SPEAKER MODULE STRUCTURE

Abstract

The invention relates to a modular loudspeaker construction which may comprise a first construction, a second construction configured to be coupled with the first construction, and a loudspeaker coupled with at least one of either the first or second constructions, wherein the second construction comprises at least one groove configured to form a resonant void by coupling between the first and second constructions, the resonant void is connected to the loudspeaker and has an absorbent material injected into it, and when the first and second constructions are coupled, one end of the groove comprising an opening is formed in a closed loop comprising part of the first construction and part of the second construction.

Description

Speaker module structure and electronic device including the same

[0001] The present disclosure relates to a speaker module structure and an electronic device including the same.

[0002] Typically, electronic devices include a speaker device to provide audio services to users, and the speaker device is fixed in the internal space of the electronic device.

[0003] Speaker devices require a resonant space to ensure the quality of sound output from the speaker unit. Therefore, the speaker device may include a case that accommodates the speaker unit to secure a resonant space.

[0004] As electronic devices become slimmer and more compact, the speaker units housed within them also need to be smaller. This means that the case housing the speaker unit, which secures resonance space, has a limited size, and consequently, the resonance space required for sound quality can also be limited in size.

[0005] The above information is provided solely as background information to aid in understanding the present disclosure. No determination has been made, nor is any assertion made, as to whether any of the above constitutes prior art in connection with the present disclosure.

[0006] When an adsorption material that adsorbs air in the height direction of the speaker device is injected into the resonance space of the speaker device, the height of the speaker device may not be sufficient, thereby narrowing the passage through which the adsorption material moves, making it difficult for the adsorption material to move smoothly into the resonance space. Accordingly, the time required for the adsorption material to move to the resonance space located a certain distance away from the inlet where the adsorption material is injected in the process may increase, which may increase the production cost. In addition, the structure of the device may form a narrow path through which the adsorption material moves, which may hinder the injection of the adsorption material.

[0007] The size of the speaker module may increase to secure an inlet or a passage for injecting the adsorbent material. Therefore, a structure capable of miniaturizing the speaker module and securing an inlet or a passage for injecting the adsorbent material is required.

[0008] An aspect of the present disclosure is to address at least the problems and / or disadvantages mentioned above, and to provide at least the advantages described below. Accordingly, an aspect of the present disclosure can provide a speaker module structure that forms a case that accommodates a speaker unit by combining independently separable structures, and an electronic device including the same capable of injecting an adsorbent material through an opening formed in a side of the case.

[0009] Additional aspects will be partly described in the following description, partly will be obvious from the description, or may be learned by practice of the embodiments disclosed.

[0010] According to various embodiments of the present disclosure, a speaker module structure includes a first structure, a second structure that is connectable with the first structure, and a speaker that is connected to at least one of the first structure and the second structure, wherein the second structure includes at least one groove that forms a resonance space by connection of the first structure and the second structure, the resonance space is connected to the speaker, an adsorption material is injected, and one end of the groove may include an opening formed as a closed loop that includes a portion of the first structure and a portion of the second structure when the first structure and the second structure are connected.

[0011] According to various embodiments of the present disclosure, an electronic device including a speaker assembly comprises a first carrier, a second carrier coupleable with the first carrier, and a speaker coupled with at least one of the first carrier and the second carrier, wherein the second carrier includes at least one groove forming a resonance space by coupling of the first carrier and the second carrier, the resonance space being connected to the speaker, and an adsorption material being injected, and one end of the groove including an opening formed as a closed loop including a portion of the first carrier and a portion of the second carrier when the first carrier and the second carrier are coupled.

[0012] According to various embodiments disclosed in this document, an adsorbent material can be smoothly injected into a resonant space within a speaker device through an opening formed in a side of the speaker device by combining separable structures.

[0013] According to various embodiments disclosed in this document, an opening for injecting an adsorbent material is formed on a side of the speaker device, thereby lowering the height of the speaker device compared to when the adsorbent material is injected from the height direction of the speaker device, thereby reducing the space loss.

[0014] Other aspects, advantages, and salient features of the present disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the present disclosure taken in conjunction with the accompanying drawings.

[0015] FIG. 1 is a front perspective view of an electronic device according to one embodiment.

[0016] FIG. 2 is a rear perspective view of an electronic device according to one embodiment.

[0017] FIG. 3 is a projection diagram showing the arrangement relationship of internal components of an electronic device according to one embodiment.

[0018] FIG. 4 shows a cross-sectional view of a portion of line A-A' of FIG. 3, according to one embodiment.

[0019] FIG. 5a illustrates a first state and a second state of a speaker module according to one embodiment.

[0020] FIG. 5b illustrates a speaker module according to another embodiment.

[0021] FIG. 6a shows a cross-sectional view taken along line B-B' of the speaker module of FIG. 5a in a second state, according to one embodiment.

[0022] FIG. 6b shows a cross-sectional view taken along line C-C' of the speaker module of FIG. 5b according to another embodiment.

[0023] FIG. 7 illustrates an opening formed in a speaker module according to one embodiment.

[0024] FIG. 8 illustrates a first sealing member attached to an area of ​​a speaker module according to one embodiment.

[0025] FIG. 9 illustrates a second sealing member attached to a speaker module according to one embodiment.

[0026] FIG. 10 illustrates an opening formed in a speaker module according to another embodiment.

[0027] Figure 11 shows an area where a first sealing member is attached and an area where a second sealing member is attached, according to another embodiment.

[0028] FIG. 12 is a block diagram of an electronic device within a network environment according to various embodiments.

[0029] Throughout the drawings, like reference numbers will be understood to refer to like parts, components and structures.

[0030] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While it includes numerous specific details to aid understanding, these are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0031] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are merely used by the inventors to facilitate a clear and consistent understanding of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only, and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0032] Singular forms are understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "component surfaces" includes reference to one or more of such surfaces.

[0033] FIG. 1 is a front perspective view of an electronic device (101) according to one embodiment. FIG. 2 is a rear perspective view of an electronic device (101) according to one embodiment.

[0034] The electronic device (101) of FIG. 1 may correspond to the electronic device (1201) of FIG. 12, which will be described later. For example, the electronic device (101) may include some or all of the components that constitute the electronic device (1201) of FIG. 12.

[0035] Referring to FIGS. 1 and 2, a speaker device according to an embodiment of the present disclosure is provided as an example of a bar-type electronic device, but can also be applied to electronic devices such as slidable, rollable, and foldable types equipped with a speaker device, and is not limited thereto.

[0036] Referring to FIGS. 1 and 2, an electronic device (101) according to one embodiment may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (or side wall) (110C) that surrounds a space between the first side (110A) and the second side (110B). In another embodiment, the housing (110) may refer to a structure that forms a portion of the first side (110A), the second side (110B), and the side surface (110C).

[0037] In one embodiment, the first side (110A) may be formed by a front plate (121) (e.g., a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. In one example, the front plate (121) may include a curved portion that extends seamlessly from the first side (110A) toward the rear plate (111) at least at one side edge portion.

[0038] In one embodiment, the second side (110B) may be formed by a substantially opaque back plate (111). In one example, the back plate (111) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one example, the back plate (111) may include a curved portion extending seamlessly from the second side (110B) toward the front plate (121) at least at one end.

[0039] In one embodiment, the side (110C) may be formed by a side member (or side bezel structure or side wall) comprising metal and / or polymer in combination with the front plate (121) and the back plate (111). In one example, the side surface (110C) is located on the right side of the electronic device (101) (e.g., the +x direction in FIG. 1) and includes a first side surface (1111) extending along a first direction (e.g., the +y direction in FIG. 1), a second side surface (1112) extending along the first direction and parallel to the first side surface (1111), a third side surface (1113) extending along a second direction (e.g., the +x direction in FIG. 1) perpendicular to the first direction and connecting one end of the first side surface (1111) (e.g., one end in the +y direction in FIG. 1) and one end of the second side surface (1112) (e.g., one end in the +y direction in FIG. 1), and / or a third side surface (1113) extending along the second direction (e.g., the +x direction in FIG. 1) and connecting the other end of the first side surface (1111) (e.g., one end in the -y direction in FIG. 1) and the other end of the second side surface (1112) (e.g., one end in the -y direction in FIG. 1). It may include a fourth side (1114) that connects.

[0040] According to one embodiment, the electronic device (101) may include at least one of a display (120), a first optical sensor (e.g., a sensor module and / or a camera module) (103), a connector hole (104), or an audio module (105). In one example, the electronic device (101) may omit at least one of the components or may additionally include other components. For example, the electronic device (101) may further include a sensor module not shown. The electronic device (101) may omit a key input device (107).

[0041] In one embodiment, a sensor such as a proximity sensor, a light sensor, an image sensor, or an iris sensor may be integrated into the display (120) or positioned adjacent to the display (120) within the area provided by the front plate (121).

[0042] In one embodiment, the display (120) may be visually exposed through a significant portion of the front plate (121). In one example, the display (120) may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one example, the corners of the display (120) may be formed to be substantially identical to the adjacent outer shape (e.g., curved) of the front plate (121).

[0043] In one embodiment, the connector hole (104) can accommodate a connector for transmitting and receiving power and / or data with an external electronic device (e.g., an electronic device (1202, 1204) of FIG. 12), and / or a connector for transmitting and receiving audio signals with the external electronic device. For example, the connector hole (104) can include a USB connector or an earphone jack (not shown) (or, “earphone interface”). In one embodiment, the USB connector and the earphone jack can be implemented as a single hole, and in another embodiment, the electronic device (101) can transmit and receive power and / or data, or audio signals, with an external device without a separate connector hole.

[0044] In one embodiment, the audio module (105) may include a microphone hole and a speaker hole. The microphone hole may have a microphone positioned inside to capture external sounds, and multiple microphones may be positioned inside to detect the direction of the sounds. In another example, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be included without the speaker hole. The speaker hole may include an external speaker hole and a receiver hole for calls.

[0045] In one embodiment, the key input device (107) may be disposed on a side (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (107), and the key input devices (107) that are not included may be implemented in another form, such as soft keys, on the display (120). In one example, the key input device (107) may include at least a portion of a fingerprint sensor disposed on a second side (110B) of the housing (110).

[0046] In one embodiment, the second optical sensor (130) and the third optical sensor (106) may be disposed on the second side (110B) of the electronic device (101). The second optical sensor (130) may include multiple cameras. In one example, the third optical sensor (106) may include a flash. In one example, the first optical sensor (103), the second optical sensor (130), and the third optical sensor (106) may include one or more lenses, image sensors, and / or image processors. The third optical sensor (106) may include a light emitting diode or a xenon lamp. In one example, two or more lenses (e.g., an infrared camera, a wide-angle and / or telephoto lens) and image sensors may be disposed on one side of the electronic device (101).

[0047] In one embodiment, the electronic device (101) may include a sensor module (not shown) to generate an electronic signal or data value corresponding to an internal operating state or an external environmental state. The electronic device (101) may further include at least one of a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor.

[0048] FIG. 3 is a projection diagram showing the arrangement relationship of internal components of an electronic device (101) according to one embodiment.

[0049] At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 and 2, and any overlapping description will be omitted below.

[0050] Referring to FIG. 3, in one embodiment, a first optical sensor (103), a second optical sensor (130), a circuit board (210), a motor (220), and a speaker module (300) may be placed in the internal space of the electronic device (101).

[0051] In one embodiment, a circuit board (210) may be disposed on at least a portion of the housing (110). The circuit board (210) may include a processor (e.g., a processor (1220) of FIG. 12), a memory (e.g., a memory (1230) of FIG. 12), a communication circuit (e.g., a communication module (1290) of FIG. 12), a power management module (e.g., a power management module (1288) of FIG. 12), and / or an interface (e.g., an interface (1277) of FIG. 12) required for operation of the electronic device (101).

[0052] In one embodiment, the circuit board (210) may include at least one of a printed board assembly (PBA), a printed circuit board (PCB), or a flexible printed circuit board (FPCB).

[0053] In one embodiment, the circuit board (210) may be electrically connected to a speaker module (300) to output audio data or voice / sound signals through a speaker (e.g., speaker unit (301) of FIG. 4 described below).

[0054] In one embodiment, the speaker module (300) can convert an electrical signal into an acoustic signal and output sound through an output unit (e.g., a diaphragm).

[0055] FIG. 4 shows a cross-sectional view of a portion of line A-A' of FIG. 3, according to one embodiment.

[0056] Referring to FIG. 4, the z-axis may refer to the thickness direction of the electronic device (101). In one example, the z-axis may include a first direction (e.g., +z direction) and a second direction (e.g., -z direction).

[0057] Referring to FIG. 4, the electronic device (101) may include a rear plate (111), a side bezel structure (131), a support member (132), a display (120), or a speaker module (300). In one example, at least a portion of the speaker module (300) may be disposed between the support member (132) and the rear plate (111). In one embodiment, the speaker module (300) may be referred to as a speaker module structure or a speaker assembly.

[0058] In one embodiment, the side bezel structure (131) may be formed to at least partially surround a space between a front side (e.g., the first side (110A) of FIG. 1) and a back side (e.g., the second side (110B) of FIG. 2) of the electronic device (101). In one example, the side bezel structure (131) may form at least a portion of a side side (e.g., the side side (110C) of FIG. 1) of the electronic device (101). In one example, the side bezel structure (131) may include a metal and / or a polymer and may have a frame that substantially forms a side side of the electronic device (101). In one example, when the side bezel structure (131) includes a metal material, a portion of the metal material portion is insulated from other portions and may be utilized as an antenna for transmitting and receiving a wireless signal.

[0059] In one embodiment, the support member (132) may be disposed within an internal space of the electronic device (101). For example, the support member (132) may be disposed within an area or space surrounded by a side bezel structure (131). In one example, the support member (132) may be formed in a flat shape with one side substantially facing the inner surface of the display (120).

[0060] In one embodiment, the side bezel structure (131) is described separately from the support member (132), but the support member (132) may be formed integrally with the side bezel structure (131). For example, the side bezel structure (131) and the support member (132) may be formed integrally by combining a plurality of metallic material parts and synthetic resin material parts through a process such as die casting, insert injection, or lathe processing. In one example, some of the metallic parts of the side bezel structure (131) or the support member (132) may function as an antenna. In another example, the support member (132) may be manufactured separately from the side bezel structure (131) and assembled and mounted on the inside of the side bezel structure (131).

[0061] In one embodiment, the support member (132) may include an opening (132a). In one example, the opening (132a) may be formed to penetrate from one surface of the support member (132) (e.g., a surface facing the inner side of the display (120)) to the other surface of the support member (132) (e.g., a surface facing in the opposite direction from the one surface of the support member (132). In one example, the support member (132) may include a flange (132b) extending from the other surface of the support member (132). In one example, sound output from the speaker unit (301) may be output to the outside through the opening (132a).

[0062] In one embodiment, the speaker module (300) may include a structure (310), a speaker unit (301), a protective member (302), and a resonant space (RS). In one embodiment, at least a portion of the resonant space (RS) may be filled with an adsorbent material.

[0063] In one embodiment, the structure (310) may include a first structure (311) and a second structure (312). The structure (310) may be referred to as a carrier (310) or a housing (310).

[0064] Referring to FIG. 4, the speaker module (300) may be a separate structure (310) including a speaker unit (301), and may be provided with a structure that shields the rear sound of the speaker unit (301) through the first structure (311) and the second structure (312).

[0065] Referring to FIG. 4, a protective member (302), a speaker unit (301), a first structure (311), and a second structure (312) may be sequentially arranged from a support member (132) of an electronic device (101) toward a first direction (e.g., +z direction).

[0066] In one embodiment, the second structure (312) may be formed in a flat plate shape so as to face the inner surface of the back plate (111). The first structure (311) may be formed in a flat plate shape so as to face at least a portion of the second structure (312) and be coupled to each other. In one example, the first structure (311) may include a first groove formed in a first direction (e.g., +z direction). In another example, the second structure (312) may include a second groove formed in a second direction (e.g., -z direction). In one example, when the first structure (311) and the second structure (312) are coupled, a resonance space (RS) may be formed by the first groove and / or the second groove.

[0067] In one embodiment, an adsorption material may be injected into the resonance space (RS). The resonance space (RS) into which the adsorption material is injected will be described in detail with reference to FIGS. 5A to 10 described below.

[0068] In one embodiment, the first structure (311) may include a rib structure formed in a second direction (e.g., -z direction) so that the speaker unit (301) can be mounted.

[0069] In one embodiment, the first structure (311) may include an opening (311a) such that one side of the seated speaker unit (301) may correspond to the resonance space (RS). In one example, the opening (311a) may be formed to penetrate from one side of the first structure (311) (e.g., the side facing the second structure (312)) to the other side of the first structure (311) (e.g., the side facing the opposite direction from the one side of the first structure (311). In one example, the rib structure of the first structure (311) may be formed in an area adjacent to one side and the other side of the opening (311a). In one example, the speaker unit (301) may be seated in the rib structure, and one side of the speaker unit (301) may form the resonance space (RS) together with the first structure (311) and the second structure (312).

[0070] In one embodiment, the speaker unit (301) may be provided in a substantially hexahedral shape. In one example, the speaker unit (301) may include components such as a magnetic circuit including a yoke and a magnet, a voice coil positioned in an air gap of the magnetic circuit, a side diaphragm vibrating by the voice coil, a center diaphragm, a suspension guiding the movement of the voice coil and the diaphragm, and a terminal pad receiving an electrical signal from the outside so as to transmit the electrical signal to the voice coil through the suspension. However, the configuration or shape of the speaker unit (301) is not limited thereto.

[0071] In one embodiment, the protective member (302) can be attached and / or coupled to the other surface of the speaker unit (301) (e.g., the surface opposite to the one surface of the speaker unit (301) forming the resonance space (RS)). In one example, the protective member (302) can allow sound of the speaker unit (301) to pass through. In one example, the protective member (302) can be a cover that protects the speaker unit (301) from the outside. In one example, the protective member (302) can be a member made of an elastic material having a structure that prevents foreign substances from entering the inside of the electronic device (101) in which the speaker module (300) is disposed. For example, the protective member (302) can include at least one of liquid injection silicone rubber (LSR), silicone, or rubber. The protective member (302) is not limited thereto, and can include a rigid material or stainless steel (STS).

[0072] In one embodiment, the display (120) may be arranged on one side of the support member (132) to output a screen in the front direction of the electronic device (101).

[0073] FIG. 5a illustrates a first state (300a) and a second state (300b) of a speaker module (300) according to one embodiment.

[0074] Referring to Fig. 5a, the first state (300a) of the speaker module (300) is a state in which the first structure (311) and the second structure (312) are separated. The second state (300b) of the speaker module (300) is a state in which the first structure (311) and the second structure (312) are combined.

[0075] In one embodiment, the first structure (311) may have a first size, and the second structure (312) may have a second size greater than the first size, but is not limited thereto. In one example, the second structure (312) may include a first region corresponding to the first structure (311) and a second region excluding the first region.

[0076] In one embodiment, the first structure (311) and the second structure (312) can be coupled. In one example, the first structure (311) and the second structure (312) can include protrusions, grooves, and / or grooves. For example, the second structure (312) can include at least one protrusion facing the first structure (311). The first structure (311) can include at least one groove for receiving at least one protrusion of the second structure (312).

[0077] In one embodiment, the first structure (311) and the second structure (312) can be fixed by at least one of an ultrasonic welding process, a double-sided tape process, and a bonding process.

[0078] In one embodiment, a resonance space can be formed in the second state (300b) of the speaker module (300) by a groove formed in the first structure (311) or the second structure (312).

[0079] Referring to FIG. 5a, the speaker module (300) may include an opening (500) for injecting an adsorption material (e.g., an adsorption material (803) of FIG. 8 described below) into a resonance space (RS) formed by the combination of the first structure (311), the second structure (312) and one surface of the speaker unit (301).

[0080] FIG. 5b illustrates a speaker module (300-1) according to one embodiment.

[0081] The speaker module (300-1) of Fig. 5b has some structural differences from the speaker module (300) of Fig. 5a, but other components and functions can be applied in the same manner.

[0082] Referring to FIG. 5b, in one embodiment, the speaker module (300-1) may include a first structure (311-1), a second structure (312-1), a speaker unit (301-1), and a protective member (305).

[0083] In one embodiment, the speaker unit (301-1) may form a resonance space (RS) by a groove formed in the first structure (311-1) or the second structure (312-1) when the first structure (311-1) and the second structure (312-1) are coupled. In one example, the speaker unit (301-1) may be placed within the resonance space (RS). In one embodiment, the speaker unit (301-1) may be placed in at least one area of ​​the resonance space (RS).

[0084] In one embodiment, the first structure (311-1) may include an opening (311-1a) so that the speaker unit (301-1) may be placed in at least one area of ​​the resonance space (RS). In one example, at least a portion of the speaker unit (301-1) may be placed in an area corresponding to the opening (311-1a) of the first structure (311-1). In one example, the opening (311-1a) may be formed to penetrate from one surface of the first structure (311-1) (e.g., a surface facing the second structure (312-1)) to the other surface of the first structure (311-1) (e.g., a surface facing in an opposite direction to the one surface of the first structure (311-1).

[0085] FIG. 6a shows a cross-sectional view taken along line B-B' in a second state (300b) of the speaker module (300) of FIG. 5a, according to one embodiment.

[0086] Referring to FIG. 6a, in one embodiment, the speaker module (300) may include a sound-absorbing sheet (303) and an opening (500).

[0087] In one embodiment, a resonance space (RS) may be formed in the second state (300b) of the speaker module (300) by at least one groove formed in the first structure (311) and / or the second structure (312). In one example, an adsorbent material may be injected into the resonance space (RS). In one example, the adsorbent material may be a porous material for discharging, condensing, or adsorbing a portion of the air inside the resonance space (RS). For example, the adsorbent material may be composed of a mixture of at least one of granular activated carbon, powdered activated carbon, or ARCP of various sizes and a binder. In another example, the adsorbent material may be composed of a mixture of Cu, Po1, Zr1, Zr2, or Al particles having a metal organic frameworks structure and a binder. As another example, the adsorbent material may be composed of a binder mixed with at least one of an element from the diatomaceous earth series, an element from the perlite or silicon dioxide series, or an element from the zeolite series.

[0088] In one embodiment, the speaker module (300) may include an opening (500) for injecting an adsorbent material. In one example, the opening (500) may be defined as a closed loop formed by the combination of the first structure (311) and the second structure (312). In one example, the area of ​​the opening (500) may be determined in consideration of the size of the adsorbent material. For example, the area of ​​the opening (500) may be about 1.15 mm. 2This may be ideal. In one example, the shape of the closed loop of the opening (500) including a part of the first structure (311) and a part of the second structure (312) is described in detail with reference to FIG. 7.

[0089] In one embodiment, the opening (500) may be a through hole connecting the resonance space (RS) to an external space of the resonance space (RS). In one example, an adsorbent material may be injected through the opening (500) arranged on the left side (e.g., in the -x direction) of the speaker module (300). In one example, the adsorbent material injected through the opening (500) may be injected into the resonance space (RS) formed by one side of the speaker unit (301) that is positioned in an area corresponding to the opening (311a) of the first structure (311).

[0090] In one embodiment, an allophone may be generated by repeated flow of an adsorbent material (803) (e.g., adsorbent material (803) of FIG. 8) disposed within a resonant space (RS). In one example, an allophone may be generated by friction of the adsorbent material (803) with at least one region of the first structure (311), the second structure (312), and / or the speaker unit (301) forming the resonant space (RS).

[0091] In one embodiment, a sound-absorbing sheet (303) may be attached to at least one surface of the first structure (311) and the second structure (312) forming the resonance space (RS). In one example, the sound-absorbing sheet (303) may be attached to at least one surface of the first structure (311) and / or the second structure (312) within the resonance space (RS) so as to be substantially parallel to the direction in which the adsorbent material is injected (e.g., +x direction). In one example, the sound-absorbing sheet (303) may include poron or a sponge.

[0092] In one embodiment, the sound-absorbing sheet (303) can prevent joints caused by the adsorbent material. In one example, the sound-absorbing sheet (303) is arranged in a direction substantially parallel to the direction in which the adsorbent material is injected, thereby minimizing the influence on the movement of the adsorbent material, thereby allowing the adsorbent material to be smoothly filled within the resonance space (RS).

[0093] In one embodiment, the sound-absorbing sheet (303) may form a portion of the resonance space (RS). That is, the sound-absorbing sheet (303) may be attached to at least a portion of the first structure (311) or the second structure (312) forming the resonance space (RS).

[0094] FIG. 6b shows a cross-sectional view taken along line C-C' of the speaker module (300-1) of FIG. 5b according to another embodiment.

[0095] Figure 6b shows a state in which the first structure (311-1) and the second structure (312-1) are combined.

[0096] In one embodiment, the first structure (311-1) may include a rib structure formed in a first direction (e.g., the +z direction of FIG. 6B) so that the speaker unit (301-1) can be mounted.

[0097] In one embodiment, a protective member (305) may be placed on the upper surface (e.g., +z direction of FIG. 6B) of the speaker unit (301-1). In one example, the protective member (305) may include a material such as a sponge or cotton.

[0098] Referring to FIG. 6b, the speaker module (300-1) may include an opening (500-1) for injecting an adsorbent material into a resonance space (RS) formed by the combination of the first structure (311-1) and the second structure (312-1). In one example, the opening (500-1) may be defined as a closed loop formed by the combination of the first structure (311-1) and the second structure (312-1). In one embodiment, a support member (132-1) may be combined with the first structure (311-1) or formed integrally with the first structure (311-1) to protect the speaker module (300-1). In one example, the support member (132-1) may be formed in a flat shape such that one surface of the support member (132-1) is substantially positioned to face the inner surface of the display (e.g., the display (120) of FIG. 1).

[0099] FIG. 7 illustrates an opening (500) formed in a speaker module (300) according to one embodiment.

[0100] Referring to FIG. 7, the first structure (311) and / or the second structure (312) may include at least one groove for forming a resonance space (RS), and one end of the groove formed in the first structure (311) and / or the second structure (312) in the second state (300b) of the speaker module (300) may include an opening (500) formed as a closed loop.

[0101] In one embodiment, the opening (500) formed as a closed loop may include a portion of the first structure (311) and a portion of the second structure (312). In one example, the shape of the opening (500) may be determined by the combined structure of the first structure (311) and the second structure (312), the open loop of the first structure (311) forming the opening (500) and / or the open loop of the second structure (312) forming the opening (500). In one example, the opening (500) may be formed by the combination of the open loop of the first structure (311) corresponding to the upper portion of the opening (500) and the open loop of the second structure (312) corresponding to the lower portion of the opening (500). The open loop of the first structure (311) may have the shape of the first portion (701). The open loop of the second structure (312) may be in the shape of the second part (702). For example, the open loop of the first structure (311) may be in the shape of a square with the lower part of the square deleted. " Corresponding to the shape, the open loop of the second structure (312) has the upper part of the square deleted " ” In the case of the shape, the speaker module (300) may include an opening (500) formed as a closed loop having a substantially rectangular shape by combining the first structure (311) and the second structure (312). In one example, the shape of the opening (500) formed as a closed loop is not limited thereto. For example, the opening (500) may be a polygonal shape such as a circle, a trapezoidal shape, a triangular shape, or a diamond shape.

[0102] FIG. 8 illustrates a first sealing member (800) attached to one area of ​​a speaker module (300) according to one embodiment.

[0103] In one embodiment, a first sealing member (800) may be arranged along the periphery of an opening (500) formed by joining the first structure (311) and the second structure (312) to seal the resonance space (RS). In one example, the first sealing member (800) may be attached or fixed to an area corresponding to the opening (500) of the speaker module (300) via an adhesive member (e.g., double-sided tape). In one example, the adhesive member may include a closed loop formed along the periphery of the opening (500).

[0104] In one embodiment, the first sealing member (800) can prevent the adsorbent material injected into the resonance space (RS) from leaking to an area other than the resonance space (RS) or prevent foreign substances from entering an area other than the resonance space (RS).

[0105] In one embodiment, the first sealing member (800) may be made of an elastic material. For example, the first sealing member (800) may include rubber.

[0106] Figure 8 (a) is a cross-sectional view of the speaker module (300) taken along line C-C' in an area where the first sealing member (800) is attached. Figure 8 (b) is a cross-sectional view of the speaker module (300) taken along line D-D' in an area where the first sealing member (800) is not attached.

[0107] In one embodiment, the first structure (311) and the second structure (312) are joined by assembling and / or mounting the first structure (311) on one side of the second structure (312), and the joining of the first structure (311) and the second structure (312) can be fixed by a process such as ultrasonic welding.

[0108] Referring to (a) of FIG. 8, an adsorbent material (803) may be injected into a resonance space (RS) formed by the combination of the first structure (311) and the second structure (312). In one example, the resonance space (RS) may include a residual space (801) remaining after the adsorbent material (803) is injected. In one example, a space compensation material (not shown) may be injected into the residual space (801) remaining after the adsorbent material (803) is injected. In one example, the space compensation material may include a flow-preventing material of the adsorbent material (803) to reduce allophones caused by the flow of the adsorbent material (803). The flow-preventing material of the adsorbent material (803) may include a sponge or cotton. In another example, the space compensation material may be the same material as the adsorbent material (803) but with a different particle size, or may be an air-adsorbing material of a different material from the adsorbent material (803).

[0109] Referring to (b) of FIG. 8, when the first structure (311) and the second structure (312) are combined and / or fixed, a gap or step may occur in the area (802) where the first structure (311) and the second structure (312) come into contact due to an error in the manufacturing process or assembly process of the first structure (311) and / or the second structure (312).

[0110] In one embodiment, when a gap or step is created in the area (802) where the first structure (311) and the second structure (312) are in contact, a bond or welding horn disposed between the first structure (311) and the second structure (312) can flow through the gap or step to secure and / or bond the first structure (311) and the second structure (312).

[0111] In one embodiment, a second sealing member (e.g., the second sealing member (900) of FIG. 9 described below) may be placed on the speaker module (300) to compensate for a gap or step created by the combination of the first structure (311) and the second structure (312).

[0112] FIG. 9 illustrates a second sealing member (900) attached to a speaker module (300) according to one embodiment.

[0113] Referring to FIG. 9, a second sealing member (900) may be placed in at least one area of ​​the speaker module (300) to compensate for a gap and / or step created by the combination of the first structure (311) and the second structure (312).

[0114] In one embodiment, a second sealing member (900) may be disposed in an area surrounding a first sealing member (800) that is attached or fixed to an area corresponding to the opening (500) to seal the resonance space (RS). In one example, the second sealing member (900) may prevent an adsorbent material or space compensation material disposed in the resonance space (RS) from leaking through a gap or step between the first sealing member (800) and the opening (500).

[0115] In one embodiment, the second sealing member (900) may include a eutectic bond and / or a polymer adhesive.

[0116] FIG. 10 illustrates an opening formed in a speaker module (400) according to another embodiment.

[0117] Referring to Fig. 10, the speaker module (400) has a different opening forming a closed loop from the speaker module (300) of Fig. 7, and other components can be applied in the same manner.

[0118] In one embodiment, the speaker module (400) may include a first structure (411), a second structure (412), and an opening (501).

[0119] Referring to Fig. 10, the first state (400a) of the speaker module (400) is a state in which the first structure (411) and the second structure (412) are separated. The second state (400b) of the speaker module (400) is a state in which the first structure (411) and the second structure (412) are combined.

[0120] In one embodiment, the speaker module (400) may include an opening (501) that forms a closed loop for injecting an adsorbent material by combining a first structure (411) and a second structure (412). In one example, the opening (501) may include a portion of the first structure (411) and a portion of the second structure (412). In one example, the opening (501) may be formed by combining an open loop of the first structure (411) corresponding to an upper portion of the opening (501) and an open loop of the second structure (412) corresponding to a lower portion of the opening (501). The open loop of the first structure (411) may have a shape of the first portion (1001). The open loop of the second structure (412) may have a shape of the second portion (1002). For example, the open loop of the first structure (411) is similar to the alphabet “T” "The shape is a "ㅡ" shape, and the open loop of the second structure (412) is a horizontally lying bar shape, and the speaker module (400) is a "T" shape. "It may include an opening (501) defined by a closed loop of shape.

[0121] FIG. 11 shows an area (1101) where a first sealing member (800a) is attached and an area (1102) where a second sealing member (900a) is attached according to another embodiment.

[0122] In one embodiment, the speaker module (400) may include a first sealing member (800a) and a second sealing member (900a).

[0123] Referring to Fig. 11, a first sealing member (800a) may be arranged along the periphery of an opening (501) formed by combining a first structure (411) and a second structure (412). In one example, the first sealing member (800a) may be attached or fixed to an area corresponding to the opening (501) via an adhesive member (e.g., double-sided tape). In one example, the adhesive member may be attached to an area (1101) formed along the periphery of the first structure (411) to couple the first sealing member (800a) to the area corresponding to the opening (501).

[0124] In one example, the first sealing member (800a) may be formed to correspond to the shape of the opening (501). For example, if the opening (501) is a “T” shape, the first sealing member (800a) may be a “T” shape corresponding to the shape of the opening (501).

[0125] In one embodiment, when the first structure (411) and the second structure (412) are coupled and / or fixed, a gap or step may be created at the part where the first structure (411) and the second structure (412) come into contact. In one example, the speaker module (400) may have a second sealing member (900a) disposed on the speaker module (400) to compensate for the gap or step created by the coupling of the first structure (411) and the second structure (412). In one example, the second sealing member (900a) may be disposed on the area (1102) where the first structure (411) and the second structure (412) come into contact.

[0126] FIG. 12 is a block diagram of an electronic device (1201) within a network environment (1200) according to various embodiments.

[0127] Referring to FIG. 12, in a network environment (1200), an electronic device (1201) may communicate with an electronic device (1202) via a first network (1298) (e.g., a short-range wireless communication network), or may communicate with an electronic device (1204) or a server (1208) via a second network (1299) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1201) may communicate with the electronic device (1204) via the server (1208). According to one embodiment, the electronic device (1201) may include a processor (1220), a memory (1230), an input module (1250), an audio output module (1255), a display module (1260), an audio module (1270), a sensor module (1276), an interface (1277), a connection terminal (1278), a haptic module (1279), a camera module (1280), a power management module (1288), a battery (1289), a communication module (1290), a subscriber identification module (1296), or an antenna module (1297). In some embodiments, the electronic device (1201) may omit at least one of these components (e.g., the connection terminal (1278)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1276), camera module (1280), or antenna module (1297)) may be integrated into one component (e.g., display module (1260)).

[0128] The processor (1220) may control at least one other component (e.g., hardware or software component) of the electronic device (1201) connected to the processor (1220) by executing, for example, software (e.g., program (1240)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1220) may store commands or data received from other components (e.g., sensor module (1276) or communication module (1290)) in a volatile memory (1232), process the commands or data stored in the volatile memory (1232), and store result data in a non-volatile memory (1234). According to one embodiment, the processor (1220) may include a main processor (1221) (e.g., a central processing unit or an application processor) or an auxiliary processor (1223) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1221). For example, when the electronic device (1201) includes the main processor (1221) and the auxiliary processor (1223), the auxiliary processor (1223) may be configured to use less power than the main processor (1221) or to be specialized for a given function. The auxiliary processor (1223) may be implemented separately from the main processor (1221) or as a part thereof.

[0129] The auxiliary processor (1223) may control at least a part of functions or states associated with at least one component (e.g., the display module (1260), the sensor module (1276), or the communication module (1290)) of the electronic device (1201), for example, on behalf of the main processor (1221) while the main processor (1221) is in an inactive (e.g., sleep) state, or together with the main processor (1221) while the main processor (1221) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1223) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1280) or a communication module (1290)). In one embodiment, the auxiliary processor (1223) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1201) where the artificial intelligence is performed, or can be performed through a separate server (e.g., server (1208)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0130] The memory (1230) can store various data used by at least one component (e.g., the processor (1220) or the sensor module (1276)) of the electronic device (1201). The data can include, for example, software (e.g., the program (1240)) and input data or output data for commands related thereto. The memory (1230) can include a volatile memory (1232) or a non-volatile memory (1234).

[0131] The program (1240) may be stored as software in memory (1230) and may include, for example, an operating system (1242), middleware (1244), or an application (1246).

[0132] The input module (1250) can receive commands or data to be used in a component of the electronic device (1201) (e.g., a processor (1220)) from an external source (e.g., a user) of the electronic device (1201). The input module (1250) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0133] The audio output module (1255) can output audio signals to the outside of the electronic device (1201). The audio output module (1255) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0134] The display module (1260) can visually provide information to an external party (e.g., a user) of the electronic device (1201). The display module (1260) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (1260) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0135] The audio module (1270) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1270) can acquire sound through the input module (1250), output sound through the sound output module (1255), or an external electronic device (e.g., electronic device (1202)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1201).

[0136] The sensor module (1276) can detect the operating status (e.g., power or temperature) of the electronic device (1201) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1276) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0137] The interface (1277) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1201) with an external electronic device (e.g., the electronic device (1202)). In one embodiment, the interface (1277) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0138] The connection terminal (1278) may include a connector through which the electronic device (1201) may be physically connected to an external electronic device (e.g., the electronic device (1202)). According to one embodiment, the connection terminal (1278) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0139] The haptic module (1279) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1279) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0140] The camera module (1280) can capture still images and videos. According to one embodiment, the camera module (1280) may include one or more lenses, image sensors, image signal processors, or flashes.

[0141] The power management module (1288) can manage power supplied to the electronic device (1201). According to one embodiment, the power management module (1288) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0142] A battery (1289) may power at least one component of the electronic device (1201). In one embodiment, the battery (1289) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0143] The communication module (1290) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1201) and an external electronic device (e.g., electronic device (1202), electronic device (1204), or server (1208)), and the performance of communication through the established communication channel. The communication module (1290) may operate independently from the processor (1220) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1290) may include a wireless communication module (1292) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1294) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1204) via a first network (1298) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1299) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1292) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1296) to verify or authenticate the electronic device (1201) within a communication network such as the first network (1298) or the second network (1299).

[0144] The wireless communication module (1292) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1292) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1292) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1292) may support various requirements specified in the electronic device (1201), an external electronic device (e.g., the electronic device (1204)), or a network system (e.g., the second network (1299)). According to one embodiment, the wireless communication module (1292) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0145] The antenna module (1297) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (1297) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1297) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1298) or the second network (1299), may be selected from the plurality of antennas, for example, by the communication module (1290). A signal or power may be transmitted or received between the communication module (1290) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1297).

[0146] According to various embodiments, the antenna module (1297) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0147] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0148] According to one embodiment, commands or data may be transmitted or received between the electronic device (1201) and an external electronic device (1204) via a server (1208) connected to a second network (1299). Each of the external electronic devices (1202 or 1204) may be the same or a different type of device as the electronic device (1201). According to one embodiment, all or part of the operations executed in the electronic device (1201) may be executed in one or more of the external electronic devices (1202, 1204, or 1208). For example, when the electronic device (1201) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1201) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1201). The electronic device (1201) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1201) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1204) may include an Internet of Things (IoT) device. The server (1208) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1204) or server (1208) may be included in the second network (1299). The electronic device (1201) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0149] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0150] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0151] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0152] Various embodiments of the present document may be implemented as software (e.g., a program (1240)) including one or more commands stored in a storage medium (e.g., an internal memory (1236) or an external memory (1238)) readable by a machine (e.g., an electronic device (1201)). For example, a processor (e.g., a processor (1220)) of the machine (e.g., an electronic device (1201)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0153] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0154] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0155] In various embodiments, a speaker module structure includes a first structure (e.g., a first structure (311)), a second structure (e.g., a second structure (312)) that can be coupled with the first structure (e.g., the first structure (311)), and a speaker (e.g., a speaker unit (301)) coupled with at least one of the first structure and the second structure, wherein the second structure includes at least one groove that forms a resonance space (e.g., a resonance space (RS)) by coupling the first structure and the second structure, the resonance space is connected to the speaker, and an adsorption material (e.g., an adsorption material (803)) is injected therein, and when the first structure and the second structure are coupled, one end of the groove may include an opening (e.g., an opening (500)) formed as a closed loop that includes a portion of the first structure and a portion of the second structure.

[0156] In one embodiment, the speaker module structure may further include a first sealing member (e.g., first sealing member (800)) that seals the opening.

[0157] In one embodiment, the speaker module structure may further include a second sealing member (e.g., second sealing member (900)) that seals a recess formed by the joining of the first structure and the second structure.

[0158] In one embodiment, the second sealing member may comprise at least one of a eutectic bond or a polymer adhesive.

[0159] In one embodiment, the speaker module structure may further include a sound-absorbing sheet (e.g., a sound-absorbing sheet (303)) disposed on at least one surface of the first structure or the second structure within the resonance space.

[0160] In one embodiment, the sound-absorbing sheet may include at least one of poron, rubber, or silicone.

[0161] In one embodiment, said portion of said first structure may comprise an open loop in the shape of a 'T'.

[0162] In one embodiment, a portion of the second structure may be positioned in an open portion of the loop to form the opening.

[0163] In one embodiment, the adsorbent material may be placed in the resonant space and a space compensation material may be placed in the remaining residual space.

[0164] In one embodiment, the space compensation material may include at least one of zeolite, sponge, cotton, or foamed resin.

[0165] An electronic device including a speaker assembly according to various embodiments may include a first carrier (e.g., a first structure (311)), a second carrier (e.g., a second structure (312)) that is coupleable with the first carrier, and a speaker (e.g., a speaker unit (301)) that is coupled with at least one of the first carrier and the second carrier, wherein the second carrier includes at least one groove that forms a resonance space (e.g., a resonance space (RS)) by coupling the first carrier and the second carrier, the resonance space being connected to the speaker, and an adsorption material (e.g., an adsorption material (803)) being injected, and one end of the groove including an opening (e.g., an opening (500)) formed as a closed loop that includes a portion of the first carrier and a portion of the second carrier in a state in which the first carrier and the second carrier are coupled.

[0166] In one embodiment, the electronic device may include a speaker assembly further comprising a first sealing member sealing the opening.

[0167] In one embodiment, the electronic device may further include a second sealing member that seals a recess formed by the coupling of the first carrier and the second carrier.

[0168] In one embodiment, the second sealing member may comprise at least one of a eutectic bond or a polymer adhesive.

[0169] In one embodiment, the electronic device may further include a sound-absorbing sheet disposed on at least one surface of the first carrier or the second carrier within the resonant space.

[0170] In one embodiment, the sound-absorbing sheet may include at least one of poron, rubber, or silicone.

[0171] In one embodiment, said portion of said first carrier may comprise an open loop in the shape of a 'T'.

[0172] In one embodiment, a portion of the second carrier may be placed in the open portion of the loop to form the opening.

[0173] In one embodiment, the adsorbent material may be placed in the resonant space and a space compensation material may be placed in the remaining residual space.

[0174] In one embodiment, the space compensation material may include at least one of zeolite, sponge, cotton, or foam resin.

[0175] While the present disclosure has been illustrated and described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the present disclosure.

Claims

1. In the speaker module structure, Structure 1; a second structure capable of being combined with the first structure; and A speaker coupled to at least one of the first structure or the second structure, The second structure includes at least one groove forming a resonance space by combining the first structure and the second structure, The above resonance space is connected to the speaker and an adsorption material is injected, A speaker module structure, wherein, in a state where the first structure and the second structure are coupled, one end of the groove includes an opening formed as a closed loop including a portion of the first structure and a portion of the second structure.

2. In claim 1, A speaker module structure further comprising a first sealing member for sealing the opening.

3. In claim 2, A speaker module structure, wherein the first sealing member is arranged along the periphery of the opening.

4. In claim 1, A speaker module structure further comprising a second sealing member that seals a recess formed by combining the first structure and the second structure.

5. In claim 4, A speaker module structure, wherein the second sealing member comprises at least one of a eutectic bond and a polymer adhesive.

6. In claim 1, A speaker module structure further comprising a sound-absorbing sheet disposed on at least one surface of the first structure or the second structure within the resonance space.

7. In claim 6, A speaker module structure wherein the sound-absorbing sheet comprises at least one of poron, rubber, or silicone.

8. In claim 1, A speaker module structure, wherein said part of said first structure includes an open loop in a 'T' shape.

9. In claim 8, A speaker module structure in which a part of the second structure is placed in an open portion of the above-mentioned loop to form the opening.

10. In claim 1, A speaker module structure in which the adsorption material is placed in the resonance space and a space compensation material is placed in the remaining space.

11. In claim 10, A speaker module structure wherein the space compensation material comprises at least one of zeolite, sponge, cotton, or foamed resin.

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