ELECTRONIC DEVICES AND METHODS FOR OPERATING THESE DEVICES

Abstract

The invention relates to an electronic device which may include: a lens element; an image sensor for capturing light that has passed through the lens element and converting this light into an electrical signal; and at least one processor configured to control the image sensor. The image sensor is capable of reading out pixel values ​​on the basis of a first readout cycle when outputting an image frame on the basis of a first readout mode. The image sensor is capable of reading out pixel values ​​on the basis of a second readout cycle longer than the first readout cycle when outputting an image frame on the basis of a second readout mode.An image sensor can be configured such that, when performing a multi-frame capture operation consisting of a first operation to output the first image frame on the basis of the first readout mode and a second operation to output the second image frame on the basis of the second readout mode, on the basis of the requirements of at least one processor, the image sensor performs the first operation on the basis of a third readout operation cycle equal to / longer than the second readout operation cycle, and performs the second operation on the basis of the third readout operation cycle. Other variations of the invention may exist. The invention also relates to a method for operating this electronic device.

Description

Image sensor, electronic device including image sensor, and method of operating same

[0001] The present disclosure relates to an image sensor, an electronic device including the image sensor, an operating method thereof, and a computer-readable recording medium for performing the operating method.

[0002] An electronic device may include an image sensor for capturing an image of a subject. The image sensor may detect information about the captured image of the subject by using a photoelectric conversion element that outputs an electrical signal based on the intensity of light reflected from the subject. For example, the image sensor may include a complementary metal-oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device according to one embodiment may include a lens unit, an image sensor that receives light passing through the lens unit and converts it into an electrical signal, and at least one processor configured to control the image sensor. The image sensor may read out a pixel value based on a first readout operation period when outputting an image frame based on a first readout mode. The image sensor may read out a pixel value based on a second readout operation period that is longer than the first readout operation period when outputting an image frame based on a second readout mode. The image sensor may be configured to perform a multi-frame shooting operation including a first operation of outputting a first image frame based on the first readout mode and a second operation of outputting a second image frame based on the second readout mode based on a request of the at least one processor, perform the first operation based on a third readout operation period that is longer than the second readout operation period, and perform the second operation based on the third readout operation period.

[0005] A method of operating an electronic device including an image sensor according to one embodiment may include an operation of selecting one of a first readout mode, a second readout mode, or a multi-frame capturing mode. The method may include an operation of reading out pixel values ​​through a first sampling operation during a first readout operation period when the first readout mode is selected. The method may include an operation of reading out pixel values ​​through a second sampling operation during a second readout operation period longer than the first readout operation period when the second readout mode is selected. The method may include a multi-frame capturing operation of reading out a first image frame and a second image frame when the multi-frame capturing mode is selected. The multi-frame capturing operation may include a first operation of reading out pixel values ​​of the first image frame based on the first sampling operation during a third readout operation period longer than the second readout operation period. The multi-frame capturing operation may include a second operation of reading out pixel values ​​of the second image frame based on the second sampling operation during the third readout operation period.

[0006] A non-transitory computer-readable recording medium according to one embodiment may be a computer program recorded thereon for executing the above-described method when an electronic device including an image sensor is executed.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a block diagram illustrating a camera module according to various embodiments.

[0009] FIG. 3 is a block diagram illustrating an example of an image sensor according to one embodiment.

[0010] FIG. 4 is a diagram illustrating an example of a circuit that constitutes a pixel included in an image sensor according to one embodiment.

[0011] FIG. 5 is a diagram illustrating an example of an operation signal for performing a reset operation for resetting a pixel by an image sensor according to one embodiment and an operation signal for performing an operation for reading out a pixel value based on a first readout mode.

[0012] FIG. 6 is a diagram illustrating examples of operation signals for performing an operation for reading pixel values ​​based on a second reading mode by an image sensor according to one embodiment.

[0013] FIG. 7 is a graph schematically illustrating the operation of an image sensor according to one embodiment of the present invention to read pixel values ​​line by line over time.

[0014] FIG. 8 illustrates a case where a time interval during which an image sensor performs a sampling operation to read out pixel values ​​included in a first line and a time interval of a reset operation signal to reset pixels included in a second line overlap.

[0015] FIG. 9 illustrates examples of vertical synchronization signals and horizontal synchronization signals for an image sensor to read out a first image frame and a second image frame according to one embodiment.

[0016] FIG. 10 is a diagram illustrating examples of a synchronized reset operation, a first operation for reading pixel values ​​based on a first read mode, and a second operation for reading pixel values ​​based on a second read mode, according to one embodiment.

[0017] FIG. 11 is a flowchart illustrating a process by which an image sensor reads pixel values ​​according to one embodiment.

[0018] FIG. 12 is a diagram illustrating a structure in which an image sensor according to one embodiment synthesizes and outputs sampling results sampled based on a second readout mode.

[0019] FIG. 13 is a diagram illustrating a structure in which an image sensor according to one embodiment selectively outputs a sampling result sampled based on a second readout mode.

[0020] FIG. 14 is a diagram illustrating an operation signal for capturing an image based on a high dynamic range shooting mode with a difference in parallax by an image sensor according to one embodiment.

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the disclosed embodiments. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0022] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0045] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0046] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0048] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0049] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0050] FIG. 2 is a block diagram (200) illustrating a camera module (180) according to various embodiments. Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0051] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0052] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of the memory (130) or as a separate memory that operates independently therefrom.

[0053] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) for at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0054] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0055] FIG. 3 is a block diagram illustrating an example of an image sensor (230) according to one embodiment.

[0056] Referring to FIG. 3, an image sensor (230) according to one embodiment may include a controller (310), a timing generator (320), a row driver (330), a pixel array (340), and a readout circuit (350). In one embodiment, at least a portion of an image signal processor (e.g., an image signal processor (260) of FIG. 2) may be implemented within the image sensor (230). The image signal processor (e.g., an image signal processor (260) of FIG. 2) may be configured as a separate component independent of the image sensor (230).

[0057] In one embodiment, the image sensor (230) may convert light received by the pixel array (340) into an electrical signal to generate an image signal. The image signal may be provided to an image signal processor (e.g., the image signal processor (260) of FIG. 2). The image signal may be temporarily stored in a data buffer (e.g., the memory (250) of FIG. 2) before being provided to the image signal processor (e.g., the image signal processor (260) of FIG. 2).

[0058] In one embodiment, the image sensor (230) may be mounted on an electronic device having a light sensing function. For example, the image sensor (230) may be included in a camera module (180) of the electronic device (101).

[0059] In one embodiment, the controller (310) can control at least some of the components (320, 330, 340, 350) included in the image sensor (230). The controller (310) can control the operating timing of the components (320, 330, 340, 350) using control signals. For example, the controller (310) can adjust a reference signal for the operation of the image sensor (230), or control the timing generator (320) to adjust the floating diffusion (FD) capacitance included in the pixel circuits within the pixel array (340) via the row driver (330).

[0060] In one embodiment, the controller (310) may receive a mode signal indicating a shooting mode from an application processor (e.g., the main processor (121) of FIG. 1). The controller (310) may control the image sensor (230) based on the received mode signal. For example, the application processor (e.g., the main processor (121) of FIG. 1) may transmit a mode signal according to the shooting mode to the controller (310). The controller (310) may control a circuit included in the pixel array (340) to output a pixel signal indicating a pixel value for each of a plurality of pixels included in the pixel array (340), or a pixel signal for some of the plurality of pixels. For example, when the mode signal indicates a first mode, the controller (310) may control the pixel array (340) to output a pixel signal based on the first readout mode. For example, when the mode signal indicates a second mode, the controller (310) can control the pixel array (340) to output a pixel signal based on the second readout mode. For example, when the mode signal indicates a multi-frame shooting mode, the pixel array (340) can be controlled to output a pixel signal according to a multi-frame shooting operation including an operation of outputting a pixel signal for a first image frame based on a first readout mode and an operation of outputting a pixel signal for a second image frame based on a second readout mode.

[0061] In the present disclosure, each readout mode may mean that the sampling method for detecting a pixel value is different from each other. For example, when reading a pixel value based on a first readout mode, one reset sampling operation and one signal sampling operation may be performed, and when reading a pixel value based on a second readout mode, two reset sampling operations and two signal sampling operations may be performed. Therefore, the minimum operation time required to perform a readout operation for reading a pixel value based on the first readout mode may be shorter than the minimum operation time required to perform a readout operation for reading a pixel value based on the second readout mode. For example, when reading a pixel value based on the first readout mode, the image sensor (230) may perform the readout operation during the first readout operation period, and when reading a pixel value based on the second readout mode, the readout operation may be performed during the second readout operation period, which is longer than the first readout operation period.

[0062] In one embodiment, the readout circuit (350) can read out pixel values. The readout circuit (350) can sample pixel signals received from the pixel array (340) to read out pixel values. The timing generator (320) can generate a signal that serves as a temporal reference for the operation of components included in the image sensor (230). The timing at which the row driver (330) and the readout circuit (350) operate can be controlled based on the signal generated by the timing generator (320).

[0063] In one embodiment, the pixel array (340) may include a plurality of pixels (PX), a plurality of row lines (e.g., RL1, RL2) connected to the plurality of pixels (PX), and a plurality of column lines (CL). For example, the pixel array (340) may include a first pixel (341) connected to a first row line (RL1) and a second pixel (342) included in a second row line (RL2). The image sensor (230) may read out pixel values ​​for pixels included in the plurality of column lines (CL) in parallel. For example, the readout circuit (350) may read out pixel values ​​for pixels connected to one row line (e.g., the first row line (RL1) or the second row line (RL2)) in parallel. In the present disclosure, an operation of reading out pixel values ​​in units of one line may be referred to as one readout operation. The pixels (PX) may include at least one light-receiving element. A photodetector can convert incident light into an electrical signal, i.e., multiple analog pixel signals, based on the amount of light. The level of the analog pixel signal output from the photodetector can increase depending on the amount of charge output from the photodetector. Therefore, the level of the analog pixel signal output from the photodetector can increase depending on the amount of light received by the corresponding pixel.

[0064] In one embodiment, the pixel array (340) can adjust a conversion gain during the process of generating analog pixel signals. The conversion gain can refer to the size of an analog pixel signal output from the pixel array (340) for a unit photocharge generated by photoelectric conversion. The conversion gain can be adjusted by changing a floating diffusion capacitance by operating at least one transistor included in the pixel array (340).

[0065] In one embodiment, row lines (e.g., RL1, RL2) may be connected to a plurality of pixels including a first pixel (341) arranged along a first direction. A row driver (330) may transmit an operation signal to a device (e.g., a transistor) included in a first pixel (341) connected through the first row line (RL1). The row driver (330) may transmit an operation signal to a device included in a second pixel (342) connected through a second row line (RL2). Column lines (CL) may be arranged in a second direction intersecting the first direction. Each of the column lines (CL) may be connected to pixels arranged in the second direction. Pixels connected to one column line (CL) may be arranged in the second direction. The column lines (CL) may transmit pixel signals output from pixels driven by the row lines among the pixels (PX) to the readout circuit (350). In one embodiment, a single pixel included in the pixel array (340) may include, but is not limited to, multiple sub-pixel groups.

[0066] In one embodiment, the row driver (330) can generate an operation signal for driving the pixel array (340) in response to a control signal of the timing generator (320). The row driver (330) can transmit the generated operation signal to at least some of the plurality of pixels (PX). The row driver (330) can control the plurality of pixels (PX) to perform an operation of detecting light in units of row lines. The row line unit can include at least one row line (e.g., RL1 or RL2). For example, the row driver (330) can transmit a selection signal (e.g., the selection signal (SEL) of FIG. 4), a reset signal (e.g., the reset signal (RG) of FIG. 4), a transmission signal (e.g., the transmission signal (TG1) of FIG. 4), and a gain control signal (e.g., the gain control signal (Tr) of FIG. 4) to the pixel array (340).

[0067] In one embodiment, the readout circuit (350) may convert a pixel signal (e.g., an electrical signal) output from a pixel (e.g., a first pixel (341)) connected to a selected row line (e.g., a first row line (RL1)) among a plurality of pixels (PX) in response to a control signal from the timing generator (320) into a pixel value representing the amount of light. The readout circuit (350) may convert each pixel signal output through each column line (CL) into a pixel value. Pixel values ​​having at least one bit may constitute an image frame. The readout circuit (350) may include, for example, at least one of a selector, a comparator, or a counter circuit. The output of the readout circuit (350) may be transmitted to an image signal processor (e.g., the image signal processor (260) of FIG. 2). The output of the readout circuit (350) may be temporarily stored in a data buffer before being transmitted to the image signal processor (e.g., the image signal processor (260) of FIG. 2).

[0068] FIG. 4 is a diagram illustrating an example of a circuit that constitutes a pixel (PX) included in an image sensor (230) according to one embodiment.

[0069] However, FIG. 4 only illustrates an example of a pixel configuration for understanding one embodiment, and the configuration of pixels included in the image sensor (230) of one embodiment is not limited to the example illustrated in FIG. 4. For example, FIG. 4 illustrates a structure in which one light-receiving element (410) (e.g., a photodiode) included in a pixel (PX) is connected to one node (430), but light-receiving elements included in a plurality of pixels (e.g., four pixels) may be connected to one floating node. Each of the plurality of pixels (PX) included in the pixel array (340) of FIG. 3 may include at least a part of the circuit illustrated in FIG. 4 (e.g., the light-receiving element (410)).

[0070] In one embodiment, the light-receiving element (410) may be connected to the node (430) through a first transistor (420). The first transistor (420) may function as a switch that electrically connects or disconnects the light-receiving element (410) to the floating node (430) according to a transmission signal (TG1). The node (430) may further include a second transistor (450) that resets the node (430) connected to the light-receiving element (410) according to a reset signal (RG). The second transistor (450) may function as a switch that controls the electrical connection between the node (430) and the reference voltage (VDD). When the switch composed of the second transistor (450) is closed by the reset signal (RG), the voltage of the node (430) may become equal to the reference voltage (VDD). Thereafter, when the switch composed of the first transistor (420) is closed while the switch composed of the second transistor (450) is open, the current generated by the light-receiving element (410) flows, so that charges may be accumulated in the first floating diffusion capacitor (431) (or the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432)). The voltage of the node (430) may be lowered due to the charges accumulated in the first floating diffusion capacitor (431) (or the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432)).

[0071] In one embodiment, a first floating diffusion capacitor (431) may be connected to a node (430). A second floating diffusion capacitor (432) may be connected to the node (430) via a third transistor (440). The third transistor (440) may constitute a switch that controls the connection between the second floating diffusion capacitor (432) and the node (430) based on a gain control signal (Tr). The image sensor (230) may adjust the floating diffusion capacitance by controlling the connection between the second floating diffusion capacitor (432) and the node (430).

[0072] In one embodiment, the fourth transistor (460) may be connected to a column line (CL) (e.g., the column line (CL) of FIG. 3). The fourth transistor (460) may transmit a pixel signal to the column line (CL) based on a selection signal (SEL) received through the row line (e.g., the first row line (RL1) of FIG. 3) when the pixel (PX) (e.g., the first pixel (341) of FIG. 3) is selected by the row driver (330). As the voltage of the node (430) decreases due to the charge accumulated in the first floating diffusion capacitor (431) (or the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432)), the voltage transmitted to the column line (CL) may change. The voltage transmitted to the column line (CL) may be transmitted to the readout circuit (350) as a pixel signal. The readout circuit (350) can read out a pixel value based on the degree to which the voltage transmitted through the column line (CL) has changed from a reference value (e.g., reference voltage (VDD)).

[0073] FIG. 5 is a diagram illustrating an example of an operation signal for performing a reset operation (510) for resetting a pixel (PX) by an image sensor (230) according to one embodiment and an operation signal for performing a first read operation (520) for reading out a pixel value based on a first read mode.

[0074] An image sensor (230) according to one embodiment can transmit an operation signal to a pixel according to a reset operation (510) that resets the pixel (PX). The reset operation (510) can include an operation of transmitting a shutter pulse (500) (or shutter signal) as a transmission signal (TG1) while the reset signal (RG) is ON.

[0075] According to one embodiment, the image sensor (230) may perform an exposure operation to expose a light-receiving element (e.g., the light-receiving element (410) of FIG. 4) of the pixel (PX) to light for an exposure time after resetting the pixel (PX). After the exposure time has elapsed, the image sensor (230) may perform an operation to read out a pixel value.

[0076] In one embodiment, the image sensor (230) may perform an operation of reading out pixel values ​​based on a readout mode selected from among a plurality of readout modes. For example, when a camera module (e.g., the camera module (180) of FIGS. 1 and 2) included in an electronic device (e.g., the electronic device (101) of FIG. 1) captures an image based on a single frame with low performance, the image sensor (230) may perform a readout operation of reading out pixel values ​​based on a first readout mode.

[0077] In one embodiment, the first readout operation (520) may include an operation of reading pixel values ​​based on correlated double sampling (CDS). The first readout operation (520) illustrated in the first readout operation (520) may be referred to as normal correlated double sampling. The correlated double sampling may include a reset sampling operation (521) and a signal sampling operation (522). The reset sampling operation (521) may include an operation of performing sampling in a reset state during a first sampling period (S1) before charges generated by the light-receiving element (410) by the transmission signal (TG1) are accumulated in the first floating diffusion capacitor (431). The signal sampling operation (522) may include an operation of performing sampling during a second sampling period (S2) after the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431). The sampling operations (521, 522) may be performed (501) using the first floating diffusion capacitor (431). The sampling operations (521, 522) may also be performed (502) using the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432). For example, when one or more light-receiving elements including a light-receiving element (410) are connected to a node (430) and a signal obtained from one or more light-receiving elements is small (when the illumination is low), the image sensor (230) can perform sampling using the first floating diffusion capacitor (431) by setting the gain control signal (Tr) to off. When the signal obtained from one or more light-receiving elements is large (when the illumination is high), the image sensor (230) can perform sampling using the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432) by setting the gain control signal (Tr) to on.The first reading operation (520) can be performed during the first reading operation period (P1).

[0078] In one embodiment, during a first read operation period (P1) during which one pixel (e.g., the second pixel (342) of FIG. 3) performs a first read operation (520), another pixel (e.g., the first pixel (341) of FIG. 3) connected to the same column line (CL) may perform at least a part of a reset operation (500). For example, when the image sensor (230) continuously captures multiple image frames, while one pixel (e.g., the second pixel (342) of FIG. 3) performs the first read operation (520) to read out a pixel value for the first image frame, another pixel (e.g., the first pixel (341) of FIG. 3) may perform the reset operation (510) to perform a capture operation for the second image frame. When a shutter pulse (500) is issued to another pixel (e.g., the first pixel (341) of FIG. 3) while a pixel connected to the same column line (CL) (e.g., the second pixel (342) of FIG. 3) performs a sampling operation (521, 522), noise may occur in the sampling result. The image sensor (230) according to one embodiment may transmit a shutter pulse (500) to the pixel circuit in a section excluding sampling sections (S1, S2) in which another pixel connected to the same column line (CL) as the pixel performing the reset operation (510) performs sampling.

[0079] FIG. 6 is a diagram illustrating examples of operation signals for performing an operation for reading pixel values ​​based on a second reading mode by an image sensor (230) according to one embodiment.

[0080] In one embodiment, the image sensor (230) can read pixel values ​​based on a second readout mode that reads pixel values ​​based on a second readout operation period (P2) that is longer than a first readout operation period (P1). For example, the second readout operation (610) can include an operation of reading pixel values ​​based on a double conversion gain (DCG) CDS. For example, the third readout operation (620) can include an operation of reading pixel values ​​based on a low noise multi sampling CDS.

[0081] In one embodiment, the image sensor (230) can acquire a high dynamic range (HDR) image with an extended dynamic range by performing a multi-frame shooting operation that captures multiple images based on different readout modes. For example, the image sensor (230) can acquire a high dynamic range image by synthesizing images acquired based on bracketing shooting that captures multiple images based on different sampling methods.

[0082] The dual conversion gain CDS may include two reset sampling operations (611-1, 611-2) and two signal sampling operations (612-1, 612-2). The first reset sampling operation (611-1) may be performed in a reset state before the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431) while the second floating diffusion capacitor (432) is not connected to the node (430). The second reset sampling operation (611-2) may be performed in a reset state before the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432) while the second floating diffusion capacitor (432) is connected to the node (430). The first signal sampling operation (612-1) may be performed after the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431) while the second floating diffusion capacitor (432) is not connected to the node (430). The second signal sampling operation (612-2) may be performed after the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432) while the second floating diffusion capacitor (432) is connected to the node (430).

[0083] The low-noise multi-sampling CDS may include two reset sampling operations (621-1, 621-2) and two signal sampling operations (622-1, 622-2). The reset sampling operations (621-1, 621-2) may include an operation of performing sampling in a reset state before the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431) (or the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432)). The signal sampling operations (622-1, 622-2) may include an operation of performing sampling after the charge generated by the light-receiving element (410) by the transmission signal (TG1) is accumulated in the first floating diffusion capacitor (431) (or the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432)). The sampling operations (621-1, 621-2, 622-1, 622-2) may be performed (501) using the first floating diffusion capacitor (431). The sampling operations (621-1, 621-2, 622-1, 622-2) may also be performed (502) using the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432).

[0084] FIG. 7 is a graph schematically illustrating the operation of an image sensor (230) according to one embodiment of the present invention to read pixel values ​​line by line over time.

[0085] In one embodiment, the first graph (710) represents an operation in which the image sensor (230) reads pixel values ​​to be included in an image frame based on a first exposure time and a first readout mode. The image sensor (230) according to one embodiment may perform a reset operation (711) to reset pixels of a row line from which pixel values ​​are to be readout. The image sensor (230) may perform an exposure operation (712) on the pixels of the reset row line during the first exposure time. The image sensor (230) may perform a first readout operation (713) on the pixels of the corresponding row line after the first exposure time has elapsed. When the first readout operation (713) is terminated, the image sensor (230) may sequentially perform the reset operation and the exposure operation on the next row so that the readout operation on the next row can be performed.

[0086] In one embodiment, the second graph (720) represents an operation of reading pixel values ​​to be included in an image frame based on a second exposure time that is longer than the first exposure time and a first readout mode. In one embodiment, another image sensor (230) may perform the readout operation after performing the exposure operation (722) for the second exposure time.

[0087] In one embodiment, the third graph (730) represents an operation of reading pixel values ​​to be included in an image frame based on a second readout mode having a longer readout operation period than the first readout mode. In order for the image sensor (230) according to one embodiment to perform the readout operation for pixels included in the second row line after the second readout operation (733) for pixels included in the first row line is completed, the interval between the time at which the reset operation for one row line is performed and the time at which the reset operation for the next row line is performed may be longer than in the cases illustrated in the first graph (710) and the second graph (720). For example, referring to FIG. 8, the slope of the parallelogram representing the image capturing operations of each row line may change. As a result, if the time at which the reset operation is initiated by starting the capturing operation for the next image frame is not delayed, the reset operation for another row may be performed while the readout operation for one row is performed. In this case, it may be difficult to synchronize the sampling operation timing of the read operation and the shutter operation timing of the reset operation so that they do not overlap.

[0088] FIG. 8 illustrates a case where a time interval during which the image sensor (230) performs a sampling operation to read out a pixel value included in a first line (e.g., line 841) and a time interval of a reset operation signal to reset a pixel included in a second line (e.g., line 842) overlap.

[0089] In one embodiment, the image sensor (230) may control an operation of reading pixel values ​​included in an image frame based on a vertical synchronization signal (810). When the image sensor (230) performs a multi-frame shooting operation, the vertical synchronization signal (810) may include a first section (811) for outputting a first image frame and a second section (812) for outputting a second image frame. For example, the first section (811) may be a section for reading a first image frame based on a reading operation according to a second reading mode (e.g., the second reading operation (610) or the third reading operation (620) of FIG. 6). For example, the second section (812) may be a section for reading a second image frame based on a reading operation according to a first reading mode (e.g., the first reading operation (520) of FIG. 5).

[0090] In the present disclosure, the term "vertical synchronization signal" may refer to a signal that performs a readout operation during a period in which the signal is high, and does not perform the readout operation to determine a frame rate during a period in which the signal is low. For example, the "vertical synchronization signal" may indicate a time period in which a single image frame is readout. The term "horizontal synchronization signal" in the present disclosure may refer to a signal that serves as a reference for the time point in which a readout operation is performed on a line-by-line basis.

[0091] In one embodiment, the image sensor (230) can control an operation of reading pixel values ​​on a line-by-line basis based on a horizontal synchronization signal (820). For example, the image sensor (230) can perform a second readout operation (610) for a row line (e.g., the second row line (RL2) of FIG. 3) during a third period (821) corresponding to a second readout operation period (P2) within a first period (811). The image sensor (230) can perform a first readout operation (520) for another row line (e.g., the first row line (RL1) of FIG. 3) during a fourth period (822) corresponding to a first readout operation period (P1) within a second period (812). A fifth section (830) may occur during which a reset operation (510) for capturing images in the second section (812) for other row lines is performed while a second read operation (610) is performed in the third section (821).

[0092] In one embodiment, since the lengths of the third section (821) and the fourth section (822) are different, the shutter pulse (500) included in the reset operation (510) during the fifth section (830) may occur while sampling (e.g., the second signal sampling operation (612-2)) is performed within the second readout operation (610). Accordingly, when the interval of the horizontal synchronization signal (820) for the second section (812) is the first readout operation period (P1), the shooting operation of the second section (812) that outputs the second image frame may need to be delayed by an amount corresponding to the fifth section (830) to prevent the shutter pulse from occurring while the sampling operation of another line is performed.

[0093] FIG. 9 illustrates an example of a vertical synchronization signal (910) and a horizontal synchronization signal (920) for reading out a first image frame and a second image frame by an image sensor (230) according to one embodiment.

[0094] In one embodiment, the image sensor (230) can control the pixel array (340) based on a vertical synchronization signal (910) that includes a first section (911) for reading a first image frame and a second section (912) for reading a second image frame. The image sensor (230) can read the first image frame based on a second readout mode and can read the second image frame based on the first readout mode.

[0095] In one embodiment, the first read mode may be a read mode that can be performed based on a first read operation period (P1), and the second read mode may be a read mode that can be performed based on a second read operation period (P2) that is longer than the first read operation period (P1). When performing a multi-frame shooting operation, the image sensor (230) may synchronize the interval between the first horizontal synchronization signal (921) for the first section (911) and the second horizontal synchronization signal (922) for the second section (912) to the second read operation period (P2). When the read operation period per row line is constant, the interval in which the shutter pulse (500) occurs within the reset operation may not overlap with the interval in which sampling is performed within the read operations, thereby preventing the shutter pulse (500) from occurring while sampling is performed in another line even if the read operations are repeated.

[0096] FIG. 10 is a diagram illustrating examples of a synchronized reset operation (1010), a first operation (1020) for reading pixel values ​​based on a first read mode, and a second operation (1030 or 1040) for reading pixel values ​​based on a second read mode, according to one embodiment.

[0097] In one embodiment, when performing a multi-frame shooting operation that captures an image based on a multi-frame shooting mode, the image sensor (230) can synchronize a reset operation (1010) (e.g., reset operation (510) of FIG. 5), a first operation (1020) (e.g., first readout operation (520) of FIG. 5), and a second operation (1030 or 1040) (e.g., second readout operation (610) or third readout operation (620) of FIG. 6). The image sensor (230) can increase the first readout operation period of the first operation (1020) to synchronize the readout operation periods of the readout operations. The operations (1010, 1020, 1030, 1040) can be synchronized based on the longest operation period (e.g., the second read operation period (P2)) among the operation periods required to perform the operations (1010, 1020, 1030, 1040). In one embodiment, since the length of the horizontal synchronization signal corresponds to the period of the read operation, the image sensor (230) can synchronize the length of the horizontal synchronization signal to the longer one among the lengths of the horizontal synchronization signals of the plurality of operation modes for the plurality of read operations.

[0098] In one embodiment, when performing a first operation (1020) for reading out pixel values ​​based on a first readout mode during a multi-frame shooting operation, the image sensor (230) can perform a sampling operation during a first period (S1) and a second period (S2) within a synchronized operation period (e.g., a second readout operation period (P2)). When performing a second operation (1030 or 1040) for reading out pixel values ​​based on a second readout mode during a multi-frame shooting operation, the image sensor (230) can perform a sampling operation during the first period (S1), the second period (S2), the third period (S11), and the fourth period (S22) within the synchronized operation period (P2). When performing a reset operation (1010) during a multi-frame shooting operation, the image sensor (230) may transmit a shutter pulse (500) to a specific row line within the pixel array (340) within a synchronized operation period (e.g., a second readout operation period (P2)) excluding the first section (S1), the second section (S2), the third section (S11), and the fourth section (S22). However, setting the operation period related to the performance of the readout operation to the second readout operation period (P2) is for synchronizing the lengths of the respective operation periods, and is not limited thereto. For example, the image sensor (230) may perform the first operation (1020) and the second operation (1030 or 1040) based on a third readout operation period whose length is greater than or equal to the second readout operation period (P2).

[0099] In one embodiment, the reset operation (1010), the first operation (1020), or the second operation (1030 or 1040) may be controlled to be performed based on a horizontal synchronization signal (e.g., the horizontal synchronization signal (920) of FIG. 9) corresponding to the synchronized operation period (P2).

[0100] FIG. 11 is a flowchart (1100) illustrating a process for an image sensor (230) to read pixel values ​​according to one embodiment.

[0101] According to one embodiment, in operation 1110, the image sensor (230) included in the electronic device (101) may determine a shooting mode for capturing an image. For example, when a user input for capturing an image is received, the electronic device (101) may identify a shooting mode set for capturing the image. The electronic device (101) may determine which reading mode the image sensor (230) will use to acquire image data based on the shooting mode for capturing the image.

[0102] According to one embodiment, when the capturing mode for capturing an image is the first mode, the image sensor (230) can read out pixel values ​​based on the first readout mode. In operation 1120, the image sensor (230) can perform an operation of reading out pixel values ​​based on the first readout mode during the first readout operation period. For example, the image sensor (230) can perform the readout operation illustrated in FIG. 5 (e.g., the first readout operation (520) of FIG. 5) during the first readout operation period (e.g., P1 of FIG. 5). The image sensor (230) can control a period during which pixels connected to a specific line in the pixel array (340) perform the readout operation based on a horizontal synchronization signal corresponding to the first readout operation period.

[0103] According to one embodiment, when the capturing mode for capturing an image is the second mode, the image sensor (230) may read out pixel values ​​based on the second readout mode. In operation 1140, the image sensor (230) may perform an operation of reading out pixel values ​​based on the second readout mode during a second readout operation period. For example, the image sensor (230) may perform the readout operation illustrated in FIG. 6 (e.g., the second readout operation (610) or the third readout operation (620) of FIG. 6) during the second readout operation period (e.g., P2 of FIG. 6). The image sensor (230) may control a period during which pixels connected to a specific line in the pixel array (340) perform the readout operation based on a horizontal synchronization signal corresponding to the second readout operation period. The second readout operation period may be longer than the first readout operation period.

[0104] According to one embodiment, when the capturing mode for capturing an image is a multi-frame capturing mode, the image sensor (230) may determine a readout mode for capturing a plurality of image frames. The image sensor (230) may read out pixel values ​​included in the image frames based on a plurality of different readout modes. For example, the image sensor (230) may read out pixel values ​​for a first image frame based on a first readout mode, and may read out pixel values ​​for a second image frame based on a second readout mode. The electronic device (101) may determine a period to be applied to a readout operation for the plurality of image frames based on readout operation periods required in the plurality of readout modes. For example, the image sensor (230) may perform a readout operation for the plurality of image frames based on a longest readout operation period among readout operation periods according to the used readout modes. However, the synchronized operation period is not limited to the above example. When performing a readout operation for a plurality of image frames based on the first readout mode and the second readout mode, the image sensor (230) can perform a readout operation for each image frame based on the second readout operation period.

[0105] According to one embodiment, in operation 1131, the image sensor (230) can read pixel values ​​of the first image frame based on the first readout mode during a second readout period. In operation 1133, the image sensor (230) can read pixel values ​​of the second image frame based on the second readout mode during a second readout period. In operation 1133, the reset operation for performing the capturing operation on the second image frame can be performed in parallel with the first readout operation on pixels connected to at least some row lines of the first image frame.

[0106] The multi-frame shooting mode may mean that the electronic device (101) performs an operation of acquiring multiple image frames through the image sensor (230) and generating an image from the multiple image frames. For example, the multi-frame shooting mode may include an operation of generating a high dynamic range (HDR) image by synthesizing image frames acquired based on different exposure values. However, the present invention is not limited thereto. For example, the multi-frame shooting mode may also include an operation of generating an image with reduced noise by using multiple image frames captured based on multiple readout modes.

[0107] Although FIG. 11 illustrates that operation 1133 is performed after operation 1131, in one embodiment, the order of operations 1131 and 1133 may be switched.

[0108] FIG. 12 is a diagram illustrating a structure in which an image sensor (230) according to one embodiment synthesizes and outputs a sampling result sampled based on a second reading mode.

[0109] In one embodiment, when the image sensor (230) reads out pixel values ​​based on the second readout mode, the image sensor (230) may obtain a first sampling result (1210) based on the first reset sampling operation (611-1) and the first signal sampling operation (612-1). The first sampling result (1210) may include a result sampled based on the first floating diffusion capacitor (431) while the gain control signal (Tr) is off. The image sensor (230) may obtain a second sampling result (1220) based on the second reset sampling operation (611-2) and the second signal sampling operation (612-2). The second sampling result (1220) may include a result sampled based on the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432) while the gain control signal (Tr) is on. When the capacitance of the first floating diffusion capacitor (431) is FD1 and the capacitance of the second floating diffusion capacitor (432) is FD2, the second sampling result (1220) may include a value obtained by multiplying the signal output from the second reset sampling operation (611-2) and the second signal sampling operation (612-2) by ((FD1+FD2) / FD1).

[0110] In one embodiment, the image sensor (230) may include a synthesizer (1230) that synthesizes a first sampling result (1210) and a second sampling result (1220). The synthesizer (1230) may output a result value (1240) synthesized from the first sampling result (1210) and the second sampling result (1220). The output result may be expanded to a bit bandwidth corresponding to a dynamic range of the first sampling result (1210) and the second sampling result (1220). For example, the result value (1240) may be expanded to 2 bits when ((FD1+FD2) / FD1) is 4, and may be expanded to 3 bits when ((FD1+FD2) / FD1) is 8.

[0111] FIG. 13 is a diagram illustrating a structure in which an image sensor (230) according to one embodiment selectively outputs a sampling result sampled based on a second reading mode.

[0112] In one embodiment, when the image sensor (230) reads out pixel values ​​based on the second readout mode, the image sensor (230) may obtain a first sampling result (1210) based on the first reset sampling operation (611-1) and the first signal sampling operation (612-1). The first sampling result (1210) may include a result sampled based on the first floating diffusion capacitor (431) while the gain control signal (Tr) is off. The image sensor (230) may obtain a second sampling result (1220) based on the second reset sampling operation (611-2) and the second signal sampling operation (612-2). The second sampling result (1220) may include a result sampled based on the first floating diffusion capacitor (431) and the second floating diffusion capacitor (432) while the gain control signal (Tr) is on.

[0113] In one embodiment, the image sensor (230) may further include a selector (1310) configured to selectively output (1340) either the first sampling result (1210) or the second sampling result (1220). By selectively outputting the sampling result instead of the extended synthesis with increasing bit count as an output for at least some frames in a multi-frame shooting operation, the degree of increase in power consumption of the image sensor (230) may be reduced.

[0114] FIG. 14 is a diagram illustrating an operation signal for capturing an image based on a staggered high dynamic range capturing mode by an image sensor (230) according to one embodiment.

[0115] Figure 14 illustrates exposure operations performed to capture each image frame according to one embodiment. It can be understood that a reset operation is performed before the exposure operation, and a readout operation is performed after the exposure operation.

[0116] In one embodiment, when the image sensor (230) captures an image based on a parallax high dynamic range shooting mode, a readout operation for two image frames (e.g., a first image frame (F1) and a second image frame (F2)) can be performed within a single period (e.g., a readout operation period (1441)) in which the horizontal synchronization signal (1440) is high. Referring to FIG. 14, a first vertical synchronization signal (1411) controlling a readout operation timing for the first image frame and a second vertical synchronization signal (1412) controlling a readout operation timing for the second image frame can be operated within the vertical synchronization signal (1410).

[0117] For example, a first reset operation (1452), a second reset operation (1462), a first read operation (1461), and a second read operation (1451) may be performed within a read operation section (1441) corresponding to a time point (T1). The second read operation (1451) may include an operation for reading pixel values ​​output based on an exposure operation performed in a first exposure section (1421) for pixels connected to a first row line (1420) to capture a second frame (F2). The first reset operation (1452) may include an operation for resetting pixels connected to a first row line (1420) to perform an exposure operation of a second exposure section (1422) to capture a third frame (F3). The first readout operation (1461) may include an operation for reading pixel values ​​output based on an exposure operation performed in a third exposure section (1431) for pixels connected to the second row line (1430) to capture a first frame (F1). The second reset operation (1462) may include an operation for resetting pixels connected to the second row line (1430) to perform an exposure operation of a fourth exposure section (1432) to capture a second frame (F2). In FIG. 14, the first readout operation (1461) is illustrated as preceding the second readout operation (1451), but the order in which the first readout operation (1461) and the second readout operation (1451) are performed within the readout operation section (1441) may be changed. For example, the second read operation (1451) may be performed before the first read operation (1461) within the read operation section (1441). Similarly, the second reset operation (1462) may be performed before the first reset operation (1452) within the read operation section (1441).

[0118] In one embodiment, the first shutter pulse (500-1) generated during the process of performing the first reset operation (1452) may occur within a section excluding the section in which the sampling operation is performed within the first readout operation (1461). The second shutter pulse (500-2) generated during the process of performing the second reset operation (1462) may occur within a section excluding the section in which the sampling operation is performed within the second readout operation (1451).

[0119] In one embodiment, the first readout operation (1461) and the second readout operation (1451) illustrated in FIG. 14 are illustrated as operating in an operation mode based on general correlated double sampling, but at least one of the first readout operation (1461) or the second readout operation (1451) may be replaced with a readout operation performed based on a higher performance operation mode (e.g., DCG CDS, low-noise multiple sampling CDS) than general correlated double sampling. Even when at least one of the first readout operation (1461) or the second readout operation (1451) is a readout operation according to another operation mode, the shutter pulses (500-1, 500-2) generated in the first reset operation (1452) and the second reset operation (1462) may be operated within a section excluding a section in which a sampling operation is performed. In this case, the interval of the horizontal synchronization signal (1440) may be maintained constant while performing high dynamic range shooting.

[0120] Various embodiments of the present disclosure may relate to an image sensor that captures a plurality of image frames, an electronic device including the image sensor, and a method of operating the same.

[0121] Various embodiments of the present disclosure may relate to an image sensor capable of freely setting a light exposure time for performing an operation of capturing a plurality of image frames based on a mutual readout mode, an electronic device including the image sensor, and an operating method thereof.

[0122] Various embodiments of the present disclosure may relate to an image sensor capable of reducing the degree of increase in power consumption according to a readout method, an electronic device including the image sensor, and an operating method thereof.

[0123] Various embodiments of the present disclosure may relate to a computer-readable recording medium having recorded thereon a computer program for performing the above-described method.

[0124] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure pertains from the description of the present disclosure.

[0125] An electronic device according to one embodiment may include a lens unit (210), an image sensor (230) that receives light passing through the lens unit (210) and converts it into an electrical signal, and at least one processor (120) configured to control the image sensor (230). The image sensor (230) may read out a pixel value based on a first readout operation period (P1) when outputting an image frame based on a first readout mode. The image sensor (230) may read out a pixel value based on a second readout operation period (P2) that is longer than the first readout operation period (P2) when outputting an image frame based on a second readout mode. When the image sensor (230) performs a multi-frame shooting operation including a first operation (510) of outputting a first image frame based on the first readout mode and a second operation (610, 620) of outputting a second image frame based on the second readout mode based on a request of the at least one processor (120), the image sensor (230) may be configured to perform the first operation (510) based on a third readout operation period that is longer than the second readout operation period (P2) and to perform the second operation (610, 620) based on the third readout operation period.

[0126] In one embodiment, the first readout mode may include an operation of obtaining a pixel value based on normal correlated double sampling (normal CDS) including one reset sampling operation and one signal sampling operation. The second readout mode may include an operation of obtaining a pixel value based on double conversion gain (DCG) CDS including two reset sampling operations and two signal sampling operations.

[0127] In one embodiment, the multi-frame shooting operation may include a reset operation for resetting pixels included in a second line different from the first line for reading out the pixel value, in a section excluding sections (521, 522, 611-1, 611-2, 612-1, 612-2, 621-1, 621-2, 622-1, 622-2) in which sampling is performed in the first operation and the second operation from the third reading operation period.

[0128] In one embodiment, the image sensor (230) may include a light-receiving element (410) that converts the light into an electrical signal, and a first switch (420) connected to the light-receiving element (410). The reset operation may include an operation of transmitting an operation signal for operating the first switch (420) to the first switch (420). The image sensor (230) may be configured to limit a section in which the operation signal is transmitted to the first switch (420) to a section excluding sections (521, 522, 611-1, 611-2, 612-1, 612-2, 621-1, 621-2, 622-1, 622-2) in which sampling is performed in the first operation and the second operation.

[0129] In one embodiment, the second operation may include a first signal sampling operation for obtaining a first sampling result (1210) and a second signal sampling operation for obtaining a second sampling result (1220). The image sensor may be configured to output the second image frame based on bits obtained by synthesizing the first sampling result (1210) and the second sampling result (1220).

[0130] In one embodiment, the image sensor may include a plurality of pixels (PX). Each of the plurality of pixels (PX) may include a first capacitor (431), a second capacitor (432), and a second switch (440) that controls a connection between the second capacitor (432) and the floating node (430), each of which is connected to a floating node (430). The image sensor (230) may be configured to read a pixel value based on a first sampling result (1210) obtained when the second switch (440) is open and a second sampling result (1220) obtained when the second switch (440) is closed.

[0131] In one embodiment, the image sensor (230) may further include a selector configured to selectively output either the first sampling result (1210) or the second sampling result (1220).

[0132] In one embodiment, the image sensor (230) may output the first image frame based on a first exposure time. The image sensor (230) may output the second image frame based on a second exposure time that is different from the first exposure time. The at least one processor (120) may be configured to synthesize the first image frame and the second image frame to obtain image data with an extended dynamic range.

[0133] A method of operating an electronic device (101) including an image sensor (230) according to one embodiment may include an operation of selecting any one of a first readout mode, a second readout mode, or a multi-frame capturing mode. The method may include an operation of reading out pixel values ​​through a first sampling operation during a first readout operation period when the first readout mode is selected. The method may include an operation of reading out pixel values ​​through a second sampling operation during a second readout operation period longer than the first readout operation period when the second readout mode is selected. The method may include a multi-frame capturing operation of reading out a first image frame and a second image frame when the multi-frame capturing mode is selected. The multi-frame capturing operation may include a first operation of reading out pixel values ​​of the first image frame based on the first sampling operation during a third readout operation period longer than the second readout operation period. The above multi-frame shooting operation may include a second operation of reading pixel values ​​of the second image frame based on the second sampling operation during the third reading operation period.

[0134] In one embodiment, the first sampling operation may include obtaining a pixel value based on a general CDS including one reset sampling operation and one sampling operation. The second sampling operation may include obtaining a pixel value based on a DCG CDS including two reset sampling operations and two signal sampling operations.

[0135] In one embodiment, the multi-frame shooting operation may include a reset operation for resetting pixels included in a second line that is different from the first line from which the pixel value is read, in a section excluding a section in which sampling is performed in the first operation and the second operation from the third read operation period.

[0136] In one embodiment, each of the plurality of pixels included in the image sensor may include a light-receiving element that converts the light into an electrical signal, and a switch connected to the light-receiving element. The reset operation may include an operation of transmitting an operation signal for operating the switch of the pixel included in the second line to the switch. The section for transmitting the operation signal to the switch may be within a section excluding a section for performing sampling based on the first sampling operation and a section for performing sampling based on the second sampling operation within the third readout operation period.

[0137] In one embodiment, the second operation may include a first signal sampling operation for obtaining a first sampling result, a second signal sampling operation for obtaining a second sampling result, and an operation for outputting the second image frame based on a bit obtained by synthesizing the first sampling result and the second sampling result.

[0138] In one embodiment, the image sensor may include a plurality of pixels. Each of the plurality of pixels may include a first capacitor connected to a floating node, a second capacitor, and a switch controlling a connection between the second capacitor and the floating node. The second operation may include obtaining a first sampling result corresponding to a signal detected when the switch is open. The second operation may include obtaining a second sampling result corresponding to a signal detected when the switch is closed. The second operation may include reading a pixel value based on the first sampling result and the second sampling result.

[0139] In one embodiment, the operation of reading the pixel value may further include an operation of selectively outputting either the first sampling result or the second sampling result.

[0140] In one embodiment, the first operation may include outputting the first image frame based on a first exposure time. The second operation may include outputting the second image frame based on a second exposure time that is different from the first exposure time. The multi-frame shooting operation may include synthesizing the first image frame and the second image frame to obtain image data with an extended dynamic range.

[0141] A non-transitory computer-readable recording medium according to one embodiment may be a computer program recorded thereon for executing the above-described method when an electronic device including an image sensor is executed.

[0142] An image sensor, an electronic device including an image sensor, and an operating method thereof according to various embodiments can freely set an exposure time for capturing image frames captured based on different readout modes when performing multi-frame capturing.

[0143] An image sensor, an electronic device including an image sensor, and an operating method thereof according to various embodiments can reduce the degree of increase in power consumption depending on a readout method.

[0144] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0145] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0146] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure.

[0147] These programs (software modules, software) may be stored in a random access memory, a non-volatile memory including a flash memory, a read only memory (ROM), an electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc ROM (CD-ROM), a digital versatile disc (DVD) or other forms of optical storage, a magnetic cassette, or a memory formed by a combination of some or all of these. In addition, each configuration memory may be included in multiple numbers.

[0148] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0149] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0150] Additionally, in the present disclosure, terms such as “part”, “module”, etc. may refer to a hardware component such as a processor or circuit, and / or a software component executed by a hardware component such as a processor.

[0151] A "component" or "module" may be implemented by a program stored in an addressable storage medium and executed by a processor. For example, a "component" or "module" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables.

[0152] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0153] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, including only b, including only c, or including a combination of two or more (including a and b, including b and c, including a and c, or including all of a, b, and c).

[0154] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

Claims

1. In electronic devices, Lens section; An image sensor that receives light passing through the lens unit and converts it into an electrical signal; and comprising at least one processor (120) configured to control the image sensor; The above image sensor: When outputting an image frame based on the first readout mode, pixel values ​​are readout based on the first readout operation period, When outputting an image frame based on the second reading mode, pixel values ​​are read based on a second reading operation period that is longer than the first reading operation period, An electronic device configured to perform a multi-frame shooting operation including a first operation of outputting a first image frame based on the first readout mode and a second operation of outputting a second image frame based on the second readout mode based on a request of at least one processor, wherein the first operation is performed based on a third readout operation period longer than the second readout operation period, and the second operation is performed based on the third readout operation period.

2. In claim 1, The above first readout mode includes an operation of obtaining pixel values ​​based on normal correlated double sampling (normal CDS) including one reset sampling operation and one signal sampling operation, An electronic device, wherein the second readout mode includes an operation of obtaining a pixel value based on a double conversion gain (DCG) CDS including two reset sampling operations and two signal sampling operations.

3. In claim 1, An electronic device wherein the multi-frame shooting operation includes a reset operation for resetting pixels included in a second line, which is different from the first line for reading out the pixel values, in a section excluding a section in which sampling is performed in the first operation and the second operation from the third reading operation period.

4. In claim 3, The above image sensor: A light-receiving element that converts the above light into an electrical signal, and comprising a first switch connected to the above light-receiving element; The above reset operation includes an operation of transmitting an operation signal for operating the first switch to the first switch, An electronic device in which the image sensor is configured to limit the section in which the operation signal is transmitted to the first switch (420) to a section excluding the section in which sampling is performed in the first operation and the second operation.

5. In claim 1, The second operation includes a first signal sampling operation for obtaining a first sampling result and a second signal sampling operation for obtaining a second sampling result, An electronic device, wherein the image sensor is configured to output the second image frame based on bits obtained by synthesizing the first sampling result and the second sampling result.

6. In claim 1, The above image sensor includes a plurality of pixels, The above multiple pixels are respectively: A first capacitor connected to the floating node, A second capacitor, and A second switch is included for controlling the connection between the second capacitor and the floating node, An electronic device, wherein the image sensor is configured to read out a pixel value based on a first sampling result obtained in a state where the second switch is open and a second sampling result obtained in a state where the second switch is closed.

7. In claim 6, An electronic device, wherein the image sensor (230) further includes a selector configured to selectively output either the first sampling result (1210) or the second sampling result (1220).

8. In claim 1, The above image sensor, Outputting the first image frame based on the first exposure time, Outputting the second image frame based on a second exposure time that is different from the first exposure time, An electronic device, wherein said at least one processor is configured to synthesize said first image frame and said second image frame to obtain image data having an extended dynamic range.

9. A method for operating an electronic device including an image sensor, An action to select either the first reading mode, the second reading mode, or the multi-frame shooting mode; When the first readout mode is selected, an operation of reading out pixel values ​​through a first sampling operation during a first readout operation period; When the second reading mode is selected, an operation of reading pixel values ​​through a second sampling operation during a second reading operation period that is longer than the first reading operation period; and When the above multi-frame shooting mode is selected, a multi-frame shooting operation is included for reading out a first image frame and a second image frame, The above multi-frame shooting operation is: A first operation for reading pixel values ​​of the first image frame based on the first sampling operation during a third reading operation period longer than the second reading operation period, and A method comprising a second operation of reading pixel values ​​of the second image frame based on the second sampling operation during the third reading operation period.

10. In claim 9, The above first sampling operation includes an operation of obtaining a pixel value based on a general CDS including one reset sampling operation and one sampling operation, A method, wherein the second sampling operation comprises an operation of obtaining a pixel value based on a DCG CDS including two reset sampling operations and two signal sampling operations.

11. In claim 9, An electronic device wherein the multi-frame shooting operation includes a reset operation for resetting pixels included in a second line, which is different from the first line for reading out the pixel values, in a section excluding a section in which sampling is performed in the first operation and the second operation from the third reading operation period.

12. In claim 11, Each of the plurality of pixels included in the image sensor: A light-receiving element that converts the above light into an electrical signal, and comprising a switch connected to the above light-receiving element, The above reset operation includes an operation of transmitting an operation signal for operating the switch of the pixel included in the second line to the switch, An electronic device in which the section for transmitting the above operation signal to the switch is within a section excluding a section for performing sampling based on the first sampling operation and a section for performing sampling based on the second sampling operation within the third reading operation period.

13. In claim 9, The second action is: A first signal sampling operation for obtaining a first sampling result, A second signal sampling operation for obtaining a second sampling result, and An electronic device comprising an operation for outputting the second image frame based on bits synthesized from the first sampling result and the second sampling result.

14. In claim 9, The above image sensor includes a plurality of pixels, The above multiple pixels are respectively: A first capacitor connected to the floating node, A second capacitor, and comprising a switch controlling the connection between the second capacitor and the floating node; The second action is: An operation of obtaining a first sampling result corresponding to a signal detected while the switch is open; An operation of obtaining a second sampling result corresponding to a signal detected while the switch is closed, and A method comprising an operation of reading a pixel value based on the first sampling result and the second sampling result.

15. In claim 9, The first operation includes an operation of outputting the first image frame based on a first exposure time, The second operation includes an operation of outputting the second image frame based on a second exposure time that is different from the first exposure time, A method wherein the multi-frame shooting operation includes an operation of synthesizing the first image frame and the second image frame to obtain image data with an extended dynamic range.

Images