DISPLAY DEVICES, DISPLAY MODULES AND THEIR MANUFACTURING METHODS

Abstract

The invention proposes a display device, a display module, and a method for making it. The display module consists of a display panel (1), a protective layer (2), a cover plate (3), and a conductive material (4); the display panel (1) is arranged with the display area (101) and the peripheral area (102) located outside the display area (101); the protective layer (2) is arranged on one side of the display panel (1) and covers at least part of the peripheral area (102) and the display area (101); the protective layer (2) has a conductive heat sink (21); and the cover plate (3) is arranged on the side of the display panel (1) away from the protective layer (2), and is electrically connected to the heat sink (21) by a conductive material (4). The display module according to the invention is capable of preventing abnormal display.

Description

Display device, display module and manufacturing method thereof Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display device, a display module, and a method for manufacturing the display module. Background Art

[0002] Display modules are essential components of electronic devices such as mobile phones and computers. OLED (organic light-emitting diode) display modules, which use OLEDs as light-emitting elements, are widely used. However, current display modules still suffer from display anomalies such as color cast, which urgently need to be addressed.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field.

[0004] Public content

[0005] The present disclosure aims to provide a display device, a display module and a manufacturing method thereof.

[0006] According to one aspect of the present disclosure, there is provided a display module, comprising:

[0007] A display panel having a display area and a peripheral area outside the display area;

[0008] a protective layer, provided on one side of the display panel, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer comprising a conductive heat dissipation layer;

[0009] a cover plate, disposed on a side of the display panel facing away from the protective layer;

[0010] A conductive medium, wherein the cover plate is electrically connected to the heat dissipation layer via the conductive medium.

[0011] In an exemplary embodiment of the present disclosure, the cover plate includes a transparent substrate and a conductive layer, the transparent substrate has a middle area and an edge area located outside the middle area; the middle area covers the display area, and the edge area covers the peripheral area; the conductive layer is arranged on the surface of the transparent substrate facing away from the display panel, and is electrically connected to the heat dissipation layer through the conductive medium, and the conductive layer includes at least a middle wire located in the middle area.

[0012] In an exemplary embodiment of the present disclosure, the conductive layer further includes edge wires, which are located in the edge area and arranged around the middle area; each of the middle wires is connected to the edge wire, and the edge wires are connected to the heat dissipation layer.

[0013] In an exemplary embodiment of the present disclosure, there are multiple intermediate conductive lines, which intersect with each other to form a grid structure.

[0014] In an exemplary embodiment of the present disclosure, the intermediate conductor includes a first intermediate conductor and a second intermediate conductor, the first intermediate conductor extends along the row direction and is spaced apart along the column direction; the second intermediate conductor extends along the column direction and is spaced apart along the row direction; the second intermediate conductor is arranged to cross the first intermediate conductor.

[0015] In an exemplary embodiment of the present disclosure, the display area is provided with an opening, the conductive layer further includes a avoidance wire, the orthographic projection of the avoidance wire on the display panel at least partially surrounds the opening; the avoidance wire is connected to at least one of the intermediate wires.

[0016] In an exemplary embodiment of the present disclosure, the conductive medium connects the conductive layer and the heat dissipation layer from the outside of the edge of the display panel across the edge of the display panel.

[0017] In an exemplary embodiment of the present disclosure, the boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body area and a connection area located outside the main body area, and the connection area is connected to the main body area;

[0018] The connection area is connected to the conductive layer through the conductive medium.

[0019] In an exemplary embodiment of the present disclosure, in a direction parallel to the main body region, a distance between a boundary of an orthographic projection of the connection region on the transparent substrate and a boundary of the transparent substrate is a first distance;

[0020] In a direction parallel to the main body area, a distance between a boundary of an orthographic projection of the main body area on the transparent substrate and a boundary of the transparent substrate is a second distance;

[0021] The first distance is smaller than the second distance.

[0022] In an exemplary embodiment of the present disclosure, the cover plate further includes:

[0023] The isolation layer at least covers the middle wire, and the isolation layer is made of a transparent insulating material.

[0024] In an exemplary embodiment of the present disclosure, an edge region of the transparent substrate is bent toward a side close to the protective layer.

[0025] In an exemplary embodiment of the present disclosure, the protective layer further comprises:

[0026] an adhesive layer, provided on a side of the display panel facing away from the cover plate;

[0027] a buffer layer, bonded to a surface of the adhesive layer facing away from the cover plate;

[0028] a reinforcement layer, provided on a surface of the buffer layer facing away from the cover plate;

[0029] The heat dissipation layer is arranged on a surface of the reinforcement layer away from the cover plate.

[0030] In an exemplary embodiment of the present disclosure, the orthographic projection of the connection area on the transparent substrate is at least partially located in the edge area;

[0031] The display module further includes:

[0032] a light shielding layer, disposed on a surface of the transparent substrate close to the display panel and located in the edge region; the light shielding layer is made of a conductive material;

[0033] At least a portion of the connection region is electrically connected to the light shielding layer.

[0034] In an exemplary embodiment of the present disclosure, the display panel includes:

[0035] Driver backplane;

[0036] a light-emitting layer, provided on a side of the driving backplane away from the protective layer;

[0037] a back film, provided on a surface of the driving back plate away from the light-emitting layer;

[0038] The adhesive layer is adhered to the surface of the back film away from the light-emitting layer; the boundary of the adhesive layer is located within the boundary of the back film, and there is a spacer between the boundary of the back film and the boundary of the back film;

[0039] The conductive layer is electrically connected to the heat dissipation layer through a conductive medium, and the conductive medium extends from the outer side of the edge of the display panel across the edge of the display panel to connect the conductive layer and the heat dissipation layer;

[0040] The conductive medium is electrically connected to the spacer.

[0041] In an exemplary embodiment of the present disclosure, the cover plate has a main area and a peripheral area located outside the main area; the main area covers the display area, the peripheral area covers the peripheral area, and the conductive medium is connected to the peripheral area;

[0042] The conductive medium extends from the outer side of the edge of the display panel across the edge of the display panel to connect the cover plate and the heat dissipation layer.

[0043] In an exemplary embodiment of the present disclosure, the peripheral region includes a plurality of contact regions spaced apart along the circumference of the main region, and the conductive medium is connected to the contact regions.

[0044] In an exemplary embodiment of the present disclosure, the outer peripheral surface of the cover plate is surrounded by multiple side surfaces distributed circumferentially, and the connection between two adjacent side surfaces is a corner; any one of the corners is located in a contact area; and the conductive medium connected to any one of the contact areas covers the corner in the contact area.

[0045] According to one aspect of the present disclosure, a method for manufacturing a display module is provided, comprising:

[0046] forming a display panel having a display area and a peripheral area outside the display area;

[0047] forming a cover plate on one side of the display panel;

[0048] forming a protective layer on a side of the display panel facing away from the cover plate, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer comprising a conductive heat dissipation layer;

[0049] The cover plate is electrically connected to the heat dissipation layer through a conductive medium.

[0050] In an exemplary embodiment of the present disclosure, the cover plate is electrically connected to the heat dissipation layer via a conductive medium; comprising:

[0051] forming a conductive material that passes through the outer side of the edge of the display panel and crosses the edge of the display panel to connect to the heat dissipation layer;

[0052] The conductive material is solidified to obtain the conductive medium.

[0053] According to one aspect of the present disclosure, a display device is provided, comprising any one of the display modules described above.

[0054] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0056] FIG1 is a cross-sectional view of an embodiment of a display module according to the present disclosure.

[0057] FIG2 is a partial cross-sectional view of an embodiment of the display module disclosed herein.

[0058] FIG3 is a circuit diagram of a pixel circuit of an embodiment of a display module disclosed herein.

[0059] FIG. 4 is a schematic diagram of a conductive layer of an embodiment of a display module according to the present disclosure.

[0060] FIG. 5 is a schematic diagram of a conductive layer of another embodiment of the display module of the present disclosure.

[0061] FIG6 is a schematic diagram of a heat dissipation layer and a conductive medium of an embodiment of a display module disclosed herein.

[0062] FIG. 7 is a schematic diagram of a heat dissipation layer of an embodiment of a display module disclosed herein.

[0063] FIG8 is a partial cross-sectional view of another embodiment of the display module disclosed herein.

[0064] FIG9 is a partial cross-sectional view of yet another embodiment of the display module disclosed herein.

[0065] FIG10 is a partial cross-sectional view of an embodiment of the display module disclosed herein.

[0066] FIG. 11 is a top view of the embodiment in FIG. 10 .

[0067] FIG12 is a cross-sectional view of an embodiment of a display device according to the present disclosure.

[0068] Description of reference numerals:

[0069] 1. Display panel; 101. Display area; 102. Peripheral area; 100. Opening; 11. Driver backplane; 12. Light-emitting layer; 13. Encapsulation layer; 14. Back film; 141. Spacer area;

[0070] 2. Protective layer; 21. Heat dissipation layer; 22. Adhesive layer; 23. Buffer layer; 24. Reinforcement layer; 211. Main body area; 212. Connection area;

[0071] 3. Cover plate; 31. Transparent substrate; 311. Middle area; 312. Edge area; 32. Conductive layer; 321. Middle conductor; 3211. First middle conductor; 3212. Second middle conductor; 322. Edge conductor; 323. Avoidance conductor; 33. Isolation layer; 301. Body area; 302. Peripheral area; 3021. Contact area; 30. Side; 300. Corner;

[0072] 4. Conductive medium;

[0073] 5. Polarizer;

[0074] 6. Optical adhesive layer;

[0075] 7. Border;

[0076] 8. Shading layer. DETAILED DESCRIPTION

[0077] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0078] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0079] In related technologies, an OLED display module includes a driver backplane and a light-emitting layer arrayed on one side of the driver backplane. The light-emitting layer may include multiple light-emitting elements. The display module can be divided into a display area and a peripheral area located outside the display area. The light-emitting elements are located within the display area.

[0080] The driving backplane may include a substrate and a driving circuit disposed on the substrate. The driving circuit may include a pixel circuit located in the display area and a peripheral circuit located in the peripheral area. The peripheral circuit is connected to the pixel circuit and includes a light-emitting control circuit, a gate driving circuit, and a source driving circuit. The light-emitting control circuit may be configured to output a light-emitting control signal to the pixel circuit, the gate driving circuit may be configured to output a write control signal and a reset control signal to the pixel circuit, and the source driving circuit may be configured to output a data signal to the pixel circuit. Furthermore, the driving circuit may also be configured to output a first power supply signal, a second power supply signal, and a reset signal to the pixel circuit.

[0081] The light-emitting element of the light-emitting layer may be an OLED, i.e., an organic light-emitting diode, which may have a first end and a second end, the first end may be an anode, and the second end may be a cathode. The first end of the light-emitting element may be connected to the pixel circuit, and the second end is used to input the second power signal.

[0082] By controlling the peripheral circuit to input light control signals, write control signals, reset control signals, data signals, first power signals, second power signals and reset signals to the pixel circuit and the light emitting element, the light emitting element can be made to emit light to display an image.

[0083] Furthermore, to protect the display module, a transparent cover can be installed on the light-emitting side of the display module, that is, the side of the light-emitting layer facing away from the driver backplane. To ensure that the product meets reliability standards, pre-market testing is required. For example, the copper rod test involves the following process: While the display module displays a static image, a scribing machine or other similar device is used to simulate the touch and sliding motion of a human finger. The test is performed by continuously rubbing the cover surface for a specified period of time, for example, eight hours. Before the test is completed, if the static image exhibits display anomalies such as color cast or a black screen, the test result is considered a failure.

[0084] After extensive research, the inventors discovered that the different materials of the copper rod and the cover plate result in different binding forces on electrons. During the repeated friction of the copper rod, electrons gradually transfer from the rod to the surface of the cover plate, gradually forming random localized charge accumulations. Because the cover plate is typically made of glass, with high resistivity and a large dielectric constant, both positive and negative charges are difficult to migrate. When charge accumulates to a certain level, it interferes with the underlying drive circuitry, affecting the displayed image.

[0085] Specifically, the charge accumulated on the cover causes the overall potential of the display module to decrease, causing the potential of the substrate to decrease, which will further cause the Vth (threshold voltage) of the transistor of the pixel circuit to shift. For example, negative charge will cause the Vth of the driving transistor to be forward biased, causing an abnormal increase in the driving current. The brightness of the light-emitting element depends on the size of the driving current. The larger the driving current, the greater the brightness of the light. Therefore, the increase in the driving current relative to the predetermined driving current caused by charge accumulation causes the local light-emitting element to be brighter. For the three colors of light-emitting elements, red (R), green (G), and blue (B), the quantum efficiency of the light-emitting material of the green light-emitting element (the efficiency of exciton transition to low-energy electrons and release of photons) is the highest, and it lights up the fastest. Therefore, when the transistors of the three colors of light-emitting elements are equally shifted, the color of the entire picture is more green, and thus appears to be locally green.

[0086] In order to solve the above problems, the present disclosure provides a display module, as shown in Figures 1, 2 and 4. The display module may include a display panel 1, a protective layer 2, a cover plate 3 and a conductive medium 4, wherein:

[0087] The display panel 1 has a display area 101 and a peripheral area 102 located outside the display area 101. A protective layer 2 is provided on one side of the display panel 1, covering at least part of the peripheral area 102 and the display area 101. The protective layer 2 includes a conductive heat dissipation layer 21. A cover plate 3 is provided on the side of the display panel 1 facing away from the protective layer 2 and is electrically connected to the heat dissipation layer 21 via a conductive medium 4.

[0088] The display module of the disclosed embodiment can be grounded during use with the heat dissipation layer 21. During the copper rod test, charges accumulated on the cover plate 3 due to the friction of the copper rod can be channeled along the conductive medium 4 to the heat dissipation layer 21 and connected to the ground. This reduces the charge accumulated on the cover plate 3, preventing interference with the pixel circuits and preventing color casts such as a green tint during testing, as well as other display anomalies caused by charge accumulation.

[0089] The basic structure of the display module according to the embodiment of the present disclosure is described in detail below:

[0090] As shown in FIG1 and FIG2 , the display panel 1 can be used to emit light to display images, and may include a driving backplane 11 and a light-emitting layer 12 located on one side of the driving backplane 11 , wherein:

[0091] The driving backplane 11 may include a substrate and a driving circuit layer. The substrate is a flat plate structure, and its material may be a hard material such as glass, or a soft material such as polyimide. The driving circuit layer may be provided on one side of the substrate and include a driving circuit. The display panel 1 may be divided into at least a display area 101 and a peripheral area 102 located outside the display area 101. Accordingly, the driving circuit layer may include a pixel circuit located at least partially within the display area 101 and a peripheral circuit located within the peripheral area 102. The pixel circuit may be a 7T1C, 7T2C, 6T1C or 6T2C pixel circuit. As long as it can drive the light-emitting element to emit light, its structure is not particularly limited. The number of pixel circuits is the same as the number of light-emitting elements, and is connected to each light-emitting element in a one-to-one correspondence so as to control the light emission of each light-emitting element separately. Among them, nTmC means that a pixel circuit includes n transistors (represented by the letter "T") and m capacitors (represented by the letter "C").

[0092] The peripheral circuit is located in the peripheral area 102 and is connected to the pixel circuit for inputting a drive signal to the pixel circuit to control the light-emitting element to emit light. The peripheral circuit is connected to the pixel circuit and includes a light-emitting control circuit, a gate drive circuit, a source drive circuit, and a power supply circuit. The light-emitting control circuit can be used to output a light-emitting control signal to the pixel circuit, the gate drive circuit can be used to output a write control signal and a reset control signal to the pixel circuit, and the source drive circuit can be used to output a data signal to the pixel circuit. In addition, the drive circuit can also be used to output a first power supply signal, a second power supply signal, and a reset signal to the pixel circuit.

[0093] The following uses a 7T1C structure pixel circuit as an example to illustrate the structure and driving method of the pixel circuit:

[0094] As shown in FIG3 , the pixel circuit may include seven transistors and a storage capacitor, namely, a driving transistor DT, first to sixth transistors T1 to T6 and a storage capacitor Cst, wherein:

[0095] The control end of the first transistor T1 is used to receive a write control signal Scan, the first end is used to receive a data signal Vdata, and the second end is connected to the first end of the driving transistor DT.

[0096] The control end of the second transistor T2 is used to receive the write control signal Scan, a first end is connected to the second end of the driving transistor DT, and a second end is connected to the control end of the driving transistor DT.

[0097] The control end of the third transistor T3 is used to receive the light emitting control signal EM, the first end is used to receive the first power signal VDD, and the second end is connected to the first end of the driving transistor DT.

[0098] The control terminal of the fourth transistor T4 is used to receive the reset control signal Reset, the first terminal is used to receive the reset signal Vinit, and the second terminal is connected to the control terminal of the driving transistor DT.

[0099] The control end of the fifth transistor T5 is used to receive the reset control signal Reset, the first end is used to receive the reset signal Vinit, and the second end is connected to the first end of the light emitting element OLED.

[0100] The control end of the sixth transistor T6 is used to receive the light emitting control signal EM, a first end is connected to the second end of the driving transistor DT, and a second end is connected to the first end of the light emitting element OLED.

[0101] A first end of the storage capacitor Cst is connected to the first end of the third transistor T3 for inputting the first power signal VDD, and a second end of the storage capacitor Cst is connected to the control end of the driving transistor DT.

[0102] The aforementioned drive transistor DT and the first through sixth transistors T1 through T6 are all P-type thin-film transistors. The first power signal VDD is a high-level signal, and the second power signal VSS is a low-level signal. The light-emitting element OLED is an organic light-emitting diode, with its first terminal serving as the anode and its second terminal serving as the cathode. The drive transistor DT and the first through seventh transistors T1 through T6 are all turned on when the voltage level is low and turned off when the voltage level is high.

[0103] The above-mentioned driving method of the pixel circuit includes:

[0104] In the reset phase, the fourth transistor T4 and the fifth transistor T5 are turned on, the first transistor T1 , the second transistor T2 , the third transistor T3 and the sixth transistor T6 are turned off, and a reset signal Vinit is transmitted to the control terminal of the driving transistor DT and the first terminal of the light emitting element OLED.

[0105] In the data writing phase, the first transistor T1 and the second transistor T2 are turned on, and the third transistor T3, the fourth transistor T4, the fifth transistor T5 and the sixth transistor T6 are turned off, so that the data signal Vdata is transmitted to the control end of the driving transistor DT through the first transistor T1, the driving transistor DT and the second transistor T2.

[0106] In the light emitting stage, the third transistor T3 and the sixth transistor T6 are turned on, and the first transistor T1, the second transistor T2, the fourth transistor T4 and the fifth transistor T5 are turned off to transmit the signal of the second end of the driving transistor DT to the first end of the light emitting element OLED, so as to control the light emitting element OLED to emit light.

[0107] The above-mentioned driving circuit layer may include multiple thin film transistors and capacitors, wherein the thin film transistors may be top-gate or bottom-gate thin film transistors, and each thin film transistor may include an active layer, a gate, a source and a drain, wherein the gate may be a double gate or a single gate, and the active layer of each thin film transistor is arranged on the same layer, the gate is arranged on the same layer, and the source and drain are arranged on the same layer to simplify the process.

[0108] The structure of the driving backplane 11 is exemplified below by taking a top-gate thin film transistor as an example:

[0109] The driving backplane 11 may include a substrate and a driving circuit layer on one side of the substrate. The driving circuit layer may include an active layer, a first gate insulating layer, a gate electrode, a second gate insulating layer, an interlayer dielectric layer, a source / drain layer, and a planar layer. The active layer is provided on one side of the substrate, with the first gate insulating layer covering the active layer and the substrate; the gate electrode is provided on the surface of the first gate insulating layer facing away from the substrate and directly opposite the active layer; the second gate insulating layer covers the gate electrode and the first gate insulating layer; the interlayer dielectric layer covers the second gate insulating layer; the source / drain layer is provided on the surface of the interlayer dielectric layer facing away from the substrate and includes a source electrode and a drain electrode, which are connected to both ends of the active layer via contact holes; and the planar layer covers the source / drain layer and the interlayer dielectric layer. Of course, the driving circuit layer may also include other film layers, as long as they can drive the light-emitting element to emit light, which will not be described in detail here.

[0110] As shown in Figure 1 , the light-emitting layer 12 is disposed on one side of the driving backplane 11. For example, the light-emitting layer 12 is disposed on the surface of the planar layer facing away from the substrate. Furthermore, the light-emitting layer 12 is located within the display area 101. The light-emitting layer 12 may include a plurality of light-emitting units arranged in an array, each light-emitting unit including a plurality of light-emitting elements.

[0111] In some embodiments of the present disclosure, the light-emitting element is an OLED, which may include a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the driving backplane 11, wherein:

[0112] The first electrode can be provided on the side of the flat layer facing away from the substrate and connected to the drain of a thin film transistor of a pixel circuit through a contact hole. The thin film transistor can be a driving transistor or other transistor, depending on the structure of the pixel circuit, and is not specifically limited here. The light-emitting functional layer may include a hole injection layer, a hole transport layer, a composite light-emitting layer, an electron transport layer and an electron injection layer stacked in sequence in a direction away from the driving backplane 11. In addition, an electron blocking layer may be provided between the hole transport layer and the composite light-emitting layer. The second electrode may extend to the peripheral area 102 and be connected to the power signal terminal to receive a power signal. The specific principle of OLED light emission will not be described in detail here.

[0113] As shown in Figure 1, in order to facilitate the definition of the range of each light-emitting element, the light-emitting layer 12 may also include a pixel definition layer, which can be arranged on the surface of the driving circuit layer away from the substrate together with the first electrode, and is provided with a plurality of openings that expose each first electrode in a one-to-one correspondence. The light-emitting functional layer is stacked on the area where the first electrode is located in the opening. The light-emitting functional layers of each light-emitting element are independently spaced apart. The luminous colors of different light-emitting functional layers can be the same or different. The second electrode covers the light-emitting functional layer so that each light-emitting element can share the same second electrode. Each light-emitting element can be defined by the above-mentioned multiple openings, and the boundary of any light-emitting element is the boundary of the light-emitting functional layer in its corresponding opening.

[0114] Of course, in other embodiments of the present disclosure, the light-emitting functional layer of each light-emitting element may belong to the same continuous light-emitting film layer, which simultaneously covers the surface of each first electrode and the pixel definition layer facing away from the substrate. The area of ​​the light-emitting film layer located within the opening and stacked on the first electrode is the light-emitting functional layer of the light-emitting element, and two adjacent light-emitting functional layers are connected through other areas of the light-emitting film layer. In other words, each light-emitting element can share the same light-emitting film layer.

[0115] In some embodiments of the present disclosure, each light-emitting unit may include a plurality of light-emitting elements emitting different colors of light, and each light-emitting element emits monochromatic light or quasi-monochromatic light.

[0116] In addition, as shown in FIG2 , the display panel 1 may further include an encapsulation layer 13 , which may cover the surface of the light-emitting layer 12 facing away from the driver backplane 11 and cover all light-emitting elements, thereby protecting the light-emitting layer 12 and preventing corrosion of the light-emitting elements by external water and oxygen. Furthermore, the boundary of the encapsulation layer 13 extends into the peripheral region 102 but does not extend beyond the peripheral region 102, thereby also protecting the peripheral circuits of the peripheral region 102.

[0117] In some embodiments of the present disclosure, encapsulation can be achieved by thin-film encapsulation (TFE). The encapsulation layer 13 may include a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the surface of the light-emitting layer 12 facing away from the driving backplane 11. The organic layer may be arranged on the surface of the first inorganic layer facing away from the driving backplane 11, and the boundary of the organic layer is limited to the inner side of the boundary of the first inorganic layer. The second inorganic layer covers the organic layer and the first inorganic layer not covered by the organic layer. The second inorganic layer can block the intrusion of water and oxygen, and flattening is achieved by the flexible organic layer.

[0118] As shown in Figures 1 and 2, the protective layer 2 is disposed on one side of the display panel 1. For example, the protective layer 2 can be disposed on the side of the driving backplane 11 that is away from the light-emitting layer 12. At the same time, the protective layer 2 can cover at least part of the peripheral area 102 and the display area 101. For example, the boundary of the protective layer 2 is located within the peripheral area 102 and is at a specified distance from the boundary of the peripheral area 102.

[0119] The protective layer 2 may include a heat dissipation layer 21 to dissipate heat for the display panel 1. The heat dissipation layer 21 may be made of copper or other metals with good thermal conductivity, or non-metallic materials such as graphene. Of course, since a material with high electrical conductivity is used, the heat dissipation layer 21 can also conduct electricity.

[0120] Furthermore, in some embodiments of the present disclosure, as shown in FIG2 , the protective layer 2 may further include an adhesive layer 22 , a buffer layer 23 and a reinforcement layer 24 , wherein:

[0121] The buffer layer 23 can be bonded to the backlight side of the display panel 1, i.e., the side of the driver backplane 11 facing away from the light-emitting layer 12, via an adhesive layer 22. The adhesive layer 22 can be a mesh adhesive (EMBO), which facilitates airflow while achieving adhesion. If the display panel 1 is a flexible display panel 1, the mesh adhesive can adapt to the bending of the display panel 1. Of course, other adhesives can also be used for the adhesive layer 22. The buffer layer 23 can be made of foam or other flexible materials to provide a buffer for the display panel 1 and also provide a light shielding effect.

[0122] The reinforcement layer 24 can be disposed on the side of the buffer layer 23 facing away from the display panel 1. The reinforcement layer 24 can be used to increase the strength of the protective layer 2, making it less susceptible to breakage and damage. The reinforcement layer 24 can be made of polyimide or other flexible materials. However, if the display panel 1 is a flexible display panel 1, the reinforcement layer 24 should be made of a flexible material to allow the display panel 1 to be bent. The aforementioned heat dissipation layer 21 can be disposed on the surface of the reinforcement layer 24 facing away from the display panel 1.

[0123] As shown in Figures 1 and 2, the cover plate 3 can be positioned on the side of the display panel 1 facing away from the protective layer 2. That is, the cover plate 3 can be positioned on the side of the light-emitting layer 12 facing away from the driver backplane 11 to protect the display panel 1. The area of ​​the cover plate 3 can be larger than that of the display panel 1, so that the edge of the cover plate 3 can extend beyond the edge of the display panel 1. Of course, the boundary of the edge region 312 can also coincide with the boundary of the peripheral region 102. The cover plate 3 can be a transparent structure to allow light emitted by the light-emitting layer 12 to pass through.

[0124] In some embodiments of the present disclosure, at least part of the edge of the cover plate 3 may be bent toward the side close to the protective layer 2, and the display panel 1 and the protective layer 2 may both be planar structures, and the bent area of ​​the cover plate 3 is located outside the boundary between the display panel 1 and the protective layer 2; or, the edges of the display panel 1 and the protective layer 2 are also bent, and the bent area matches and fits with the curved area of ​​the cover plate 3.

[0125] Furthermore, as shown in Figures 1 and 2, the display module may also include a polarizer 5, which may be disposed between the encapsulation layer 13 and the cover plate 3. This polarizer 5 may be a circular polarizer to reduce the display module's reflection of external light. An optical adhesive layer 6 may be disposed between the polarizer 5 and the cover plate 3 to achieve flattening, facilitate adhesion to the cover plate 3, and reduce optical path differences at different locations.

[0126] In addition, the display module may also include a touch layer, which may be provided between the encapsulation layer 13 and the cover plate 3, and the orthographic projection of the touch layer on the display panel 1 at least covers the display area 101. The touch layer may adopt a self-capacitive or mutual-capacitive touch structure. For example, the touch layer may be an external touch structure, or it may be an on-cell structure such as FMLOC (Flexible Multi-Layer On Cell). The specific structure is not particularly limited here, as long as the touch function can be realized. The user can operate on the side of the cover plate 3 facing away from the display panel 1, and the touch position is sensed by the touch layer to achieve interaction.

[0127] The display module may further include a light-shielding layer 8, which may be disposed between the cover plate 3 and the display panel 1. The material of the light-shielding layer 8 may be ink or opaque photoresist, etc. The orthographic projection of the light-shielding layer 8 on the display panel 1 is located in the peripheral area 102 and is disposed around the display area 101. The light-shielding layer 8 may shield at least a portion of the peripheral area 102 of the display panel 1.

[0128] The following is a detailed description of the solution for improving color cast of the display module according to the embodiment of the present disclosure:

[0129] As shown in FIG1 and FIG2 , since the heat dissipation layer 21 of the protective layer 2 is made of metal and has conductive properties, the cover plate 3 and the heat dissipation layer 21 can be electrically connected through the conductive medium 4 to conduct the charge on the cover plate 3 .

[0130] In some embodiments of the present disclosure, to facilitate charge conduction, a conductive layer 32 may be provided in the cover plate 3, and a conductive path may be established between the conductive layer 32 and the heat dissipation layer 21. When the heat dissipation layer 21 is grounded, the charge accumulated on the conductive layer 32 may be conducted to the heat dissipation layer 21 and ultimately directed to a predetermined ground terminal connected to the heat dissipation layer 21, thereby avoiding interference with the pixel circuit. Specifically, the cover plate 3 may include a transparent substrate 31 and a conductive layer 32, wherein:

[0131] The transparent substrate 31 has a central region 311 and an edge region 312 located outside the central region 311. The central region 311 covers the display area 101, and the boundary of the central region 311 may coincide with the boundary of the display area 101. The edge region 312 may cover the peripheral region 102, and the boundary of the edge region 312 may lie outside the peripheral region 102. In other words, the area of ​​the transparent substrate 31 may be larger than the area of ​​the display panel 1, allowing the edge of the transparent substrate 31 to extend beyond the edge of the display panel 1. Of course, the boundary of the edge region 312 may also coincide with the boundary of the peripheral region 102. The material of the transparent substrate 31 can be a transparent material such as glass, and is not particularly limited here.

[0132] As shown in Figures 4 and 5, the conductive layer 32 is provided on the surface of the transparent substrate 31 away from the display panel 1, and is connected to the heat dissipation layer 21. The electrical conductivity of the material of the conductive layer 32 is higher than that of the transparent substrate 31. The electrical conductivity of the conductive layer 32 may be 10 times, 20 times, 100 times, etc., of the transparent substrate 31, and is not specifically limited here. For example, the material of the conductive layer 32 may include transparent conductive materials such as ITO (indium tin oxide), which can ensure conductivity while avoiding blocking light. Of course, other transparent conductive materials such as IZO (indium zinc oxide) may also be included, which are not listed here one by one. In addition, the conductive layer 32 may also be made of other conductive materials, as long as it does not affect the image display and can conduct electricity.

[0133] The conductive layer 32 may include a central conductor 321, which may be located in the central region 311. Specifically, the orthographic projection of the central conductor 321 on the display panel 1 is located in the display region 101, thereby conducting charges within the display region 101 to the heat dissipation layer 21. During use, the heat dissipation layer 21 may be grounded, i.e., the potential of the heat dissipation layer 21 is set to zero, thereby directing the charges in the conductive layer 32 toward the heat dissipation layer 21 and ultimately to a predetermined ground terminal. The ground terminal may be connected to a ground terminal of an electronic device employing the display module of the present disclosure. Of course, the conductive layer 32 may be a continuous planar film layer, as long as it can conduct the charges.

[0134] In some embodiments of the present disclosure, as shown in Figure 1, at least a portion of the edge of the cover plate 3 is bent toward the direction close to the protective layer 2. At this time, at least a portion of the edge area 312 of the transparent substrate 31 can be bent toward the direction close to the protective layer 2, while the middle area 311 is a planar structure.

[0135] The structure of the conductive layer 32 is described below:

[0136] As shown in Figures 4 and 5, there are multiple intermediate conductors 321, which intersect to form a grid structure. In some embodiments of the present disclosure, the intermediate conductors 321 may include a first intermediate conductor 3211 and a second intermediate conductor 3212 extending in a straight line. The first intermediate conductor 3211 may extend in the row direction and be spaced apart in the column direction. The second intermediate conductors 3212 extend in the column direction and are spaced apart in the row direction. Each second intermediate conductor 3212 is arranged to intersect with each first intermediate conductor 3211. The row direction may be the X direction as shown in Figures 4 and 5, and the column direction may be the Y direction as shown in Figures 4 and 5, with the two being perpendicular to each other.

[0137] It should be noted that the row direction and column direction in FIG. 4 and FIG. 5 are merely exemplary and do not constitute a specific limitation on the intermediate conductor 321 . Those skilled in the art will appreciate that rotating the row direction and column direction will change accordingly.

[0138] As shown in Figures 4 and 5, the spacing T1 between two adjacent first intermediate conductors 3211 and the spacing T2 between two adjacent second intermediate conductors 3212 can both be 1 cm to 3 cm, for example, 1 cm, 2 cm, or 3 cm, but T1 and T2 can be different. The spacing between two adjacent first intermediate conductors 3211 can be calculated as the sum of the width of the gap between the two adjacent first intermediate conductors 3211 and the line width of a first intermediate conductor 3211, that is, the distance between the centerlines of the two adjacent first intermediate conductors 3211. Similarly, the spacing between two adjacent second intermediate conductors 3212 can be calculated as the sum of the width of the gap between the two adjacent second intermediate conductors 3212 and the line width of a second intermediate conductor 3212, that is, the distance between the centerlines of the two adjacent second intermediate conductors 3212.

[0139] In some embodiments of the present disclosure, for a rectangular display module, if the first direction is the width direction and the second direction is the length direction; if the aspect ratio of the display module is 16:9, eight first intermediate conductors 3211 and four second intermediate conductors 3212 may be provided. The spacing between two adjacent intermediate conductors 321 is 2 cm.

[0140] As shown in Figures 4 and 5, in order to facilitate the connection of the intermediate wire 321 to the heat dissipation layer 21, in some embodiments of the present disclosure, the conductive layer 32 further includes an edge wire 322. The edge wire 322 is located in the edge area 312 of the transparent substrate 31, and the edge wire 322 is arranged around the intermediate area 311. Each intermediate wire 321 is connected to the edge wire 322, and the edge wire 322 can be connected to the heat dissipation layer 21.

[0141] In some embodiments of the present disclosure, the edge wire 322 may be a closed annular structure, disposed within the edge region 312 and surrounding the exterior of the middle region 311. Both ends of each middle wire 321 are connected to the edge wire 322. The annular structure may be a circular ring, a rectangular ring, or the like, and its shape may be the same as that of the middle region 311, depending on the shape of the middle region 311. At the same time, the edge wire 322 is connected to the heat dissipation layer 21. Of course, in other embodiments of the present disclosure, the edge wire 322 may also be a "U"-shaped or other partially closed curved structure, which may surround the exterior of the middle region 311 but does not completely enclose the middle region 311.

[0142] In addition, as shown in FIG5 , the display area 101 of the display panel 1 may be provided with an opening 100. The opening 100 may penetrate the light-emitting layer 12 and the driving circuit layer of the display panel 1 and expose the substrate. Of course, it may also penetrate the substrate. A camera device corresponding to the opening 100 may be provided on the side of the protective layer 2 facing away from the display panel 1, so that images can be captured through the display module. Accordingly, the conductive layer 32 also includes a avoidance wire 323. The orthographic projection of the avoidance wire 323 on the display panel 1 at least partially surrounds the outside of the opening 100, and the avoidance wire 323 is connected to at least one intermediate wire 321. When the opening 100 is located on the extension path of an intermediate wire 321, the avoidance wire 323 can be used to bypass the opening 100 so that the intermediate wire 321 is connected to the edge wire 322, or directly connected to the heat dissipation layer 21.

[0143] In some embodiments of the present disclosure, as shown in FIG5 , the avoidance wire 323 may be a closed ring structure surrounding the opening 100. An intermediate wire 321 is connected to the avoidance wire 323. The avoidance wire 323 may divide the intermediate wire 321 into two sections, which are connected via the avoidance wire 323. The intermediate wire 321 may be a first intermediate wire 3211 or a second intermediate wire 3212, without particular limitation herein.

[0144] The connection method between the conductive layer 32 and the heat dissipation layer 21 is described below:

[0145] As shown in Figures 1, 4, 5 and 7, the conductive layer 32 can be electrically connected to the heat dissipation layer 21 through the conductive medium 4. The conductive medium 4 can be electrically connected to the conductive layer 32 on the surface of the transparent substrate 31 facing away from the protective layer 2, and can be electrically connected to the edge of the heat dissipation layer 21 from the outside of the edge of the transparent substrate 31 and the edge of the display panel 1 across the edge of the transparent substrate 31 and the edge of the display panel 1.

[0146] The conductive medium 4 can be a conductive adhesive or other material that can connect the conductive layer 32 and the heat dissipation layer 21, and is not particularly limited here. For example, the conductive adhesive can include a matrix and a conductive filler. The matrix can include epoxy resin, acrylate resin, polyurethane, etc. The matrix can account for 15% to 25% by weight of the conductive adhesive. The conductive filler can include metal powders such as gold, silver, copper, aluminum, zinc, iron, nickel, etc., or graphite or other conductive compounds. The conductive filler can account for 30% to 60% by weight of the conductive adhesive. In addition, the conductive adhesive can also include solvents and additives. The solvent can be compounds such as water and alcohols. The solvent can account for 10% to 20% by weight of the conductive adhesive. The additive can include a crosslinking agent, coupling agent, etc.

[0147] In some embodiments of the present disclosure, as shown in Figures 6 and 7, the boundary of the heat dissipation layer 21 is located inside the boundary of the transparent substrate 31, so that the area of ​​the heat dissipation layer 21 is smaller than that of the transparent substrate 31. At the same time, the heat dissipation layer 21 includes a main body region 211 and a connection region 212 located outside the main body region 211. The number of connection regions 212 can be one or more. The boundary of the orthographic projection of the main body region 211 on the transparent substrate 31 can be located within the peripheral region 102, that is, the range of the main body region 211 is no less than the middle region 311, and the boundary of the orthographic projection of the connection region 212 on the transparent substrate 31 is also located within the edge region 312. For example, the main body region 211 can be a rectangular structure with rounded corners, and the connection region 212 can be an outwardly convex arc-shaped region located at the four corners of the rectangle.

[0148] The connection region 212 is connected to the main body region 211 and is connected to the conductive layer 32 via the conductive medium 4. Because the connection region 212 is located outside the main body region 211, it is closer to the edge of the transparent substrate 31 than the intermediate region 311. Without adding the conductive medium 4, the connection region 212 can increase the contact surface between the conductive medium 4 and the heat dissipation layer 21 and shorten the path for the conductive medium 4 to extend, thereby achieving more complete contact and a more stable connection, and facilitating full electrical conduction between the heat dissipation layer 21 and the conductive layer 32.

[0149] Furthermore, as shown in FIG6 , in a direction parallel to the intermediate region 311, the distance between the boundary of the orthographic projection of the connection region 212 on the transparent substrate 31 and the boundary of the transparent substrate 31 can be defined as a first distance S1; the distance between the boundary of the orthographic projection of the main body region 211 on the transparent substrate 31 and the boundary of the transparent substrate 31 can be defined as a second distance S2. The first distance S1 is smaller than the second distance S2, meaning that the distance between the connection region 212 and the boundary of the transparent substrate 31 is closer than the distance between the main body region 211 and the boundary of the transparent substrate 31. The boundary of the orthographic projection of the connection region 212 on the transparent substrate 31 is arc-shaped, and the first distance S1 is the distance between the point on the arc closest to the boundary of the transparent substrate 31. For example, the first distance S1 can be 0.3 mm to 0.5 mm, such as 0.3 mm, 0.4 mm, or 0.5 mm, and the second distance S2 can be 0.9 mm to 1.1 mm, such as 0.9 mm, 1 mm, or 1.1 mm.

[0150] In addition, in some embodiments of the present disclosure, as shown in FIG1 , the cover plate 3 may further include an isolation layer 33, which may cover at least a portion of the conductive layer 32 and the transparent substrate 31. The isolation layer 33 is made of a transparent insulating material and is used to protect the conductive layer 32 and the transparent substrate 31 from wear and corrosion. Furthermore, users can perform touch operations on the side of the isolation layer 33 facing away from the display substrate 1. Therefore, the isolation layer 33 may be made of a fingerprint-resistant material to prevent fingerprints. For example, the isolation layer 33 may be made of an oleophobic material. Once oil stains on fingers come into contact with the isolation layer 33, they will form tiny oil droplets, preventing the formation of fingerprint patterns.

[0151] The boundary of the orthographic projection of the isolation layer 33 on the transparent substrate 31 can be located within the edge region 312, thereby completely covering the middle region 311 and at least partially covering the edge region 312. Furthermore, the boundary of the orthographic projection of the isolation layer 33 on the transparent substrate 31 can be made to coincide with the boundary of the transparent substrate 31, thereby completely covering the conductive layer 32 and the portion of the transparent substrate 31 not covered by the conductive layer 32.

[0152] If the isolation layer 33 completely covers the middle wire 321 and the edge wire 322, to ensure that the conductive medium 4 can connect to the edge wire 322, in some embodiments of the present disclosure, a via hole exposing the edge wire 322 can be provided in the isolation layer 33. The conductive medium 4 can extend from the surface of the isolation layer 33 facing away from the transparent substrate 31 into the via hole, thereby connecting to the edge wire 322. Alternatively, in some embodiments of the present disclosure, before forming the isolation layer 33, the edge wire 322 can be connected to the heat dissipation layer 21 via the conductive medium 4, and then the isolation layer 33 can be used to cover the conductive layer 32, the conductive medium 4, and the transparent substrate 31.

[0153] Of course, in other embodiments of the present disclosure, the boundary of the isolation layer 33 coincides with the boundary of the middle area 311 , so that the edge wire 322 is not covered by the isolation layer 33 . In this case, the edge wire 322 can be directly connected to the heat dissipation layer 21 through the conductive medium 4 .

[0154] The following is a detailed description of the specific principles of the disclosed display module for preventing charge accumulation and improving color cast:

[0155] During the repeated friction of the copper rod test, electrons are gradually transferred from the copper rod to the surface of the cover plate 3, and negative charge accumulates locally on the cover plate 3; at the same time, due to friction, electrons are lost locally on the cover plate 3, which is equivalent to positive charge accumulating locally on the cover plate 3.

[0156] Due to the path formed by the conductive layer 32 and the heat sink layer 21, and the tendency of charge to accumulate in materials with higher conductivity, the charge on the cover plate 3 reaches the nearby intermediate conductor 321 in the shortest possible time. When the charge on the intermediate conductor 321 accumulates, a potential difference is formed relative to the grounded heat sink layer 21. Under the influence of the Coulomb force of the electric field, the charge moves along the conductive medium 4 toward the heat sink layer 21, and is ultimately conducted from the heat sink 21 to the ground point of the driver circuit board. This process eliminates charge accumulation on the cover plate 3, preventing interference with the thin-film transistors of the pixel circuit, thereby improving display anomalies such as color cast.

[0157] Furthermore, in another embodiment of the present disclosure, as shown in FIG8 , the orthographic projection of the connection region 212 of the heat dissipation layer 21 on the transparent substrate 31 is at least partially located in the edge region 312 . The display module further includes a light-shielding layer 8 , which can be disposed on the surface of the transparent substrate 31 proximal to the display panel 1 and located in the edge region 312 . Light-shielding layer 8 is a conductive light-shielding material, such as conductive black ink. Of course, other materials can also be used, as long as they provide light-shielding and are conductive.

[0158] At least a portion of the connection region 212 can be electrically connected to the light shielding layer 8 to conduct charges from the transparent substrate 31. For example, at least a portion of the connection region 212 can be bent toward the transparent substrate 31 and directly overlap the light shielding layer 8. Electrical connection can be achieved via a conductive adhesive or other medium. The conductive medium 4 can be connected to both the light shielding layer 8 and the connection region 212, or only to the connection region 212 without being connected to the light shielding layer 8.

[0159] In another embodiment of the present disclosure, as shown in FIG9 , the surface of the driving back plate 11 facing away from the light-emitting layer 12 may be covered with a back film 14 for protecting the driving back plate 11, and the boundary of the back film 14 may coincide with the boundary of the driving back plate 11. The material of the back film 14 may be a resin or other material, and it may be a multi-layer or single-layer structure. The adhesive layer 22 may be bonded to the surface of the back film 14 facing away from the light-emitting layer 12, and the boundary of the adhesive layer 22 is located within the boundary of the back film 14. There is a spacer 141 between the adhesive layer 22 and the boundary of the back film 14, and the spacer 141 is the area of ​​the back film 14 not covered by the adhesive layer 22.

[0160] The conductive medium 4 not only electrically connects the conductive layer 32 and the heat dissipation layer 21 , but also extends to the area corresponding to the spacer 141 and is electrically connected to the spacer 141 , thereby conducting away the charge on the back film 14 .

[0161] As shown in Figures 10 and 11, in some embodiments of the present disclosure, charge can be conducted without passing through the conductive layer 32. For example, the cover plate 3 is made of a transparent material and does not include the conductive layer 32. It can have a body region 301 and a peripheral region 302 located outside the body region 301. The body region 301 covers the display area 101, the peripheral region 302 covers the peripheral region 102, and the conductive medium 4 connects the peripheral region 302 and the heat dissipation layer 21. Charge on the cover plate 3 can also be conducted to the heat dissipation layer 21 through the conductive medium 4.

[0162] Furthermore, there may be multiple contact positions between the conductive medium 4 and the peripheral region 302 . For example, the peripheral region 302 includes multiple contact regions 3021 spaced apart along the circumference of the main region 301 , and the conductive medium 4 is connected to the contact regions 3021 .

[0163] Furthermore, the outer circumference of the cover plate 3 can be formed by multiple circumferentially distributed side surfaces 30, with the connection between two adjacent side surfaces 30 forming a corner 300. The number of side surfaces 30 is not specifically limited herein and can be three, four, or five, etc. Adjacent side surfaces 30 can be directly connected or connected via a curved transition, such that the orthographic projection of the cover plate 3 on the display panel 1 is a polygon or a polygon with curved corners. Each corner 300 is located within a contact area 3021, and each contact area 3021 has one corner 300. The conductive medium 4 connected to a contact area 3021 covers the corner 300 within the contact area 3021. In other words, each corner 300 of the cover plate 3 is covered by the conductive medium 4.

[0164] The present disclosure provides a method for manufacturing a display module. The display module may be any of the above-mentioned embodiments, and its specific structure is not described in detail here. The manufacturing method of the present disclosure may include steps S110 to S140, wherein:

[0165] Step S110: forming a display panel, wherein the display panel has a display area and a peripheral area outside the display area;

[0166] Step S120: forming a cover plate on one side of the display panel;

[0167] Step S130: forming a protective layer on a side of the display panel facing away from the cover plate, wherein the protective layer covers at least a portion of the peripheral area and the display area; the protective layer includes a conductive heat dissipation layer.

[0168] Step S140: electrically connecting the cover plate to the heat dissipation layer via a conductive medium.

[0169] The details of the structures involved in each step of the manufacturing method disclosed herein have been described in detail in the embodiment of the display module and will not be repeated here. Among them, step S140 may include:

[0170] forming a conductive material that passes through the outer side of the edge of the display panel and crosses the edge of the display panel to connect to the heat dissipation layer;

[0171] The conductive material is solidified to obtain the conductive medium.

[0172] It should be noted that although the steps of the manufacturing method disclosed herein are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in this specific order, or that all steps must be performed to achieve the desired results. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0173] The present disclosure also provides a display device, which may include the display module of any of the above embodiments. The specific structure and beneficial effects of the display module can be referred to the embodiments of the display module above and will not be described in detail here.

[0174] In addition, as shown in FIG12 , the display device may further include a frame 7 . The display module may be placed within the range surrounded by the frame 7 , and the frame 7 may be used to protect the display module.

[0175] The display device may also include a driver circuit board, which may be a flexible circuit board. It is connected to the display panel 1 and bent to the side of the protective layer 2 facing away from the cover plate 3. The driver circuit board outputs a drive signal to the display panel 1, causing it to display an image. The heat dissipation layer 31 is also connected to the driver circuit board, allowing it to be grounded via the driver circuit board, thereby dissipating the charge accumulated on the conductive layer 32.

[0176] The display device disclosed herein may be a mobile phone, a tablet computer, a wearable device (smart bracelet, watch), a laptop computer, a television, or other similar devices with image display capabilities, which are not listed here one by one.

[0177] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A display module, wherein: include: A display panel having a display area and a peripheral area outside the display area; a protective layer, provided on one side of the display panel, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer comprising a conductive heat dissipation layer; a cover plate, disposed on a side of the display panel facing away from the protective layer; A conductive medium, wherein the cover plate is electrically connected to the heat dissipation layer via the conductive medium.

2. The display module according to claim 1, wherein: The cover plate includes a transparent substrate and a conductive layer, the transparent substrate has a middle area and an edge area located outside the middle area; the middle area covers the display area, and the edge area covers the peripheral area; the conductive layer is arranged on the surface of the transparent substrate facing away from the display panel, and is electrically connected to the heat dissipation layer through the conductive medium, and the conductive layer includes at least a middle wire located in the middle area.

3. The display module according to claim 2, wherein: The conductive layer further includes edge wires, which are located in the edge area and arranged around the middle area; each of the middle wires is connected to the edge wire, and the edge wires are connected to the heat dissipation layer.

4. The display module according to claim 3, wherein: There are multiple intermediate conductors, which intersect with each other to form a grid structure.

5. The display module according to claim 4, wherein: The intermediate conductors include a first intermediate conductor and a second intermediate conductor. The first intermediate conductor extends in a row direction and is spaced apart in a column direction. The second intermediate conductor extends in a column direction and is spaced apart in a row direction. The second intermediate conductor is arranged to cross the first intermediate conductor.

6. The display module according to claim 4, wherein: The display area is provided with an opening, and the conductive layer further includes a avoiding wire, wherein the orthographic projection of the avoiding wire on the display panel at least partially surrounds the outside of the opening; The avoidance conductor is connected to at least one of the intermediate conductors.

7. The display module according to any one of claims 2 to 6, wherein: The conductive medium extends from the outer side of the edge of the display panel across the edge of the display panel to connect the conductive layer and the heat dissipation layer.

8. The display module according to claim 2, wherein: The boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body area and a connection area located outside the main body area, and the connection area is connected to the main body area; The connection area is connected to the conductive layer through the conductive medium.

9. The display module according to claim 8, wherein: In a direction parallel to the main body region, a distance between a boundary of an orthographic projection of the connection region on the transparent substrate and a boundary of the transparent substrate is a first distance; In a direction parallel to the main body area, a distance between a boundary of an orthographic projection of the main body area on the transparent substrate and a boundary of the transparent substrate is a second distance; The first distance is smaller than the second distance.

10. The display module according to any one of claims 2 to 6, wherein: The cover plate further comprises: The isolation layer at least covers the middle wire, and the isolation layer is made of a transparent insulating material.

11. The display module according to any one of claims 2 to 6, wherein: The edge area of ​​the transparent substrate is bent toward a side close to the protective layer.

12. The display module according to any one of claims 2 to 6, wherein: The protective layer further comprises: an adhesive layer, provided on a side of the display panel facing away from the cover plate; a buffer layer, bonded to a surface of the adhesive layer facing away from the cover plate; a reinforcement layer, provided on a surface of the buffer layer facing away from the cover plate; The heat dissipation layer is arranged on a surface of the reinforcement layer away from the cover plate.

13. The display module according to claim 8, wherein: The orthographic projection of the connection area on the transparent substrate is at least partially located in the edge area; The display module further includes: a light shielding layer, disposed on a surface of the transparent substrate close to the display panel and located in the edge region; the light shielding layer is made of a conductive material; At least a portion of the connection region is electrically connected to the light shielding layer.

14. The display module according to claim 13, wherein: The display panel includes: Driver backplane; a light-emitting layer, provided on a side of the driving backplane away from the protective layer; a back film, provided on a surface of the driving back plate away from the light-emitting layer; The adhesive layer is adhered to the surface of the back film away from the light-emitting layer; the boundary of the adhesive layer is located within the boundary of the back film, and there is a spacer between the boundary of the back film and the boundary of the back film; The conductive layer is electrically connected to the heat dissipation layer through a conductive medium, and the conductive medium extends from the outer side of the edge of the display panel across the edge of the display panel to connect the conductive layer and the heat dissipation layer; The conductive medium is electrically connected to the spacer.

15. The display module according to claim 1, wherein: The cover plate has a main area and a peripheral area located outside the main area; the main area covers the display area, the peripheral area covers the peripheral area, and the conductive medium is connected to the peripheral area; The conductive medium extends from the outer side of the edge of the display panel across the edge of the display panel to connect the cover plate and the heat dissipation layer.

16. The display module according to claim 15, wherein: The peripheral area includes a plurality of contact areas spaced apart from each other along the circumference of the main area, and the conductive medium is connected to the contact areas.

17. The display module according to claim 16, wherein: The outer peripheral surface of the cover plate is surrounded by a plurality of side surfaces distributed in the circumferential direction, and the connection between two adjacent side surfaces forms a corner; any of the corners is located within a contact area; The conductive medium connected to any one of the contact regions covers the corner within the contact region.

18. A method for manufacturing a display module, wherein: include: forming a display panel having a display area and a peripheral area outside the display area; forming a cover plate on one side of the display panel; forming a protective layer on a side of the display panel facing away from the cover plate, the protective layer covering at least a portion of the peripheral area and the display area; the protective layer comprising a conductive heat dissipation layer; The cover plate is electrically connected to the heat dissipation layer through a conductive medium.

19. The manufacturing method according to claim 18, wherein: The cover plate is electrically connected to the heat dissipation layer through a conductive medium; comprising: forming a conductive material that passes through the outer side of the edge of the display panel and crosses the edge of the display panel to connect to the heat dissipation layer; The conductive material is solidified to obtain the conductive medium.

20. A display device, wherein: Comprising the display module according to any one of claims 1-17.

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