Electronic devices

Abstract

The invention relates to an electronic device. This electronic device comprises a housing, a buffer attached to the housing, a first electronic component located on the side belonging to the buffer and away from the housing, and a second electronic component located on the side belonging to the housing and away from the buffer. The buffer has a recess, and at least part of the frontal protrusion of the second electronic component, along the thickness of the electronic device, is contained within the frontal protrusion of the recess.The recessed arrangement can reduce the direct and indirect contact area between the buffer and the first electronic component and / or the direct or indirect contact area between the buffer and the second electronic component, thereby reducing the heat transfer efficiency of the corresponding buffer area and reducing the heat transfer efficiency of the electronic device along the thickness. This makes the heat more uniform in the direction other than the thickness, reduces the likelihood of the first electronic component having a relatively high local temperature, and improves the user's thermal experience.

Description

An electronic device Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to an electronic device. Background Art

[0002] With the development of technology, electronic devices such as mobile phones and tablets have become commonly used electronic devices. During use, the heat generated by secondary electronic components such as motherboards and chip components will be transferred to the screen through buffering foam, causing the temperature of the corresponding position of the screen to rise, affecting the user experience.

[0003] Application Contents

[0004] In view of the problems existing in the background technology, the purpose of this application is to provide an electronic device for improving the problem of mutual influence of heat generated between different electronic components of the electronic device in the prior art.

[0005] The present application provides an electronic device, comprising:

[0006] case;

[0007] a first electronic component;

[0008] a second electronic component;

[0009] a buffer assembly connected to the housing, the first electronic component being located on a side of the buffer assembly away from the housing, and the second electronic component being located on a side of the housing away from the buffer assembly;

[0010] The buffer assembly is provided with a recessed portion, and at least a portion of an orthographic projection of the second electronic component along the thickness direction of the electronic device is located within the orthographic projection of the recessed portion along the thickness direction of the electronic device.

[0011] By providing a recessed portion, the area of ​​direct or indirect contact between the buffer component and the first electronic component and / or the second electronic component can be reduced, thereby reducing the heat transfer efficiency of the area of ​​the buffer component corresponding to the second electronic component, which is beneficial to reducing the possibility of local high temperature in the first electronic component, reducing the impact of the heat generation of the first electronic component on the touch, and improving the user experience.

[0012] In a possible implementation, the recessed portion includes a first recessed portion, the first recessed portion is located on a side of the buffer assembly facing the second electronic component, and the recessed portion is recessed in a direction away from the second electronic component.

[0013] By arranging the recessed portion on the side of the buffer assembly facing the second electronic component, the contact area between the buffer assembly and the second electronic component can be reduced, thereby reducing the heat conduction efficiency.

[0014] In a possible implementation, the recess further includes a second recess, and the second recess is located on a side of the buffer assembly away from the second electronic component.

[0015] By providing two recessed portions, the contact area between the buffer assembly and the first and second electronic components can be reduced simultaneously, thereby reducing the possibility of heat transfer and interference between the first and second electronic components.

[0016] In a possible implementation, the recessed portion is a through hole, and the through hole passes through the buffer assembly along a thickness direction of the electronic device.

[0017] By setting through holes, the area of ​​the buffer assembly corresponding to the electronic component is not in direct or indirect contact with the electronic component. Since air has good heat insulation ability, setting through holes can reduce the heat conduction coefficient of the area, which is beneficial to reduce the possibility of heat transfer to the screen assembly.

[0018] In a possible implementation manner, the buffer assembly is provided with a plurality of the through holes.

[0019] The heat transfer efficiency can be further reduced by providing multiple through holes

[0020] In a possible implementation, along the thickness direction of the electronic device, the depth of the recessed portion is m, the thickness of the buffer component is n, and 0<m≤n.

[0021] The depth of the corresponding recessed portion can be set according to the actual heat insulation effect.

[0022] In a possible implementation, the recessed portion is provided with a heat insulating material, and the heat conducting efficiency of the heat insulating material is lower than the heat conducting efficiency of the buffer assembly.

[0023] The heat conduction efficiency can be further reduced by providing heat insulating materials.

[0024] In a possible implementation manner, an adhesive is provided between the side wall of the recessed portion and the thermal insulation material, and the thermal insulation material is bonded to the side wall of the recessed portion.

[0025] The stability of the thermal insulation material installation can be improved by providing an adhesive.

[0026] In a possible implementation manner, the thermal insulation material fills all of the recessed portions or the thermal insulation material has a grid structure.

[0027] By setting the thermal insulation material into a grid structure, it can achieve thermal insulation while reducing the amount of thermal insulation material used, which is conducive to reducing costs and is more in line with actual usage needs.

[0028] In a possible embodiment, at least part of the thermal insulation material is one or more materials selected from the group consisting of thermal insulation components, thermal insulation aerogels, glass fiber wool, asbestos, rock wool, silicate, ceramic fiber paper, and vacuum panels.

[0029] By providing the above materials, the heat conduction efficiency of the corresponding area can be further reduced.

[0030] In a possible implementation, the orthographic projection of the recessed portion along the thickness direction of the electronic device includes the orthographic projection of the second electronic component along the thickness direction of the electronic device.

[0031] The projected area of ​​the recessed portion is larger than the projected area of ​​the electronic component, which is beneficial to improving the heat insulation capacity of the recessed portion and reducing the possibility of heat generated by the electronic component being transferred to the screen assembly through contact heat transfer.

[0032] In a possible implementation, the electronic device further includes a first heat-conducting component, wherein a heat-conducting efficiency of the first heat-conducting component along a thickness direction of the electronic device is lower than a heat-conducting efficiency of the first heat-conducting component along a length direction and / or a width direction of the electronic device;

[0033] The first heat conducting component is installed on a side of the housing facing the second electronic component.

[0034] By arranging the first heat-conducting component between the housing and the electronic component, the heat generated by the electronic component can be promptly taken away from the vicinity of the electronic component, thereby reducing the influence of the heat on the operation of the electronic component.

[0035] In a possible embodiment, the electronic device further includes a second heat-conducting component, which is located on a side of the buffer assembly away from the first electronic component, and the heat-conducting efficiency of the second heat-conducting component along the length direction and / or thickness direction of the electronic device is higher than the heat-conducting efficiency along the thickness direction of the electronic device.

[0036] Providing a second heat-conducting component facilitates heat transfer along the length and / or width direction of the electronic device, reduces the possibility of heat transfer along the thickness direction, and thus reduces the possibility of heat generated by the second electronic component being transferred to the first electronic component.

[0037] In a possible implementation, the electronic device further includes a shielding component, the shielding component is located on a side of the housing facing the second electronic component, the shielding component has an installation cavity, and the second electronic component is located in the installation cavity.

[0038] Providing the shielding component can reduce the influence of other factors on the second electronic component.

[0039] In a possible implementation, a third heat conducting component is provided on an inner wall of the installation cavity, the third heat conducting component protrudes toward the interior of the installation cavity, and at least a portion of the thermal interface material is in contact with the second electronic component.

[0040] The use of heat-conducting materials in the shielding component can help to promptly dissipate the heat generated by the electronic components and reduce the possibility of heat accumulation near the electronic components.

[0041] In a possible implementation manner, the third heat conducting component and the shielding component are integrally formed.

[0042] Typically, the shielding component can be made of metal materials such as stainless steel. Since metal materials have good thermal conductivity, metal materials can be used as the third heat-conducting component to conduct heat emitted by the second electronic component and reduce the possibility of heat accumulation near the second electronic component.

[0043] The present application provides an electronic device, wherein the electronic device includes a shell, a buffer assembly is connected to the shell, a first electronic component is located on a side of the buffer assembly away from the shell, and a second electronic component is located on a side of the shell away from the buffer assembly. The buffer assembly has a recessed portion, and at least a portion of the orthographic projection of the second electronic component along the thickness direction of the electronic device is located within the orthographic projection of the recessed portion. By providing the recessed portion, the area of ​​direct or indirect contact between the buffer assembly and the first electronic component and / or the second electronic component can be reduced, thereby reducing the heat transfer efficiency of the corresponding area of ​​the buffer assembly, thereby reducing the heat transfer efficiency of the electronic device along the thickness direction, improving the uniformity of heat along the non-thickness direction, and helping to reduce the possibility of a locally high temperature in the first electronic component, and helping to improve the user's thermal experience.

[0044] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG1 is an exploded view of the electronic device provided in this application;

[0046] FIG2 is a schematic structural diagram of a first embodiment of an electronic device provided by the present application;

[0047] FIG3 is a schematic structural diagram of a second embodiment of an electronic device provided by the present application;

[0048] FIG4 is a schematic structural diagram of a third embodiment of an electronic device provided in this application;

[0049] FIG5 is a schematic structural diagram of a fourth embodiment of an electronic device provided by the present application;

[0050] FIG6 is a schematic structural diagram of a fifth embodiment of an electronic device provided in this application;

[0051] FIG7 is a schematic structural diagram of a sixth embodiment of an electronic device provided in this application;

[0052] FIG8 is a schematic structural diagram of a seventh embodiment of an electronic device provided in this application;

[0053] FIG9 is a schematic structural diagram of an eighth embodiment of an electronic device provided in this application;

[0054] FIG10 is a schematic structural diagram of a ninth embodiment of an electronic device provided in this application;

[0055] FIG11 is a schematic structural diagram of a tenth embodiment of an electronic device provided by the present application;

[0056] FIG12 is a schematic structural diagram of the eleventh embodiment of the electronic device provided in this application.

[0057] Reference numerals:

[0058] 1- shell;

[0059] 11- back cover;

[0060] 2- first electronic component;

[0061] 21-glass cover;

[0062] 22-display component;

[0063] 3- second electronic component;

[0064] 4-Buffer component;

[0065] 41-depression;

[0066] 411-first recessed portion;

[0067] 412- second recessed portion;

[0068] 42- thermal insulation materials;

[0069] 5-first heat conducting component;

[0070] 6- shielding components;

[0071] 7- second heat conducting component;

[0072] 8- third heat conducting component;

[0073] 9-Circuit board.

[0074] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0075] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0076] With the advancement of technology, electronic devices such as mobile phones and tablets have become common communication devices in people's daily lives. During use, the load on electronic components such as motherboards and chips increases, generating more heat. This heat is transferred through the midframe and cushioning foam to the phone screen, causing localized high temperatures on the screen, affecting the user's touch experience. Furthermore, when the temperature control software or programs within the electronic device detects high screen temperatures, they will reduce the frequency of the central processing unit and other electronic components, causing the electronic device to freeze and affect product performance.

[0077] In view of this, an embodiment of the present application provides an electronic device for improving the problem of mutual influence of heat generated between different electronic components of electronic devices in the prior art.

[0078] As shown in Figure 1, the Z axis in the figure represents the thickness direction of the electronic device, the X axis represents the width direction of the electronic device, and the Y axis represents the length direction of the electronic device. An embodiment of the present application provides an electronic device, which may be a mobile phone, a tablet computer (portable android device, PAD), a personal digital assistant (PDA), a laptop computer, a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), and the like, a mobile terminal or a fixed terminal with a display screen. The electronic device includes a housing 1, a first electronic component 2, a second electronic component 3, and a buffer assembly 4. The housing 1 may be a middle frame of the electronic device, and the housing 1 also includes a back cover 11.

[0079] In the present application, the first electronic component 2 can be a display screen of an electronic device for displaying images or videos, etc. The display screen includes a display panel, and the display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active matrix organic light-emitting diode or an active matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), Miniled, MicroLed, Micro-oLed, a quantum dot light-emitting diode (QLED), etc. In some embodiments, the electronic device can include one or more display screens. It is understood that the first electronic component 2 can also be other electronic devices extending along the XY plane, and this application does not limit this.

[0080] The second electronic component 3 can be a processor. The processor may include one or more processing units. The processor may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units can be independent devices or integrated into one or more processors. It is understood that the second electronic component 3 can also be other electronic devices extending along the XY plane, such as other chips provided on the mainboard of an electronic device, and this application is not limited to this.

[0081] The buffer component 4 can be made of materials such as buffer foam. The buffer foam can be made of a polymer foam. According to the material type of the base material, it is mainly divided into types such as polypropylene (PP), polyethylene (PE), and polyurethane (PU). It has pores inside and is mainly divided into open-cell, semi-open-cell, and closed-cell structures according to the structure. When the buffer component 4 is applied to electronic equipment, it mainly plays the role of sealing, pressing, buffering, and supporting. For example, it can be used to protect the first electronic component 2. When the electronic device falls or the first electronic component 2 is impacted, the buffer foam can be used to absorb the impact and play a buffering role, thereby reducing the possibility of damage to the first electronic component 2.

[0082] As shown in Figure 1, the buffer assembly 4 is connected to the shell 1, the first electronic component 2 is located on the side of the buffer assembly 4 away from the shell 1, and the second electronic component 3 is located on the side of the shell 1 away from the buffer assembly 4, that is, the buffer assembly 4 is located between the first electronic component 2 and the shell 1, and the shell 1 is located between the buffer assembly 4 and the second electronic component 3. During installation, the buffer assembly 4 can be fixedly connected to the shell 1 by bonding or the like, or it can be fixed by clamping the first electronic component 2 and the shell 1. The buffer assembly 4 can be a whole-layer structure, that is, covering the surface of the first electronic component 2 facing the shell 1, or it can be an annular structure, that is, arranged along the edge of the first electronic component 2 on the side of the first electronic component 2 facing the shell 1. The buffer assembly 4 is provided with a recessed portion 41, which can be specifically provided on the side of the shell 1 where the second electronic component 3 such as the motherboard and the chip is located away from the first electronic component 2. As shown in FIG2 , the surface of the first electronic component 2 facing the buffer assembly 4 is used as the projection plane, i.e., the projection plane is parallel to the XY plane in FIG1 . When the screen assembly is a curved screen structure, the projection plane can be the plane where the lower end surface of the curved screen (the lower end surface along the thickness direction Z) is located. The orthographic projection of the second electronic component 3 along the thickness direction Z of the electronic device is at least partially located within the projection range of the recessed portion 41 along the thickness direction Z. Alternatively, the orthographic projection of the second electronic component 3 along the thickness direction Z of the electronic device is completely located within the projection range of the recessed portion 41 along the thickness direction Z. That is, the area of ​​the recessed portion 41 can be larger than the area of ​​the second electronic component 3 so that the second electronic component 3 is entirely located within the projection range of the recessed portion 41. Alternatively, the area of ​​the recessed portion 41 can be equal to or smaller than the area of ​​the second electronic component 3 so that a portion of the second electronic component 3 is located within the projection range of the recessed portion 41.

[0083] The shape of the recessed portion 41 projected onto the above-mentioned projection surface may be a rectangle, a circle, a regular polygon, a polygon or other irregular shapes. In some possible embodiments, the recessed portion 41 may be a groove structure, that is, the bottom is not through. In other examples, the recessed portion 41 may be a through-hole structure. The depth of the recessed portion 41 is m, and the thickness of the buffer component 4 is n. Specifically, 0<m≤n. When the buffer component 4 has a recessed portion 41, the contact area can be reduced, thereby reducing the thermal conductivity efficiency.

[0084] Specifically, the ratio between the depth m of the recessed portion 41 and the thickness n of the buffer component 4 can be 0.2, 0.4, 0.6, 0.8, etc. Similar to normal circumstances, the thermal conductivity of air is lower than that of the buffer foam. Therefore, the greater the depth of the recessed portion 41, the stronger the thermal insulation capacity of the area where the recessed portion 41 is located, and the more conducive it is to reducing the impact of the heat emitted by the second electronic component 3 on the first electronic component 2.

[0085] It should be noted here that the relationship between the depth m of the recessed portion 41 and the thickness n of the buffer component 4 can satisfy 0<m≤n, which can improve the thermal insulation capacity and reduce the possibility of heat transfer between the first electronic component 2 and the second electronic component 3. The ratio between m and n listed above is only a more preferred scheme. In actual use, the ratio between m and n can be designed according to actual conditions. The actual ratio between m and n includes but is not limited to the ratios listed above.

[0086] In some possible embodiments, the recessed portion 41 may be filled with air, meaning that no additional thermal insulation material may be provided within the recessed portion 41. Since air has excellent thermal insulation properties and generally has a higher thermal insulation efficiency than the buffer assembly 4, filling the recessed portion with air can reduce the heat transfer efficiency of the area corresponding to the recessed portion 41, namely, reduce the heat transfer efficiency of the area whose orthographic projection along the thickness direction of the electronic device falls within the orthographic projection of the recessed portion 41, thereby facilitating the reduction of the amount of heat transferred from the second electronic component 3 to the first electronic component 2. In other embodiments, a thermal insulation material 42 may be provided within the recessed portion 41, with the thermal insulation efficiency of the thermal insulation material 42 being higher than that of the buffer assembly 4, thereby reducing the amount of heat transferred from the second electronic component 3 to the first electronic component 2.

[0087] By providing a recessed portion 41 in the buffer component 4 and filling the recessed portion 41 with an insulating material 42 (or insulating medium) having a higher insulating efficiency than the buffer component 4, the recessed portion 41 can be used to form an insulating channel, and the insulating material 42 is filled in the insulating channel to further enhance the insulating capacity of the insulating channel, thereby reducing the possibility of heat generated by the second electronic component 3 being transferred to the first electronic component 2 through the area where the insulating channel is located, thereby reducing the possibility of locally high temperatures in the first electronic component 2. When the first electronic component 2 is a screen component, the impact of screen heating on the touch can be reduced, which is beneficial to improving the user experience and more in line with actual usage needs.

[0088] Since the recessed portion 41 is provided in the buffer assembly 4, the possibility of the heat generated by the second electronic component 3 being transferred to the first electronic component 2 is reduced, thereby reducing the possibility that the temperature control software of the electronic device will reduce the frequency of the second electronic component 3 due to detecting that the temperature of the first electronic component 2 is higher, thereby reducing the possibility of the electronic device being stuck, which is beneficial to improving the user experience.

[0089] In one possible embodiment, with the surface of the first electronic component 2 facing the buffer assembly 4 as the projection surface, the orthographic projection of the recessed portion 41 along the thickness direction Z of the electronic device includes the orthographic projection of the second electronic component 3 along the thickness direction Z of the electronic device. The projected area of ​​the recessed portion 41 is larger than the projected area of ​​the second electronic component 3 and covers the entire projection of the second electronic component 3. For example, if the area of ​​the second electronic component 3 is 10 square centimeters, the area of ​​the recessed portion 41 can be 30 to 40 square centimeters.

[0090] By making the projected area of ​​the recess 41 larger than the projected area of ​​the second electronic component 3 , the second electronic component 3 can be located within the region of the recess 41 , thereby facilitating heat insulation through the recess 41 and reducing the possibility of heat transfer to the first electronic component 2 .

[0091] As shown in FIG3 , in one possible embodiment, the electronic device may include a first heat-conducting component 5 , wherein the heat-conducting efficiency of the first heat-conducting component 5 along the thickness direction Z of the electronic device is lower than the heat-conducting efficiency of the first heat-conducting component 5 along the length direction Y and / or width direction X of the electronic device. The first heat-conducting component 5 is mounted on a side of the housing 1 facing the second electronic component 3 .

[0092] The first heat-conducting component 5 can be made of a material with high thermal conductivity, which is used to absorb the heat generated by the second electronic component 3 and transfer the heat to the side of the heat-conducting material away from the chip assembly. This design can help to promptly remove the heat generated by the second electronic component 3 from the vicinity of the second electronic component 3, thereby reducing the possibility of the second electronic component 3 being too hot, resulting in a reduced frequency, and causing the electronic device to freeze. In some possible embodiments, the first heat-conducting component 5 can be made of graphite material, such as graphene, artificial graphite, etc. Since the performance of graphite materials in different directions is different and they have anisotropic characteristics, the thermal conductivity in different directions will also be different. In actual use, the first heat-conducting component 5 can be set to have a lower thermal conductivity along the thickness direction Z of the electronic device and a higher thermal conductivity along the non-thickness direction, thereby facilitating heat transfer along the non-thickness direction Z, making the temperature of the first electronic component 2 more uniform, and reducing the possibility of local overheating of the first electronic component 2. In other examples, the first heat-conducting component 5 may also adopt a VC heat-conducting plate, in which the heat-conducting medium channel is arranged in a direction parallel to the XY plane, so that the heat-conducting efficiency of the first heat-conducting component 5 along the thickness direction Z is lower than the heat-conducting efficiency along the XY plane.

[0093] As shown in FIG3 , in one possible embodiment, the electronic device may further include a shielding component 6 . The shielding component 6 may be a structure such as a shielding cover. The shielding component 6 may be made of metal, such as stainless steel. The shielding component 6 is located on the side of the buffer assembly 4 away from the first electronic component 2 , specifically, on the side of the housing 1 facing the second electronic component 3 . The shielding component 6 defines a mounting cavity, in which at least a portion of the electronic device's mainboard is located. The second electronic component 3 , such as a chip, is mounted on a circuit board 9 and also within the mounting cavity. The shielding component 6 can be used to shield the second electronic component 3 from interference from external factors such as signals, magnetic fields, and radiation, thereby improving the operational stability of the second electronic component 3 . Furthermore, metal materials generally have good thermal conductivity and can be used to conduct heat. Specifically, the shielding component 6 may be raised toward the second electronic component 3 , with the raised portion serving as a third heat conducting component 8 . The third heat conducting component 8 may be integrally formed into the inner wall of the mounting cavity during the processing of the shielding component 6 . The third heat conducting component 8 is used to contact the second electronic component 3 to absorb heat generated by the second electronic component 3 .

[0094] In a possible embodiment, the shielding component 6 may include an end cover and a mounting bracket. The bracket may be made of nickel silver, nickel silver, stainless steel, tinned steel strip and other materials. The end cover may be made of stainless steel. The end cover is installed on the circuit board 9 through the mounting bracket to protect electronic components and shield interference signals.

[0095] In a possible implementation, at least a portion of the shielding component 6 is made of a heat-conducting material. Since metal has good heat conductivity, metal can be used as the heat-conducting material.

[0096] By providing the heat-conducting material, the shielding component 6 can not only perform the shielding function but also promptly dissipate the heat generated by the second electronic component 3 .

[0097] As shown in FIG4 , in one possible embodiment, the third heat-conducting component 8 may be provided separately. For example, to improve heat transfer efficiency, a third heat-conducting component 8 may be provided between the shielding component 6 and the second electronic component 3, with at least a portion of the third heat-conducting component 8 in contact with the second electronic component 3. The third heat-conducting component 8 may be a thermal interface material (TIM). For example, silicone grease may be applied between the shielding component 6 and the second electronic component 3. Since silicone grease has good thermal conductivity, it can promptly absorb heat generated by the second electronic component 3 and transfer the heat to the shielding component 6, which then transfers the heat away through the shielding component 6, thereby reducing the possibility of heat accumulation between the second electronic component 3.

[0098] The third heat conducting component 8 is provided to promptly remove the heat generated by the second electronic component 3 away from the vicinity of the second electronic component 3 by means of contact heat transfer, thereby improving the heat dissipation efficiency of the electronic device.

[0099] As shown in FIG3 , in one possible embodiment, the first electronic component 2 may be a screen assembly, which may include a glass cover 21 and a display assembly 22. The display assembly 22 may be an OLED display assembly. The glass cover 21 is located on the side of the display assembly 22 away from the housing 1 to protect the display assembly 22. A second heat-conducting component 7 may be provided between the buffer assembly 4 and the housing 1. Specifically, graphene, graphite sheets, composite graphite, copper foil, VC, heat pipes, etc. may be selected. Its specific characteristics or structure may be the same as the first heat-conducting component 5 mentioned above, that is, the heat conduction efficiency of the second heat-conducting component 7 along the length direction Y and / or width direction X of the electronic device is higher than its heat conduction efficiency along the thickness direction Z. When the heat generated by the second electronic component 3 is transferred to the second heat-conducting component 7 through the housing 1, the second heat-conducting component 7 can conduct the heat along the width direction X and / or length direction Y of the electronic device, that is, reduce the heat transfer along the thickness direction Z of the electronic device and promote heat transfer along the XY plane, which is conducive to uniform heat distribution, thereby helping to reduce the occurrence of local overheating in the electronic device and improving the user experience.

[0100] As shown in FIG. 3 , in a possible implementation, the recessed portion 41 may be located on a side of the buffer assembly 4 facing the second electronic component 3 and recessed in a direction away from the second electronic component 3 .

[0101] With such a design, the opening of the recessed portion 41 can be directed toward the second electronic component 3 , thereby reducing the possibility of contact and heat transfer between the buffer assembly 4 and the second electronic component 3 , thereby facilitating reduction of heat transfer efficiency.

[0102] As shown in FIG4 , in one possible embodiment, the recessed portion 41 includes a first recessed portion 411 and a second recessed portion 412, wherein the first recessed portion 411 is located on the side of the buffer assembly 4 facing the second electronic component 3, and the second recessed portion 412 is located on the side of the buffer assembly 4 away from the first electronic component 2. Specifically, the depth of the first recessed portion 411 may be greater than or equal to the depth of the second recessed portion 412. Typically, the first electronic component 2 is a screen assembly, and the second electronic component 3 is a chip. The chip generates a large amount of heat. Therefore, the greater depth of the first recessed portion 411 can reduce the heat generated by the chip from being transferred to the side where the buffer assembly 4 is located, thereby facilitating the reduction of heat transfer to the side where the first electronic component 2 is located.

[0103] Compared with the solution in which the depth of the first recess 411 can be greater than or equal to the depth of the second recess 412, the depth of the second recess 412 is greater than the depth of the first recess 411, which can also play a role in hindering heat conduction. However, since the depth of the first recess 411 is shallow, the heat insulation ability will be relatively poor, and it is easy for a small amount of heat generated by the second electronic component 3 to be easily transferred to the buffer component 4 and transferred to the first electronic component 2 through other areas of the buffer component 4, that is, the area where the recess 41 is not set.

[0104] The provision of the first recess 411 and the second recess 412 reduces the direct or indirect contact area between the buffer assembly 4 and the second electronic component 3, and between the first electronic component 2 and the buffer assembly 4, respectively, thereby reducing heat conduction efficiency. The second recess 412 further reduces the likelihood of heat transfer to the first electronic component 2. This allows heat to propagate along the non-thickness direction Z, thereby reducing the likelihood of localized overheating of the first electronic component 2.

[0105] As shown in FIG. 5 , in a possible embodiment, the recessed portion 41 is a through hole, that is, along the thickness direction Z of the electronic device, the recessed portion 41 completely passes through the buffer assembly 4 .

[0106] By configuring the recess 41 as a through hole, the direct or indirect contact area between the second electronic component 3 and the first electronic component 2 and the buffer assembly 4 can be reduced, thereby reducing the heat conduction efficiency and the possibility of heat from the second electronic component 3 being transferred to the first electronic component 2.

[0107] As shown in Figure 6, in a possible embodiment, the buffer component 4 can be provided with a plurality of recessed portions 41. For example, a plurality of grooves or through holes can be provided on the same side of the buffer component 4, and each groove or through hole is arranged according to a preset rule. For example, multiple rows of grooves / through holes can be provided, and a plurality of grooves / through holes can be provided in each row. That is, the grooves or through holes are arranged in an array manner. For example, the array arrangement can be, for example, 2*2, 2*3, 2*4, 3*3 or 3*4, etc. It can be understood that the above-mentioned preset rules can be set according to the specific circumstances, and this application does not limit the number and position of the arrangement.

[0108] As shown in FIG7 , in one possible embodiment, recessed portion 41 may be filled with thermal insulation material 42 or an air barrier. The thermal conductivity of thermal insulation material 42 is lower than that of buffer assembly 4. Thermal insulation material 42 may be selected from thermal insulation aerogel, thermal insulation aerogel, asbestos, rock wool vacuum board, ceramic fiber paper, glass fiber wool, etc. It may also be selected from materials containing sulfates such as aluminum sulfate. It may also be selected from thermal insulation films, thermal insulation tissue paper, thermal insulation gaskets, and other thermal insulation materials. Thermal insulation material 42 may be selected from one or more of the aforementioned embodiments and combined.

[0109] Since air itself has good heat insulation ability and the cost of using air is lower than filling other heat insulation materials 42 , it is possible to only provide the recessed portion 41 in the buffer component 4 without additionally filling other heat insulation materials 42 .

[0110] Specifically, the thermal insulation material can be thermal insulation aerogel, which has good thermal insulation capabilities and is beneficial to reducing the possibility of local high temperatures caused by the influence of the first electronic component 2 and the second electronic component 3. At the same time, the thermal insulation aerogel has a smaller mass. Compared with the thermal insulation gasket, at the same thickness, the thermal insulation effect of the thermal insulation aerogel is better, that is, less (thinner) thermal insulation aerogel can be used to obtain better thermal insulation effects. Therefore, when thermal insulation aerogel is used in electronic devices such as mobile phones, tablets, and laptops, it is beneficial to reduce the weight of the electronic equipment while improving the thermal insulation capability, making it more convenient for users to carry and more in line with actual usage needs.

[0111] Specifically, in a possible embodiment, an adhesive may be provided on the inner wall of the recessed portion 41, and the thermal insulation material 42 may be bonded to the inner wall of the recessed portion 41 through the adhesive. Specifically, the adhesive may be thermal insulation glue to further reduce the thermal conductivity efficiency.

[0112] As shown in Figures 8, 9 and 10, in a possible embodiment, the recessed portion 41 can be a rectangular recess, a circular recess, a regular polygonal recess, a polygonal recess or other irregularly shaped recess, etc. The specific structure can be designed according to actual needs.

[0113] By providing the heat-insulating material 42 in the recessed portion 41, the heat transfer efficiency of the buffer foam in the area corresponding to the second electronic component 3 such as the motherboard and chip can be further reduced, which is beneficial to hinder the conduction of heat to the location of the first electronic component 2, thereby reducing the possibility of the first electronic component 2 having a locally high temperature.

[0114] When designing the structure of the recessed portion 41, the position, depth, and area of ​​the recessed portion 41 can be adjusted based on actual conditions, such as the position and shape of other surrounding components. The second electronic component 3 can be located entirely within the projection range of the recessed portion 41, or partially within the projection range of the recessed portion 41. When the second electronic component 3 generates a large amount of heat, the area and depth of the recessed portion 41 can be increased. When the second electronic component 3 generates a small amount of heat, the area or depth of the recessed portion 41 can be decreased to reduce the number of recessed portions 41 of the buffer component 4 or reduce the volume, thereby reducing the impact of the recessed portions 41 on the buffering effect of the buffer component 4, thereby reducing the possibility of damage to the first electronic component 2 and / or the second electronic component 3, and more in line with actual usage requirements.

[0115] In a possible implementation, the heat insulating material 42 may fill the entire space of the recess 41 .

[0116] Filling the entire recessed portion 41 with the heat insulating material 42 can help reduce the heat conduction efficiency of the region, thereby reducing the possibility of heat generated by the second electronic component 3 being transferred to the first electronic component 2 .

[0117] As shown in Figures 11 and 12 , in one possible embodiment, the thermal insulation material 42 may have a grid-like structure. Specifically, the grid-like structure may be a cross-shaped grid, a strip-shaped structure, or the like. Since air also has a good thermal insulation effect, the area of ​​the thermal insulation material 42 can be appropriately reduced. This achieves the desired thermal insulation effect while also reducing costs, better meeting actual production needs.

[0118] An embodiment of the present application provides an electronic device, wherein the electronic device includes a housing 1, a buffer assembly 4 is connected to the housing 1, a first electronic component 2 is located on a side of the buffer assembly 4 away from the housing 1, and a second electronic component 3 is located on a side of the housing 1 away from the buffer assembly 4. The buffer assembly 4 has a recessed portion 41, and at least a portion of the orthographic projection of the second electronic component 3 along the thickness direction of the electronic device is located within the orthographic projection of the recessed portion. By providing the recessed portion 41, the area of ​​direct or indirect contact between the buffer assembly 4 and the first electronic component 2 and / or the second electronic component 3 can be reduced, thereby reducing the heat transfer efficiency of the corresponding area of ​​the buffer assembly 4, thereby reducing the heat transfer efficiency of the electronic device along the thickness direction, improving the uniformity of heat along the non-thickness direction, and helping to reduce the possibility of a locally high temperature in the first electronic component 2, which is conducive to improving the user's thermal experience.

[0119] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

[0120] Note: A portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves all rights reserved except for copies of the materials in the patent file or patent record in the Patent Office.

Claims

1. An electronic device, characterized in that: The electronic device comprises: case; a first electronic component; a second electronic component; a buffer assembly connected to the housing, the first electronic component being located on a side of the buffer assembly away from the housing, and the second electronic component being located on a side of the housing away from the buffer assembly; The buffer assembly is provided with a recessed portion, and at least a portion of an orthographic projection of the second electronic component along the thickness direction of the electronic device is located within the orthographic projection of the recessed portion along the thickness direction of the electronic device.

2. The electronic device according to claim 1, wherein The recessed portion includes a first recessed portion, the first recessed portion is located on a side of the buffer assembly facing the second electronic component, and the recessed portion is recessed in a direction away from the second electronic component.

3. The electronic device according to claim 2, wherein: The recessed portion further includes a second recessed portion, and the second recessed portion is located on a side of the buffer assembly away from the second electronic component.

4. The electronic device according to claim 1, wherein: The recessed portion is a through hole, and the through hole penetrates the buffer assembly along the thickness direction of the electronic device.

5. The electronic device according to claim 4, characterized in that The buffer component is provided with a plurality of the through holes.

6. The electronic device according to any one of claims 1 to 5, characterized in that: Along the thickness direction of the electronic device, the depth of the recessed portion is m, the thickness of the buffer component is n, and 0<m≤n.

7. The electronic device according to any one of claims 1 to 5, characterized in that: The recessed portion is provided with a heat insulating material, and the heat conducting efficiency of the heat insulating material is lower than the heat conducting efficiency of the buffer assembly.

8. The electronic device according to claim 7, wherein: An adhesive is provided between the side wall of the recessed portion and the heat insulating material, and the heat insulating material is bonded to the side wall of the recessed portion.

9. The electronic device according to claim 7, wherein: The heat insulating material fills all the recessed parts or the heat insulating material is a grid-like structure.

10. The electronic device according to claim 7, wherein: At least part of the thermal insulation material is one or more materials selected from the group consisting of thermal insulation elements, thermal insulation aerogels, glass fiber wool, asbestos, rock wool, silicate, ceramic fiber paper, and vacuum panels.

11. The electronic device according to any one of claims 1 to 5, characterized in that: The orthographic projection of the recessed portion along the thickness direction of the electronic device includes the orthographic projection of the second electronic component along the thickness direction of the electronic device.

12. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further includes a first heat-conducting component, wherein a heat-conducting efficiency of the first heat-conducting component along a thickness direction of the electronic device is lower than a heat-conducting efficiency of the first heat-conducting component along a length direction and / or a width direction of the electronic device; The first heat conducting component is installed on a side of the housing facing the second electronic component.

13. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device also includes a second heat-conducting component, which is located on a side of the buffer assembly away from the first electronic component, and the heat-conducting efficiency of the second heat-conducting component along the length direction and / or width direction of the electronic device is higher than the heat-conducting efficiency along the thickness direction of the electronic device.

14. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further includes a shielding component, which is located on a side of the housing facing the second electronic component. The shielding component has an installation cavity, and the second electronic component is located in the installation cavity.

15. The electronic device according to claim 14, characterized in that A third heat conducting component is provided on the inner wall of the installation cavity. The third heat conducting component protrudes toward the interior of the installation cavity, and at least a portion of the third heat conducting component is in contact with the second electronic component.

16. The electronic device according to claim 15, characterized in that The third heat conducting component and the shielding component are integrally formed.

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