high voltage and high current, thereby reducing the temperature rise of the conductor. When the conductor size is constant, it can carry a larger current and meet the temperature rise requirements. The cable with cooling function provided herein only requires a semiconductor cooling module and a control module to achieve the cooling of the conductor, and therefore has the advantage of a simple structure. The cable with cooling function provided herein only requires the semiconductor cooling model to be arranged on the side of the conductor, and therefore has the advantage of flexible size. The cable with cooling function provided herein is controlled by the control module to supply the electrical signal to the semiconductor cooling module, so that the semiconductor cooling module cools the conductor, and therefore has the advantages of reliable performance, no noise, and no refrigerant pollution.

[0017] In order to make the above and other purposes, features and advantages of this article more obvious and easy to understand, the following specifically cites preferred embodiments and provides detailed descriptions in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of this article or the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of this article. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] FIG1 shows a structural diagram of a cable with a cooling function according to an embodiment of the present invention;

[0020] 2A and 2B show a cross-sectional view of a cable with a cooling function according to an embodiment of the present invention;

[0021] FIG3 shows another cross-sectional view of the cable with cooling function according to the embodiment of the present invention;

[0022] FIG4 shows a first circuit diagram of a cable with a cooling function according to an embodiment of the present invention;

[0023] FIG5 shows a second circuit diagram of a cable with a cooling function according to an embodiment of the present invention;

[0024] FIG6 shows a partial enlarged view of a cable with a cooling function according to an embodiment of the present invention;

[0025] FIG7 shows a first flow chart of a process in which a control module adjusts an electrical signal of a semiconductor cooling module according to an embodiment of the present invention;

[0026] FIG8 shows a second flow chart of the process of the control module adjusting the electrical signal of the semiconductor cooling module according to the embodiment of this invention;

[0027] FIG9 shows a third flow chart of the process of adjusting the electrical signal of the semiconductor cooling module by the control module according to the embodiment of this invention;

[0028] FIG10 shows a cross-sectional view of a current transfer device according to an embodiment of the present invention;

[0029] FIG11 shows a structural diagram of a semiconductor cooling module according to an embodiment of the present invention;

[0030] FIG12 shows a structural diagram of a computer device according to an embodiment of the present invention.

[0031] Description of the accompanying symbols:

[0032] 100. Cable with cooling function;

[0033] 101. Semiconductor cooling module;

[0034] 102. Conductor;

[0035] 103. Control module;

[0036] 104. Rectifier module;

[0037] 105. Temperature detector;

[0038] 106. Low voltage wiring harness;

[0039] 107. Insulation protective layer;

[0040] 200. Charging module;

[0041] 300, battery module;

[0042] 1011, alumina substrate;

[0043] 1012. Waterproof protective layer;

[0044] 1013, semiconductor P / N layer;

[0045] 1014, power interface;

[0046] 1302. Computer equipment;

[0047] 1304, processor;

[0048] 1306. Memory;

[0049] 1308, driving mechanism;

[0050] 1310, input / output module;

[0051] 1312. Input devices;

[0052] 1314. Output device;

[0053] 1316. Presentation equipment;

[0054] 1318. Graphical User Interface;

[0055] 1320, network interface;

[0056] 1322, communication link;

[0057] 1324. Communication bus. DETAILED DESCRIPTION

[0058] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of this document. Obviously, the embodiments described are only part of the embodiments of this document, not all of the embodiments. Based on the embodiments of this document, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this document.

[0059] This specification provides method operation steps as described in the embodiments or flowcharts, but more or fewer operation steps may be included based on routine or non-creative work. The order of steps listed in the embodiments is only one way of executing the steps among many orderings and does not represent the only execution order. When a system or device product is actually executed, the method can be executed in the order shown in the embodiments or the drawings or in parallel.

[0060] The exemplary embodiments and descriptions herein are used to explain the present invention, but are not intended to limit the present invention. In addition, elements / components with the same or similar reference numerals in the drawings and embodiments are used to represent the same or similar parts.

[0061] Existing technologies primarily cool high-current conductors using liquid cooling and air cooling. Liquid cooling requires additional cooling pipes, water pumps, and heat sinks, leading to complex system structures, extremely high safety and stability requirements, and increased costs. Air cooling, however, is limited by installation dimensions and space, resulting in low cooling efficiency, excessive noise, and impacts on the vehicle's NVH.

[0062] In order to solve the above technical problems, in one embodiment of this invention, a new cable with cooling function is provided. The cable with cooling function provided in this invention has the advantages of simple structure, flexible size, reliable performance, no noise and no refrigerant pollution.

[0063] Specifically, as shown in FIG1 and FIG5 , the cable with cooling function includes: a semiconductor cooling module 101 , a conductor 102 and a control module 103 ;

[0064] The cooling end of the semiconductor cooling module 101 is disposed on at least one side of the conductor 102 to absorb heat dissipated by the conductor 102 .

[0065] The semiconductor cooling module 101 is electrically connected to the control module 103 , and the control module 103 is used to control the electrical signal supplied to the semiconductor cooling module 101 .

[0066] Specifically, in principle, the semiconductor cooling module 101 is a heat transfer tool. When current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, creating a temperature difference between the hot and cold ends. The semiconductor cooling module 101 described herein includes not only a cooling end but also a hot end, positioned opposite the cooling end. The semiconductor cooling module 101 can utilize existing semiconductor cooling modules and can be customized based on the size of the conductor. The semiconductor cooling module 101 can completely or partially cover the conductor 102.

[0067] The amount of heat released or absorbed by the semiconductor cooling module 101 is determined by the magnitude of the current. Therefore, the semiconductor cooling module 101 described in this article can be used to control the electrical signal (including current signal and voltage signal) supplied to the semiconductor cooling module 101 through the control module 103, thereby achieving the effect of controlling the temperature rise of the conductor 102, so that the cable with cooling function can operate at a stable temperature.

[0068] The control module 103 supplies power to the semiconductor cooling module 101 (e.g., low-voltage 12V DC). The control module 103 controls the connection between the semiconductor cooling module 101 and the semiconductor cooling module 101 to achieve access control. During implementation, the control logic of the semiconductor cooling module 101 can be set by the staff according to actual needs. For example, different semiconductor cooling modules 101 can be connected in different time periods, or different electrical signals of the conductor 102 can be connected to different semiconductor cooling modules 101. This article does not limit the control logic of the electrical signals supplied to the semiconductor cooling module by the control module 103. As long as the logic can achieve electrical signal control, it falls within the scope of protection of this article. Through the power supply and control method of this article, the structure of the cable with cooling function can be simplified, the cooling efficiency can be improved, and energy waste can be avoided.

[0069] The control module 103 may be a central processing unit (CPU), or other programmable general-purpose or special-purpose microprocessor, digital signal processor (DSP), programmable control module, application-specific integrated circuit (ASIC), or other similar components or a combination of the above components. This document does not specifically limit the type, model, etc. of the control module 103.

[0070] In some embodiments, in order to allow the semiconductor cooling module 101 to completely fit on the conductor 102, the semiconductor cooling module 101 may include multiple semiconductor cooling modules 101, and the sizes of the multiple semiconductor cooling modules 101 may be the same or different, depending on the size of the conductor.

[0071] In some embodiments, the maximum size of the semiconductor cooling module 101 can be greater than 60mmX60mm, the thickness can be less than 4.1mm, the maximum cooling power can reach 270W, and the maximum temperature difference of a single layer can reach more than 60°C.

[0072] Furthermore, in order to accurately control the temperature of each semiconductor cooling module 101 , the plurality of semiconductor cooling modules 101 are electrically connected to the control module 103 in parallel, so that the power supply signal of each semiconductor cooling module 101 can be individually controlled.

[0073] Furthermore, when the models and powers of the plurality of semiconductor cooling modules 101 are completely consistent, the plurality of semiconductor cooling modules 101 are electrically connected to the control module 103 in series, so that the power supply signals of each semiconductor cooling module 101 are consistent.

[0074] Multiple semiconductor cooling modules 101 can be arranged on the side of the conductor 102 at fixed intervals (as shown in Figure 1, for example, 10 cm, the specific interval distance can be determined according to the temperature rise of the semiconductor cooling module 101), and can also be arranged closely (i.e. without gaps) on the side of the conductor 102. The specific arrangement method can be determined according to the temperature rise of the conductor 102 in the working state.

[0075] To ensure the cooling effect, the ratio of the total area of ​​the cooling end of the semiconductor cooling module 101 to the area of ​​the conductor 102 is in the range of 3% to 95%.

[0076] In order to verify the effect of the ratio of the total area of ​​the cooling end to the area of ​​the conductor 102 in the semiconductor cooling module 101 on the temperature rise of the conductor 102, the inventors selected 13 cables with the same cross-sectional area, the same material, and the same length, and passed the same current. They used different ratios of the area of ​​the cooling end covering the conductor 102 in the semiconductor cooling module 101, and read the temperature rise value of each cable, which is recorded in Table 1.

[0077] The experimental method involves, in a closed environment, passing the same current through cables covering different ratios of the total cooling end area to the conductor area of ​​the semiconductor cooling module 101. The temperature before power-on and after power-on, when the temperature stabilized, is recorded, and the absolute value of the difference is taken. In this embodiment, a temperature rise of less than 50K is considered acceptable.

[0078] Table 1: Effect of the ratio of the total area of ​​the cooling end to the area of ​​the conductor 102 in different semiconductor cooling modules 101 on the cable temperature rise

[0079]

[0080] As can be seen from Table 1 above, when the ratio of the total cooling end area of ​​semiconductor cooling module 101 to the conductor 102 area is less than 3%, the cable's temperature rise falls below the acceptable value. A larger coverage area ratio results in a lower temperature rise. However, during cable use, the joints at both ends and the bends in the middle inevitably leave the semiconductor cooling module 101 uncovered. Therefore, the inventors set the ratio of the total cooling end area of ​​semiconductor cooling module 101 to the conductor 102 area to between 3% and 95%.

[0081] As shown in Figure 2A, semiconductor cooling module 101 is fixed to conductor 102 using thermally conductive adhesive. Other methods, such as screws, can also be used to secure semiconductor cooling module 101 to conductor 102, although this is not a limitation herein. For applications requiring high vibration levels, semiconductor cooling module 101 can be secured using an additional mounting bracket to enhance shock absorption.

[0082] To improve heat dissipation efficiency, semiconductor cooling modules 101 are installed on both sides of conductor 102. In further embodiments, depending on the use of the conductor and the need for high cooling, multiple layers of semiconductor cooling modules 101 can be stacked to achieve multi-stage cooling, further enhancing cooling capacity. As shown in Figure 3, double layers of semiconductor cooling modules 101 can also be installed on both sides of conductor 102.

[0083] The heat generated by the cable 100 with cooling function provided in this embodiment when passing high voltage and high current will be absorbed by the semiconductor cooling module 101 covering the conductor 102, thereby achieving the purpose of reducing the temperature rise of the conductor. When the size of the conductor 102 is constant, it can carry a larger current and meet the temperature rise requirements.

[0084] In a further embodiment herein, as shown in FIG4 , the cable with a cooling function further includes a rectifier module 104 electrically connected between the control module 103 and the conductor 102 for rectifying the electrical energy obtained from the conductor 102 and converting the current in the conductor 102 into a power supply current for the control module 103. Because the current and voltage transmitted by the conductor 102 may not necessarily meet the power supply requirements of the control module 103 and the semiconductor cooling module 101, in order to obtain electrical energy from the conductor 102, the current drawn from the conductor 102 needs to be passed through the rectifier module and converted into a current and voltage usable by the control module 103 and the semiconductor cooling module 101.

[0085] This embodiment can eliminate the need for a power supply, and the conductor 102 supplies power to the control module, thereby simplifying the circuit and reducing many power supply lines for the control module 103 and the semiconductor cooling module 101. It also avoids the situation where the semiconductor cooling module 101 cannot work due to a lack of power in the external power supply.

[0086] In a further embodiment of this invention, the cable with cooling function also includes: at least one temperature detector, which is arranged on the conductor and is used to detect the temperature value of the conductor; the control module is electrically connected to the temperature detector and is used to adjust the electrical signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detector.

[0087] In further embodiments herein, as shown in Figures 1, 5, and 6, the cable with cooling function further includes: a plurality of temperature detectors 105 distributed along the conductor 102 for detecting the temperature of the conductor 102. In a specific implementation, the more temperature detectors 105 are arranged and the more evenly they are distributed, the more accurately the detected temperature will be in line with actual conditions.

[0088] The control module 103 is electrically connected to the temperature detector 105 and is used to adjust the electrical signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detector 105 .

[0089] In some embodiments, the process in which the control module 103 adjusts the electrical signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detector 105 includes: calculating the difference between the temperature value detected by the temperature detector 105 and the preset temperature rise value of the conductor 102; inputting the difference into the PID control strategy to obtain the electrical control signal of the semiconductor cooling module 101; adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the electrical control signal of the semiconductor cooling module 101; wherein the control parameters in the PID control strategy are adjusted in advance according to the PID control indicators.

[0090] In specific implementation, the preset temperature rise value can be determined according to the application scenario of the conductor and the maximum temperature rise value that the conductor can withstand. This article does not limit its specific value.

[0091] The cable with cooling function provided in this embodiment can detect temperature and control heat absorption in real time after adding temperature control function, thus achieving closed-loop control. Different temperature rise control can be performed on the conductor according to the current carrying capacity of the conductor under different conditions.

[0092] In a specific embodiment, as shown in FIG7 , when there are multiple temperature detectors 105 , the control module 103 adjusts the electrical signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detector 105 , including:

[0093] Step 701 : Calculate the temperature distribution of the conductor 102 according to the temperature value detected by the temperature detector 105 .

[0094] In specific implementation, the temperature distribution of the conductor 102 may be established by using a B-spline interpolation method. In specific implementation, the temperature distribution of the conductor 102 may also be established by using other modeling methods. This document does not specifically limit the temperature distribution establishment process.

[0095] Step 702 : Determine the power supply signal of each semiconductor cooling module 101 on the conductor 102 according to the temperature distribution of the conductor 102 .

[0096] In this step, the higher the temperature of the conductor 102, the larger the power supply signal of the semiconductor cooling module 101. In specific implementation, the control module 103 can determine the power supply signal of each semiconductor cooling module 101 on the conductor 102 according to a preset temperature adjustment strategy (as shown in Table 2).

[0097] Table 2 Correspondence between the temperature range of the conductor detected by the temperature detector and the power supply current of the control module

[0098] Temperature range (°C) Current (A) X1~X2Y1X2~X3Y2…………

[0099] Step 703 : supplying power to each semiconductor cooling module 101 according to the power supply signal of each semiconductor cooling module 101 .

[0100] In one embodiment of the present invention, the step 702 of determining the power supply current of each semiconductor cooling module 101 on the conductor 102 according to the temperature distribution of the conductor 102 includes:

[0101] Step 7021, calculating a difference distribution according to the temperature distribution of the conductor 102 and a preset temperature rise value of the conductor 102;

[0102] Step 7022: Adjust the electrical signal supplied to the semiconductor cooling module 101 according to the difference distribution.

[0103] In specific implementation, step 7022 includes: inputting the difference distribution into the PID control strategy to obtain a control signal of the electrical signal of the semiconductor cooling module 101; adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the electrical control signal of the semiconductor cooling module 101; wherein the control parameters in the PID control strategy are adjusted in advance according to the PID control indicators.

[0104] In a further embodiment of the present invention, in order to more accurately adjust the electrical signal of the semiconductor cooling module 101, the control module 103 is also electrically connected to the charging module 200 connected to the conductor 102, for obtaining the charging and discharging current value and the charging time, and adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the charging and discharging current value, the charging time and the temperature value detected by the temperature detector.

[0105] Specifically, as shown in FIG8 , the control module 103 adjusts the electrical signal supplied to the semiconductor cooling module according to the charge and discharge current value, the charging time, and the temperature value detected by the temperature detector, including:

[0106] Step 801: Calculate the heat generated by the conductor according to the charge and discharge current values ​​and the charging time.

[0107] In this step, Q=I 2 ×R×t is used to calculate the heat generated by the conductor, where Q is the heat generated by the conductor, I is the charge and discharge current, t is the charging time, and R is the resistance of the conductor.

[0108] Step 802: Calculate the theoretical temperature rise of the conductor based on the heat generated by the conductor and the material information of the conductor.

[0109] The heat generated by the conductor is the heat generated during charging and discharging. In this step, the theoretical temperature rise value of the conductor can be calculated using the following formula, which can be obtained by fitting the test data obtained from the conductor temperature rise experiment:

[0110]

[0111] Among them, τ w is the theoretical temperature rise value, Q is the heat generated by the conductor, t is the charging time, A is the effective heat dissipation area, K T is the comprehensive heat dissipation coefficient of the conductor surface, A and K T The material information of the conductor.

[0112] The theoretical temperature rise value of the conductor can be calculated based on the heat generated by the conductor and the material information of the conductor, and reference can be made to the existing technology, which is not limited here.

[0113] Step 803 : Calculate the actual temperature rise value of the conductor based on the temperature value detected by the temperature detector and the theoretical temperature rise value of the conductor.

[0114] The execution process of this step includes: first, determining the temperature rise correction coefficient based on the temperature value detected by the temperature detector. Specifically, if the temperature detected by the temperature detector is greater than the standard temperature value for temperature rise calculation, the temperature correction coefficient is greater than 1, and the higher the temperature detected by the temperature detector, the greater the coefficient. If the temperature detected by the temperature detector is less than the standard temperature value for temperature rise calculation, the temperature correction coefficient is less than 1, and the lower the temperature detected by the temperature detector, the smaller the coefficient. The actual temperature rise value of the conductor is calculated using the following formula:

[0115] τ=K w ×τ w ;

[0116] Among them, τ w is the theoretical temperature rise, K w is the temperature correction coefficient, and τ is the actual temperature rise value.

[0117] Step 804: Adjust the electrical signal supplied to the semiconductor cooling module according to the actual temperature rise value of the conductor.

[0118] This embodiment can adjust the electrical signal of the semiconductor cooling module 101 based on the charge and discharge information combined with the temperature value detected by the temperature detector and the actual temperature rise value predicted in advance, so that the temperature of the conductor reaches the operating temperature as soon as possible, thereby improving the efficiency and accuracy of temperature control.

[0119] In a further embodiment herein, as shown in FIG. 9 , in order to enable the current adjustment of the semiconductor cooling module 101 to have an automatic adjustment capability, the above step 804 adjusts the electrical signal supplied to the semiconductor cooling module 101 according to the actual temperature rise value of the conductor 102, including:

[0120] Step 901, calculating the difference between the actual temperature rise value of the conductor 102 and the preset temperature rise value of the conductor 102;

[0121] Step 902 : Input the difference into the PID control strategy to obtain an electrical control signal for the semiconductor cooling module 101 .

[0122] When this step is implemented, the semiconductor cooling module 101 electrical control signal is generated only when there is a deviation between the actual temperature rise value of the conductor 102 and the preset temperature rise value. When the actual temperature rise value of the conductor 102 is equal to the preset temperature rise value, the temperature of the conductor 102 can be controlled within the preset temperature rise value to ensure the safety of the conductor 102. At this time, the semiconductor cooling module 101 electrical control signal will not be generated.

[0123] The control parameters in the PID control strategy are pre-adjusted based on the PID control performance. The PID control strategy includes three components: proportional control, integral control, and differential control. PID control performance indicators include rise time, overshoot, settling time, and steady-state error. Adjusting the control parameters in the PID control strategy can be referenced in existing technologies and will not be detailed here.

[0124] Step 903 : adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the electrical control signal of the semiconductor cooling module 101 .

[0125] In a further embodiment of the present invention, in order to improve the temperature control accuracy of the conductor and make its calculated value more consistent with the actual situation, the control module 103 is also electrically connected to the environmental parameter detection module and the charging module 200 connected to the conductor, for obtaining environmental parameter information from the environmental parameter detection module and obtaining the charge and discharge current value and charging time from the charging module; according to the environmental parameter information, the charge and discharge current value and charging time, the electrical signal supplied to the semiconductor cooling module is adjusted.

[0126] Specifically, the environmental parameter information includes but is not limited to: environmental humidity, environmental temperature, environmental pressure, etc.

[0127] Adjusting the electrical signal supplied to the semiconductor cooling module according to the environmental parameter information, the charge and discharge current value, and the charging time includes:

[0128] (1) Calculate the heat generated by the conductor based on the charge and discharge current values ​​and charging time.

[0129] (2) Calculate the theoretical temperature rise of the conductor 102 based on the conductor's heat generation and the conductor's material information.

[0130] (3) Calculate the actual temperature rise of the conductor 102 based on the environmental parameter information and the theoretical temperature rise of the conductor 102.

[0131] In this step, the execution process of this step includes: first determining the temperature rise correction coefficient based on the environmental parameter information. Specifically, for each environmental parameter information, a correction coefficient is calculated (the calculation process of each correction coefficient refers to the temperature correction coefficient described in the previous embodiment and is not described in detail here), and the correction coefficients corresponding to all environmental parameter information are weightedly summed (as shown in Formula 1 below) or multiplied (as shown in Formula 2 below) to obtain a final correction coefficient; the final correction coefficient is multiplied by the theoretical temperature rise value of the conductor 102 to calculate the actual temperature rise value of the conductor 102.

[0132] K=a1×K w1 +……+a n ×K wn (Formula 1);

[0133] K=a1×K w1 ×……×K wn (Formula 2);

[0134] Among them, K is the final correction coefficient; is the coefficient, a1…a n is a known quantity, which can be determined according to the importance of the environmental parameter; a is a known quantity; i represents the i-th environmental parameter; K w1 …K wn is the environmental parameter value.

[0135] (4) Adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the actual temperature rise value of the conductor 102 .

[0136] In a further embodiment herein, as shown in FIG. 1 , FIG. 6 and FIG. 10 , the wires connecting the semiconductor cooling module 101 to the control module 103 are disposed in a low-voltage wiring harness 106 .

[0137] This embodiment arranges the wires connecting the semiconductor cooling module 101 to the control module 103 in the low-voltage wiring harness 106, thereby ensuring clear wiring, facilitating adjustment and replacement of the semiconductor cooling module, and achieving safe isolation of the high and low voltage power supply systems.

[0138] In a further embodiment of the present invention, as shown in FIG11 , the semiconductor cooling module 101 includes: an alumina substrate 1011 , a waterproof protective layer 1012 , a semiconductor P / N layer 1013 , and a power interface 1014 .

[0139] The alumina substrate 1011 , the waterproof protection layer 1012 , and the semiconductor P / N layer 1013 are sequentially provided. The power interface 1014 is electrically connected to the semiconductor P / N layer 1013 .

[0140] The alumina substrate 1011 constitutes the hot end, ie, the heat dissipation end, of the semiconductor cooling module 101. The semiconductor P / N layer 1013 constitutes the cooling end, ie, the heat absorption end, of the semiconductor cooling module 101.

[0141] This embodiment utilizes an alumina substrate 1011 as the surface of the semiconductor cooling module, which improves thermal conductivity, resulting in faster heat transfer, shorter cooling times, greater endurance, and flexible connections. This allows for better adhesion to conductors, effectively absorbing surface stress at conductor bends, and resists breakage during installation and use. The core of the semiconductor cooling module utilizes a PN junction constructed from a specialized semiconductor material. When current flows through a thermocouple pair composed of an N-type semiconductor and a P-type semiconductor, heat transfer occurs between the two ends, creating a temperature difference between the hot and cold ends. This allows for cooling control by controlling the DC current.

[0142] The cooling rate of the semiconductor cooling module 101 is 0.05K / s-5K / s.

[0143] In order to verify the effect of the cooling rate of the semiconductor cooling module 101 on the temperature rise of the conductor 102, the inventor selected 10 cables of the same cross-sectional area, the same material, and the same length, and passed the same current. The inventor used semiconductor cooling modules 101 with different cooling rates to cool the cables, and read the temperature rise value of each cable, which is recorded in Table 3.

[0144] The experimental method involves, in a closed environment, passing the same current through cables using semiconductor cooling modules 101 with different cooling rates. The temperature before power is applied and the temperature after power is applied, when the temperature stabilizes, are recorded, and the absolute value of the difference is taken. In this embodiment, a temperature rise of less than 50K is considered acceptable.

[0145] Table 3: Effects of different cooling rates of semiconductor cooling modules 101 on cable temperature rise

[0146]

[0147] As can be seen from Table 3 above, when the cooling rate of semiconductor cooling module 101 is less than 0.05K / s, the temperature rise of the cable is less than the acceptable value. The higher the cooling rate of semiconductor cooling module 101, the lower the temperature rise. However, when the cooling rate of semiconductor cooling module 101 exceeds 5K / s, the temperature rise does not decrease significantly due to the heat generated by the cable itself and the power of semiconductor cooling module 101 itself, but the power of semiconductor cooling module 101 increases, which is not economical. Therefore, the inventors set the cooling rate of semiconductor cooling module 101 to 0.05K / s-5K / s.

[0148] In a further embodiment of this invention, in order to ensure the safety of the conductor, an insulating protective layer 107 is provided around the conductor 102. As shown in FIG. 2A and FIG. 2B , the insulating protective layer 107 is provided between the conductor 102 and the semiconductor cooling module 101, or on the outer side of the semiconductor cooling module 101.

[0149] In a further embodiment of the present invention, the material of the insulating protective layer 107 is one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

[0150] Furthermore, in order to prevent the conductor from being burned due to fire, a fire-resistant layer is provided outside the insulating protective layer.

[0151] In further embodiments herein, the cross-section of the conductor 102 is circular, elliptical, rectangular, polygonal, E-shaped, F-shaped, H-shaped, K-shaped, L-shaped, T-shaped, U-shaped, V-shaped, W-shaped, X-shaped, Y-shaped, Z-shaped, arc-shaped, or wavy. The arc shape includes a semi-arc, an acute-angle arc, an obtuse-angle arc, and the like. The cross-sectional shape of the conductor 102 can be designed in various shapes to facilitate designers to select different conductor 102 cross-sections according to the actual installation environment, thereby reducing the cable volume, optimizing the cable assembly environment, and improving the safety of the cable.

[0152] In further embodiments of the present invention, the material of the conductor 102 described herein may be one or more combinations of metals, conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials.

[0153] During specific implementation, the conductor 102 described in this article is made of copper or copper alloy or aluminum or aluminum alloy. Due to the high voltage and large current of electric vehicle cables, large-diameter wires are required to conduct current. Copper conductor materials have good electrical conductivity and ductility, and are preferred as cable conductor materials. However, as the price of copper continues to rise, the material cost of using copper as a conductor will become increasingly high. For this reason, people have begun to look for substitutes for metallic copper to reduce costs. The content of metallic aluminum in the earth's crust is about 7.73%. After the refining technology is optimized, the price is relatively low. In addition, compared with copper, aluminum is lighter and its conductivity is second only to copper. Aluminum can replace part of copper in the field of electrical connections. Therefore, replacing copper with aluminum is a development trend in the field of automotive electrical connections.

[0154] In a further embodiment of this invention, in order to further improve the heat dissipation effect, the cable with cooling function also includes: a heat dissipation device, which is arranged on the outside of the semiconductor cooling module 101. During specific implementation, the heat dissipation device can be close to the outer side of the semiconductor cooling module 101, or close to the outer side of the semiconductor cooling module 101, depending on the type of heat dissipation device.

[0155] The heat dissipation devices described herein include, but are not limited to, fans, heat exchangers, liquid cooling devices, and heat dissipation fins, with the heat dissipation fins preferably being made of metal. Large components such as fans, heat exchangers, and liquid cooling devices are positioned near the semiconductor cooling module 101, with the heat dissipation fins positioned in close proximity to the semiconductor cooling module 101. In a further embodiment herein, as shown in FIG5 , a current transmission device is provided, comprising: the cooling cable 100 described in any of the aforementioned embodiments, a charging module 200, and a battery module 300.

[0156] The two ends of the cable 100 with a cooling function are respectively connected to the charging module 200 and the battery module 300 , so as to transmit the electric energy obtained by the charging module 200 to the battery module 300 .

[0157] In some embodiments, the charging module 200 described herein is a fast charging station, and the battery module 300 is a BMS (Battery Management System) battery management module.

[0158] In a further embodiment of the present invention, the control module 103 is further connected to the charging module 200 , and the charging module 200 is used to provide power to the control module 103 .

[0159] In a further embodiment of the present invention, an electric vehicle is provided, comprising the current transmission device described in any of the aforementioned embodiments.

[0160] In a further embodiment herein, the method executed by the control module may be executed in a computer device, such as a central control device, as shown in FIG12 , which may include one or more processors 1304, such as one or more central processing units (CPUs), each of which may implement one or more hardware threads. The computer device 1302 may also include any memory 1306 for storing any type of information such as code, settings, data, etc. Without limitation, for example, the memory 1306 may include any one or more combinations of the following: any type of RAM, any type of ROM, a flash memory device, a hard disk, an optical disk, etc. More generally, any memory may use any technology to store information. Furthermore, any memory may provide volatile or non-volatile retention of information. Furthermore, any memory may represent a fixed or removable component of the computer device 1302. In one case, when the processor 1304 executes an associated instruction stored in any memory or combination of memories, the computer device 1302 may perform any operation of the associated instruction. The computer device 1302 also includes one or more drive mechanisms 1308 for interacting with any storage, such as a hard disk drive mechanism, an optical disk drive mechanism, and the like.

[0161] Computer device 1302 may also include an input / output module 1310 (I / O) for receiving various inputs (via input devices 1312) and providing various outputs (via output devices 1314). A specific output mechanism may include a presentation device 1316 and an associated graphical user interface 1318 (GUI). In other embodiments, input / output module 1310 (I / O), input devices 1312, and output devices 1314 may not be included, and the computer device 1302 may simply function as a computer device on a network. Computer device 1302 may also include one or more network interfaces 1320 for exchanging data with other devices via one or more communication links 1322. One or more communication buses 1324 couple the components described above.

[0162] The communication link 1322 can be implemented in any manner, for example, through a local area network, a wide area network (e.g., the Internet), a point-to-point connection, etc., or any combination thereof. The communication link 1322 can include any combination of hardwired links, wireless links, routers, gateway functions, name servers, etc., governed by any protocol or combination of protocols.

[0163] Corresponding to the method in FIG. 7 to FIG. 9 , the embodiments of this document further provide a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the above method are executed.

[0164] The embodiments of this document also provide a computer-readable instruction, wherein when a processor executes the instruction, the program therein causes the processor to execute the method shown in Figures 7 to 9.

[0165] It should be understood that in the various embodiments of this document, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this document.

[0166] It should also be understood that in the embodiments herein, the term "and / or" merely describes an association between associated objects, indicating that three possible relationships exist. For example, "A and / or B" could represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0167] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the composition and steps of each example according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this document.

[0168] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0169] In the several embodiments provided herein, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices, or units, or can be an electrical, mechanical, or other form of connection.

[0170] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments herein.

[0171] In addition, the functional units in the various embodiments herein may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0172] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this article is essentially or the part that contributes to the existing technology, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of this article. The aforementioned storage medium includes: various media that can store program code, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0173] This article uses specific embodiments to illustrate the principles and implementation methods of this article. The description of the above embodiments is only used to help understand the methods and core ideas of this article. At the same time, for those skilled in the art, based on the ideas of this article, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation to this article.

Claims

1. A cable with a cooling function, characterized in that, it includes: a semiconductor cooling module (101), a conductor (102) and a control module (103); the cooling end of the semiconductor cooling module (101) is arranged on at least one side surface of the conductor (102) for absorbing the heat dissipated by the conductor (102); the semiconductor cooling module (101) is electrically connected to the control module (103), and the control module (103) is used for controlling the electrical signal supplied to the semiconductor cooling module (101).

2. The cable with a cooling function according to claim 1, characterized in that, there are a plurality of the semiconductor cooling modules (101), and the plurality of semiconductor cooling modules (101) are connected to the control module (103) in a parallel manner.

3. The cable with a cooling function according to claim 1, characterized in that, there are a plurality of the semiconductor cooling modules (101), and the plurality of semiconductor cooling modules (101) are connected to the control module (103) in a series manner.

4. The cable with a cooling function according to claim 2 or 3, characterized in that, the plurality of semiconductor cooling modules (101) are arranged at a predetermined distance interval on at least one side surface of the conductor (102).

5. The cable with a cooling function according to claim 1, characterized in that, the proportion range of the total area of the cooling ends in the semiconductor cooling module (101) to the area of the conductor (102) is 3% to 95%.

6. The cable with a cooling function according to claim 1, characterized in that, it further includes: a rectification module (104), electrically connected between the control module (103) and the conductor (102), for rectifying the electric energy obtained from the conductor (102).

7. The cable with a cooling function according to claim 1, characterized in that, it further includes: at least one temperature detector (105), arranged on the conductor (102), for detecting the temperature value of the conductor (102); the control module (103) is electrically connected to the temperature detector (105), and is used for adjusting the electrical signal supplied to the semiconductor cooling module (101) according to the temperature value detected by the temperature detector (105).

8. The cable with a cooling function according to claim 7, characterized in that, when there are a plurality of the temperature detectors (105), adjusting the electrical signal supplied to the semiconductor cooling module (101) according to the temperature values detected by the temperature detectors (105) includes: calculating the temperature distribution of the conductor (102) according to the temperature values detected by the temperature detectors (105); determining the power supply signals of the semiconductor cooling modules (101) on the conductor (102) according to the temperature distribution of the conductor (102); powering the semiconductor cooling modules (101) according to the power supply signals of the semiconductor cooling modules (101).

9. The cable with a cooling function according to claim 7, characterized in that, The control module (103) is also electrically connected to the charging module (200) connected to the conductor (102), and is configured to obtain the charge and discharge current value and the charging duration, and adjust the electrical signal supplied to the semiconductor cooling module (101) according to the charge and discharge current value, the charging duration, and the temperature value detected by the temperature detector (105).

10. The cable with a cooling function according to claim 9, wherein, the control module (103) adjusts the electrical signal supplied to the semiconductor cooling module (101) according to the charge and discharge current value, the charging duration, and the temperature value detected by the temperature detector (105), including: calculating the heat generation amount of the conductor according to the charge and discharge current value and the charging duration; calculating the theoretical temperature rise value of the conductor (102) according to the heat generation amount of the conductor and the material information of the conductor (102); calculating the actual temperature rise value of the conductor (102) according to the temperature value detected by the temperature detector (105) and the theoretical temperature rise value of the conductor (102); adjusting the electrical signal supplied to the semiconductor cooling module (101) according to the actual temperature rise value of the conductor (102).

11. The cable with a cooling function according to claim 10, wherein, adjusting the electrical signal supplied to the semiconductor cooling module (101) according to the actual temperature rise value of the conductor (102), including: calculating the difference between the actual temperature rise value of the conductor (102) and the preset temperature rise value of the conductor (102); inputting the difference into the PID control strategy to obtain the electrical control signal of the semiconductor cooling module (101); adjusting the electrical signal supplied to the semiconductor cooling module (101) according to the electrical control signal of the semiconductor cooling module (101); wherein, the control parameters in the PID control strategy are pre-adjusted according to the PID control index.

12. The cable with a cooling function according to claim 7, wherein, the control module (103) is also electrically connected to the environmental parameter detection module and the charging module (200) connected to the conductor (102), and is configured to obtain environmental parameter information from the environmental parameter detection module, and obtain the charge and discharge current value and the charging duration from the charging module (200); and adjust the electrical signal supplied to the semiconductor cooling module (101) according to the environmental parameter information, the charge and discharge current value, and the charging duration.

13. The cable with a cooling function according to claim 1, wherein, the wire connecting the semiconductor cooling module (101) to the control module (103) is arranged in the low-voltage harness (106).

14. The cable with a cooling function according to claim 1, wherein, the semiconductor cooling module (101) includes: an alumina substrate (1011), a waterproof protective layer (1012), a semiconductor P / N layer (1013), and a power interface (1014); the alumina substrate (1011), the waterproof protective layer (1012), and the semiconductor P / N layer (1013) are arranged in sequence; The power interface (1014) is electrically connected to the semiconductor P / N layer (1013).

15. The cable with a cooling function according to claim 14, wherein, the cooling rate of the semiconductor cooling module (101) is 0.05 K / s - 5 K / s.

16. The cable with a cooling function according to claim 1, wherein, it further includes: an insulating protective layer (107), disposed between the conductor (102) and the semiconductor cooling module (101), or disposed on the outer side of the semiconductor cooling module (101).

17. The cable with a cooling function according to claim 16, wherein, the insulating protective layer (107) is made of one or a combination of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, polyethylene.

18. The cable with a cooling function according to claim 1, wherein, the cross-section of the conductor (102) is in a circular or oval or rectangular or polygonal or E-shaped or F-shaped or H-shaped or K-shaped or L-shaped or T-shaped or U-shaped or V-shaped or W-shaped or X-shaped or Y-shaped or Z-shaped or arc-shaped or wavy structure.

19. The cable with a cooling function according to claim 1, wherein, the conductor (102) is made of one or a combination of metal, conductive ceramic, carbon-containing conductor, solid electrolyte, mixed conductor, conductive polymer material.

20. The cable with a cooling function according to claim 19, wherein, the conductor (102) is made of copper or copper alloy or aluminum or aluminum alloy.

21. The cable with a cooling function according to claim 1, wherein, it further includes: a heat dissipation device, disposed outside the semiconductor cooling module (101).

22. A current transmission device, wherein, it includes: the cable with a cooling function (100) according to any one of claims 1 to 21, a charging module (200), and a battery module (300); both ends of the cable with a cooling function (100) are respectively connected to the charging module (200) and the battery module (300), and are used to conduct the electric energy obtained by the charging module (200) to the battery module (300).

23. The current transmission device according to claim 22, wherein, the control module (103) is connected to the charging module (200), and the charging module (200) is used to supply electric energy to the control module (103).

24. An electric vehicle, wherein, it includes the current transmission device according to claim 22 or 23.

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