LOW COMPRESSION CONDUCTIVE PADS

VN104688AActive Publication Date: 2024-08-26JOINSET

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Patent Information

Application Number: VN1202308139
Authority / Receiving Office: VN · VN
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2022-11-18
Filing Date: 2023-11-16
Publication Date: 2024-08-26
Estimated Expiration: 2043-11-16

Application Information

Patent Timeline

18 Nov 2022

Priority

16 Nov 2023

Application

VN1202308139

26 Aug 2024

Publication

VN104688A

Inventors: KIM, SUN-KI; KIM, HYOUNG-KYU

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Abstract

The invention relates to a low-compression conductive cuff with significantly reduced compression force. The cuff comprises an elastic porous foam material and a conductive sheath structured to enclose the foam in the width direction and bonded by interleaved adhesive, and the porous foam material is defined to be penetrated longitudinally.

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