Methods for manufacturing electrical wiring harnesses and wiring assemblies

Abstract

The invention relates to a method for manufacturing electrical conductors and electrical wire assemblies. The method for manufacturing electrical conductors includes: Step S10: fabrication of a printing die; Step S20: fabrication of a substrate; Step S30: printing conductive ink onto the substrate using a printing die; Step S40: coagulation of the conductive ink to form a conductive ring; and Step S50: formation of an insulating protective layer around the conductive ring and on the surface of the conductive ring. The invention solves the technical problems of the complex manufacturing process and high processing costs of electrical conductors for electrically connecting electrical components.

Description

Production method of wire harness and wire harness

[0001] Related applications

[0002] This application claims priority to the Chinese invention patent with patent application number CN202110875932.0, application date July 30, 2021, and invention name “Method for producing wire harness and wire harness”. Technical Field

[0003] The present invention relates to the technical field of electronic components, in particular to a production method of a wire harness and the wire harness. Background Art

[0004] Electrical connections for vehicles, household appliances, and more require wiring harnesses. Existing wiring harnesses primarily consist of wires, terminals, sheaths, positioning components, and brackets. These components are numerous, complex in structure, and require complex processing techniques, resulting in a low degree of automation.

[0005] PCBs (Printed Circuit Boards) can quickly create dense electrical circuits. However, PCBs are designed for integrated circuits and are less suitable for electrical connections in electrical devices, especially large equipment. PCB production equipment is expensive and the production process is complex. The PCB production process includes etching, which can cause significant environmental pollution.

[0006] Summary of the Invention

[0007] The object of the present invention is to provide a method for producing a wire harness and a wire harness, so as to alleviate the technical problems of a wire harness for electrically connecting electrical components, such as a relatively complex production process and a high processing cost.

[0008] The above-mentioned purpose of the present invention can be achieved by adopting the following technical solutions:

[0009] The present invention provides a method for producing a wiring harness, which includes: step S10, preparing a printing plate; step S20, preparing a substrate; step S30, printing conductive ink onto the substrate through the printing plate; step S40, condensing the conductive ink to form a conductive loop; step S50, forming an insulating protective layer around and on the surface of the conductive loop.

[0010] The present invention provides a wiring harness produced using the above-mentioned wiring harness production method. The wiring harness includes: a substrate, at least one layer of conductive loop and at least one layer of insulating protective layer. Each of the conductive loops is located between the substrate and the outermost insulating protective layer, and the conductive loops and the insulating protective layers are alternately distributed.

[0011] The characteristics and advantages of the present invention are:

[0012] This wiring harness production method uses conductive ink printing to form a conductive loop on a substrate. The conductive loop can be connected to external electrical components to achieve the electrical connection function of the wiring harness. The wiring harness is also insulated and protected by an insulating protective layer, thereby achieving rapid prototyping of the wiring harness loop. This wiring harness production method has the following advantages:

[0013] (1) The conductive circuit has high molding efficiency and can be formed in one step, which enables automation, large-scale and rapid production, and a high degree of production automation;

[0014] (2) Pre-prepare the printing plate and use printing to form multi-circuit and complex electrical circuits;

[0015] (3) The wiring harness composed of parts such as wires, terminals and sheaths is difficult to install and assemble in the use environment and is a step that takes up a lot of time in the entire product installation and assembly process; the wiring harness produced by this production method is easy to install and disassemble;

[0016] (4) Multi-layer printing can be used to prepare more conductive circuits under the condition of a small substrate area, meeting the requirements of more electrical circuits;

[0017] (5) Punching and pouring conductive materials can be used to electrically connect conductive circuits on different layers, thus realizing a more complex electrical circuit design and being applicable to more complex wiring harnesses;

[0018] (6) The material selection of the insulation protection layer is relatively diverse, and a variety of process methods can be used to achieve insulation protection and ensure the insulation protection effect;

[0019] (7) The substrate can be a component of the electrical device, which can realize the integrated production of components and wiring harnesses and achieve rapid installation and removal of wiring harnesses;

[0020] (8) A contoured printing plate can be used, which can be printed on a non-flat substrate, increasing the application environment of the wiring harness;

[0021] (9) Flexible substrates can be used to make the wiring harness suitable for a variety of installation situations; the wiring harness produced can be used on electrical appliances with complex installation environments, and can also be used in environments with high vibration requirements to reduce the interference of vibration factors;

[0022] (10) When the wiring harness is damaged, the damaged substrate can be directly replaced without removing the entire wiring harness for replacement, which saves maintenance time and reduces maintenance costs;

[0023] (11) Conductive ink is prepared using metal powder or other conductive powder, has good conductivity, is simple and convenient to prepare, and has little pollution;

[0024] (12) A shielding layer is set outside the wiring harness, which can be used at locations where electromagnetic interference is relatively strong, so that the signal inside the wiring harness can be shielded from electromagnetic interference and ensure signal stability;

[0025] (13) A heat sink is provided on the insulating protective layer to quickly dissipate the heat generated by the wiring harness current into the air, which is beneficial to lowering the temperature of the wiring harness and reducing the risk of the conductive circuit fusing;

[0026] (14) The equipment cost is relatively low, which reduces the cost of wiring harness. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The following drawings are intended only to illustrate and explain the present invention, and are not intended to limit the scope of the present invention.

[0028] FIG1 is a schematic diagram of a method for producing a wiring harness provided by the present invention;

[0029] Figures 2 and 3 are partial schematic diagrams of a wire harness produced by the wire harness production method provided by the present invention;

[0030] FIG4 is a top view of an embodiment of a wire harness produced by the wire harness production method provided by the present invention;

[0031] FIG5 is a side cross-sectional view of an embodiment of a wire harness produced by the method for producing a wire harness provided by the present invention;

[0032] FIG6 is a top view of another embodiment of a wire harness produced by the wire harness production method provided by the present invention;

[0033] FIG7 is a side cross-sectional view of another embodiment of a wire harness produced by the wire harness production method provided by the present invention. DETAILED DESCRIPTION

[0034] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described with reference to the accompanying drawings. In the description of the present invention, unless otherwise specified, the meaning of "multiple" is two or more.

[0035] Example 1

[0036] The present invention provides a method for producing a wiring harness. As shown in Figure 1, the method includes: step S10, preparing a printing plate; step S20, preparing a substrate 10; step S30, printing conductive ink onto the substrate 10 through the printing plate; step S40, condensing the conductive ink to form a conductive loop 21; step S50, forming an insulating protective layer 40 around and on the surface of the conductive loop 21.

[0037] This wiring harness production method uses conductive ink printing to form a conductive loop 21 on a substrate 10. The conductive loop 21 can be connected to external electrical components to achieve the electrical connection function of the wiring harness. The conductive loop 21 is insulated and protected by an insulating protective layer 40, thereby achieving rapid prototyping of the wiring harness loop. Using this wiring harness production method, the conductive loop 21 is efficiently formed and can be formed in one step, enabling automated, large-scale, and rapid production, with a relatively high degree of production automation. Wiring harnesses composed of parts such as wires, terminals, and sheaths are difficult to install and assemble in the operating environment and are a time-consuming step in the entire product installation and assembly process. However, the wiring harness produced by this production method is easy to install and disassemble, improving assembly efficiency.

[0038] In one embodiment, the method for producing the wiring harness includes step S60 performed after step S50 , wherein step S60 is: printing conductive ink onto the insulating protective layer 40 using a printing plate; and step S60 , step S40 , and step S50 are alternately performed one or more times in sequence.

[0039] Steps S30 and S40 form a conductive layer 30 on substrate 10. Steps S60 and S40 are performed once to form another conductive layer 30 on the already formed conductive loops 21 and insulating protective layer 40. By alternating steps S60, S40, and S50, multiple conductive layers 30 are constructed on substrate 10, forming a multilayer structure. By using multi-layer printing to form multiple conductive layers 30, a larger number of conductive loops 21 can be produced on a smaller substrate 10 area, meeting the requirement for a larger number of electrical circuits.

[0040] Figures 2 and 3 are schematic diagrams of a wiring harness produced using this method. The wiring harness shown in Figure 2 has a two-layer structure. As shown in Figure 3, a conductive layer 30 can include multiple conductive loops 21. In a multi-layer wiring harness, the number and structure of conductive loops 21 in each conductive layer 30 can be the same or different.

[0041] Furthermore, the wiring harness production method includes step S70: punching holes in the insulating protective layer 40 and / or the conductive loop 21, and pouring conductive material to form a connecting loop 22 that electrically connects at least two layers of conductive loops 21. Punching holes and pouring conductive material allows for electrical connection of conductive loops 21 in different layers, enabling a more complex electrical loop design and adapting to more complex wiring harnesses.

[0042] In one embodiment, the wiring harness produced by the wiring harness production method includes multiple conductive layers 30, the insulating protective layer 40 between two adjacent conductive layers 30 is punched, and conductive material is poured to form a connecting loop 22, which connects the conductive loops 21 of the two adjacent conductive layers 30.

[0043] In one embodiment, the wiring harness produced by the wiring harness production method includes at least three conductive layers 30, including an upper conductive layer 31, a middle conductive layer 32, and a lower conductive layer 33. A connecting loop 22 is provided through the middle conductive layer 32 and is connected to the upper conductive layer 31 and the lower conductive layer 33, respectively. In some cases, the connecting loop 22 passes through the conductive loop 21 of the middle conductive layer 32 and is connected to the conductive loop 21, thereby connecting the upper conductive layer 31, the middle conductive layer 32, and the lower conductive layer 33 simultaneously. In other cases, the connecting loop 22 passes through the middle conductive layer 32 via an area where the conductive loop 21 is not provided, connecting the upper conductive layer 31 and the lower conductive layer 33, while avoiding the conductive loop 21 of the middle conductive layer 32 and preventing connection therewith.

[0044] In some embodiments, there is one or more conductive layers 30 between the two conductive layers 30 connected by the communication loop 22, and communication with the one or more conductive layers 30 in the middle needs to be avoided. The conductive loop 21 in the middle conductive layer 30 can be improved. For example, the conductive loop 21 can extend along a curve or a fold line to avoid the location where the communication loop 22 is punched. The communication loop 22 can also be configured to extend along a fold line or a curve to avoid the one or more conductive layers 30 in the middle.

[0045] Punching and pouring of conductive material can be performed after each conductive layer 30 is formed. Alternatively, punching and pouring of conductive material can be performed while the conductive layers 30 and insulating protective layers 40 are being formed. For example, after forming one conductive layer 30 or one insulating protective layer 40, the layer is punched and poured with conductive material to form the connecting loop 22, and then the next conductive layer 30 or insulating protective layer 40 is formed. In some cases, the conductive loops 21 in the middle conductive layer 30 are relatively dense, making it difficult to improve the conductive loops 21 so that the connecting loops 22 avoid the conductive loops 21 in the middle conductive layer 30. To this end, the inventors have made further improvements to the production method of the wiring harness and the wiring harness produced therefrom.

[0046] As shown in Figures 4 and 5, the wiring harness includes an upper conductive layer 31, a middle conductive layer 32 and a lower conductive layer 33. The conductive loops 21 in the upper conductive layer 31 are respectively connected to the conductive protrusions 23, and the conductive protrusions 23 deviate from the conductive loops 21 in the middle conductive layer 32. The connecting loops 22 are respectively connected with the conductive protrusions 23 in the upper conductive layer 31 and the conductive protrusions 23 in the lower conductive layer 33, and avoid the conductive loops 21 in the middle conductive layer 32, thereby connecting the upper conductive layer 31 with the lower conductive layer 33 and avoiding connection with the middle conductive layer 32.

[0047] As shown in Figures 6 and 7, the wiring harness includes an upper conductive layer 31, a middle conductive layer 32 and a lower conductive layer 33. The punching position of step S50 is opposite to the conductive loop 21 of the upper conductive layer 31, the conductive loop 21 of the lower conductive layer 33 and the conductive loop 21 of the middle conductive layer 32, and the punched hole penetrates the conductive loop 21 of the middle conductive layer 32; an insulating sleeve 34 is provided in the hole, and the insulating sleeve 34 is located in the middle conductive layer 32 and separates the conductive loop 21 of the middle conductive layer 32; conductive material is poured into the hole and the insulating sleeve 34 to prevent the connecting loop 22 from being connected to the middle conductive layer 32.

[0048] Furthermore, as shown in FIG7 , the hole punched in step S50 is a stepped hole. The stepped hole is located in the lower conductive layer 33 and has a smaller inner diameter to facilitate the installation of the insulating sleeve 34 . The stepped portion of the stepped hole can support the insulating sleeve 34 .

[0049] In one embodiment, the conductive layer 30 formed in steps S30 and S40 includes multiple conductive loops 21, thereby producing a larger number of conductive loops 21. Multiple conductive loops 21 within the same conductive layer 30 may be disconnected or electrically connected. For example, all conductive loops 21 within the same conductive layer 30 may be disconnected; or at least two conductive loops 21 within the same conductive layer 30 may be electrically connected. The conductive loops 21 within each conductive layer 30 are configured based on the desired electrical connection function.

[0050] The structure of the conductive loops 21 within a conductive layer 30 is determined by the printing plate. This wiring harness production method utilizes transfer printing. A printing plate is designed based on the conductive loops 21 to be formed. Conductive ink is first applied to the printing plate, and then printed using a printing machine. The printing plate is prepared in advance, and then printed to form the conductive loops 21 within the conductive layer 30. Multiple conductive loops 21 can form a multi-loop, complex electrical circuit.

[0051] In one embodiment, step S10 utilizes machining or 3D printing to prepare a printing plate. The printing plate is prepared according to the electrical circuit requirements. An ink layer can be formed on the printing plate along the path of the electrical circuit. The ink is then transferred to the substrate 10 or insulating protective layer 40. The wider the cross-sectional width of the conductive circuit 21, the greater the conduction current. The printing plate is designed based on the conduction current requirements to control the cross-sectional width of the conductive circuit 21.

[0052] The conductive loop 21 is convex and has a large cross-sectional area. In one embodiment, step S30 employs multiple printing steps. Multiple printing steps are performed within the same conductive layer 30 to increase the thickness of the conductive loop 21. Multiple printing steps can utilize the same printing plate to gradually increase the thickness of the conductive loop 21.

[0053] In one embodiment, step S30 is performed using screen printing, relief printing, flexographic printing, gravure printing, or offset printing. In gravure printing allows the thickness of the printing ink to be controlled by the depth of the gravure printing plate. By specifically designing the gravure printing plate, conductive circuits 21 of varying thicknesses can be provided within the same conductive layer 30.

[0054] Specifically, when screen printing is used, a silk screen is used as the base, and a photosensitive platemaking method is used to produce a screen printing plate with images. The screen printing equipment includes a screen printing plate, a scraper, ink, a printing table, and a substrate. The substrate can be a substrate 10 or a pre-formed insulating protective layer 40. Printing is performed based on the principle that the mesh holes in the image portion of the screen printing plate are permeable to ink, while the mesh holes in the non-image portion are impermeable to ink. When letterpress printing is used, the image portion of the printing plate is raised. When flexographic printing is used, a molded rubber relief plate is used for printing. When gravure printing is used, the entire surface of the printing plate is coated with ink, and then a special scraper mechanism is used to remove the ink from the blank areas, leaving only the ink in the mesh holes in the image portion. The ink is then transferred to the surface of the substrate under high pressure. The substrate can be a substrate 10 or a pre-formed insulating protective layer 40. When using a flat plate, the image and non-image parts on the printing plate are almost on the same plane. During printing, in order to enable the ink to distinguish between the image and non-image parts, the water supply device of the printing plate component first supplies water to the non-image part of the printing plate, thereby protecting the non-image part of the printing plate from being soaked by ink.

[0055] The wiring harness produced by the wiring harness production method can be a planar wiring harness or a spatial wiring harness. The planar wiring harness is two-dimensional, and the conductive loop 21 extends in the plane of the XY axis; the spatial wiring harness is three-dimensional, and the conductive loop 21 can extend in the Z axis direction in addition to the XY axis direction. When the wiring harness produced is a planar wiring harness, step S30 adopts screen printing, letterpress printing, flexographic printing, gravure printing or offset printing. When the wiring harness produced is a spatial wiring harness, preferably, step S30 adopts letterpress printing, flexographic printing or gravure printing.

[0056] Step S60 may adopt the same printing process as step S30, which will not be described in detail here.

[0057] In step S40, the conductive ink may be dried to solidify. In one embodiment, step S40 uses one or more of natural drying, hot and cold air drying, infrared irradiation drying, and ultraviolet curing to dry and solidify the conductive ink.

[0058] In one embodiment, step S50 forms the insulating protective layer 40 by one or more of coating, printing, spraying, dipping, and injection molding processes to ensure the insulating protection effect of the insulating protective layer 40 on the conductive layer 30 .

[0059] Step S20 includes cleaning the surface of the substrate 10. The substrate 10 may be cleaned by one or more of solution washing, ultrasonic washing, and high-pressure washing to remove oil, impurities, and dirt.

[0060] In one embodiment, the wiring harness production method further includes step S15, performed after step S10, in which an insulating layer is provided on the surface of the substrate 10, and the conductive loops 21 are formed on the surface of the insulating layer. If the substrate 10 is made of a conductive material, pre-forming the insulating layer on the substrate 10 can ensure insulation between the conductive loops 21. The insulating layer can be formed using one or more of coating, printing, spraying, dipping, and injection molding processes. If the substrate 10 itself is made of an insulating material, the insulating layer may not be provided.

[0061] The substrate 10 can have a contoured structure, allowing printing on non-planar substrates 10. This expands the application range of the produced wiring harness and facilitates its adaptation to the application environment. The flexible substrate 10 allows the produced wiring harness to be adapted to a variety of installation scenarios, making it easier to use in appliances with complex installation environments. This helps reduce interference from vibration factors and ensures stability even in environments with high vibration requirements. The substrate 10 can be a component of an electrical device, enabling the integrated production of the component and wiring harness, enabling quick installation and removal of the wiring harness. For example, the substrate 10 can be a vehicle body component or a component of an onboard electrical appliance. The conductive circuit 21 is integrally formed with the substrate 10. Simply replacing the substrate 10 allows the wiring harness to be replaced, saving both maintenance time and costs. For example, the inner lining of a vehicle door can serve as the substrate 10 for the door wiring harness, allowing the inner lining to be directly replaced during maintenance. The substrate 10 can also be a component of the body-in-white, bumper, roof, inner door panel, seat frame, or various onboard electrical appliances.

[0062] This wiring harness production method uses printing to form the conductive loop 21. This method has relatively low equipment costs, reducing the cost of the wiring harness. Furthermore, the process is fast, enabling additive manufacturing with minimal pollution. The printed plate can be processed using machining or 3D printing, and the conductive ink can be printed using printing equipment. This production method eliminates the need for wire raw materials and complex processes such as wire cutting, terminal crimping, sheath insertion, and rubber encapsulation. The circuit can be printed in one go, or directly onto the housing of the corresponding product, saving processing time and enabling large-scale automated production.

[0063] In one embodiment, the wiring harness production method includes steps S25 and S80, wherein step S25 is performed before step S30 and step S80 is performed after step S50. In step S25, a lower shielding layer is printed on the substrate; in step S80, an upper shielding layer is printed around the insulating protective layer, electrically connecting the upper shielding layer to the lower shielding layer and enclosing the conductive loop. The upper and lower shielding layers are connected via shielding layers located on the side walls of the wiring harness. The upper and lower shielding layers, together with the shielding layers located on the side walls of the wiring harness, form a box structure that surrounds the conductive loop. The shielding structure is provided outside the wiring harness, and can be used in locations with high electromagnetic interference to shield signals within the wiring harness from electromagnetic interference, ensuring signal stability.

[0064] If the wiring harness includes multiple conductive layers, the upper shielding layer is positioned above the topmost conductive layer, meaning that step S80 is performed before the last step S50. If an insulating layer is provided on the substrate, the lower shielding layer is positioned above the insulating layer. The shielding layer on the sidewalls of the wiring harness can be sprayed or printed, or aluminum foil can be used.

[0065] In one embodiment, the wiring harness production method further includes step S90 performed after step S50: crimping or welding connecting terminals 211 at the ends of the conductive loops. By interlocking the connecting terminals 211, electrical connections are achieved between different wiring harnesses or between a wiring harness and an electrical appliance.

[0066] As shown in FIG2 and FIG3 , the terminal of the conductive circuit 21 is provided with a connection terminal 211 . The connection terminal 211 can be a gold finger, a pin terminal or a welding wire to connect with other electrical circuits.

[0067] Furthermore, the wiring harness production method further includes step S100, performed after step S90. Step S100: a sheath is provided at the terminal end of the conductive loop, and a connecting terminal 211 is accommodated within the sheath. The sheath is inserted into each other to achieve contact and connection with the connecting terminal 211 within the sheath. In some cases, multiple connecting terminals 211 are provided within a single sheath, and two matching sheaths are connected to ensure a secure connection, making the electrical connection of the connecting terminal 211 more reliable and stable.

[0068] In one embodiment, the production method of the wiring harness also includes step S110 implemented after step S50. Step S110: a heat sink is provided on the insulating protective layer. A heat sink is provided on the insulating protective layer. The heat generated by the wiring harness current is quickly dissipated into the air through the heat sink, which is beneficial to reducing the temperature of the wiring harness and reducing the risk of the conductive circuit melting.

[0069] Example 2

[0070] The present invention provides a wiring harness produced using the aforementioned wiring harness production method. The wiring harness comprises: a substrate 10, at least one layer of conductive loops 21, and at least one insulating protective layer 40. Each conductive loop 21 is positioned between the substrate 10 and the outermost insulating protective layer 40, with the conductive loops 21 and the insulating protective layer 40 arranged alternately. The wiring harness is suitable for automated, high-volume, and rapid production. The conductive loops 21 can be formed in one step, resulting in a high degree of automation and efficiency, reducing production costs. The harness is also easy to install and disassemble, improving assembly efficiency.

[0071] In one embodiment, the cross-sectional width of the conductive loop is 0.1mm-68mm. In a wiring harness, the cross-sectional area of ​​the conductor determines the current that the conductor can conduct. Generally, the conductor that realizes signal conduction has a smaller current and a smaller conductor cross-sectional area. For example, the minimum cross-sectional area of ​​the signal line of an automobile wiring harness can reach 0.1mm. 2 , and the conductor that realizes power conduction has a large current and a large conductor cross-sectional area. For example, the maximum cross-sectional area of ​​the car battery harness is 260mm 2 .

[0072] When the width of the conductive loop 21 is less than 0.1 mm, in order to obtain a cross-sectional area of ​​0.1 mm 2 To print a conductor with a thickness of at least 1 mm, it is necessary to print a conductive loop 21. The smaller the width, the greater the thickness. In order to obtain a thicker thickness, multiple printings are required, which wastes working hours and reduces processing efficiency. In addition, since the conductive loop 21 is too narrow, the strength cannot meet the requirements, and the layout of the wiring harness is also restricted, and the height of the wiring harness cannot be reduced.

[0073] When the width of the conductive loop 21 is greater than 68 mm, in order to obtain a cross-sectional area of ​​260 mm 2 The conductor needs to be printed with a thickness of at least 3.82 mm. The wider the width, the smaller the thickness. However, the smaller the thickness, the larger the area of ​​the printed conductive loop 21, and the occupied area of ​​the wiring harness cannot be reduced.

[0074] Therefore, the inventors selected a cross-sectional width of the conductive loop of 0.1 mm to 68 mm, and obtained conductors with different cross-sectional areas by printing conductive loops 21 of different thicknesses.

[0075] After many experiments, the inventors found that when the cross-sectional width of the conductive loop is 0.5mm-58mm, the aspect ratio of the printed conductive loop 21 is within a relatively reasonable range, the thickness range is suitable for printing processing, and the occupied area is not wasted. Therefore, the inventors prefer that the cross-sectional width of the conductive loop is 0.5mm-58mm.

[0076] In one embodiment, the conductive circuit is made of conductive ink. Conductive ink is conductive, has inherent viscosity, can adhere firmly to the substrate, and has fluidity. Printing can be used to create the conductive circuit, resulting in a high degree of automation and efficiency, thus reducing production costs.

[0077] In one embodiment, the conductive ink includes a conductive filler, a binder, a solvent, and an additive, wherein the conductive filler includes a combination of one or more of metal powder, conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials.

[0078] In one embodiment, the carbon-containing conductor is graphite powder, carbon nanotube material, graphene material, or a combination thereof.

[0079] The conductive ink can be prepared using metal powder or other conductive powder, which can make the formed conductive circuit 21 have better conductivity, and is simple and convenient to prepare with less pollution.

[0080] In one embodiment, the metal powder can be one or more of nickel or its alloys, cadmium or its alloys, zirconium or its alloys, chromium or its alloys, cobalt or its alloys, manganese or its alloys, aluminum or its alloys, tin or its alloys, titanium or its alloys, zinc or its alloys, copper or its alloys, silver or its alloys, and gold or its alloys. Preferably, the most commonly used metal material for conductors is copper or its alloys, as copper has relatively good electrical conductivity among metals, is not a precious metal, is relatively easy to process, and has good ductility. However, as copper prices continue to rise, the material cost of using copper as a conductor will become increasingly high. Therefore, people have begun to seek alternatives to copper to reduce costs. Aluminum accounts for approximately 7.73% of the Earth's crust. With optimized refining technology, its price is relatively low. Furthermore, aluminum is lighter than copper and has a conductivity second only to copper. Therefore, aluminum or its alloys can partially replace copper or its alloys in electrical connections.

[0081] In one embodiment, the adhesive includes at least one of epoxy resin, polyester resin, acrylic resin, polyamide resin, modified phenolic resin and cellulose resin.

[0082] In one embodiment, the insulating protective layer is formed of a material selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and a combination of one or more of polyethylene.

[0083] In one embodiment, the breakdown strength of the insulating protective layer is 0.3KV / mm-35KV / mm. Breakdown strength is also called dielectric breakdown strength. It indicates the highest electric field strength that a material can withstand to avoid being destroyed (broken down) under the action of an electric field. When the breakdown strength of the insulating protective layer is lower than 0.3KV / mm, some thinner insulating protective layers may be broken down under normal voltage, resulting in invalid insulation. When the breakdown strength of the insulating protective layer is higher than 35KV / mm, since high voltages higher than 35KV will not occur in general vehicle environments, the use of materials with too high a breakdown strength will increase the cost of the integrated wiring harness assembly, resulting in design waste.

[0084] In one embodiment, the thickness of the insulating protective layer is 0.03mm-5mm. If the thickness of the insulating protective layer is less than 0.03mm, not only can the breakdown voltage of the insulating protective layer not be guaranteed to be higher than the operating voltage, but the wear resistance of the insulating protective layer cannot be guaranteed. After repeated scraping, the insulating protective layer will be damaged, exposing the conductor, which will lead to leakage or short circuit, causing circuit damage and functional failure. When the thickness of the insulating protective layer is equal to 5mm, the breakdown voltage, insulation resistance and wear resistance of the insulating protective layer can all meet the requirements. However, when the thickness is greater than 5mm, the thickness of the insulating protective layer is relatively large, and problems such as pores and collapse may occur during the processing, which reduces the performance of the insulating protective layer. In addition, the insulating protective layer material is wasted and the processing steps and time are increased. Therefore, the inventors selected the thickness of the insulating protective layer to be 0.03mm-5mm.

[0085] The substrate 10 can have a contoured structure, allowing printing on non-planar substrates 10. This expands the application range of the produced wiring harness and facilitates its adaptation to the application environment. The flexible substrate 10 allows the produced wiring harness to be adapted to a variety of installation scenarios, making it easier to use in appliances with complex installation environments. This helps reduce interference from vibration factors and ensures stability even in environments with high vibration requirements. The substrate 10 can be a component of an electrical device, enabling the integrated production of the component and wiring harness, enabling quick installation and removal of the wiring harness. For example, the substrate 10 can be a vehicle body component or a component of an onboard electrical appliance. The conductive circuit 21 is integrally formed with the substrate 10. Simply replacing the substrate 10 allows the wiring harness to be replaced, saving both maintenance time and costs. For example, the inner lining of a vehicle door can serve as the substrate 10 for the door wiring harness, allowing the inner lining to be directly replaced during maintenance. The substrate 10 can also be a component of the body-in-white, bumper, roof, inner door panel, seat frame, or various onboard electrical appliances.

[0086] Conventional printed circuit boards primarily function as circuit boards, mounting electrical components and achieving specific electrical functions. Unlike conventional printed circuit boards, this wiring harness conducts current and transmits signals. Connecting terminals 211 are provided at the ends of conductive loops 21. These terminals can be gold fingers, pin terminals, or solder wires. These terminals electrically connect conductive loops 21 to a power source or electrical device.

[0087] At present, automotive wiring harnesses are usually produced separately for wiring harness factories. The wires, terminals, sheaths, positioning parts, seals, brackets, etc. are processed and assembled together to form a complete wiring harness, which is then delivered to the automobile factory. During the final assembly of the automobile, they are assembled to the car body at different workstations. The installation is difficult and wastes labor.

[0088] The wiring harness can be directly installed on the body sheet metal, instrument panel or electrical device, without the need to set up a separate wiring harness. Once the automobile parts are installed, the wiring harness is also installed, saving labor hours for automobile assembly and reducing at least 60% of manual operations.

[0089] The above description is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A method for producing a wire harness, wherein: The production method of the wiring harness comprises: Step S10, preparing a printing plate; Step S20, preparing a substrate; Step S30, printing the conductive ink onto the substrate using the printing plate; Step S40, the conductive ink coagulates to form a conductive loop; In step S50 , an insulating protective layer is formed around and on the surface of the conductive loop.

2. The method for producing a wire harness according to claim 1, wherein: The production method of the wiring harness includes step S60 performed after step S50, wherein step S60: printing conductive ink onto the insulating protective layer by the printing plate; Furthermore, the step S60, the step S40 and the step S50 are alternately performed one or more times in sequence.

3. The method for producing a wire harness according to claim 2, wherein: The production method of the wiring harness comprises: Step S70 , punching holes in the insulating protective layer and / or the conductive loop, and pouring conductive material to form a connecting loop that electrically connects at least two layers of the conductive loop.

4. The method for producing a wire harness according to claim 2, wherein: The production method of the wiring harness comprises: Step S25, printing a lower shielding layer on the substrate; Step S80, printing an upper shielding layer on the outer periphery of the insulating protective layer, wherein the upper shielding layer is electrically connected to the lower shielding layer and closes the conductive loop; The step S25 is performed before the step S30 , and the step S80 is performed before the step S50 .

5. The method for producing a wire harness according to claim 1, wherein: The step S30 is performed by printing multiple times.

6. The method for producing a wire harness according to claim 1, wherein: The step S30 is performed by screen printing, relief printing, flexographic printing, gravure printing or offset printing.

7. The method for producing a wire harness according to claim 6, wherein: The wiring harness is a spatial wiring harness, and step S30 is performed by letterpress printing, flexographic printing or gravure printing.

8. The method for producing a wire harness according to claim 1, wherein: The method for producing a wiring harness further includes step S90 performed after step S50 , wherein step S90 is: crimping or welding a connection terminal at a terminal end of the conductive loop.

9. The method for producing a wire harness according to claim 8, wherein: The method for producing a wiring harness further includes step S100 performed after step S90 , wherein step S100 includes providing a sheath at a terminal end of the conductive loop, wherein the connecting terminal is accommodated in the sheath.

10. The method for producing a wire harness according to claim 1 or 2, wherein: The method for producing a wire harness further includes step S110 performed after step S50 , wherein step S110 is: providing a heat sink on the insulating protective layer.

11. The method for producing a wire harness according to claim 1, wherein: The step S40 uses one or more of natural drying, hot and cold air drying, infrared irradiation drying, and ultraviolet curing to dry and solidify the conductive ink.

12. The method for producing a wire harness according to claim 1, wherein: The conductive layer formed in step S30 and step S40 includes a plurality of conductive loops; in the same conductive layer, the plurality of conductive loops are disconnected or electrically connected.

13. The method for producing a wire harness according to claim 1, wherein: In step S10, the printing plate is prepared by machining or 3D printing.

14. The method for producing a wire harness according to claim 1, wherein: The method for producing a wire harness further includes step S15 performed after step S10 , in which an insulating layer is provided on the surface of the substrate.

15. The method for producing a wire harness according to claim 1, wherein: In step S50, the insulating protective layer is formed by one or more processes including coating, printing, spraying, dipping, and injection molding.

16. A wiring harness, wherein: The wire harness is produced using the production method of any one of claims 1 to 15, comprising: a substrate, at least one layer of conductive loops and at least one layer of insulating protective layer, each of the conductive loops being located between the substrate and the outermost insulating protective layer, and the conductive loops and the insulating protective layers being distributed alternately.

17. The wire harness according to claim 16, wherein The cross-sectional width of the conductive loop is 0.1 mm to 68 mm.

18. The wire harness according to claim 16, wherein The cross-sectional width of the conductive loop is 0.5 mm to 58 mm.

19. The wire harness according to claim 16, wherein The conductive circuit is made of conductive ink.

20. The wire harness according to claim 19, wherein The conductive ink includes conductive fillers, adhesives, solvents and additives, and the conductive fillers include one or more combinations of metal powders, conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials.

21. The wire harness according to claim 20, wherein The carbon-containing conductor is one or a combination of graphite powder, carbon nanotube material, and graphene material.

22. The wire harness according to claim 20, wherein The metal powder is one or more of nickel or its alloys, cadmium or its alloys, zirconium or its alloys, chromium or its alloys, cobalt or its alloys, manganese or its alloys, aluminum or its alloys, tin or its alloys, titanium or its alloys, zinc or its alloys, copper or its alloys, silver or its alloys and gold or its alloys.

23. The wiring harness according to claim 16, wherein The insulating protective layer is formed of a material selected from the group consisting of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and a combination of one or more of polyethylene.

24. The wiring harness according to claim 16, wherein The breakdown strength of the insulating protective layer is 0.3KV / mm-35KV / mm.

25. The wiring harness according to claim 16, wherein The thickness of the insulating protective layer is 0.03 mm to 5 mm.

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