Methods for manufacturing electrical wiring harnesses, nozzles, and wiring assemblies.

Abstract

The invention relates to a method for producing electrical conductors, nozzles, and wire assemblies. The method for producing electrical conductors comprises the following steps: step S10: preparation of the substrate; step S20: spraying conductive paint onto the substrate to form a conductive ring; and step S30: application of an insulating protective layer at the periphery of the conductive ring and on its surface. The invention solves technical problems concerning the complex and costly manufacturing process of electrical conductor assemblies for electrically connecting electrical components.

Description

Wire harness production method, nozzle, and wire harness

[0001] Related applications

[0002] This application claims priority to the Chinese invention patent with patent application number CN202110875947.7, application date July 30, 2021, and invention name “Method for producing wire harness, nozzle and wire harness”. Technical Field

[0003] The present invention relates to the technical field of electronic components, in particular to a production method of a wire harness, a nozzle and the wire harness. Background Art

[0004] Electrical connections require wiring harnesses. Existing wiring harnesses primarily consist of wires, terminals, sheaths, retaining elements, and brackets, resulting in a complex structure with numerous components. The wires in a wiring harness undergo a series of processes, including conductor drawing, twisting, annealing, and insulation extrusion. This results in a complex production process and high processing costs. Existing wiring harnesses are mostly produced in a centralized batch production model.

[0005] Some wire harness products with small batches and a wide variety of products have high requirements for flexible production and cannot be mass-produced. Such wire harnesses can only be produced manually and using temporary tooling, which has a long processing cycle and increases production costs.

[0006] Summary of the Invention

[0007] The purpose of the present invention is to provide a method for producing a wire harness, a nozzle and a wire harness, so as to alleviate the technical problems of a wire harness for electrically connecting electrical components, such as a relatively complex production process and a high processing cost.

[0008] The above-mentioned purpose of the present invention can be achieved by adopting the following technical solutions:

[0009] The present invention provides a method for producing a wiring harness, which includes: step S10, preparing a substrate; step S20, spraying a conductive coating onto the substrate to form a conductive loop; step S30, forming an insulating protective layer around and on the surface of the conductive loop.

[0010] The present invention provides a nozzle, which is applied to the above-mentioned wire harness production method, and the discharge port of the nozzle is square.

[0011] The present invention provides a wiring harness produced using the above-mentioned wiring harness production method. The wiring harness includes: a substrate, at least one layer of conductive loop and at least one layer of insulating protective layer. Each of the conductive loops is located between the substrate and the outermost insulating protective layer, and the conductive loops and the insulating protective layers are alternately distributed.

[0012] The characteristics and advantages of the present invention are:

[0013] This wiring harness production method uses a spray coating method to form a conductive loop on a substrate. The conductive loop can be connected to external electrical components to achieve the electrical connection function of the wiring harness. The insulating protective layer is then used for insulation protection, thereby achieving rapid prototyping of the wiring harness loop. This wiring harness production method has the following advantages:

[0014] (1) The wire harness produced by spraying has a high degree of flexibility, fast and convenient processing, high efficiency, and the cost is much lower than the existing small-batch wire harness production model;

[0015] (2) Multi-layer spraying can be used to prepare more conductive circuits under the condition of a small substrate area, meeting the requirements of more electrical circuits;

[0016] (3) Punching and pouring conductive materials can be used to electrically connect conductive circuits on different layers, thus realizing a more complex electrical circuit design and being applicable to more complex wiring harnesses;

[0017] (4) The cross-sectional area of ​​the conductive loop can be adjusted by adjusting the spraying parameters, which is suitable for processing loops with multiple wire diameters and facilitates the regulation of the conductive properties of the conductive loop;

[0018] (5) Using a servo mechanism or manipulator to control the trajectory of the nozzle facilitates the processing of wire harnesses with complex spatial structures; and ensures stable spraying and uniform size of the conductive circuit;

[0019] (6) The material selection of the insulation protection layer is relatively diverse, and a variety of process methods can be used to achieve insulation protection and ensure the insulation protection effect;

[0020] (7) The substrate can be a component of the electrical device, which can realize the integrated production of components and wiring harnesses and achieve rapid installation and removal of wiring harnesses;

[0021] (8) A contoured substrate can be used, and spraying can be performed on a non-flat substrate, which increases the application environment of the spray wiring harness;

[0022] (9) Flexible substrates can be used to make the spray wiring harness suitable for a variety of installation situations; the produced wiring harness can be used on electrical appliances with complex installation environments, and can also be used in environments with high vibration requirements to reduce the interference of vibration factors;

[0023] (10) When the wiring harness is damaged, the damaged substrate can be directly replaced without removing the entire wiring harness for replacement, which saves maintenance time and reduces maintenance costs;

[0024] (11) A shielding layer is set outside the wiring harness, which can be used at locations where electromagnetic interference is relatively strong, so that the signal inside the wiring harness can be shielded from electromagnetic interference and ensure signal stability;

[0025] (12) A heat sink is provided on the insulating protective layer, which can quickly dissipate the heat generated by the wiring harness current into the air, thereby helping to reduce the temperature of the wiring harness and reduce the risk of the conductive circuit melting. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The following drawings are intended only to illustrate and explain the present invention, and are not intended to limit the scope of the present invention.

[0027] FIG1 is a schematic diagram of a method for producing a wiring harness provided by the present invention;

[0028] FIG2 is a schematic diagram of the working method of the wiring harness production method provided by the present invention;

[0029] Figures 3 and 4 are schematic structural diagrams of a wire harness produced by the wire harness production method provided by the present invention;

[0030] 5-6 are schematic structural diagrams of the nozzle in the method for producing the wire harness provided by the present invention;

[0031] FIG7 is a top view of an embodiment of a wire harness produced by the wire harness production method provided by the present invention;

[0032] FIG8 is a side cross-sectional view of an embodiment of a wire harness produced by the method for producing a wire harness provided by the present invention;

[0033] FIG9 is a top view of another embodiment of a wire harness produced by the wire harness production method provided by the present invention;

[0034] FIG10 is a side cross-sectional view of another embodiment of a wire harness produced by the wire harness production method provided by the present invention. DETAILED DESCRIPTION

[0035] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described with reference to the accompanying drawings. In the description of the present invention, unless otherwise specified, the meaning of "multiple" is two or more.

[0036] Example 1

[0037] The present invention provides a method for producing a wire harness, as shown in Figures 1 and 2, the method for producing a wire harness includes: step S10, preparing a substrate 10; step S20, spraying a conductive coating onto the substrate 10 to form a conductive loop 21; step S30, forming an insulating protective layer 40 around and on the surface of the conductive loop 21.

[0038] This wiring harness production method uses a spray coating process to form a conductive loop 21 on a substrate 10. The conductive loop 21 can be connected to external electrical components to achieve the electrical connection function of the wiring harness. The conductive loop 21 is then insulated and protected by an insulating protective layer 40, thereby enabling rapid prototyping of the wiring harness loop. This method utilizes a spray coating process to produce the wiring harness, offering a high degree of flexibility, fast and convenient processing, high efficiency, and reduced production costs, making it suitable for small-batch wiring harness production.

[0039] In one embodiment, the wiring harness production method includes step S40, which is performed after step S30. Step S40 involves spraying a conductive coating onto the insulating protective layer 40 to form a conductive loop 21. Furthermore, step S40 and step S30 are alternately performed one or more times. Step S20 forms a conductive layer 30 on the substrate 10. Once step S40 is performed, another conductive layer 30 can be formed on the already formed conductive loop 21 and insulating protective layer 40. By alternating steps S40 and S30, multiple conductive layers 30 are constructed on the substrate 10, forming a multi-layer structure. By using multi-layer spraying to form multiple conductive layers 30, a larger number of conductive loops 21 can be prepared while maintaining a relatively small substrate 10 area, thereby meeting the requirement for a larger number of electrical loops.

[0040] Figures 3 and 4 are schematic diagrams of wiring harnesses produced using this method. The wiring harness shown in Figure 3 is a single-layer structure, while the wiring harness shown in Figure 4 is a double-layer structure. A conductive layer 30 may include multiple conductive loops 21. In a multi-layer wiring harness, the number and structure of conductive loops 21 in each conductive layer 30 may be the same or different.

[0041] Furthermore, the wiring harness production method includes step S50: punching holes in the insulating protective layer 40 and / or the conductive loop 21, and pouring conductive material to form a connecting loop 22 that electrically connects at least two layers of conductive loops 21. Punching holes and pouring conductive material allows for electrical connection of conductive loops 21 in different layers, enabling a more complex electrical loop design and adapting to more complex wiring harnesses.

[0042] In one embodiment, the wiring harness produced by the wiring harness production method includes multiple conductive layers 30, the insulating protective layer 40 between two adjacent conductive layers 30 is punched, and conductive material is poured to form a connecting loop 22, which connects the conductive loops 21 of the two adjacent conductive layers 30.

[0043] In one embodiment, the wiring harness produced by the wiring harness production method includes at least three conductive layers 30, including an upper conductive layer 31, a middle conductive layer 32, and a lower conductive layer 33. A connecting loop 22 is provided through the middle conductive layer 32 and is connected to the upper conductive layer 31 and the lower conductive layer 33, respectively. In some cases, the connecting loop 22 passes through the conductive loop 21 of the middle conductive layer 32 and is connected to the conductive loop 21, thereby connecting the upper conductive layer 31, the middle conductive layer 32, and the lower conductive layer 33 simultaneously. In other cases, the connecting loop 22 passes through the middle conductive layer 32 via an area where the conductive loop 21 is not provided, connecting the upper conductive layer 31 and the lower conductive layer 33, while avoiding the conductive loop 21 of the middle conductive layer 32 and preventing connection therewith.

[0044] In some embodiments, there is one or more conductive layers 30 between the two conductive layers 30 connected by the communication loop 22, and communication with the one or more conductive layers 30 in the middle needs to be avoided. The conductive loop 21 in the middle conductive layer 30 can be improved. For example, the conductive loop 21 can extend along a curve or a fold line to avoid the location where the communication loop 22 is punched. The communication loop 22 can also be configured to extend along a fold line or a curve to avoid the one or more conductive layers 30 in the middle.

[0045] Punching and pouring of conductive material can be performed after each conductive layer 30 is formed. Alternatively, punching and pouring of conductive material can be performed while the conductive layers 30 and insulating protective layers 40 are being formed. For example, after forming one conductive layer 30 or one insulating protective layer 40, the layer is punched and poured with conductive material to form the connecting loop 22, and then the next conductive layer 30 or insulating protective layer 40 is formed. In some cases, the conductive loops 21 in the middle conductive layer 30 are relatively dense, making it difficult to improve the conductive loops 21 so that the connecting loops 22 avoid the conductive loops 21 in the middle conductive layer 30. To this end, the inventors have made further improvements to the production method of the wiring harness and the wiring harness produced therefrom.

[0046] As shown in Figures 7 and 8, the wiring harness includes an upper conductive layer 31, a middle conductive layer 32 and a lower conductive layer 33. The conductive loops 21 in the upper conductive layer 31 are respectively connected to the conductive protrusions 23, and the conductive protrusions 23 deviate from the conductive loops 21 in the middle conductive layer 32. The connecting loops 22 are respectively connected with the conductive protrusions 23 in the upper conductive layer 31 and the conductive protrusions 23 in the lower conductive layer 33, and avoid the conductive loops 21 in the middle conductive layer 32, thereby connecting the upper conductive layer 31 with the lower conductive layer 33 and avoiding connection with the middle conductive layer 32.

[0047] As shown in Figures 9 and 10, the wiring harness includes an upper conductive layer 31, a middle conductive layer 32 and a lower conductive layer 33. The punching position of step S50 is opposite to the conductive loop 21 of the upper conductive layer 31, the conductive loop 21 of the lower conductive layer 33 and the conductive loop 21 of the middle conductive layer 32, and the punched hole penetrates the conductive loop 21 of the middle conductive layer 32; an insulating sleeve 342 is provided in the hole, and the insulating sleeve 342 is located in the middle conductive layer 32 and separates the conductive loop 21 of the middle conductive layer 32; conductive material is poured into the hole and the insulating sleeve 342 to prevent the connecting loop 22 from being connected to the middle conductive layer 32.

[0048] Furthermore, as shown in FIG10 , the hole punched in step S50 is a stepped hole 341 . The portion of the stepped hole 341 located in the lower conductive layer 33 has a smaller inner diameter to facilitate the installation of the insulating sleeve 342 . The stepped portion of the stepped hole 341 can support the insulating sleeve 342 .

[0049] Adjusting the cross-sectional area of ​​the conductive loop 21, for example, by adjusting its thickness or width, can adjust the conduction current of the conductive loop 21. In this wiring harness production method, the cross-sectional area of ​​the conductive loop 21 can be adjusted by adjusting the spraying parameters in step S20. The thickness or width of the conductive loop 21 is tailored to the desired conduction current of the conductive loop 21. This wiring harness production method is suitable for processing loops with multiple wire diameters and facilitates the control of the conductive properties of the conductive loop 21.

[0050] In one embodiment, steps S20 and S40 respectively use a nozzle 50, and the conductive paint is sprayed outward through the nozzle 50. By using nozzles 50 of different sizes or shapes, the width and thickness of the cross section of the conductive loop 21 can be adjusted.

[0051] Furthermore, the discharge port 501 of the nozzle 50 is square, which is conducive to making the width and thickness of the cross section of the conductive loop 21 uniform, ensuring the stability of the cross section, and avoiding the situation where more material is discharged in the middle of the cross section and less material is discharged on both sides during spraying, ultimately forming a conductive loop 21 with a high middle section and low sides.

[0052] In one embodiment, the size of the discharge opening 501 of the nozzle 50 is adjustable to adjust the width and thickness of the cross-section of the conductive loop 21. As shown in Figures 5 and 6, the nozzle 50 includes a nozzle body 51 and a movable sidewall 52. The movable sidewall 52 is connected to the nozzle body 51 via a hinge 53. By rotating the movable sidewall 52 relative to the nozzle body 51 about the center of the hinge 53 and adjusting the mounting angle of the movable sidewall 52, the position of the lower end of the movable sidewall 52 is adjusted, thereby adjusting the size of the discharge opening 501 of the nozzle 50.

[0053] Specifically, the nozzle body 51 is connected to a motor 54, whose shaft is connected to a drive screw 55. The movable sidewall 52 is provided with a threaded hole, into which the drive screw 55 engages. The motor 54 drives the drive screw 55, which in turn rotates the movable sidewall 52 about the hinge 53 to adjust the size of the nozzle 50's discharge port 501. The discharge port 501 of the nozzle 50 is square, making it easy to adjust the cross-sectional size of the conductive loop 21 by adjusting the size of the discharge port 501.

[0054] Adjusting the spraying distance of the nozzle 50, for example, the distance between the nozzle 50 and the substrate 10, can also adjust the width and thickness of the cross-section of the conductive loop 21. Adjusting the spraying speed, that is, the speed at which the nozzle 50 moves, can also adjust the width and thickness of the cross-section of the conductive loop 21. Preferably, the spraying distance is 5 mm to 100 mm, and the spraying speed is 0.1 mm / s to 100 mm / s. This prevents excessive dispersion of the sprayed material and breaks in the trajectory of the conductive loop 21, thereby ensuring conductive performance.

[0055] The nozzle 50 can be mounted on a servo mechanism or a manipulator, which drives the nozzle 50 to move within space, spraying the conductive loop 21 at various angles to form a spatially structured wire harness. This facilitates the processing of wire harnesses with complex spatial structures, ensures stable spraying, and maintains uniform dimensions of the conductive loop 21. Furthermore, the nozzle 50 can be mounted on a three-axis servo mechanism or a six-axis manipulator.

[0056] Specifically, the three-axis servo mechanism is equipped with a movable guide rail in each of the X, Y, and Z directions. Each direction of movement is driven by a servo motor 54. Under program control, a three-dimensional machining trajectory is achieved, spraying to form a conductive loop 21 along a spatial trajectory. The six-axis manipulator can drive the nozzle 50 to move more flexibly, spraying to form a more complex conductive loop 21 along a spatial trajectory.

[0057] In one embodiment, the conductive layer 30 formed in step S20 includes multiple conductive loops 21, thereby producing a larger number of conductive loops 21. Multiple conductive loops 21 within the same conductive layer 30 may be disconnected or electrically connected. For example, all conductive loops 21 within the same conductive layer 30 may be disconnected; or at least two conductive loops 21 within the same conductive layer 30 may be electrically connected. The conductive loops 21 within each conductive layer 30 are configured based on the desired electrical connection function.

[0058] In one embodiment, step S20 uses high-pressure airless spraying, electrostatic spraying or air spraying to spray the conductive paint mixed with the adhesive onto the substrate 10. The conductive paint and the adhesive form a coating, which is sprayed onto the molding surface, and the coating solidifies to form a conductive loop 21. Specifically, when air spraying is used, compressed air is used to atomize the paint for spraying. When high-pressure airless spraying is used, the paint is pressurized to a pressure of 9.8MPa to 29.4MPa by a pressure pump, and then sprayed out through the small hole of the olive-shaped nozzle 50. When the high-pressure paint rushes out of the nozzle 50 and enters the atmosphere, it immediately expands violently and breaks into an extremely fine mist, which is directly sprayed onto the surface of the substrate 10 or the formed insulating protective layer 40. In high-pressure airless spraying, the paint is pressurized to a high pressure by a high-pressure pump and is not mixed with the compressed air. In electrostatic spraying, the principle of corona discharge is used to charge atomized paint negatively under the influence of a high-voltage DC electric field. The paint then dissipates by adsorbing onto a positively charged substrate. Electrostatic spraying equipment includes a spray gun, a spray cup, and a high-voltage power supply. Preferably, the paint also contains a solvent and additives. The conductive paint can be one or more of copper, aluminum, gold, silver, graphite, and other powders. The adhesive can include at least one of epoxy resin, polyester resin, acrylic resin, polyamide resin, modified phenolic resin, and cellulose resin.

[0059] In one embodiment, the conductive coating comprises a metal material, and step S20 utilizes thermal spraying, arc spraying, or plasma spraying to spray the molten conductive coating onto the substrate 10. Specifically, in the case of thermal spraying, the coating is heated and melted, then atomized into extremely fine particles using a high-speed airflow. The particles are then sprayed onto the molding surface at a high velocity, whereupon the coating solidifies to form a coating. In the case of arc spraying, an arc burning between continuously fed metal powders is used to melt the metal. The molten metal is then atomized using a high-speed airflow, and the atomized metal particles are accelerated and sprayed onto the molding surface, forming a conductive loop 21. In the case of plasma spraying, a plasma arc driven by direct current is used as a heat source to heat the conductive coating to a molten or semi-molten state. The coating is then sprayed onto the molding surface at a high velocity, forming a firmly adhered conductive loop 21. Thermal spraying includes flame spraying and arc spraying, differing in whether a flame or an arc is used to melt the material. Plasma spraying is a type of arc spraying, and the plasma arc can generate high temperatures to heat the metal powder. The conductive coating can be metal powder or metal wire.

[0060] When the conductive coating is a metal powder, the conductive coating includes one or a combination of nickel or its alloys, cadmium or its alloys, zirconium or its alloys, chromium or its alloys, cobalt or its alloys, manganese or its alloys, aluminum or its alloys, tin or its alloys, titanium or its alloys, zinc or its alloys, copper or its alloys, silver or its alloys, and gold or its alloys. When the conductive coating is a non-metallic powder, the conductive coating includes one or a combination of conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials. The carbon-containing conductor may be one or more of graphite powder, carbon nanotube materials, and graphene materials.

[0061] Step S40 may adopt the same process as step S20, which will not be described in detail here.

[0062] In one embodiment, the material forming the insulating protective layer 40 is a combination of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene; step S30 uses one or more coating, printing, spraying, dipping, and injection molding processes to form the insulating protective layer 40 to ensure the insulating protection effect of the insulating protective layer 40 on the conductive layer 30.

[0063] Step S10 includes cleaning the surface of the substrate 10. The substrate 10 may be cleaned by one or more of solution washing, ultrasonic washing, and high-pressure washing to remove oil, impurities, and dirt.

[0064] In one embodiment, the process further includes step S05 prior to step S10: providing an insulating layer on the surface of substrate 10, and forming conductive loops 21 on the surface of the insulating layer. If substrate 10 is made of a conductive material, pre-forming an insulating layer on substrate 10 can ensure insulation between conductive loops 21. The insulating layer can be formed using one or more of coating, printing, spraying, dipping, and injection molding processes. If substrate 10 itself is made of an insulating material, the insulating layer may not be provided.

[0065] The substrate 10 can adopt a contoured structure to adapt the produced wiring harness to the application environment. A flexible substrate 10 can be used, making the produced wiring harness suitable for a variety of installation scenarios, making it easier to use on appliances with complex installation environments. This helps reduce interference from vibration factors and ensures stability even in environments with high vibration requirements. The substrate 10 can be a component of an electrical device, enabling the integrated production of the component and wiring harness, allowing for quick installation and removal of the wiring harness. For example, the substrate 10 can be a vehicle body component or a component of an onboard electrical appliance. The conductive circuit 21 is integrally formed with the substrate 10. By replacing the substrate 10, the wiring harness can be replaced, saving both maintenance time and costs. For example, the inner lining of a vehicle door can serve as the substrate 10 for the door wiring harness, allowing the inner lining to be directly replaced during maintenance. The substrate 10 can also be a component of the body-in-white, bumper, roof, inner door panel, seat frame, or various onboard electrical appliances.

[0066] Typically, spray coating has the characteristics of large coverage, uniform thickness, and strong adhesion, and is generally used for surface coating such as corrosion protection and wear resistance. This wiring harness production method uses spray coating to produce the conductive loop 21, achieving adjustable width and thickness and a small coverage area.

[0067] In one embodiment, the production method of the wiring harness includes step S15 and step S60, step S15 is implemented before step S20, and step S60 is implemented before step S30; in step S15, a lower shielding layer is sprayed on the substrate; in step S60, an upper shielding layer is sprayed on the outer periphery of the insulating protective layer, the upper shielding layer is electrically connected to the lower shielding layer and the conductive loop 21 is closed.

[0068] The upper shielding layer and the lower shielding layer are connected by a shielding layer located on the side wall of the wiring harness. The upper shielding layer, the lower shielding layer and the shielding layer located on the side wall of the wiring harness form a box structure, which surrounds the conductive loop 21. The shielding structure is provided outside the wiring harness to shield the signal within the wiring harness from electromagnetic interference in locations with strong electromagnetic interference, thereby ensuring signal stability.

[0069] If the wiring harness includes multiple conductive layers, the upper shielding layer is positioned above the topmost conductive layer, meaning that step S80 is performed before the last step S50. If an insulating layer is provided on the substrate, the lower shielding layer is positioned above the insulating layer. The shielding layer on the sidewalls of the wiring harness can be sprayed or printed, or aluminum foil can be used.

[0070] In one embodiment, the wiring harness production method further comprises step S70 after step S30: crimping or welding connecting terminals at the ends of the conductive loop 21. By inter-plugging the connecting terminals, electrical connections are achieved between different wiring harnesses or between a wiring harness and an electrical appliance.

[0071] As shown in FIG4 , the terminal of the conductive circuit 21 is provided with a connection terminal 211 . The connection terminal 211 may be a gold finger or a pin terminal, and may also be welded with a wire to connect to other electrical circuits.

[0072] Furthermore, the wiring harness production method further includes, after step S70, step S80: providing a sheath at the terminal end of the conductive loop 21, with the connecting terminal housed within the sheath. The sheaths are inserted into each other to achieve contact and connection with the connecting terminal 211 within the sheath. In some cases, multiple connecting terminals 211 are provided within a single sheath, and two mating sheaths are connected to ensure a secure connection, making the electrical connection of the connecting terminal 211 more reliable and stable.

[0073] In one embodiment, the production method of the wiring harness also includes step S90 implemented after step S30. Step S90: a heat sink is provided on the insulating protective layer. A heat sink is provided on the insulating protective layer. The heat generated by the wiring harness current is quickly dissipated into the air through the heat sink, which is beneficial to reducing the temperature of the wiring harness and reducing the risk of the conductive circuit 21 melting.

[0074] Example 2

[0075] The present invention provides a nozzle 50 for use in the aforementioned wire harness production method, through which conductive coating is sprayed outwardly. By adjusting the size or shape of the discharge port 501 of the nozzle 50, the width and thickness of the cross-section of the sprayed conductive loop 21 can be adjusted. As shown in Figures 5 and 6, the discharge port 501 of the nozzle 50 is square. The square shape of the discharge port 501 of the nozzle 50 facilitates uniformity in the width and thickness of the cross-section of the conductive loop 21, ensuring cross-sectional stability and avoiding the situation during spraying where more coating is discharged in the middle of the cross-section and less coating is discharged at the sides, ultimately forming a conductive loop 21 with a higher cross-section in the middle and lower cross-sections at the sides.

[0076] In one embodiment, the size of the discharge opening 501 of the nozzle 50 is adjustable to adjust the width and thickness of the cross-section of the conductive loop 21. As shown in Figures 5 and 6, the nozzle 50 includes a nozzle body 51 and a movable sidewall 52. The movable sidewall 52 is connected to the nozzle body 51 via a hinge 53. By rotating the movable sidewall 52 relative to the nozzle body 51 about the center of the hinge 53 and adjusting the mounting angle of the movable sidewall 52, the position of the lower end of the movable sidewall 52 is adjusted, thereby adjusting the size of the discharge opening 501 of the nozzle 50.

[0077] Specifically, the nozzle body 51 is connected to a motor 54, whose shaft is connected to a drive screw 55. The movable sidewall 52 is provided with a threaded hole, into which the drive screw 55 engages. The motor 54 drives the drive screw 55, which in turn rotates the movable sidewall 52 about the hinge 53 to adjust the size of the nozzle 50's discharge port 501. The discharge port 501 of the nozzle 50 is square, making it easy to adjust the cross-sectional size of the conductive loop 21 by adjusting the size of the discharge port 501.

[0078] Example 3

[0079] The present invention provides a wiring harness produced using the aforementioned wiring harness production method. The wiring harness comprises: a substrate 10, at least one layer of conductive loops 21, and at least one insulating protective layer 40. Each conductive loop 21 is positioned between the substrate 10 and the outermost insulating protective layer 40, with the conductive loops 21 and the insulating protective layer 40 arranged alternately. The wiring harness is suitable for flexible production and small-batch production, offering fast and convenient processing, high efficiency, and reduced production costs.

[0080] In one embodiment, the cross-sectional width of the conductive loop 21 is 0.1mm-68mm. In a wiring harness, the cross-sectional area of ​​the conductor determines the current that the conductor can conduct. Generally, the conductor that realizes signal conduction has a smaller current and a smaller conductor cross-sectional area. For example, the minimum cross-sectional area of ​​the signal line of an automobile wiring harness can reach 0.1mm. 2 , and the conductor that realizes power conduction has a large current and a large conductor cross-sectional area. For example, the maximum cross-sectional area of ​​the car battery harness is 260mm 2 .

[0081] When the width of the conductive loop 21 is less than 0.1 mm, in order to obtain a cross-sectional area of ​​0.1 mm 2 To form a conductor, a conductive loop 21 with a thickness of at least 1 mm must be sprayed. The smaller the width, the greater the thickness. In order to obtain a thicker thickness, multiple spraying operations are required, which wastes work time and reduces processing efficiency. In addition, since the conductive loop 21 is too narrow, the strength cannot meet the requirements, and the layout of the wiring harness is also restricted, making it impossible to reduce the height of the wiring harness.

[0082] When the width of the conductive loop 21 is greater than 68 mm, in order to obtain a cross-sectional area of ​​260 mm 2 The conductor must be sprayed with a thickness of at least 3.82 mm. The wider the width, the smaller the thickness. However, the smaller the thickness, the larger the area of ​​the sprayed conductive loop 21, and the occupied area of ​​the wiring harness cannot be reduced.

[0083] Therefore, the inventors selected a cross-sectional width of the conductive loop of 0.1 mm to 68 mm, and obtained conductors with different cross-sectional areas by printing conductive loops 21 of different thicknesses.

[0084] After many experiments, the inventors found that when the cross-sectional width of the conductive loop is 0.5mm-58mm, the aspect ratio of the printed conductive loop 21 is within a relatively reasonable range, the thickness range is suitable for printing processing, and the occupied area is not wasted. Therefore, the inventors prefer that the cross-sectional width of the conductive loop is 0.5mm-58mm.

[0085] In one embodiment, the conductive coating includes a conductive filler, a binder, a solvent, and an additive, wherein the conductive filler includes a combination of one or more of metal powder, conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials.

[0086] In one embodiment, the carbon-containing conductor is graphite powder, carbon nanotube material, graphene material, or a combination thereof.

[0087] In one embodiment, the metal powder can be one or more of nickel or its alloys, cadmium or its alloys, zirconium or its alloys, chromium or its alloys, cobalt or its alloys, manganese or its alloys, aluminum or its alloys, tin or its alloys, titanium or its alloys, zinc or its alloys, copper or its alloys, silver or its alloys, and gold or its alloys. Preferably, the most commonly used metal material for conductors is copper or its alloys, as copper has relatively good electrical conductivity among metals, is not a precious metal, is relatively easy to process, and has good ductility. However, as copper prices continue to rise, the material cost of using copper as a conductor will become increasingly high. Therefore, people have begun to seek alternatives to copper to reduce costs. Aluminum accounts for approximately 7.73% of the Earth's crust. With optimized refining technology, its price is relatively low. Furthermore, aluminum is lighter than copper and has a conductivity second only to copper. Therefore, aluminum or its alloys can partially replace copper or its alloys in electrical connections.

[0088] In one embodiment, the insulating protective layer is made of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

[0089] In one embodiment, the breakdown strength of the insulating protective layer is 0.3KV / mm-35KV / mm. Breakdown strength is also called dielectric breakdown strength. It indicates the highest electric field strength that a material can withstand to avoid being destroyed (broken down) under the action of an electric field. When the breakdown strength of the insulating protective layer is lower than 0.3KV / mm, some thinner insulating protective layers may be broken down under normal voltage, resulting in invalid insulation. When the breakdown strength of the insulating protective layer is higher than 35KV / mm, since high voltages higher than 35KV will not occur in general vehicle environments, the use of materials with too high a breakdown strength will increase the cost of the integrated wiring harness assembly, resulting in design waste.

[0090] In one embodiment, the thickness of the insulating protective layer is 0.03mm-5mm. If the thickness of the insulating protective layer is less than 0.03mm, not only can the breakdown voltage of the insulating protective layer not be guaranteed to be higher than the operating voltage, but the wear resistance of the insulating protective layer cannot be guaranteed. After repeated scraping, the insulating protective layer will be damaged, exposing the conductor, which will lead to leakage or short circuit, causing circuit damage and functional failure. When the thickness of the insulating protective layer is equal to 5mm, the breakdown voltage, insulation resistance and wear resistance of the insulating protective layer can all meet the requirements. However, when the thickness is greater than 5mm, the thickness of the insulating protective layer is relatively large, and problems such as pores and collapse may occur during the processing, which reduces the performance of the insulating protective layer. In addition, the insulating protective layer material is wasted and the processing steps and time are increased. Therefore, the inventors selected the thickness of the insulating protective layer to be 0.03mm-5mm.

[0091] The substrate 10 can adopt a contoured structure to adapt the produced wiring harness to the application environment. A flexible substrate 10 can be used, making the produced wiring harness suitable for a variety of installation scenarios, making it easier to use on appliances with complex installation environments. This helps reduce interference from vibration factors and ensures stability even in environments with high vibration requirements. The substrate 10 can be a component of an electrical device, enabling the integrated production of the component and wiring harness, allowing for quick installation and removal of the wiring harness. For example, the substrate 10 can be a vehicle body component or a component of an onboard electrical appliance. The conductive circuit 21 is integrally formed with the substrate 10. By replacing the substrate 10, the wiring harness can be replaced, saving both maintenance time and costs. For example, the inner lining of a vehicle door can serve as the substrate 10 for the door wiring harness, allowing the inner lining to be directly replaced during maintenance. The substrate 10 can also be a component of the body-in-white, bumper, roof, inner door panel, seat frame, or various onboard electrical appliances.

[0092] Conventional printed circuit boards primarily function as circuit boards, mounting electrical components and achieving specific electrical functions. Unlike conventional printed circuit boards, this wiring harness conducts current and transmits signals. Connecting terminals 211 are provided at the ends of conductive loops 21. These terminals can be gold fingers, pin terminals, or solder wires. These terminals electrically connect conductive loops 21 to a power source or electrical device.

[0093] At present, automotive wiring harnesses are usually produced separately for wiring harness factories. The wires, terminals, sheaths, positioning parts, seals, brackets, etc. are processed and assembled together to form a complete wiring harness. It is then delivered to the automobile factory and assembled to the car body at different workstations during automobile assembly. The installation is relatively difficult and wastes labor.

[0094] The wiring harness can be directly installed on the body sheet metal, instrument panel or electrical device, without the need to set up a separate wiring harness. Once the automobile parts are installed, the wiring harness is also installed, saving labor hours for automobile assembly and reducing at least 60% of manual operations.

[0095] The above description is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A method for producing a wire harness, wherein: The production method of the wiring harness comprises: Step S10, preparing a substrate; Step S20, spraying a conductive coating onto the substrate to form a conductive loop; Step S30: forming an insulating protective layer around and on the surface of the conductive loop.

2. The method for producing a wire harness according to claim 1, wherein: The production method of the wiring harness includes step S40 performed after step S30, wherein step S40: spraying a conductive coating onto the insulating protective layer to form a conductive loop; Furthermore, the step S40 and the step S30 are alternately performed one or more times.

3. The method for producing a wire harness according to claim 2, wherein: The production method of the wiring harness comprises: Step S50 , punching holes in the insulating protective layer and / or the conductive loop, and pouring conductive material to form a connecting loop that electrically connects at least two layers of the conductive loop.

4. The method for producing a wire harness according to claim 1 or 2, wherein: The production method of the wiring harness comprises: Step S15, spraying a lower shielding layer on the substrate; Step S60, spraying an upper shielding layer on the outer periphery of the insulating protective layer, wherein the upper shielding layer is electrically connected to the lower shielding layer and closes the conductive loop; The step S15 is performed before the step S20 , and the step S60 is performed before the step S30 .

5. The method for producing a wire harness according to claim 1, wherein: The step S20 uses a nozzle, and the discharge port of the nozzle is square.

6. The method for producing a wire harness according to claim 5, wherein: The nozzle is installed on a three-axis servo mechanism or a six-axis manipulator.

7. The method for producing a wire harness according to claim 1, wherein: In step S20 , the conductive coating mixed with the adhesive is sprayed onto the substrate by high-pressure airless spraying, electrostatic spraying or air spraying.

8. The method for producing a wire harness according to claim 1, wherein: The conductive coating comprises a metal material, and step S20 is performed by spraying the molten conductive coating onto the substrate in a manner of thermal spraying, arc spraying or plasma spraying.

9. The method for producing a wire harness according to claim 1, wherein: The conductive layer formed in step S20 includes a plurality of conductive loops; in the same conductive layer, the plurality of conductive loops are disconnected or electrically connected.

10. The method for producing a wire harness according to claim 1, wherein: The method further includes step S05 before step S10: providing an insulating layer on the surface of the substrate, and forming the conductive loop on the surface of the insulating layer.

11. The method for producing a wire harness according to claim 1, wherein: The method further includes a step S70 after the step S30: crimping or welding a connection terminal at the terminal end of the conductive loop.

12. The method for producing a wire harness according to claim 11, wherein: The method further comprises a step S80 after the step S70: providing a sheath at the terminal end of the conductive loop, wherein the connecting terminal is accommodated in the sheath.

13. The method for producing a wire harness according to claim 1 or 2, wherein: The method further includes step S90 after step S30: providing a heat sink on the insulating protective layer.

14. The method for producing a wire harness according to claim 1, wherein: In step S30, the insulating protective layer is formed by one or more processes including coating, printing, spraying, dipping, and injection molding.

15. A nozzle, wherein The nozzle is applied to the method for producing a wire harness according to any one of claims 1 to 14, and the discharge port of the nozzle is square.

16. A wiring harness, wherein: The wiring harness is produced using the production method of any one of claims 1 to 14, comprising: a substrate, at least one layer of conductive loops and at least one layer of insulating protective layer, each of the conductive loops being located between the substrate and the outermost insulating protective layer, and the conductive loops and the insulating protective layers being distributed alternately.

17. The wire harness according to claim 16, wherein The cross-sectional width of the conductive loop is 0.1 mm to 68 mm.

18. The wire harness according to claim 16, wherein The cross-sectional width of the conductive loop is 0.5 mm to 58 mm.

19. The wire harness according to claim 16, wherein The conductive coating comprises conductive fillers, adhesives, solvents and additives, wherein the conductive fillers comprise one or more combinations of metal powders, conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors and conductive polymer materials.

20. The wire harness according to claim 19, wherein The carbon-containing conductor is one or a combination of graphite powder, carbon nanotube material, and graphene material.

21. The wire harness according to claim 19, wherein The metal powder is one or more of nickel or its alloys, cadmium or its alloys, zirconium or its alloys, chromium or its alloys, cobalt or its alloys, manganese or its alloys, aluminum or its alloys, tin or its alloys, titanium or its alloys, zinc or its alloys, copper or its alloys, silver or its alloys and gold or its alloys.

22. The wiring harness according to claim 16, wherein The insulating protective layer is made of a material selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and a combination of one or more of polyethylene.

23. The wiring harness according to claim 16, wherein The breakdown strength of the insulating protective layer is 0.3KV / mm-35KV / mm.

24. The wiring harness according to claim 16, wherein The thickness of the insulating protective layer is 0.03 mm to 5 mm.

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