TEMPERATURE CONTROL SYSTEMS FOR EQUIPMENT AND METHODS OF TEMPERATURE CONTROL

Abstract

The invention relates to a temperature control system for equipment and a temperature control method, which includes: a temperature detection module (1), a temperature control module (2), and a temperature regulation module (3). The temperature detection module (1) is configured to detect and collect the current temperature of the equipment. The temperature control module (2) is configured to collect the predicted temperature at the next time based on the current temperature and the temperature prediction model and output a temperature adjustment command to the temperature regulation module (3) based on the predicted temperature at the next time and the temperature threshold. The temperature regulation module (3) is configured to regulate the temperature of the equipment based on the temperature adjustment command. The temperature prediction model is collected beforehand. The temperature control method improves the temperature stability of the equipment during operation and ensures the electrical energy conversion efficiency of the equipment.

Description

Temperature control system and temperature control method for device Technical Field

[0001] The present invention relates to the technical field of electrical equipment, and in particular to a temperature control system and a temperature control method for a device. Background Art

[0002] As is known to all, a power supply device generates heat when supplying power to a load. In order to prevent the power supply device from malfunctioning due to temperature rise and reducing the service life of the power supply device, heat dissipation measures are taken for the power supply device.

[0003] In the prior art, a temperature acquisition device is used to acquire the temperature of a power supply unit, which is then cooled using cooling methods such as heat sinks, air cooling, or liquid cooling. The sampling circuit of the temperature acquisition device typically uses a thermistor, which generates different resistance values ​​based on temperature changes, thereby acquiring the power supply unit's temperature. However, when the current flowing through the thermistor is high, the thermistor's sampling accuracy is often affected. The thermistor cannot quickly sense temperature changes, resulting in inaccurate temperature readings of the power supply unit, which can affect the unit's operation and service life.

[0004] Summary of the Invention

[0005] In response to the problems in the prior art, embodiments of the present invention provide a temperature control system and a temperature control method for a device, which can at least partially solve the problems in the prior art.

[0006] In one aspect, the present invention provides a temperature control system for a device, comprising a temperature detection module, a temperature control module, and a temperature adjustment module, wherein:

[0007] The temperature detection module is used to detect the current temperature of the device, and the temperature control module is used to obtain the predicted temperature at the next moment based on the current temperature and the temperature prediction model, and output a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module adjusts the temperature of the device according to the temperature adjustment instruction.

[0008] In another aspect, the present invention provides a temperature control method, comprising:

[0009] Get the current temperature of the device;

[0010] Obtaining a predicted temperature at the next moment based on the current temperature and a temperature prediction model;

[0011] According to the predicted temperature at the next moment and the temperature threshold, a temperature adjustment instruction is output to adjust the temperature of the device.

[0012] On the other hand, the present invention provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the temperature control method described in any one of the above embodiments when executing the program.

[0013] In another aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the temperature control method described in any of the above embodiments when executed by a processor.

[0014] The temperature control system and temperature control method of the device provided in the embodiments of the present invention include a temperature detection module, a temperature control module and a temperature adjustment module. The temperature detection module is used to detect and obtain the current temperature of the device. The temperature control module is used to obtain the predicted temperature at the next moment based on the current temperature and a temperature prediction model, and output a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at the next moment and a temperature threshold. The temperature adjustment module adjusts the temperature of the device according to the temperature adjustment instruction to improve the temperature stability of the device during operation, thereby ensuring the power conversion efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0016] FIG1 is a schematic structural diagram of a temperature control system of an apparatus provided in one embodiment of the present invention.

[0017] FIG2 is a schematic diagram of the structure of a thermal resistor temperature measurement circuit provided by an embodiment of the present invention.

[0018] FIG3 is a schematic structural diagram of a temperature control system of an apparatus provided by another embodiment of the present invention.

[0019] FIG4 is a schematic structural diagram of a temperature detection accuracy processing unit provided by an embodiment of the present invention.

[0020] FIG5 is a schematic structural diagram of a voltage follower circuit provided in an embodiment of the present invention.

[0021] FIG6 is a schematic structural diagram of a feedback amplifier circuit provided in an embodiment of the present invention.

[0022] FIG7 is a schematic structural diagram of a filter circuit provided by an embodiment of the present invention.

[0023] FIG8 is a schematic structural diagram of a temperature control system of an apparatus provided in yet another embodiment of the present invention.

[0024] FIG9 is a schematic structural diagram of a heating unit provided in one embodiment of the present invention.

[0025] FIG10 is a schematic structural diagram of a cooling unit provided in one embodiment of the present invention.

[0026] FIG11 is a flow chart of a temperature control method according to an embodiment of the present invention.

[0027] FIG12 is a flow chart of a temperature control method according to another embodiment of the present invention.

[0028] FIG13 is a flow chart of a temperature control method provided in yet another embodiment of the present invention.

[0029] FIG14 is a temperature curve diagram of a device provided by an embodiment of the present invention.

[0030] FIG15 is a schematic diagram of the physical structure of an electronic device provided in one embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 1- Temperature detection module; 2- Temperature control module;

[0033] 3- temperature adjustment module; 11- temperature detection unit;

[0034] 12-temperature detection accuracy processing unit; 31-heating unit;

[0035] 32-cooling unit; 121-first comparator;

[0036] 122-first capacitor; 123-second comparator;

[0037] 124-first resistor; 125-second resistor;

[0038] 126 - a third resistor; 127 - a fourth resistor;

[0039] 128-second capacitor; 129-inductor;

[0040] 311-heating resistance wire; 312-first MOS tube;

[0041] 313 - fifth resistor; 314 - sixth resistor;

[0042] 321 - second MOS tube; 322 - seventh resistor;

[0043] 323-Cooling fan. DETAILED DESCRIPTION

[0044] To make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention. It should be noted that, unless there is a conflict, the embodiments and features in the embodiments of this application can be combined with each other in any manner.

[0045] The devices of the embodiments of the present invention include but are not limited to AC-DC converters in DC charging piles, DC chargers, and other devices.

[0046] FIG1 is a schematic diagram of the structure of a temperature control system of an apparatus provided in an embodiment of the present invention. As shown in FIG1 , the temperature control system of the apparatus provided in an embodiment of the present invention includes a temperature detection module 1, a temperature control module 2, and a temperature adjustment module 3, wherein:

[0047] The temperature detection module 1 is used to detect the current temperature of the device, and the temperature control module 2 is used to obtain the predicted temperature at the next moment based on the current temperature and the temperature prediction model, and output a temperature adjustment instruction to the temperature adjustment module 3 based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module 3 adjusts the temperature of the device according to the temperature adjustment instruction.

[0048] Specifically, temperature detection module 1 detects the device's temperature in real time, obtains the device's current temperature, and then sends the current temperature to temperature control module 2. After receiving the current temperature, temperature control module 2 inputs it into the temperature prediction model to obtain a predicted temperature for the next moment. Based on the predicted temperature for the next moment and a temperature threshold, a temperature adjustment instruction is generated. If a first difference between the predicted temperature for the next moment and the temperature threshold is greater than a first threshold, the temperature adjustment instruction causes temperature adjustment module 3 to cool the device. If the predicted temperature for the next moment is less than the temperature threshold and a second difference between the predicted temperature for the next moment and the temperature threshold is greater than a second threshold, the temperature adjustment instruction causes temperature adjustment module 3 to heat the device. Temperature control module 2 sends the temperature adjustment instruction to temperature adjustment module 3. Upon receiving the temperature adjustment instruction, temperature adjustment module 3 adjusts the device's temperature according to the temperature adjustment instruction. The temperature threshold is preset and can be set based on actual needs, and is not limited in this embodiment of the present invention. The temperature adjustment instruction is preset. The time interval between the current moment and the next moment is set according to actual needs and is not limited in the embodiment of the present invention.

[0049] The temperature control system of a device provided in an embodiment of the present invention includes a temperature detection module, a temperature control module, and a temperature adjustment module. The temperature detection module is used to detect and obtain the current temperature of the device. The temperature control module is used to obtain a predicted temperature at the next moment based on the current temperature and a temperature prediction model, and output a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at the next moment and a temperature threshold. The temperature adjustment module adjusts the temperature of the device according to the temperature adjustment instruction to improve the temperature stability of the device during operation, thereby ensuring the power conversion efficiency of the device. In addition, because the temperature of the device is adjusted based on the predicted temperature at the next moment, the predicted temperature can be compensated, thereby achieving pre-regulation of the device temperature.

[0050] On the basis of the above embodiments, further, the temperature prediction model is obtained in advance.

[0051] Specifically, the temperature control module can collect historical temperature training data of the device, and then train the temperature prediction model based on the historical temperature training data and the initial model, thereby obtaining the temperature prediction model, and configure the obtained temperature prediction model into the temperature control module. The initial model includes but is not limited to a neural network model, and is configured according to actual needs, and is not limited in the present embodiment.

[0052] On the basis of the above embodiments, further, the temperature prediction model is obtained by self-learning based on historical temperature data.

[0053] Specifically, the temperature control module can collect historical temperature data of the device and then self-learn to obtain the temperature prediction model based on the historical temperature data. The self-learning can adopt a machine learning model and be set according to actual needs, which is not limited in the embodiment of the present invention.

[0054] It is understandable that, since the temperature data of the device is continuously updated, the historical temperature data can be updated regularly and the temperature prediction model can be re-learned.

[0055] For example, the obtained historical temperature data is used as historical temperature training data, and then the temperature prediction model is trained based on the historical temperature data and the initial model. Then, the historical temperature data is regularly updated as historical temperature training data, and the temperature prediction model is trained again based on the historical temperature data and the initial model.

[0056] Based on the above embodiments, as shown in FIG3 , the temperature detection module 1 further includes a temperature detection unit 11. The temperature detection unit 11 employs a thermocouple temperature measurement circuit, a thermal resistor temperature measurement circuit, or a temperature acquisition chip. The temperature acquisition chip can be selected based on actual needs and is not limited in the present embodiment.

[0057] FIG2 is a schematic structural diagram of a thermal resistor temperature measurement circuit provided in an embodiment of the present invention. As shown in FIG2 , on the basis of the above embodiments, the thermal resistor temperature measurement circuit provided in an embodiment of the present invention further includes a resistor R1, a capacitor C1 and a thermistor TH1, a first end of the resistor R1 is connected to a power supply VCC, a second end of the resistor R1 is connected to a first end of the capacitor C1 and a first end of the thermistor TH1, respectively, and a second end of the capacitor C1 and a second end of the thermistor TH1 are grounded.

[0058] The thermocouple temperature measurement circuit may adopt a circuit structure similar to that of FIG. 2 , by replacing the thermistor TH1 in FIG. 2 with a thermocouple.

[0059] FIG3 is a schematic diagram of the structure of a temperature control system of a device provided by another embodiment of the present invention, and FIG4 is a schematic diagram of the structure of a temperature detection accuracy processing unit provided by an embodiment of the present invention. As shown in FIG3 and FIG4 , based on the above embodiments, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12, and the temperature detection processing unit 12 includes a voltage follower circuit, a feedback amplifier circuit, and a filter circuit, wherein:

[0060] The voltage follower circuit includes a first comparator 121 and a first capacitor 122, a first end of the first comparator 121 is connected to the temperature detection unit 11, a second end of the first comparator 121 is connected to the output end of the first comparator 121, a third end of the first comparator 121 is connected to the first power supply VCC1, a fourth end of the first comparator 121 is grounded, a first end of the first capacitor 122 is grounded, and a second end of the first capacitor 122 is connected to the first power supply VCC1;

[0061] The feedback amplifier circuit includes a second comparator 123, a first resistor 124, a second resistor 125, and a third resistor 126. The first end of the first resistor 124 is connected to the output end of the first comparator 121, the second end of the first resistor 124 is connected to the second end of the second comparator 123, the first end of the second comparator 123 is connected to the first end of the third resistor 126 and the second end of the second resistor 125, respectively, the second end of the third resistor 126 is connected to the output end of the second comparator 123, the first end of the second resistor 125 is grounded, the third end of the second comparator 123 is connected to the first power supply VCC1, and the fourth end of the second comparator 123 is grounded.

[0062] The filtering circuit includes a fourth resistor 127, a second capacitor 128 and an inductor 129. The first end of the fourth resistor 127 is connected to the output end of the second comparator 123, the second end of the fourth resistor 127 is connected to the first end of the second capacitor 128 and the first end of the inductor 129 respectively, the second end of the second capacitor 128 is grounded, and the second end of the inductor 129 is connected to the temperature control module 2.

[0063] The voltage follower circuit isolates the acquisition circuit from the post-processing circuit; the feedback amplifier circuit amplifies the isolated small signal to improve accuracy; and the filter circuit filters the signal to eliminate line conduction interference. The temperature detection precision processing unit improves the accuracy of the device's temperature acquisition.

[0064] FIG5 is a schematic diagram of the structure of a voltage follower circuit provided in an embodiment of the present invention. As shown in FIG3 and FIG5, based on the above embodiments, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12, and the temperature detection processing unit 12 includes a voltage follower circuit, wherein:

[0065] The voltage follower circuit includes a first comparator 121 and a first capacitor 122. The first end of the first comparator 121 is connected to the temperature detection unit 11, the second end of the first comparator 121 is connected to the output end of the first comparator 121, the third end of the first comparator 121 is connected to the first power supply VCC1, the fourth end of the first comparator 121 is grounded, the first end of the first capacitor 122 is grounded, the second end of the first capacitor 122 is connected to the first power supply VCC1, and the output end of the first comparator 121 can be connected to the temperature control module 2.

[0066] FIG6 is a schematic diagram of the structure of a feedback amplifier circuit provided in an embodiment of the present invention. As shown in FIG3 and FIG6 , based on the above embodiments, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12, and the temperature detection processing unit 12 includes a feedback amplifier circuit, wherein:

[0067] The feedback amplification circuit includes a second comparator 123, a first resistor 124, a second resistor 125 and a third resistor 126. The second end of the first resistor 124 is connected to the second end of the second comparator 123, the first end of the second comparator 123 is respectively connected to the first end of the third resistor 126 and the second end of the second resistor 125, the second end of the third resistor 126 is connected to the output end of the second comparator 123, the first end of the second resistor 125 is grounded, the third end of the second comparator 123 is connected to the first power supply VCC1, the fourth end of the second comparator 123 is grounded, the first end of the first resistor 124 can be connected to the temperature detection unit 11, and the output end of the second comparator 123 can be connected to the temperature control module 2.

[0068] FIG7 is a schematic diagram of the structure of a filter circuit provided in an embodiment of the present invention. As shown in FIG3 and FIG7 , based on the above embodiments, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12, and the temperature detection processing unit 12 includes a filter circuit, wherein:

[0069] The filtering circuit includes a fourth resistor 127, a second capacitor 128 and an inductor 129. The second end of the fourth resistor 127 is connected to the first end of the second capacitor 128 and the first end of the inductor 129 respectively. The second end of the second capacitor 128 is grounded. The second end of the inductor 129 is connected to the temperature control module 2. The first end of the fourth resistor 127 can be connected to the temperature detection unit 11.

[0070] Figure 8 is a structural schematic diagram of the temperature control system of a device provided in another embodiment of the present invention. As shown in Figure 8, on the basis of the above embodiments, the temperature adjustment module 3 further includes a heating unit 31 and a cooling unit 32. The heating unit 31 is used to heat the device to increase the temperature of the device, and the cooling unit 32 is used to cool the device to reduce the temperature of the device.

[0071] The temperature control system provided by the embodiments of the present invention utilizes a temperature adjustment module to both increase and decrease the temperature of the device, making it suitable for use in all weather conditions. This is particularly true for devices installed outdoors, where cooling is required in the summer and temperature increases in the winter to ensure efficient power conversion.

[0072] On the basis of the above embodiments, the heating unit 31 can further achieve heating by heating resistance wire, copper electric heating plate, aluminum electric heating plate, ceramic electric heating, stainless steel electric heating tube, controlled circulating air duct heating or chemical reagent reaction heating.

[0073] Among them, heating resistance wire, copper electric heating plate, aluminum electric heating plate, ceramic electric heating and stainless steel electric heating tube can be used in conjunction with MOS tube to adjust temperature and control heating, and air is supplied by fans; the principle of circulating air duct heating is to control the opening and closing of the heat dissipation air duct, that is, to close the air duct outlet when heating is required, so that the hot air around the electronic device is not discharged outside the device but circulates inside the device to supplement heat for other non-heating electronic devices; chemical reagent heating is to set up a closed and independent chemical reaction unit inside the device, control the feed amount of chemical reagents to control the reaction temperature, and then supply air through fans to circulate to the electronic devices in the device that need temperature compensation. Chemical reagents such as CaO and H2O, CaO and H2O react to generate CaOH2, which can dissipate heat.

[0074] FIG9 is a schematic structural diagram of a heating unit provided in an embodiment of the present invention. As shown in FIG9 , the heating unit 31 includes a heating resistor 311, a first MOS transistor 312, a fifth resistor 313, and a sixth resistor 314, wherein:

[0075] The first end of the heating resistor 311 is connected to the second power supply VCC2, the second end of the heating resistor 311 is connected to the drain of the first MOS transistor 312, the gate of the first MOS transistor 312 is connected to the first end of the fifth resistor 313 and the first end of the sixth resistor 314 respectively, the source of the first MOS transistor 312 and the second end of the fifth resistor 313 are grounded, and the second end of the sixth resistor 314 is connected to the temperature control module 2.

[0076] When the device needs to be heated, the device can be heated by heating the resistance wire 311. The resistance wire can be replaced by a copper heating plate, an aluminum heating plate, a ceramic or stainless steel electric heating tube, and the MOS tube can be used to adjust the temperature and control the heating.

[0077] On the basis of the above embodiments, the cooling unit 32 can further achieve cooling by liquid cooling circulation cooling, metal heat pipe conduction cooling, graphite sheet conduction cooling, semiconductor cooling, chemical reagent cooling or cooling fan.

[0078] Among them, liquid cooling circulation cooling uses coolant as a medium to take away heat through circulation, and then discharges the excess heat from the device through the radiator and cooling fan; metal heat pipe conduction cooling and graphite sheet conduction cooling are to attach heat conduction parts (metal or graphite) to the surface of the device with strong heat generation, and then use the cooling fan to blow the excess heat conducted out into the exhaust duct and then discharge it from the device; semiconductor cooling is to connect it to the power supply so that its cold end is close to the heat-generating device and the hot end relies on the cooling fan to discharge the heat from the device to achieve the internal heat dissipation effect of the device; chemical reagent cooling is to set up a closed and independent chemical reaction unit inside the device, and absorb the surrounding heat through chemical reaction to reduce the excess heat around the heat-generating electronic device to achieve the purpose of cooling the device.

[0079] FIG10 is a schematic structural diagram of a cooling unit provided in an embodiment of the present invention. As shown in FIG10 , based on the above embodiments, the cooling unit 32 further includes a second MOS transistor 321, a seventh resistor 322 and a cooling fan 323, wherein:

[0080] A first end of the seventh resistor 322 and a drain of the second MOS transistor 321 are connected to the third power supply VCC3, a gate of the second MOS transistor 321 and a second end of the seventh resistor 322 are connected to the temperature control module 2, a source of the second MOS transistor 321 is connected to a first end of the cooling fan 323, and a second end of the cooling fan 323 is grounded.

[0081] When the device needs to be cooled, the cooling fan 323 can be used to cool the device. It is understandable that other methods such as water cooling can also be used for cooling, which can be selected according to actual conditions and is not limited in the embodiment of the present invention.

[0082] On the basis of the above embodiments, further, the temperature control module 2 adopts a microprocessor, a field programmable gate array (FPGA) or a complex programmable logic device (CPLD).

[0083] For example, the analog signal acquisition pin of the microprocessor's analog-to-digital converter is connected to the second end of the filter circuit's inductor 129 to acquire the current temperature output by the temperature detection module 1. The microprocessor's first control output pin is connected to the second end of the seventh resistor 322 and the gate of the second MOS transistor 321, respectively, to output a temperature adjustment command to control the fan 323 to rotate and cool down. The microprocessor's second control output pin is connected to the second end of the sixth resistor 314 to output a temperature adjustment command to control the heating resistor 311 to heat.

[0084] An embodiment of the present invention provides a charging system, comprising a temperature control system of the device described in any one of the above embodiments.

[0085] The following is a specific example of an application scenario of the temperature control system of the device provided by an embodiment of the present invention. The device is an AC-DC converter installed in a charging pile, which can charge electric vehicles. The AC-DC converter in the charging pile is configured with the temperature control system of the device provided by an embodiment of the present invention.

[0086] When the charging pile is located outdoors in the Northeast region, the weather is cold in winter with low outdoor temperatures, and hot in summer with high outdoor temperatures. When the charging pile is charging an electric car in winter, due to the low outside temperature, the AC-DC converter needs to be heated. The temperature detection module 1 can collect the current temperature of the AC-DC converter in real time. The temperature control module 2 obtains the predicted temperature of the AC-DC converter at the next moment based on the current temperature and the temperature prediction model, and outputs a temperature adjustment instruction to the temperature adjustment module 3 based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module 3 heats the AC-DC converter so that it operates within a certain range of the temperature threshold. When the charging pile is charging an electric car in the summer, due to the high outside temperature, and considering that the temperature of the AC-DC converter itself will rise during operation, the AC-DC converter needs to be cooled. The temperature detection module 1 can collect the current temperature of the AC-DC converter in real time. The temperature control module 2 obtains the predicted temperature of the AC-DC converter at the next moment based on the current temperature and the temperature prediction model, and outputs a temperature adjustment instruction to the temperature adjustment module 3 based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module 3 will reduce the temperature of the AC-DC converter so that it operates within a certain range of the temperature threshold.

[0087] When the charging pile is located outdoors in Xinjiang and is in a season with a large temperature difference between day and night. For example, when the charging pile charges an electric car at noon, due to the high outside temperature and the fact that the temperature of the AC-DC converter itself will rise during operation, the temperature control system of the device provided by the embodiment of the present invention will cool the AC-DC converter so that it operates within a certain range of the temperature threshold. When the charging pile charges an electric car at night, due to the low outside temperature, the temperature control system of the device provided by the embodiment of the present invention will heat the AC-DC converter so that it operates within a certain range of the temperature threshold.

[0088] FIG11 is a flow chart of a temperature control method according to an embodiment of the present invention. As shown in FIG11 , the temperature control method according to an embodiment of the present invention can be applied to the temperature control system of the device according to any of the above embodiments, including:

[0089] S801, obtaining the current temperature of the device;

[0090] Specifically, the temperature detection module can detect the temperature of the device in real time, obtain the current temperature of the device, and then send the current temperature to the temperature control module. The temperature control module can receive the current temperature.

[0091] S802: Obtaining a predicted temperature at the next moment based on the current temperature and a temperature prediction model;

[0092] Specifically, after obtaining the current temperature, the temperature control module inputs the current temperature into a temperature prediction model to obtain a predicted temperature of the device at the next moment. The temperature prediction model can be trained based on historical temperature training data.

[0093] S803: Output a temperature adjustment instruction to adjust the temperature of the device according to the predicted temperature at the next moment and the temperature threshold.

[0094] Specifically, after obtaining the predicted temperature at the next moment, the temperature control module will obtain a temperature adjustment instruction based on the predicted temperature at the next moment and the temperature threshold, and then send the temperature adjustment instruction to the temperature adjustment module. The temperature adjustment module will adjust the temperature of the device according to the temperature adjustment instruction.

[0095] For example, the temperature control module outputs the temperature adjustment instruction to lower the temperature of the device after determining that the predicted temperature at the next moment is greater than the temperature threshold and a first difference between the predicted temperature at the next moment and the temperature threshold is greater than a first threshold. The temperature control module outputs the temperature adjustment instruction to increase the temperature of the device after determining that the predicted temperature at the next moment is less than the temperature threshold and a second difference between the temperature threshold and the predicted temperature at the next moment is greater than a second threshold.

[0096] The temperature control method provided by an embodiment of the present invention obtains the current temperature of a device, obtains a predicted temperature for the next moment based on the current temperature and a temperature prediction model, and outputs a temperature adjustment instruction based on the predicted temperature for the next moment and a temperature threshold to adjust the device temperature. This improves the temperature stability of the device during operation, thereby ensuring the device's power conversion efficiency. Furthermore, because the device temperature is adjusted based on the predicted temperature for the next moment, the predicted temperature can be compensated, enabling pre-regulation of the device temperature.

[0097] On the basis of the above embodiments, further, the temperature prediction model is obtained in advance.

[0098] Specifically, the temperature control module can collect historical temperature training data of the device, and then train the temperature prediction model based on the historical temperature training data and the initial model, thereby obtaining the temperature prediction model, and configure the obtained temperature prediction model into the temperature control module. The initial model includes but is not limited to a neural network model, and is configured according to actual needs, and is not limited in the present embodiment.

[0099] On the basis of the above embodiments, further, the temperature prediction model is obtained by self-learning based on historical temperature data.

[0100] Specifically, the temperature control module can collect historical temperature data of the device and then self-learn to obtain the temperature prediction model based on the historical temperature data. The self-learning can adopt a machine learning model and be set according to actual needs, which is not limited in the embodiment of the present invention.

[0101] It is understandable that, since the temperature data of the device is continuously updated, the historical temperature data can be updated regularly and the temperature prediction model can be re-learned.

[0102] FIG12 is a flow chart of a temperature control method according to another embodiment of the present invention. As shown in FIG12 , the temperature prediction model is obtained by training based on historical temperature training data. The steps of obtaining the temperature prediction model by training based on the historical temperature training data include:

[0103] S901, obtaining the historical temperature training data;

[0104] Specifically, when the device is working normally, the temperature of the device is collected at unit time intervals within a preset time period, and the temperature of the device at each moment can be obtained. The server can obtain the temperature at each moment as the historical temperature training data, and the historical temperature training data includes the temperature at the a-th moment and the temperature at the a+1-th moment. The temperature at the a-th moment corresponds to the temperature at the a+1-th moment, a is a positive integer, and a is less than the data volume of the historical temperature training data. The data volume of the historical temperature training data is set according to actual experience, and is not limited in the embodiment of the present invention. The preset time period is set according to actual needs, and is not limited in the embodiment of the present invention. The unit time interval can be set to 1 to 3 seconds, and is set according to actual experience, and is not limited in the embodiment of the present invention.

[0105] S902: Train and obtain the temperature prediction model based on the historical temperature training data and the initial model.

[0106] Specifically, after obtaining the historical temperature training data, the server may divide the historical temperature training data into a training set and a validation set. The initial model is trained using the temperature at the bth moment in the training set as input data and the temperature at the b+1th moment as output data, thereby obtaining a temperature prediction model to be determined. b is a positive integer and is less than or equal to the amount of data in the training set. The temperature at the fth moment in the validation set is input into the temperature prediction model to be determined, thereby outputting a predicted temperature at the f+1th moment. f is a positive integer and is less than or equal to the amount of data in the validation set. The temperature at the next moment in the training set is compared with the corresponding predicted temperature. If the absolute value of the difference between the temperature at the next moment and the predicted temperature at the next moment is less than or equal to a deviation threshold, then the predicted temperature is accurate. If the absolute value of the difference between the temperature at the next moment and the predicted temperature at the next moment is greater than the deviation threshold, then the predicted temperature is inaccurate. The number of accurate and inaccurate temperature predictions at each moment in the validation set is counted to calculate the prediction accuracy of the temperature prediction model to be determined. If the prediction accuracy is greater than the accuracy threshold, the temperature prediction model to be determined is used as the temperature prediction model. Otherwise, the parameters and / or historical temperature training data are adjusted and the model training is re-performed. The initial model includes, but is not limited to, a neural network model. The deviation threshold is set based on practical experience and is not limited in this embodiment of the present invention. The accuracy threshold is set based on practical experience and is not limited in this embodiment of the present invention.

[0107] For example, the initial model adopts a three-layer neural network model, which can be expressed as follows:

[0108]

[0109] in, represents the predicted temperature at time t+1, m represents the number of hidden layer nodes, v i represents the connection weight from the i-th hidden layer node to the output node, g represents the fine-tuning coefficient, ω i (t) represents the connection weight function corresponding to the i-th hidden layer node, x(t) represents the temperature at time t, T represents the number of samples, x t represents the temperature at time t, θ i represents the threshold of the i-th hidden layer neuron, θ represents the threshold of the output layer neuron, and i is a positive integer less than or equal to m. m is set as needed, for example, to 5 or 6, and is not limited in this embodiment. g is set as needed, for example, to 1, and is not limited in this embodiment.

[0110] For example, set the number of hidden nodes m to 6, and the connection weight from the hidden layer node to the output node v i The initial value is 0.01, and the hidden layer neuron threshold θ i The initial value of is 0.002, the initial value of the output layer neuron threshold θ is 0.03, the learning rate is 0.07-0.22, and the number of samples of historical temperature training data is 49-130.

[0111] The temperature prediction model obtained through training of the three-layer neural network model has high temperature prediction efficiency and accuracy.

[0112] FIG13 is a flow chart of a temperature control method according to another embodiment of the present invention. As shown in FIG13 , based on the above embodiments, further, outputting a temperature adjustment instruction to adjust the temperature of the device according to the predicted temperature at the next moment and the temperature threshold includes:

[0113] S8031: If it is determined that the predicted temperature at the next moment is greater than the temperature threshold and a first difference between the predicted temperature at the next moment and the temperature threshold is greater than a first threshold, outputting the temperature adjustment instruction to lower the temperature of the device;

[0114] Specifically, the temperature control module compares the predicted temperature at the next moment with the temperature threshold. If the predicted temperature at the next moment is greater than the temperature threshold, then the first difference between the predicted temperature at the next moment and the temperature threshold is calculated, and then the first difference is compared with the first threshold. If the first difference is greater than the first threshold, it means that the predicted temperature at the next moment is too high and needs to be cooled. The temperature adjustment instruction can be output to lower the temperature of the device to achieve early control of the temperature at the next moment.

[0115] For example, the temperature control module sends a temperature adjustment instruction to the cooling unit of the temperature adjustment module to lower the temperature of the device so that the actual temperature at the next moment is lower than the predicted temperature at the next moment, meeting the operating temperature requirements of the device and achieving the purpose of pre-adjusting the temperature of the device.

[0116] S8032: If it is determined that the predicted temperature at the next moment is less than the temperature threshold and a second difference between the temperature threshold and the predicted temperature at the next moment is greater than a second threshold, output the temperature adjustment instruction to increase the temperature of the device.

[0117] Specifically, the temperature control module compares the predicted temperature at the next moment with the temperature threshold. If the predicted temperature at the next moment is less than the temperature threshold, then the second difference between the predicted temperature at the next moment and the temperature threshold is calculated, and then the second difference is compared with the second threshold. If the second difference is greater than the second threshold, it means that the predicted temperature at the next moment is too low and needs to be heated. The temperature adjustment instruction can be output to increase the temperature of the device to achieve early control of the temperature at the next moment.

[0118] For example, the temperature control module sends a temperature adjustment instruction to the heating unit of the temperature adjustment module to increase the temperature of the device so that the actual temperature at the next moment is higher than the predicted temperature at the next moment, meets the operating temperature requirements of the device, and achieves the purpose of pre-adjusting the temperature of the device.

[0119] Figure 14 is a temperature curve diagram of a device provided by an embodiment of the present invention. As shown in Figure 14, the temperature control method provided by an embodiment of the present invention is used to control the temperature of a certain device. 65°C is the temperature threshold of the device, that is, the ideal operating temperature. As can be seen from Figure 14, the range of fluctuation of the actual temperature after adjustment around 65°C at time t+1 is significantly smaller than the range of fluctuation of the predicted temperature around 65°C at time t+1, which significantly improves the temperature stability of the device during operation.

[0120] FIG15 is a schematic diagram of the physical structure of an electronic device provided in one embodiment of the present invention. As shown in FIG15 , the electronic device 600 may include: a processor 100 and a memory 140. The memory 140 is coupled to the processor 100. The processor 100 may invoke logic instructions in the memory 140 to execute the following method: obtaining the current temperature of the device; obtaining a predicted temperature at the next moment based on the current temperature and a temperature prediction model; wherein the temperature prediction model is trained based on historical temperature training data; and outputting a temperature adjustment instruction to adjust the temperature of the device based on the predicted temperature at the next moment and a temperature threshold.

[0121] This embodiment discloses a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium, and the computer program includes program instructions. When the program instructions are executed by a computer, the computer can perform the methods provided by the above-mentioned method embodiments, for example, including: obtaining the current temperature of a device; obtaining a predicted temperature at the next moment based on the current temperature and a temperature prediction model; wherein the temperature prediction model is obtained by training based on historical temperature training data; and outputting a temperature adjustment instruction to adjust the temperature of the device based on the predicted temperature at the next moment and a temperature threshold.

[0122] This embodiment provides a computer-readable storage medium, which stores a computer program. The computer program enables the computer to execute the methods provided by the above-mentioned method embodiments, for example, including: obtaining the current temperature of the device; obtaining the predicted temperature at the next moment based on the current temperature and a temperature prediction model; wherein the temperature prediction model is obtained by training based on historical temperature training data; and outputting a temperature adjustment instruction to adjust the temperature of the device based on the predicted temperature at the next moment and a temperature threshold.

[0123] As shown in Figure 15 , electronic device 600 may further include: a communication module 110, an input unit 120, an audio processing unit 130, a display 160, and a power supply 170. It is worth noting that electronic device 600 does not necessarily include all of the components shown in Figure 15 ; furthermore, electronic device 600 may also include components not shown in Figure 15 , for which reference may be made to existing technologies. It is worth noting that this figure is illustrative only; other types of structures may be used to supplement or replace this structure to implement telecommunication or other functions.

[0124] As shown in FIG. 15 , the processor 100 is sometimes also referred to as a controller or an operation control, and may include a microprocessor or other processor device and / or logic device. The processor 100 receives input and controls the operation of various components of the electronic device 600 .

[0125] Memory 140 may be, for example, one or more of a cache, flash memory, a hard drive, removable media, volatile memory, non-volatile memory, or other suitable devices. It may store the aforementioned failure-related information and may also store a program for executing the relevant information. Processor 100 may execute the program stored in memory 140 to implement information storage or processing.

[0126] Input unit 120 provides input to processor 100. Input unit 120 is, for example, a keypad or touch input device. Power supply 170 is used to provide power to electronic device 600. Display 160 is used to display objects such as images and text. Display 160 can be, for example, an LCD display, but is not limited thereto.

[0127] The memory 140 may be a solid-state memory, such as a read-only memory (ROM), a random access memory (RAM), or a SIM card. Alternatively, it may be a memory that retains information even when power is off, can be selectively erased, and is provided with more data. Examples of memory 140 are sometimes referred to as EPROMs. The memory 140 may also be some other type of device. The memory 140 includes a buffer 141 (sometimes referred to as a buffer memory). The memory 140 may include an application / function storage unit 142 for storing application programs and function programs or processes for executing the operation of the electronic device 600 via the processor 100.

[0128] The memory 140 may also include a data storage unit 143 for storing data, such as contacts, digital data, pictures, sounds, and / or any other data used by the electronic device. The driver storage unit 144 of the memory 140 may include various driver programs for communication functions of the electronic device and / or for executing other functions of the electronic device (such as messaging applications, address book applications, etc.).

[0129] The communication module 110 includes a transmitter / receiver for transmitting and receiving signals via an antenna 111. The communication module 110 is coupled to the processor 100 to provide input signals and receive output signals, which may be the same as in the case of a conventional mobile communication terminal.

[0130] Based on different communication technologies, multiple communication modules 110 may be provided in the same electronic device, such as a cellular network module, a Bluetooth module, and / or a wireless local area network module. The communication module 110 is also coupled to a speaker 131 and a microphone 132 via an audio processor 130 to provide audio output via the speaker 131 and receive audio input from the microphone 132, thereby implementing common telecommunication functions. The audio processor 130 may include any suitable buffer, decoder, amplifier, etc. Furthermore, the audio processor 130 is coupled to the processor 100, enabling local recording via the microphone 132 and playback of stored audio via the speaker 131.

[0131] It will be understood by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0132] The present invention is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device produce a device for implementing the functions specified in one or more processes in the flowchart and / or one or more boxes in the block diagram.

[0133] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a product including an instruction device that implements the functions specified in one or more processes in the flowchart and / or one or more boxes in the block diagram.

[0134] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more processes in the flowchart and / or one or more boxes in the block diagram.

[0135] Throughout this specification, reference to terms such as "one embodiment," "a specific embodiment," "some embodiments," "for example," "example," "specific example," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0136] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A temperature control system for a device, It is characterized in that It includes a temperature detection module, a temperature control module and a temperature adjustment module, wherein: The temperature detection module is used to detect the current temperature of the device, and the temperature control module is used to obtain the predicted temperature at the next moment based on the current temperature and the temperature prediction model, and output a temperature adjustment instruction to the temperature adjustment module based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module adjusts the temperature of the device according to the temperature adjustment instruction.

2. The temperature control system according to claim 1, It is characterized in that The temperature prediction model is obtained through self-learning based on historical temperature data.

3. The temperature control system according to claim 1, It is characterized in that The temperature prediction model is obtained in advance.

4. The temperature control system according to claim 1, It is characterized in that The temperature detection module includes a temperature detection unit, and the temperature detection unit adopts a thermocouple temperature measurement circuit, a thermal resistor temperature measurement circuit or a temperature acquisition chip.

5. The temperature control system according to claim 4, It is characterized in that The temperature detection module further includes a temperature detection accuracy processing unit, and the temperature detection processing unit includes a voltage follower circuit, wherein: The voltage follower circuit includes a first comparator and a first capacitor, the first end of the first comparator is connected to the temperature detection unit, the second end of the first comparator is connected to the output end of the first comparator, the third end of the first comparator is connected to a first power supply, the fourth end of the first comparator is grounded, the first end of the first capacitor is grounded, and the second end of the first capacitor is connected to the first power supply.

6. The temperature control system according to claim 4, It is characterized in that The temperature detection module further includes a temperature detection accuracy processing unit, and the temperature detection processing unit includes a feedback amplification circuit, wherein: The feedback amplifier circuit includes a second comparator, a first resistor, a second resistor and a third resistor, the second end of the first resistor is connected to the second end of the second comparator, the first end of the second comparator is respectively connected to the output end of the second comparator and the second end of the second resistor, the first end of the second resistor is grounded, the third end of the second comparator is connected to the first power supply, and the fourth end of the second comparator is grounded.

7. The temperature control system according to claim 4, It is characterized in that The temperature detection module further includes a temperature detection accuracy processing unit, and the temperature detection processing unit includes a filter circuit, wherein: The filtering circuit includes a fourth resistor, a second capacitor and an inductor, the second end of the fourth resistor is respectively connected to the first end of the second capacitor and the first end of the inductor, the second end of the second capacitor is grounded, and the second end of the inductor is connected to the temperature control module.

8. The temperature control system according to claim 1, It is characterized in that The temperature adjustment module includes a heating unit and a cooling unit.

9. The temperature control system according to claim 8, It is characterized in that The heating unit achieves heating through heating resistance wire, copper electric heating plate, aluminum electric heating plate, ceramic electric heating, stainless steel electric heating tube, controlled circulating air duct heating or chemical reagent reaction heating.

10. The temperature control system according to claim 8, It is characterized in that The heating unit includes a heating resistor, a first MOS tube, a fifth resistor and a sixth resistor, wherein: The first end of the heating resistor is connected to the second power supply, the second end of the heating resistor is connected to the drain of the first MOS tube, the gate of the first MOS tube is respectively connected to the first end of the fifth resistor and the first end of the sixth resistor, the source of the first MOS tube and the second end of the fifth resistor are grounded, and the second end of the sixth resistor is connected to the temperature control module.

11. The temperature control system according to claim 8, It is characterized in that The cooling unit realizes cooling by liquid cooling circulation cooling, metal heat pipe conduction cooling, graphite sheet conduction cooling, semiconductor cooling, chemical reagent cooling or heat dissipation fan.

12. The temperature control system according to claim 8, It is characterized in that The cooling unit includes a second MOS tube, a seventh resistor and a cooling fan, wherein: The first end of the seventh resistor and the drain of the second MOS tube are connected to a third power supply, the gate of the second MOS tube and the second end of the seventh resistor are connected to the temperature control module, the source of the second MOS tube is connected to the first end of the cooling fan, and the second end of the cooling fan is grounded.

13. The temperature control system according to any one of claims 1 to 12, It is characterized in that The temperature control module adopts a microprocessor, a field programmable gate array or a complex programmable logic device.

14. A charging system, It is characterized in that A temperature control system comprising the device as claimed in any one of claims 1 to 13.

15. A temperature control method, It is characterized in that include: Get the current temperature of the device; Obtaining a predicted temperature at the next moment according to the current temperature and the temperature prediction model; According to the predicted temperature at the next moment and the temperature threshold, a temperature adjustment instruction is output to adjust the temperature of the device.

16. The method according to claim 15, It is characterized in that The temperature prediction model is obtained through self-learning based on historical temperature data.

17. The method according to claim 15, It is characterized in that The temperature prediction model is obtained in advance.

18. The method according to claim 15, It is characterized in that The temperature prediction model is obtained based on historical temperature training data, including: Acquire the historical temperature training data; The temperature prediction model is obtained through training based on the historical temperature training data and the initial model.

19. The method according to any one of claims 15 to 18, It is characterized in that Outputting a temperature adjustment instruction to adjust the temperature of the device according to the predicted temperature at the next moment and the temperature threshold comprises: If it is determined that the predicted temperature at the next moment is greater than the temperature threshold and a first difference between the predicted temperature at the next moment and the temperature threshold is greater than a first threshold, outputting the temperature adjustment instruction to reduce the temperature of the device; If it is determined that the predicted temperature at the next moment is less than the temperature threshold and a second difference between the temperature threshold and the predicted temperature at the next moment is greater than a second threshold, the temperature adjustment instruction is output to increase the temperature of the device.

20. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, It is characterized in that When the processor executes the computer program, the steps of the method according to any one of claims 15 to 19 are implemented.

21. A computer-readable storage medium having a computer program stored thereon, It is characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 15 to 19 are implemented.

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