CHARGER

Abstract

The invention relates to a charger, comprising a printed circuit board assembly and a heat sink enclosure. The heat sink enclosure comprises a body, a heat sink, and a fan. The body has a containment section, a first side wall, and a second side wall. The first side wall has an inner and outer surface that faces the inner surface. The inner surface of the first side wall faces the printed circuit board assembly. The second side wall is perpendicular to the first side wall. The heat sink is arranged on the outer surface of the first side wall of the body. The fan is arranged on the second side wall, drawing the heat absorbed by the heat sink outwards.

Description

Charger TECHNICAL FIELD

[0001] The present invention relates to a charger, in particular, a waterproof charger. BACKGROUND

[0002] In a waterproof charger, due to waterproofing requirements, a fan cannot directly blow air to internal heat-generating elements for heat dissipation. Therefore, internal heat energy needs to be first conducted to a metal shell, and then the heat on the shell is taken away by the fan blowing, so as to achieve the purpose of heat dissipation.

[0003] However, in the current charger on the market, such as the existing heat dissipation shell structure 9000 shown in FIG. 7, the fan 9200 is mostly installed above the accommodation part 9400 where the heat-generating elements are placed and located in the center of the upper cover 9100. The fan 9200 directly blows air to the fin structure 9300 on the shell, so that the air flows from the air inlet 9001 to the air outlet 9002 in the direction indicated by the arrow 9003.

[0004] However, since the air direction is not consistent (for example: blowing out radially from the center), and due to the size limitation of the product, the fan is often close to the shell, resulting in increased back pressure (the air blown into the fin structure 9300 from the air inlet 9001 will first hit the shell and then turn to the direction of the air outlet 9002) and cannot effectively increase the air volume, thereby limiting the heat dissipation effect.

[0005] Therefore, it is very meaningful to improve the heat dissipation shell structure in the waterproof charger.

[0006] SUMMARY

[0007] According to some embodiments of the present invention, a charger is provided, comprising a printed circuit board assembly and a heat dissipation shell structure. The heat dissipation shell structure comprises a main body, a fin structure, and a fan. The main body has an accommodation part, a first side wall, and a second side wall. The first side wall has an inner surface and an outer surface opposite to the inner surface. The inner surface of the first side wall faces the printed circuit board assembly. The second side wall is perpendicular to the first side wall. The fin structure is arranged on the outer surface of the first side wall of the main body. The fan is arranged on the second side wall to extract the heat absorbed by the fin structure outward.

[0008] In some embodiments, the fin structure has a plurality of fins, and the fins are arranged parallel to each other in a first direction.

[0009] In some embodiments, the fan has a rotation axis, and the rotation axis is parallel to a second direction perpendicular to the first direction. The fin structure and the fan form an air duct. In the air duct, the air flows in the second direction.

[0010] In some embodiments, the fan at least partially overlaps the fin structure when viewed along the second direction.

[0011] In some embodiments, the fan at least partially overlaps the printed circuit board assembly when viewed along the second direction.

[0012] In some embodiments, the main body further has a clearance between the receiving portion and the second side wall in the second direction. The fin structure does not extend into the clearance.

[0013] In some embodiments, the length of the clearance in the second direction is greater than 15 mm.

[0014] In some embodiments, the charger further comprises an upper cover and a bottom cover. The upper cover is connected to the main body. The fin structure is disposed between the upper cover and the main body. The bottom cover is opposite to the upper cover and connected to the main body. The printed circuit board assembly is disposed between the bottom cover and the main body.

[0015] In some embodiments, the charger further comprises a Form in Place Gasket (FIPG) disposed between the bottom cover and the main body to seal the bottom cover and the main body.

[0016] In some embodiments, the charger further comprises a thermal conductive glue filled in the receiving portion and contacting the printed circuit board assembly. BRIEF DESCRIPTION OF DRAWINGS

[0017] FIG. 1 is a front perspective view of a charger according to some embodiments of the present disclosure;

[0018] FIG. 2 is a back perspective view of the charger according to some embodiments of the present disclosure, in which the upper cover of the charger is represented by a dashed line;

[0019] FIG. 3 is an exploded view of the charger according to some embodiments of the present disclosure;

[0020] FIG. 4A is a top view of the combination of the main body and the fin structure in a heat dissipation housing structure according to some embodiments of the present disclosure;

[0021] FIG. 4B is a bottom view of the main body according to some embodiments of the present disclosure;

[0022] FIG. 4C is a side view of the combination of the main body and the fin structure according to some embodiments of the present disclosure;

[0023] FIG. 5 is a cross-sectional view of the charger along the line A-A in FIG. 1 according to some embodiments of the present disclosure;

[0024] FIG. 6 is a bottom perspective view of the charger according to some embodiments of the present disclosure, in which the bottom cover and the circuit board of the printed circuit board assembly are omitted;

[0025] Fig. 7 is a cross-sectional view of a conventional heat dissipation housing structure; wherein reference numerals:

[0026] 1000: charger

[0027] 1001: air inlet

[0028] 1002: air outlet

[0029] 1100: printed circuit board assembly

[0030] 1101: circuit board

[0031] 1102: electronic component

[0032] 1200: heat dissipation housing structure

[0033] 1210: main body

[0034] 1211: first side wall

[0035] 1212: second side wall

[0036] 1213: clearance

[0037] 1215: receiving portion

[0038] 1217: opening

[0039] 1219: power connection portion

[0040] 1220: fin structure

[0041] 1225: fin

[0042] 1226: bent fin

[0043] 1230: fan

[0044] 1235: rotation axis

[0045] 1300: air duct

[0046] 1305: arrow

[0047] 1400: upper cover

[0048] 1500: bottom cover

[0049] 1600: field-formed gasket

[0050] 1700: thermally conductive adhesive

[0051] 9000: conventional heat dissipation housing structure

[0052] 9001: air inlet

[0053] 9002: air outlet

[0054] 9003: Arrow

[0055] 9100: Top Cover

[0056] 9200: Fan

[0057] 9300: Fin structure

[0058] 9400: Storage Department

[0059] D1: First Direction

[0060] D2: Second Direction

[0061] L: Length Detailed Implementation

[0062] The following description provides many different embodiments or examples, and describes specific examples of various components and arrangements to implement different features of the invention. For example, if this specification describes a first feature formed "on" or "above" a second feature, it means that it may include embodiments in which the first feature and the second feature are in direct contact, or embodiments in which an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact.

[0063] Relative spatial terms, such as "below" and "above," may be used in the embodiments to facilitate the description of the relationship between elements or features in the drawings and other elements or features. In addition to the orientations shown in the drawings, these spatial terms are intended to encompass different orientations of the device in use or operation. The device may be turned to different orientations (rotated 90 degrees or other orientations), and the spatial terms used herein can be interpreted in the same way.

[0064] The charger 1000 disclosed in this specification can be a waterproof battery charger. Depending on the user's needs, the charger 1000 can be a vehicle charger for applications such as electric motorcycles. Alternatively, the charger 1000 can also be a handheld, portable charger. In the charger 1000, the printed circuit board assembly with charging functionality is sealed to achieve waterproof and dustproof effects, and a heat dissipation housing structure improves the efficiency of removing heat generated by the printed circuit board assembly. The construction of the charger 1000 will be described in detail below.

[0065] Please refer to Figures 1 through 3 first. Figure 1 is a front perspective view of the charger 1000 according to some embodiments of the present invention. Figure 2 is a rear perspective view of the charger 1000 according to some embodiments of the present invention, wherein the top cover 1400 of the charger is indicated by dashed lines. Figure 3 is an exploded view of the charger 1000 according to some embodiments of the present invention.

[0066] As shown in FIGS. 1-3, the charger 1000 mainly includes a printed circuit board assembly 1100, a heat dissipation housing structure 1200, an upper cover 1400, and a bottom cover 1500.

[0067] As shown in FIG. 3, the printed circuit board assembly 1100 and the heat dissipation housing structure 1200 are disposed between the upper cover 1400 and the bottom cover 1500. The upper cover 1400 is connected to one side (e.g., the side close to the +Z direction) of the heat dissipation housing structure 1200. The bottom cover 1500 is opposite to the upper cover 1400 and is connected to the other side (e.g., the side close to the -Z direction) of the heat dissipation housing structure 1200.

[0068] As described above, the printed circuit board assembly 1100 has a charging function and includes a circuit board 1101 and a plurality of electronic components 1102. In embodiments according to the present application, the printed circuit board assembly 1100 is received in the heat dissipation housing structure 1200 (e.g., in the receiving portion 1215 described below). In some embodiments, the circuit board 1101 is disposed parallel to the bottom cover 1500, and the circuit board 1101 is closer to the bottom cover 1500 than the electronic components 1102.

[0069] The configuration of the heat dissipation housing structure 1200 is described below with reference to FIGS. 2 and 4A-4C. FIG. 4A is a top view of the combination of the main body 1210 and the fin structure 1220 in the heat dissipation housing structure 1200 according to some embodiments of the present application. FIG. 4B is a bottom view of the main body 1210 according to some embodiments of the present application. FIG. 4C is a side view of the combination of the main body 1210 and the fin structure 1220 according to some embodiments of the present application.

[0070] The heat dissipation housing structure 1200 includes a main body 1210, a fin structure 1220, and a fan 1230.

[0071] In some embodiments, the main body 1210 can be made of a metal material for heat conduction. The main body 1210 has a receiving portion 1215 that receives the printed circuit board assembly 1100. As shown in FIG. 4B, the internal configuration of the receiving portion 1215 can be determined according to the arrangement, size, and shape of the electronic components 1102 of the printed circuit board assembly 1100. In other words, the internal configuration of the receiving portion 1215 is not limited by the drawings of the present application and can be determined according to the actual arrangement of the printed circuit board assembly 1100. In addition, the bottom cover 1500 (FIG. 3) is connected to one side of the receiving portion 1215 of the main body 1210, so that the printed circuit board assembly 1100 is disposed between the bottom cover 1500 and the main body 1210. Furthermore, the upper cover 1400 opposite to the bottom cover 1500 is connected to the other side of the main body 1210.

[0072] The main body 1210 has a first side wall 1211, as shown in FIG. 4A. The first side wall 1211 has an inner surface and an outer surface opposite to the inner surface. In this specification, the surface of the first side wall 1211 facing the printed circuit board assembly 1100 is referred to as the inner surface, and the surface of the first side wall 1211 facing away from the printed circuit board assembly 1100 (i.e., the surface of the main body 1210 facing the upper cover 1400) is referred to as the outer surface. The fin structure 1220 is disposed on the outer surface of the first side wall 1211 of the main body 1210. Therefore, the fin structure 1220 is disposed between the upper cover 1400 and the main body 1210, as shown in FIG. 2.

[0073] As shown in FIG. 4A, the fin structure 1220 has a plurality of fins 1225. The fins 1225 are arranged in parallel with each other in a first direction D1. Specifically, each fin can protrude from the outer surface of the first side wall 1211 in the Z direction in FIG. 4A, and the longitudinal length thereof extends in the Y direction. Meanwhile, the fins are arranged in parallel with each other in the X direction (i.e., the first direction D1). It should be understood that the height of the fin structure 1220 protruding from the first side wall 1211, the length extending in the Y direction, the number of fins 1225, and the like are configured in accordance with the shape and size of the back surface of the receiving portion 1215, and are not limited to the embodiments presented in this specification.

[0074] In this embodiment, the heat generated by the printed circuit board assembly 1100 is conducted to the fin structure 1220 via the main body 1210. Therefore, the main purpose of the heat dissipation housing structure 1200 is to remove the heat absorbed by the fin structure 1220.

[0075] In this specification, one of the side walls of the main body 1210 perpendicular to the first side wall 1211 is referred to as a second side wall 1212. In FIG. 4A, the second side wall 1212 is located on the right side of the drawing. At the second side wall 1212, the main body 1210 has an opening 1217 for accommodating a fan 1230, as shown in FIG. 2.

[0076] As shown in FIG. 2, the fan 1230 is disposed at the second side wall 1212, and the fan 1230 has a rotation axis 1235. The rotation axis 1235 is parallel to a second direction D2 (Y direction) perpendicular to the first direction D1 (X direction). The fan 1230 can draw the heat absorbed by the fin structure 1220 out of the charger 1000.

[0077] As shown in FIG. 4A, in some embodiments, the fin structure 1220 can further include some bent fins 1226 (indicated by the dashed circles in FIG. 4A). The bent fins 1226 are configured to direct air to the fan 1230. As described above, the configuration of the receiving portion 1215 depends on the configuration of the printed circuit board assembly 1100, and the configuration of the fin structure 1220 depends on the shape and size of the back surface of the receiving portion 1215. Therefore, whether the bent fins 1226 are needed, and the position, number, shape, etc. of the bent fins 1226 can be determined according to different printed circuit board assemblies 1100. In the embodiment shown in FIG. 4A, the fin structure 1220 has four bent fins 1226 to direct air that is far away from the fan 1230 to the fan 1230, so as to achieve a higher heat dissipation efficiency.

[0078] Next, please refer to FIG. 4A, FIG. 4C and FIG. 5. FIG. 5 is a cross-sectional view of the charger 1000 along the line segment A-A in FIG. 1 according to some embodiments of the present application.

[0079] In the embodiments according to the present application, the fin structure 1220 and the fan 1230 form an air duct 1300. In FIG. 5, the air flowing in the air duct 1300 is indicated by the arrow 1305. As shown in FIG. 5, in the air duct 1300, the air flows in the second direction D2.

[0080] In detail, in the charger 1000 according to the present application, because the fan 1230 draws out the heat absorbed by the fin structure 1220 by suction, the air inlet 1001 of the charger 1000 is located on the side away from the fan 1230, and the air outlet 1002 is located on the side of the fan 1230. By arranging the fan 1230 on the side of the fin structure 1220 (rather than in the middle as in the conventional heat dissipation shell structure 9000), the air volume can be effectively increased, and each fin 1225 can be uniformly subjected to air, thereby improving the heat dissipation efficiency. Moreover, compared with the design of blowing air from the fan to the shell, the suction design of the present application makes the air not be blocked by the internal structure of the main body 1210, further increasing the air volume.

[0081] In addition, as shown in FIG. 4A and FIG. 5, in some embodiments, the main body 1210 further has a clearance 1213. The clearance 1213 is located between the receiving portion 1215 and the second side wall 1212 in the second direction D2. The clearance 1213 is a space specially left in the main body 1210, and the fin structure 1220 does not extend into the clearance 1213.

[0082] As shown in FIG. 5, by providing the clearance 1213, the fan 1230 is kept at a distance from the fin structure 1220. This design can improve the problem of back pressure increase caused by the fan being too close to the fins in conventional heat dissipation housing structures. By reducing the back pressure, the fan 1230 according to embodiments of the present application can achieve a greater air volume, further improving the heat dissipation efficiency. In some embodiments, in the second direction D2, the length L (FIG. 4A) of the clearance 1213 is greater than 15 mm to ensure the effect of reducing back pressure.

[0083] In some embodiments, in order to achieve mechanism miniaturization, the configuration of the fin structure 1220 and the printed circuit board assembly 1100 can correspond to the size of the fan 1230. For example, as shown in FIG. 4C, viewed along the second direction D2, the fan 1230 at least partially overlaps the fin structure 1220, and the fan 1230 also at least partially overlaps the receiving portion 1215 (and the printed circuit board assembly 1100 received therein). In this way, the size in the Z direction can be effectively limited.

[0084] The assembly process of the charger 1000 will be described with reference to FIG. 3 and FIG. 6. FIG. 6 is a bottom perspective view of the charger 1000 according to some embodiments of the present application, in which the bottom cover 1500 and the circuit board 1101 of the printed circuit board assembly 1100 are omitted.

[0085] In assembling the charger 1000, the fin structure 1220 and the main body 1210 can be fixed together first. In some embodiments, the fin structure 1220 can be integrally formed with the main body 1210.

[0086] Next, as shown in FIG. 6, the printed circuit board assembly 1100 (the circuit board 1101 is omitted in FIG. 6 for clarity) can be placed into the receiving portion 1215 of the main body 1210 first. After placement, the thermally conductive adhesive 1700 (FIG. 3) is filled into the receiving portion 1215 so that the thermally conductive adhesive 1700 contacts the printed circuit board assembly 1100. The thermally conductive adhesive 1700 is used to quickly conduct the heat generated by the electronic components 1102 to the main body 1210, and can protect the electronic components 1102 from damage caused by impact, vibration, etc. In some embodiments, the thermally conductive adhesive 1700 can be cured after heating to stably combine with the electronic components 1102, improving stability.

[0087] Next, a field-induced pad graphic (FIPG) 1600 is formed at the edge of the main body 1210 to combine the main body 1210 and the bottom cover 1500. The FIPG 1600 is provided between the bottom cover 1500 and the main body 1210 to seal the bottom cover 1500 and the main body 1210. After the bottom cover 1500 and the main body 1210 are sealed together, the receiving portion 1215 achieves the effect of being waterproof and dustproof, protecting the internal printed circuit board assembly 1100.

[0088] Finally, the fan 1230 and the upper cover 1400 are assembled and fixed on the main body 1210 to complete the assembly of the charger 1000.

[0089] In addition, as shown in FIG. 2 and FIG. 6, the main body 1210 can further include a plurality of power connection portions 1219. In some embodiments, the main body 1210 includes two power connection portions 1219 for connecting a power output line and a power input line (not shown) respectively. Moreover, the power lines are electrically connected to the printed circuit board assembly 1100 sealed inside the main body 1210 through the power connection portions 1219. In the embodiments of the present application, the power connection portions 1219 are located on the side surface perpendicular to the first side wall 1211 and the second side wall 1212, but the location of the power connection portions 1219 is not limited thereto and can be set at a suitable location as required.

[0090] In summary, the present application provides a waterproof and dustproof charger 1000. In the heat dissipation shell structure 1200 in which the printed circuit board assembly 1100 is sealed, the effect of increasing air flow can be achieved by setting the fin structure 1220 and the fan 1230 on the side, and the heat dissipation efficiency is significantly improved. Moreover, by filling the heat-conducting glue 1700 in the accommodation portion 1215 in which the printed circuit board assembly 1100 is placed, the heat generated by the printed circuit board assembly 1100 can be removed more effectively. In addition, by using the in-situ formed gasket 1600 to seal the printed circuit board assembly 1100 in the heat dissipation shell structure 1200, the waterproof and dustproof properties of the printed circuit board assembly 1100 are ensured, and the stability of the overall device is improved.

[0091] Although the embodiments of the present application and their advantages have been disclosed as above, it should be understood that any person with ordinary knowledge in the art can make modifications, replacements and refinements without departing from the spirit and scope of the present application. In addition, the scope of protection of the present application is not limited to the processes, machines, manufacture, material composition, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the art can understand the current or future developed processes, machines, manufacture, material composition, devices, methods and steps from the disclosure of the present application, as long as they can substantially achieve the same function or obtain substantially the same results as in the embodiments described herein. Therefore, the scope of protection of the present application includes the above processes, machines, manufacture, material composition, devices, methods and steps. In addition, each application patent range constitutes a separate embodiment, and the scope of protection of the present application also includes the combination of each application patent range and embodiment.

Claims

1. A charger characterized by: Comprising: a printed circuit board assembly; and a heat dissipation housing structure comprising: a main body having: a receiving portion receiving the printed circuit board assembly; a first side wall having an inner surface and an outer surface opposite to the inner surface, wherein the inner surface of the first side wall faces the printed circuit board assembly; and a second side wall perpendicular to the first side wall; a fin structure disposed on the outer surface of the first side wall of the main body; and a fan disposed on the second side wall to draw out heat absorbed by the fin structure. wherein the fin structure has a plurality of fins arranged parallel to each other in a first direction.

2. The charger of claim 1, wherein:

3. The charger of claim 2, wherein: the fan has a rotation axis parallel to a second direction perpendicular to the first direction; the fin structure and the fan form an air duct; in the air duct, air flows along the second direction. wherein, 4. The charger of claim 3, wherein: the fan and the fin structure at least partially overlap when viewed along the second direction. wherein, 5. The charger of claim 3, wherein: the fan and the printed circuit board assembly at least partially overlap when viewed along the second direction. wherein the main body further has a clearance portion between the receiving portion and the second side wall in the second direction, wherein the fin structure does not extend into the clearance portion.

6. The charger of claim 3, wherein: wherein a length of the clearance portion in the second direction is greater than 15 mm.

7. The charger of claim 6, wherein: further comprising:

8. The charger of claim 1, wherein: an upper cover connected to the main body, wherein the fin structure is disposed between the upper cover and the main body; and a bottom cover opposite to the upper cover and connected to the main body, wherein the printed circuit board assembly is disposed between the bottom cover and the main body. further comprising: a field installable gasket (FIPG) disposed between the bottom cover and the main body to seal the bottom cover and the main body.

9. The charger of claim 8, wherein: further comprising: a thermal conductive paste filled in the receiving portion and contacting the printed circuit board assembly.

10. The charger of claim 1, wherein: ​ ​

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