Display modules and display devices
Patent Information
- Authority / Receiving Office
- VN · VN
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2024-07-17
- Publication Date
- 2026-06-15
AI Technical Summary
The short-field communication structure of existing display devices is insufficient, resulting in poor performance of short-range wireless communication.
By increasing the area of the near field communication structure in the display module, the specific implementation method is to place the near field communication structure on the backlight side of the display panel and overlap at least partially with the forward projection of the binding portion, thereby increasing the area of the near field communication structure to increase the signal quantity.
It effectively improves the short-range wireless communication performance of the display module and solves the problem of insufficient semaphore.
Smart Images
Figure VN1202506398_0
Abstract
Description
Display module and display device
[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 31, 2023, with application number 202311119096.9 and invention name “Display Module and Display Device”, the content of which should be understood as incorporated into this application by reference. Technical Field
[0002] The present disclosure relates to, but is not limited to, the field of display devices, and in particular to a display module and a display device. Background Art
[0003] Organic Light Emitting Diodes (OLEDs) and Quantum-dot Light Emitting Diodes (QLEDs) are active light-emitting display devices with advantages such as self-luminescence, wide viewing angles, high contrast, low power consumption, extremely fast response times, thinness, flexibility, and low cost. With the continuous advancement of display technology, flexible displays using OLEDs or QLEDs as light-emitting devices and thin-film transistors (TFTs) for signal control have become mainstream products in the display field.
[0004] Currently, some display devices have a near field communication (NFC) structure, but there is a problem of insufficient signal strength of the NFC structure.
[0005] Summary of the Invention
[0006] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
[0007] The technical problem to be solved by the present disclosure is to provide a display module that increases the area of the near-field communication structure, improves the signal volume of the near-field communication structure, ensures the short-range wireless communication performance of the display module, and solves the problem of insufficient signal volume of the near-field communication structure.
[0008] At least one embodiment of the present disclosure provides a display module, including:
[0009] A display panel, the display panel comprising a display portion, a bending portion, and a binding portion, the display portion, the bending portion, and the binding portion being connected in sequence, and the bending portion being folded to the backlight side of the display portion;
[0010] a near field communication structure, the near field communication structure being located on a backlight side of the display portion;
[0011] The display portion, the near field communication structure and the binding portion are arranged sequentially in a direction perpendicular to the display portion, and the orthographic projection of the near field communication structure on the display portion at least partially overlaps with the orthographic projection of the binding portion on the display portion.
[0012] In an exemplary embodiment, a first back film layer is further included, the first back film layer is located on the surface of the binding portion close to the display portion, and the near field communication structure is configured to be bonded to the first back film layer.
[0013] In an exemplary embodiment, the near field communication structure is provided with a double-sided adhesive tape on the surface facing the first backing film layer for bonding, and the double-sided adhesive tape is configured as acrylic hot melt adhesive.
[0014] In an exemplary embodiment, the thickness of the double-sided tape is set to 0.02 mm to 0.05 mm.
[0015] In an exemplary embodiment, a composite film is further included, wherein the composite film is disposed between the near field communication structure and the display portion, and the thickness of the composite film is set to be less than 0.16 mm.
[0016] In an exemplary embodiment, the composite film includes a first film layer and a grid glue, the first film layer and the grid glue are stacked in a direction perpendicular to the display part, and the first film layer is configured as a graphite layer, a foam glue layer or a polyimide layer.
[0017] In an exemplary embodiment, the thickness of the first film layer is set to 0.05 to 0.07 mm, and the thickness of the grid glue is set to 0.02 to 0.04 mm.
[0018] In an exemplary embodiment, the thickness of the composite film is set to 0.06 mm to 0.12 mm.
[0019] In an exemplary embodiment, a conductive member for grounding the display panel is further included;
[0020] The near field communication structure includes a ferrite plate and a copper foil, wherein the ferrite plate and the copper foil are stacked in a direction perpendicular to the display portion, and the copper foil is located on a side of the ferrite plate away from the display portion;
[0021] A first through hole is provided on the ferrite plate, the conductive member passes through the first through hole, one end of the conductive member rests on the copper foil, and the conductive member is spaced apart from the inner side wall of the first through hole.
[0022] In an exemplary embodiment, a composite film and a second back film layer are further included, wherein the second back film layer is arranged on a surface of the display portion facing the near field communication structure.
[0023] The second back film layer, the composite film, and the near field communication structure are stacked in sequence in a direction perpendicular to the display portion;
[0024] The composite membrane is provided with a second through hole, the second through hole is communicated with the first through hole, and the first through hole and the second through hole constitute a receiving cavity;
[0025] One end of the conductive member away from the copper foil rests on the second back film layer. The conductive member passes through the first through hole and the second through hole in sequence. The conductive member is spaced apart from the inner side wall of the second through hole.
[0026] In an exemplary embodiment, there are a plurality of the conductive members, and a plurality of the accommodating cavities, and the conductive members and the accommodating cavities are arranged in a one-to-one correspondence.
[0027] In an exemplary embodiment, the cross-sectional shape of the conductive member on a plane parallel to the display portion is set to a rectangle, a circle, a diamond, a triangle, a trapezoid or an irregular shape, and the hole shapes of the second through hole and the first through hole are both set to be consistent with the cross-sectional shape of the conductive member on a plane parallel to the display portion.
[0028] In an exemplary embodiment, the conductive member is configured as conductive foam or conductive double-sided tape.
[0029] In an exemplary embodiment, the cross-sectional area of the conductive member on a plane parallel to the display portion is set to be greater than or equal to 5 mm 2 .
[0030] In an exemplary embodiment, the near-field communication structure includes a ferrite plate and a first trace, the first trace is arranged on the ferrite plate, and the orthographic projection of the first trace on the display portion is at least partially set to overlap with the orthographic projection of the binding portion on the display portion, or the orthographic projection of the first trace on the display portion is at least partially set to not overlap with the orthographic projection of the binding portion on the display portion.
[0031] In an exemplary embodiment, a chip is further included, and the chip is arranged on a surface of the binding portion away from the near field communication structure, and the orthographic projection of the chip on the display portion is located within the orthographic projection of the near field communication structure on the display portion.
[0032] In an exemplary embodiment, the orthographic projection of the near-field communication structure on the display portion is set as a first projection, the orthographic projection of the binding portion on the display portion is set as a second projection, and the overlapping projection area of the second projection and the first projection is set to be greater than two-thirds of the projection area of the second projection.
[0033] In an exemplary embodiment, the projection area of the orthographic projection of the near field communication structure on the display portion is not less than two-thirds of the area of the display portion.
[0034] In an exemplary embodiment, it further includes a cover plate, a curable optical adhesive, a polarizer and an encapsulation layer located on the light-emitting side of the display portion, and the encapsulation layer, the polarizer, the curable optical adhesive and the cover plate are stacked in sequence in a direction away from the display portion.
[0035] At least one embodiment of the present disclosure provides a display device including the above-mentioned display module.
[0036] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. Other advantages of the present application can be realized and obtained through the solutions described in the description and the drawings.
[0037] Summary of the Figures
[0038] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.
[0039] FIG1 is a schematic diagram of a related display module;
[0040] FIG2 is a schematic projection diagram of the near field communication structure in FIG1 ;
[0041] FIG3 is a schematic diagram of a display module according to an exemplary embodiment of the present disclosure;
[0042] FIG4 is a projection diagram of the near field communication structure and the binding portion in FIG3 ;
[0043] FIG5 is a schematic diagram of the display panel in FIG3 ;
[0044] FIG6 is a partial schematic diagram of the display module in FIG3 ;
[0045] FIG7 is a schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;
[0046] FIG8 is a schematic diagram of a projection of the near field communication structure in FIG7 on a display unit;
[0047] FIG9 is a schematic diagram of another near field communication structure according to an exemplary embodiment of the present disclosure;
[0048] FIG10 is a schematic diagram of a projection of the near field communication structure in FIG9 on a display unit;
[0049] FIG11 is another schematic diagram of projection of the near field communication structure in FIG9 on the display unit;
[0050] FIG12 is a schematic diagram of another near field communication structure according to an exemplary embodiment of the present disclosure;
[0051] FIG13 is a schematic diagram of a projection of the near field communication structure in FIG12 on a display unit;
[0052] FIG14 is a schematic diagram of another projection of the near field communication structure in FIG12 on the display unit;
[0053] FIG15 is a schematic diagram of another near field communication structure according to an exemplary embodiment of the present disclosure;
[0054] FIG16 is a schematic diagram of a projection of the near field communication structure in FIG15 on a display unit;
[0055] FIG17 is a schematic diagram of another projection of the near field communication structure in FIG15 on the display unit;
[0056] FIG18 is a schematic diagram of another near field communication structure according to an exemplary embodiment of the present disclosure;
[0057] FIG19 is a schematic diagram of a projection of the near field communication structure in FIG18 on a display unit;
[0058] FIG20 is another schematic diagram of a projection of the near field communication structure in FIG18 on a display unit;
[0059] FIG21 is a schematic diagram of another near field communication structure according to an exemplary embodiment of the present disclosure;
[0060] FIG22 is a schematic cross-sectional view of another display module according to an exemplary embodiment of the present disclosure;
[0061] FIG23 is a partial cross-sectional schematic diagram of the display module in FIG22;
[0062] FIG24 is a schematic diagram of the ferrite plate in FIG22 .
[0063] Description of the accompanying drawings:
[0064] 1-Cover plate; 2-Curable optical adhesive; 3-Polarizer;
[0065] 4-Encapsulation layer; 5-Display panel; 6-Back film layer;
[0066] 7-composite film; 8-bent gasket; 9-near field communication structure;
[0067] 10-first circuit board; 11-chip; 12-protective adhesive layer;
[0068] 13-display portion; 14-bending portion; 15-binding portion;
[0069] 16-double-sided tape; 17-first backing film layer; 18-second backing film layer;
[0070] 19-first plate segment; 20-second plate segment; 21-first bend;
[0071] 22-light-emitting side; 23-backlight side; 24-first gap;
[0072] 25-first film layer; 26-grid glue; 27-ferrite plate;
[0073] 28-first trace; 29-first area; 30-first edge;
[0074] 31-notch; 32-second edge; 33-copper foil;
[0075] 34-conductive member; 35-first through hole; 36-second through hole;
[0076] 37-accommodation cavity; 38-second gap; 39-third gap.
[0077] Details
[0078] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the embodiments can be implemented in a variety of different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.
[0079] In this specification, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.
[0080] In this specification, for convenience, words and phrases indicating orientation or positional relationships, such as "middle," "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," and "outside," are used to illustrate the positional relationships of constituent elements with reference to the accompanying drawings. This is merely for the purpose of facilitating the description of this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present disclosure. The positional relationships of constituent elements may be appropriately changed depending on the direction in which each constituent element is described. Therefore, the present disclosure is not limited to the words and phrases described in the specification and may be appropriately replaced according to the circumstances.
[0081] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct connections, indirect connections through intermediaries, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure.
[0082] In this specification, "electrically connected" includes components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.
[0083] In this specification, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus also includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus also includes a state where the angle is greater than 85° and less than 95°.
[0084] The triangles, rectangles, trapezoids, pentagons or hexagons in this specification are not in the strict sense, but may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, arc edges and deformations.
[0085] The term "about" in the embodiments of the present disclosure does not strictly define the limits and allows for numerical values within the range of process and measurement errors.
[0086] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps in the specific order described. As will be understood by those skilled in the art, other orders of steps are also possible. Therefore, the specific order of the steps set forth in the specification should not be interpreted as a limitation to the claims. In addition, the claims for the method and / or process should not be limited to performing their steps in the order written, and those skilled in the art can readily understand that these orders can be changed and still remain within the spirit and scope of the embodiments of the present application.
[0087] FIG1 is a schematic diagram of a related display module, and FIG2 is a schematic projection diagram of the near-field communication structure in FIG1 . As shown in FIG1 and FIG2 , the related display module includes a display panel 5, a composite film (Super Clean Foam, abbreviated as SCF) 7, a bending spacer 8, and a near-field communication structure (Near Field Communication, abbreviated as NFC) 9, wherein the display panel 5 includes a display portion 13, a bending portion 14, and a binding portion 15, and the composite film 7 and the bending spacer 8 support the space between the display portion 13 and the binding portion 15. In a direction parallel to the display portion 13, the distance between the near-field communication structure 9 and the binding portion 15 can be L, and the value of L is greater than or equal to 2.5 mm. For example, in some display modules, the distance between the near-field communication structure 9 and the binding portion 15 is 2.5 mm, 3 mm, or 5 mm. The binding portion 15 is projected onto the display portion 13 as projection A, and the near-field communication structure 9 is projected onto the display portion 13 as projection B. Projection A and projection B are arranged at intervals, and the distance between them is L. The inventors of this application have found that when the overall size of the display module is small, the area of the near-field communication structure 9 in the display module is too small, which will lead to insufficient signal quantity of the near-field communication structure 9 and poor short-range wireless communication performance of the display module.
[0088] FIG3 is a schematic diagram of a display module according to an exemplary embodiment of the present disclosure, and FIG4 is a schematic projection diagram of the near-field communication structure and binding portion in FIG3 . An embodiment of the present disclosure provides a display module, as shown in FIG3 and FIG4 . The display module may include a display panel 5 and a near-field communication structure 9. The display panel 5 may include a display portion 13, a bending portion 14, and a binding portion 15 connected in sequence. The bending portion 14 may be folded to the backlight side of the display portion 13, and the near-field communication structure 9 may be located on the backlight side of the display portion 13. The display portion 13, the near-field communication structure 9, and the binding portion 15 may be arranged in sequence in a direction perpendicular to the display portion 13, and the orthographic projection B of the near-field communication structure 9 on the display portion 13 is arranged to at least partially overlap with the orthographic projection A of the binding portion 15 on the display portion 13. Therefore, the display module of this example extends the near-field communication structure 9 to between the display part 13 and the binding part 15. Compared with the related display modules in which the near-field communication structure 9 does not extend between the display part 13 and the binding part 15, the display module of this example increases the area of the near-field communication structure 9, improves the signal amount of the near-field communication structure 9, and ensures the short-range wireless communication performance of the display module.
[0089] Figure 5 is a schematic diagram of the display panel in Figure 3. In some exemplary embodiments, as shown in Figures 3 and 5, the display panel 5 may include a display portion 13, a bending portion 14 and a binding portion 15 connected in sequence, wherein the display portion 13, the bending portion 14 and the binding portion 15 may be an integral part, the display portion 13 may be flat, and the display portion 13 may have a light-emitting side 22 and a backlight side 23. After the display portion 13 is lit, the light-emitting side 22 emits light to display text or images. The bending portion 14 can be made of a flexible material and can be bent. The bending portion 14 has metal traces and the like. During production, the bending portion 14 can be laid flat on the production equipment. During installation, the bending portion 14 can be folded toward the backlight side 23 of the display portion 13, so that the bending portion 14 is in a bent state and remains in this state. In the bent state, the bending portion 14 forms a nearly semicircular shape. The radius of the semicircle formed by the bending portion 14 is approximately 0.2 mm to 0.5 mm. In this example, the radius of the semicircle formed by the bending portion 14 is approximately 0.25 mm, but is not limited thereto. For example, the radius of the semicircle formed by the bending portion 14 can be 0.2 mm, 0.3 mm, or 0.35 mm. The binding portion 15 is located on the backlight side 23 of the display portion 13, parallel to the display portion 13, and includes a chip on panel (COP) mounting area and a driver integrated circuit (D-IC) area. A first gap 24 is formed between the binding portion 15 and the display portion 13 , and a component is required to support and fill the first gap 24 to support the space between the binding portion 15 and the display portion 13 .
[0090] In some exemplary embodiments, as shown in FIG3 , the display module further includes a first circuit board 10 and a chip 11. The first circuit board 10 may be a flexible printed circuit (FPC) and can be soldered to the near-field communication structure 9. Components (not shown) may be provided on the first circuit board 10, and the components (not shown) may be located on one side of the first circuit board 10. The first circuit board 10 may include a first section 19, a first bend 21, and a second section 20, which are sequentially connected. The first bend 21 divides the first circuit board 10 into the first section 19 and the second section 20, which are located on different planes. The components (not shown) may be arranged on the second section 20. The surface of the second section 20 facing the display portion 5 may be soldered to the near-field communication structure 9. The second section 20 may include a device area (not shown), in which multiple components (not shown) may be arranged. These multiple components may include larger components such as flash memory chips. The components are mounted on the first circuit board 10 using surface mount technology (SMT). First plate segment 19 can extend to the surface of binding portion 15 away from display portion 13. Binding portion 15 is bonded to the driver integrated circuit region of binding portion 15, forming an electrical connection between first plate segment 19 and binding portion 15. Chip 11 is located on the surface of binding portion 15 away from display portion 13. Chip 11 is bonded to the chip mounting region of binding portion 15, forming an electrical connection between chip 11 and binding portion 15. In addition, the orthographic projection of chip 11 on display portion 13 is located within the orthographic projection of near-field communication structure 9 on display portion 13.
[0091] In some exemplary embodiments, as shown in FIG3 , the display module further comprises a cover plate 1, a curable optical adhesive 2, a polarizer 3, and an encapsulation layer 4. The cover plate 1, the curable optical adhesive 2, the polarizer 3, and the encapsulation layer 4 are located on the light-emitting side of the display portion 13. The encapsulation layer 4, the polarizer 3, the curable optical adhesive 2, and the cover plate 1 are stacked sequentially in a direction away from the display portion 13. The encapsulation layer 4, the polarizer 3, the curable optical adhesive 2, and the cover plate 1 can all transmit light emitted from the display portion 13. The encapsulation layer 4 and the cover plate 1 can both protect the display portion 13, and the polarizer 3 can reduce the impact of external light emission on the image displayed on the display portion 13.
[0092] In some exemplary embodiments, as shown in FIG3 and FIG5 , the display module further includes a bottom film layer (BF) 6, wherein the bottom film layer 6 can be provided on the display panel 5. Depending on the position, the bottom film layer 6 can be divided into a first back film layer 17 and a second back film layer 18. The first back film layer 17 is located on the surface of the binding portion 15 facing the near field communication structure 9, and the second back film layer 18 is located on the backlight side surface of the display portion 13. When the bending portion 14 is in a bent state, the first back film layer 17 covers the surface of the binding portion 15 facing the display portion 13, and the second back film layer 18 covers the surface of the display portion 13 close to the binding portion 15. The first back film layer 17 and the second back film layer 18 can be prepared on the display panel 5 during the production of the display panel 5. When the first back film layer 17 and the second back film layer 18 are prepared on the display panel 5, the bending portion 14 is laid flat on the production equipment, and the first back film layer 17 and the second back film layer 18 are arranged in place at one time. The first backing film layer 17 and the second backing film layer 18 also partially fill the space within the first gap 24. Furthermore, the display module includes a protective adhesive layer (Metal Coating Layer, MCL) 12. The protective adhesive layer 12 covers at least the side of the bent portion 14 facing away from the near-field communication structure 9. The protective adhesive layer 12 also covers the portion of the surface of the binding portion 15 facing away from the near-field communication structure 9. The protective adhesive layer 12 protects the components it covers.
[0093] In an exemplary embodiment, as shown in Figures 3, 4, and 5, one end of the near-field communication structure 9 is inserted into the first gap 24 and is located between the first backing film layer 17 and the second backing film layer 18. The near-field communication structure 9 can be configured to be bonded to the first backing film layer 17. Compared to the display module shown in Figure 1, the display module of this example omits the curved gasket 8. The near-field communication structure 9 replaces the curved gasket 8 and is filled between the display portion 13 and the binding portion 15. The near-field communication structure 9 can be provided with double-sided adhesive 16 on the surface facing the first backing film layer 17 for bonding. The double-sided adhesive 16 can be made of AD adhesive, i.e., acrylic hot melt adhesive. The double-sided adhesive 16 can be pre-pasted on the near-field communication structure 9 before the near-field communication structure 9 is assembled with the display panel 5. When the near-field communication structure 9 is assembled with the display panel 5, the double-sided adhesive 16 and the near-field communication structure 9 are fed as a whole, which can reduce the preparation steps, effectively optimize the production line process, and eliminate the need for additional manual labor to attach the double-sided adhesive 16. In an exemplary embodiment, the thickness of the double-sided tape 16 can be set to 0.02mm to 0.05mm. The thickness of the double-sided tape 16 can be the dimension of the double-sided tape 16 in a direction perpendicular to the display portion 15. In this example, the thickness of the double-sided tape 16 can be 0.03mm, but is not limited thereto. For example, the thickness of the double-sided tape 16 can be 0.04mm, or 0.02mm, or 0.05mm. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the orthographic projection of the near-field communication structure 9 on the display portion 13 can be set to the first projection B. The first projection B is set to partially overlap with the second projection A. The first projection B has a portion that does not overlap with the second projection A. The second projection A has a portion that does not overlap with the first projection B. The overlapping portion of the first projection B and the second projection A can be the third projection C. The orthographic projection of the double-sided tape 16 on the display portion 13 may be located within the third projection C, and the orthographic projection of the chip 11 on the display portion 13 may also be located within the third projection C. In an exemplary embodiment, the overlapping projection area of the second projection A and the first projection B is the area of the third projection C. The area of the third projection C may be greater than two-thirds of the area of the second projection A. In this example, the area of the third projection C is approximately four-fifths of the projection area of the second projection A, but is not limited thereto. For example, the area of the third projection C is approximately seven-ninths of the area of the second projection A. For another example, the area of the third projection C is approximately three-quarters of the area of the second projection A.In an exemplary embodiment, the projection area of the positive projection of the near-field communication structure 9 on the display portion 13 is the area of the first projection B, and the area of the first projection B is not less than two-thirds of the area of the display portion 13. The area of the display portion 13 is the area occupied by the display portion 13 in the plane in which it is located. In this example, the area of the first projection B may be four-fifths of the area of the display portion 13, but is not limited to this. For example, the area of the first projection B may be two-thirds of the area of the display portion 13, and for another example, the area of the first projection B may be seven-tenths of the area of the display portion 13.
[0094] FIG6 is a partial schematic diagram of FIG3 . In some exemplary embodiments, as shown in FIG3 , FIG5 , and FIG6 , the display module further includes a composite film 7 . The composite film 7 is located on the backlight side 23 of the display portion 13 . The composite film 7 can be disposed between the near-field communication structure 9 and the display portion 13 . The composite film 7 can be sandwiched between the second backing film layer 18 and the near-field communication structure 9 . The near-field communication structure 9 can be bonded to the second backing film layer 18 and the near-field communication structure 9 , respectively. One end of the composite film 7 is also inserted into the first gap 24 . The orthographic projection of the near-field communication structure 9 on the display portion 13 can be entirely located within the orthographic projection of the composite film 7 on the display portion 13 , so that the orthographic projection of the binding portion 15 on the display portion 13 overlaps with the orthographic projection of the composite film 7 on the display portion 13 . In some exemplary embodiments, the thickness of the composite film 7 may be H1, which may be less than 0.16 mm. In this example, the thickness of the composite film 7 may range from 0.06 mm to 0.12 mm, i.e., 0.06 mm ≤ H1 ≤ 0.12 mm. The thickness of the composite film 7 may be the dimension of the composite film 7 in a direction perpendicular to the display portion 13. In this example, the thickness of the composite film 7 may be 0.09 mm, i.e., H1 = 0.09 mm. Compared to the 0.16 mm thickness of the composite film 7 in the related display module, the thickness of the composite film 7 in this example is smaller, providing sufficient space within the first gap 24 for the near-field communication structure 9 and the double-sided tape 16. In an exemplary embodiment, the composite film 7 includes a first film layer 25 and a grid glue 26 stacked in a direction perpendicular to the display portion 13. The number of layers of the first film layer 25 and the grid glue 26 is not limited to one layer and can be multiple layers. The material of the first film layer 25 can be graphite, foam glue or polyimide. The thickness of the first film layer 25 can be set to H2, and the value of H2 can be 0.05 to 0.07 mm. The thickness of the grid glue 26 can be set to H3, and the value of H3 can be 0.02 mm to 0.04 mm.
[0095] In an exemplary embodiment, as shown in Figure 6, the thickness of the composite film 7 can be 0.09 mm, that is, H1 = 0.09 mm, the material of the first film layer 25 can be foam glue, the first film layer 25 forms a foam glue layer, the thickness of the foam glue layer is H2, and the thickness of the grid glue 26 can be set to H3, where H2 = 0.06 mm and H3 = 0.03 mm.
[0096] In an exemplary embodiment, as shown in Figure 6, the thickness of the composite film 7 can be 0.09 mm, that is, H1 = 0.09 mm, the material of the first film layer 25 can be foam glue, the first film layer 25 forms a foam glue layer, the thickness of the foam glue layer is H2, and the thickness of the grid glue 26 can be set to H3, where H2 = 0.05 mm and H3 = 0.04 mm.
[0097] In an exemplary embodiment, as shown in Figure 6, the thickness of the composite film 7 can be 0.09 mm, that is, H1 = 0.09 mm, the material of the first film layer 25 can be polyimide, the first film layer 25 forms a polyimide layer, the thickness of the polyimide layer is H2, and the thickness of the grid glue 26 can be set to H3, where H2 = 0.06 mm and H3 = 0.03 mm.
[0098] In an exemplary embodiment, as shown in Figure 6, the thickness of the composite film 7 can be 0.09 mm, that is, H1 = 0.09 mm, the material of the first film layer 25 can be polyimide, the first film layer 25 forms a polyimide layer, the thickness of the polyimide layer is H2, and the thickness of the grid glue 26 can be set to H3, where H2 = 0.05 mm and H3 = 0.04 mm.
[0099] In an exemplary embodiment, as shown in FIG6 , the thickness of the composite film 7 may be 0.09 mm, i.e., H1=0.09 mm. The material of the first film layer 25 may be a graphite sheet, and the first film layer 25 forms a graphite layer, and the thickness of the graphite layer is H2. The thickness of the grid glue 26 may be set to H3, where H2=0.06 mm and H3=0.03 mm.
[0100] In an exemplary embodiment, as shown in FIG6 , the thickness of the composite film 7 may be 0.09 mm, i.e., H1=0.09 mm, the material of the first film layer 25 may be a graphite sheet, the first film layer 25 forms a graphite layer, the thickness of the graphite layer is H2, and the thickness of the grid glue 26 may be set to H3, wherein H2=0.05 mm and H3=0.04 mm.
[0101] FIG7 is a schematic diagram of a near-field communication structure according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG7 , the near-field communication structure 9 may include a ferrite plate 27 and a first trace 28. The first trace 28 is disposed on the ferrite plate 27. The ferrite plate 27 may be rectangular, but is not limited thereto. For example, the ferrite plate 27 may be a parallelogram, trapezoidal, circular, or irregularly shaped plate. The first trace 28 is arranged along the edge of the ferrite plate 27 and forms a ring. However, the location of the first trace 28 is not limited to the edge of the ferrite plate 27 and may be located elsewhere on the ferrite plate 27.
[0102] FIG8 is a schematic diagram of the projection of the near-field communication structure in FIG7 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG7 , and FIG8 , the orthographic projection of the ferrite plate 27 on the display portion 13 is set to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13 , and both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion. The overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping portion.
[0103] FIG9 is a schematic diagram of another near-field communication structure according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG9 , the near-field communication structure 9 may include a ferrite plate 27 and a first trace 28. The first trace 28 is disposed on the ferrite plate 27. The ferrite plate 27 may be rectangular, but is not limited thereto. For example, the ferrite plate 27 may be a parallelogram, a trapezoidal, a circular, or an irregularly patterned plate. The first trace 28 is arranged in a ring, and the ferrite plate 27 has a first region 29 where the first trace 28 is not disposed.
[0104] FIG10 is a schematic diagram of a projection of the near-field communication structure in FIG9 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG9 , and FIG10 , the first region 29 of the ferrite plate 27 corresponds to the binding portion in a direction perpendicular to the display portion 13 . The orthographic projection of the ferrite plate 27 on the display portion 13 is configured to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13 , and both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to a second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion, and the overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can not overlap with the orthographic projection of the binding portion 15 on the display portion 13 , that is, the second projection A and the fourth projection D do not overlap.
[0105] FIG11 is another schematic diagram of the projection of the near-field communication structure in FIG9 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG9 , and FIG11 , the first region 29 of the ferrite plate 27 is staggered with the binding portion in a direction perpendicular to the display portion 13 . The orthographic projection of the ferrite plate 27 on the display portion 13 is configured to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13 , and both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to a second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion, and the overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13 , that is, the second projection A and the fourth projection D have an overlapping portion.
[0106] FIG12 is a schematic diagram of another near-field communication structure according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG12 , the near-field communication structure 9 may include a ferrite plate 27 and a first trace 28. The first trace 28 is disposed on the ferrite plate 27, which may be an irregularly patterned plate. The first trace 28 is arranged in a ring shape, and the ferrite plate 27 has a first region 29 where the first trace 28 is not disposed.
[0107] FIG13 is a schematic diagram of a projection of the near-field communication structure in FIG12 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG12 , and FIG13 , the first region 29 of the ferrite plate 27 corresponds to the binding portion 15 in a direction perpendicular to the display portion 13 . The orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13 , and both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to a second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion. The overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can not overlap with the projection of the binding portion 15 on the display portion 13 , that is, the second projection A and the fourth projection D do not overlap.
[0108] FIG14 is another schematic diagram of the projection of the near-field communication structure in FIG12 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG12 , and FIG14 , the first region 29 of the ferrite plate 27 is staggered with the binding portion 15 in a direction perpendicular to the display portion 13. The orthographic projection of the ferrite plate 27 on the display portion 13 is configured to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13. Both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to a second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion. The overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping portion.
[0109] FIG15 is a schematic diagram of another near-field communication structure according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG15 , the near-field communication structure 9 may include a ferrite plate 27 and a first trace 28. The first trace 28 is disposed on the ferrite plate 27, which may be an irregularly patterned plate. The first trace 28 is arranged in a ring shape, and the ferrite plate 27 has a first region 29 where the first trace 28 is not disposed.
[0110] FIG16 is a schematic diagram of a projection of the near-field communication structure in FIG15 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG15 , and FIG16 , the first region 29 of the ferrite plate 27 corresponds to the binding portion 15 in a direction perpendicular to the display portion 13 . The orthographic projection of the ferrite plate 27 on the display portion 13 is configured to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13 , and both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to a second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion. The overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can not overlap with the projection of the binding portion 15 on the display portion 13 , that is, the second projection A and the fourth projection D do not overlap.
[0111] FIG17 is another schematic diagram of the projection of the near-field communication structure in FIG15 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG15 , and FIG17 , the first region 29 of the ferrite plate 27 is staggered with the binding portion 15 in a direction perpendicular to the display portion 13. The orthographic projection of the ferrite plate 27 on the display portion 13 is configured to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13. Both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to a second projection A. The first projection B and the second projection A partially overlap. The first projection B and the second projection A both have a non-overlapping portion. The overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping portion.
[0112] FIG18 is a schematic diagram of another near-field communication structure according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG18 , the near-field communication structure 9 may include a ferrite plate 27 having an irregular pattern and a first trace 28. The first trace 28 is disposed on the ferrite plate 27. The circumferential edge of the ferrite plate 27 includes a first edge 30, which may be provided with two notches 31, thereby forming the ferrite plate 27 in an irregular shape. The first trace 28 is arranged along the edge of the ferrite plate 27 and forms a ring.
[0113] Figure 19 is a schematic diagram of a projection of the near-field communication structure in Figure 18 on the display portion. In some exemplary embodiments, as shown in Figures 3, 18 and 19, the first edge 30 of the ferrite plate 27 is located on the side of the ferrite plate 27 close to the bending portion 14, and the orthographic projection of the ferrite plate 27 on the display portion 13 is set to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the first projection B and the second projection A can partially overlap. The first projection B and the second projection A both have some non-overlapping parts, and the overlapping part of the first projection B and the second projection A can be the third projection C. The orthographic projection of the first routing line 28 on the display portion 13 may be the fourth projection D, and the orthographic projection of the first routing line 28 on the display portion 13 may overlap with the projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D overlap, and the orthographic projection of the first edge 30 on the display portion 13 may be the fifth projection E, and the fifth projection E is located within the second projection A.
[0114] FIG20 is another schematic diagram of a projection of the near-field communication structure in FIG18 on the display portion. In some exemplary embodiments, as shown in FIG3 , FIG18 , and FIG20 , the first edge 30 of the ferrite plate 27 is located on the side of the ferrite plate 27 away from the bent portion 14 . The orthographic projection of the ferrite plate 27 on the display portion 13 is configured to be consistent with the orthographic projection of the near-field communication structure 9 on the display portion 13 , and both projections are first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be configured as a second projection A. The first projection B and the second projection A can partially overlap. The first projection B and the second projection A both have a non-overlapping portion, and the overlapping portion of the first projection B and the second projection A can be a third projection C. The orthographic projection of the first trace 28 on the display portion 13 can be a fourth projection D. The orthographic projection of the first trace 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13 , that is, the second projection A and the fourth projection D overlap.
[0115] FIG21 is a schematic diagram of another near-field communication structure according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG21 , the near-field communication structure 9 may include a ferrite plate 27 having an irregular pattern and a first trace 28. The first trace 28 is disposed on the ferrite plate 27. The circumferential edge of the ferrite plate 27 includes a first edge 30 and a second edge 32. Both the first edge 30 and the second edge 32 may be provided with two notches 31, thereby forming the ferrite plate 27 into an irregular shape. The first trace 28 is arranged along the edge of the ferrite plate 27 and forms a ring.
[0116] FIG22 is a schematic cross-sectional view of another display module according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG3 and FIG22 , the near-field communication structure 9 may include a plate-shaped ferrite plate 27 and a copper foil 33. The ferrite plate 27 and the copper foil 33 may be stacked in a direction perpendicular to the display portion 13. The ferrite plate 27 is located on the side of the copper foil 33 facing the composite film 7. The ferrite plate 27 may bond the composite film 7 to the copper foil 33. In a direction perpendicular to the display portion 13, the display portion 13, the second back film layer 18, the composite film 7, the ferrite plate 27, and the copper foil 33 are stacked in this order.
[0117] Figure 23 is a partial schematic cross-sectional view of the display module in Figure 22, and Figure 24 is a schematic view of the ferrite plate in Figure 22. In some exemplary embodiments, as shown in Figures 3, 22, 23 and 24, the display module also includes a conductive conductive member 34. The conductive member 34 can penetrate the composite film 7 and the ferrite plate 27, and can achieve the connection between the copper foil 33 and the second back film layer 18. The copper foil 33 can be used as a grounding terminal by connecting to the shell or other forms. The second back film layer 18 is connected to the copper foil 33 through the conductive member 34, thereby achieving the grounding of the display part 13.
[0118] In some exemplary embodiments, as shown in Figures 3, 22, 23, and 24, the ferrite plate 27 may be provided with a first through hole 35, which passes through the ferrite plate 27 in a direction perpendicular to the display portion 13. The first through hole 35 may be a rectangular hole, but is not limited thereto. For example, the first through hole 35 may be a regular hole such as a circular hole, a triangular hole, a trapezoidal hole, or an irregular hole. The composite film 7 may be provided with a second through hole 36, which passes through the composite film 7 in a direction perpendicular to the display portion 13. The hole shape and hole size of the second through hole 36 are consistent with those of the first through hole 35. In this example, the second through hole 36 and the first through hole 35 are both rectangular holes, but are not limited thereto. For example, the second through hole 36 and the first through hole 35 have different hole shapes, or the second through hole 36 and the first through hole 35 have the same hole shape but different sizes. One end of the first through hole 35 extends to the copper foil 33, the other end of the first through hole 35 is connected to the first end of the second through hole 36, and the second end of the second through hole 36 extends to the second back film layer 18, so that the second through hole 36 and the first through hole 35 are correspondingly arranged in a direction perpendicular to the display part 15, and the second through hole 36 and the first through hole 35 together constitute a accommodating cavity 37, so that the cross-section of the accommodating cavity 37 on a plane parallel to the display part 13 is rectangular.
[0119] In some exemplary embodiments, as shown in Figures 3, 22, 23, and 24, the conductive member 34 may be made of conductive foam or conductive double-sided tape. The conductive member 34 is conductive and flexible. In this example, the conductive member 34 is made of conductive foam, but is not limited thereto. For example, the conductive member 34 may be made of other flexible and conductive materials besides conductive foam or conductive double-sided tape. The cross-section of the conductive member 34 in a plane parallel to the display portion 13 may be rectangular, so that the shape of the conductive member 34 matches the hole shape of the second through hole 36 and the first through hole 35. For example, the cross-section of the conductive member 34 in a plane parallel to the display portion 13 may be circular, trapezoidal, diamond-shaped, triangular, or irregularly shaped. The second through hole 36 and the first through hole 35 are both configured as corresponding circular holes, trapezoidal holes, diamond-shaped holes, triangular holes, or irregularly shaped holes corresponding to the conductive member 34. The cross section of the conductive member 34 on a plane parallel to the display portion 13 may be rectangular, and the minimum area of the cross section may be S, where S is ≥ 5 mm. 2 In this example, S = 6 mm 2 , but not limited thereto, for example, the minimum cross-sectional area S of the conductive member 34 may be 5 mm 2 For example, the minimum cross-sectional area S of the conductive member 34 can be 6.5 mm 2 For example, the minimum cross-sectional area S of the conductive member 34 can be 8 mm 2 .
[0120] In some exemplary embodiments, as shown in Figures 3, 22, 23, and 24, the conductive member 34 is located in the accommodating cavity 37, and the conductive member 34 passes through the second through hole 36 and the first through hole 35. One end of the conductive member 34 in a direction perpendicular to the display portion 13 abuts against the copper foil 33, and the other end of the conductive member 34 in a direction perpendicular to the display portion 13 abuts against the second back film layer 18. The minimum cross-sectional area of the conductive member 34 in a plane parallel to the display portion 13 may be greater than or equal to 5 mm. 2 , so that the contact area between the conductive member 34 and the second back film layer 18 is greater than or equal to 5mm 2 The contact area between the conductive member 34 and the copper foil 33 is greater than or equal to 5 mm 2 , it can be seen that the ground contact area of the conductive member 34 is greater than or equal to 5mm 2 . Thus, the static electricity of the display part 15 is guided to the conductive member 34 through the second back film layer 18, and then guided to the copper foil 33 by the conductive member 34. The conductive member 34 passes through the first through-hole 35, and the outer wall of the conductive member 34 and the inner wall of the first through-hole 35 are spaced apart, that is, there is a second gap 38 between the outer wall of the conductive member 34 and the inner wall of the first through-hole 35. The second gap 38 can be a gap surrounding the conductive member 34, so that the conductive member 34 does not contact the inner wall of the first through-hole 35. The minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through-hole 35 is about 0.3mm to 0.7mm. In this example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through-hole 35 can be 0.5mm, but is not limited thereto. For example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through-hole 35 can be 0.4mm. For another example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through-hole 35 can be 0.6mm. The conductive member 34 extends through the second through-hole 36, and the outer wall of the conductive member 34 is spaced apart from the inner wall of the second through-hole 36. Specifically, a third gap 39 exists between the outer wall of the conductive member 34 and the inner wall of the second through-hole 36. The third gap 39 may be a space surrounding the conductive member 34, so that the conductive member 34 does not contact the inner wall of the second through-hole 36. The minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through-hole 36 is approximately 0.3 mm to 0.7 mm. In this example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through-hole 36 may be 0.5 mm, but is not limited thereto. For example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through-hole 36 may be 0.4 mm. In another example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through-hole 36 may be 0.6 mm.
[0121] In some exemplary embodiments, as shown in Figures 3, 22, 23, and 24, there may be one conductive member 34 and one accommodating cavity 37. However, in some exemplary embodiments, there may be multiple conductive members 34 and multiple accommodating cavities 37, and the conductive members 34 and accommodating cavities 37 are arranged in a one-to-one correspondence. For example, the ferrite plate 27 may have two first through holes 35, and the composite film 7 may have two second through holes 36 corresponding to the first through holes 35, forming two accommodating cavities 37, with one conductive member 34 positioned in each of the two accommodating cavities 37. For another example, the ferrite plate 27 may have four first through holes 35, and the composite film 7 may have four second through holes 36 corresponding to the first through holes 35, forming four accommodating cavities 37, with one conductive member 34 positioned in each of the four accommodating cavities 37. Multiple conductive members 34 can all contact the copper foil 33 and the second back film layer 18. The multiple conductive members 34 can effectively enhance the display module's anti-static field and electrostatic protection capabilities.
[0122] In some exemplary embodiments, an installation method is used to assemble a display module as shown in Figure 3. The installation method mainly has three steps, which include binding of the display panel 5, assembly and installation of the composite film 7 and near-field communication structure 9, and bending. First, the bending portion 14 of the display panel 5 is not in a bent state, and the bending portion 14 is not folded. In this state, the back film 6 and the protective adhesive layer 12 are bonded, and the binding portion 15 of the display panel 5 and the first circuit board 10 are bound. Next, the composite film 7 is attached to the display portion 13 of the display panel 5, and the composite film 7 is attached to the backlight side of the display portion 13. Then, the near-field communication structure 9 is installed, and the near-field communication structure 9 is aligned and bonded to the composite film 7, wherein the double-sided tape 16 has been pre-installed on the near-field communication structure 9, and the double-sided tape 16 and the near-field communication structure 9 are fed as one piece. Finally, the bent portion 14 is folded so that it is in a curved state, and the double-sided tape 16 is aligned and bonded to the backing film on the binding area 15. The near-field communication structure 9 and the first circuit board 10 are then welded to complete the assembly of the display module. In addition, as shown in Figure 3, the display module can also be installed with a cover plate 1, curable optical adhesive 2, polarizer 3, and encapsulation layer 4. During the first step of display module installation, that is, before the display panel 5 is bonded, the encapsulation layer 4, polarizer 3, curable optical adhesive 2, and cover plate 1 need to be aligned and installed in sequence with respect to the display portion 13 of the display panel 5.
[0123] In some exemplary embodiments, a display device includes the above-mentioned display module, and the display device can be an OLED display device. The display device provided by the embodiment of the present disclosure can be applied to electronic devices, and can be a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a car display, or any product or component with a display function, such as a wearable device, such as a smart watch, a smart bracelet, smart glasses, smart headphones, smart clothing, a head-mounted display, etc. In this example, the display device is a mobile phone. By increasing the space occupied by the near-field communication structure 9, the signal amount of the near-field communication structure 9 is guaranteed while simplifying the structure.
[0124] In combination with the above embodiments, the display module ensures the signal volume of the near-field communication structure 9 by increasing the space occupied by the near-field communication structure 9, so that the performance of the display device at the 12 o'clock and 6 o'clock directions is close. The display module reduces the thickness of the composite film, and replaces the curved gasket with double-sided tape 16, and then extends the near-field communication structure 9 to increase the area of the near-field communication structure 9, thereby improving the performance of the near-field communication structure 9. The display module can achieve the overall maximum stacking thickness unchanged, but the signal of the near-field communication structure 9 will be greatly improved, and the cancellation of the curved gasket can save material and labor costs. The double-sided tape 16 and the near-field communication structure 9 signal are loaded as one, which effectively optimizes the production line process without increasing the labor corresponding to the double-sided tape 16 attachment. The display module introduces electrostatic field optimization measures, uses the near-field communication structure 9 and the composite film to open and close, and uses conductive parts to ground the copper foil and the display panel. The grounding area of a single conductive part 34 is greater than or equal to 5mm 2 The number of the conductive member 34 is at least one, which effectively improves the anti-static field and electrostatic protection capabilities of the display module.
[0125] It will be appreciated by those skilled in the art that all or some of the steps, systems, and functional modules / units in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. In hardware implementations, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed by several physical components in cooperation. Some or all components may be implemented as software executed by a processor, such as a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or temporary medium). As is well known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable, and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those skilled in the art that communication media generally embodies computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.
Claims
1. A display module, wherein: include: A display panel, the display panel comprising a display portion, a bending portion and a binding portion, the display portion, the bending portion and the binding portion are connected in sequence, and the bending portion is folded to the backlight side of the display portion; A near field communication structure, wherein the near field communication structure is located on the backlight side of the display portion; The display portion, the near field communication structure and the binding portion are arranged in sequence in a direction perpendicular to the display portion, and an orthographic projection of the near field communication structure on the display portion at least partially overlaps with an orthographic projection of the binding portion on the display portion.
2. The display module according to claim 1, further comprising a first back film layer, wherein the first back film layer is located on a surface of the binding portion close to the display portion, and the near field communication structure is configured to be bonded to the first back film layer.
3. The display module according to claim 2, wherein: The near field communication structure is provided with a double-sided adhesive for bonding on a surface facing the first back film layer, and the double-sided adhesive is configured as acrylic hot melt adhesive.
4. The display module according to claim 3, characterized in that: The thickness of the double-sided tape is set to 0.02 mm to 0.05 mm. 5 . The display module according to claim 2 , further comprising a composite film, wherein the composite film is disposed between the near field communication structure and the display portion, and a thickness of the composite film is set to be less than 0.16 mm.
6. The display module according to claim 5, characterized in that: The composite film comprises a first film layer and a mesh adhesive, wherein the first film layer and the mesh adhesive are stacked in a direction perpendicular to the display portion, and the first film layer is configured as a graphite layer, a foam adhesive layer or a polyimide layer.
7. The display module according to claim 6, wherein: The thickness of the first film layer is set to 0.05 to 0.07 mm, and the thickness of the grid glue is set to 0.02 to 0.04 mm.
8. The display module according to claim 5, characterized in that: The thickness of the composite film is set to be 0.06 mm to 0.12 mm.
9. The display module according to claim 1, further comprising a conductive member for grounding the display panel; The near field communication structure comprises a ferrite plate and a copper foil, wherein the ferrite plate and the copper foil are stacked in a direction perpendicular to the display portion, and the copper foil is located on a side of the ferrite plate away from the display portion; The ferrite plate is provided with a first through hole, the conductive member passes through the first through hole, one end of the conductive member is against the copper foil, and the conductive member is arranged to be spaced apart from the inner side wall of the first through hole.
10. The display module according to claim 9, further comprising a composite film and a second back film layer, wherein the second back film layer is arranged on a surface of the display portion facing the near field communication structure. The second back film layer, the composite film, and the near field communication structure are stacked in sequence in a direction perpendicular to the display portion; The composite membrane is provided with a second through hole, the second through hole is connected to the first through hole, and the first through hole and the second through hole constitute a containing cavity; One end of the conductive member away from the copper foil abuts against the second back film layer, the conductive member sequentially passes through the first through hole and the second through hole, and the conductive member is arranged to be spaced apart from the inner side wall of the second through hole.
11. The display module according to claim 10, wherein: There are a plurality of the conductive members, there are a plurality of the accommodating cavities, and the conductive members and the accommodating cavities are arranged in one-to-one correspondence.
12. The display module according to claim 10, wherein: The cross-sectional shape of the conductive member on a plane parallel to the display portion is set to be rectangular, circular, rhombus, triangle, trapezoid or irregular, and the hole shapes of the second through hole and the first through hole are both set to be consistent with the cross-sectional shape of the conductive member on a plane parallel to the display portion.
13. The display module according to claim 9, wherein: The conductive member is configured as conductive foam or conductive double-sided tape.
14. The display module according to claim 9, wherein: The cross-sectional area of the conductive member on a plane parallel to the display portion is set to be greater than or equal to 5 mm2.
15. The display module according to any one of claims 1 to 8, characterized in that: The near-field communication structure includes a ferrite board and a first routing line, wherein the first routing line is arranged on the ferrite board, and an orthographic projection of the first routing line on the display portion is at least partially arranged to overlap at least partially with an orthographic projection of the binding portion on the display portion, or an orthographic projection of the first routing line on the display portion is at least partially arranged to not overlap with an orthographic projection of the binding portion on the display portion.
16. The display module according to any one of claims 1 to 14, further comprising a chip, wherein the chip is arranged on a surface of the binding portion away from the near-field communication structure, and the orthographic projection of the chip on the display portion is located within the orthographic projection of the near-field communication structure on the display portion.
17. The display module according to any one of claims 1 to 14, wherein: The orthographic projection of the near field communication structure on the display portion is set to a first projection, the orthographic projection of the binding portion on the display portion is set to a second projection, and the overlapping projection area of the second projection and the first projection is set to be greater than two-thirds of the projection area of the second projection.
18. The display module according to any one of claims 1 to 14, wherein: The projection area of the orthographic projection of the near field communication structure on the display portion is not less than two thirds of the area of the display portion.
19. The display module according to any one of claims 1 to 14, further comprising a cover plate, a curable optical adhesive, a polarizer and an encapsulation layer located on the light-emitting side of the display unit, wherein the encapsulation layer, the polarizer, the curable optical adhesive and the cover plate are stacked in sequence in a direction away from the display unit.
20. A display device, wherein: Comprising a display module as described in any one of claims 1 to 19.