Display devices and methods for manufacturing display devices.

Abstract

The invention relates to a display device comprising sub-pixels made on a substrate, and comprising a color-shifting layer in the first sub-pixel region and comprising quantum dots, a first scattering layer in the second sub-pixel region and comprising a first scattering agent, and a second scattering layer in the third sub-pixel region and comprising a second scattering agent, a first color filter in the first sub-pixel region, a second color filter in the second sub-pixel region and a third color filter in the third sub-pixel region, wherein the light emitted from the luminescent element comprises light of second color and light of third color, and wherein the colors of light passing through the first scattering layer and the second scattering layer are essentially unchanged by the first scattering layer and the second scattering layer.

Description

Display device and method for manufacturing the display device

[0001] An aspect according to some embodiments of the present disclosure relates to a display device and a method of manufacturing the display device.

[0002] As interest in information displays has grown recently, research and development on display devices are continuing.

[0003] The above-described information disclosed in this background art is intended to enhance understanding of the background of the present disclosure and may therefore include information that does not correspond to prior art.

[0004] One aspect of the present disclosure is to provide a display device and a method of manufacturing the display device having improved light emission efficiency.

[0005] One aspect of the present disclosure is to provide a display device and a method of manufacturing the display device, wherein sufficient brightness can be realized.

[0006] One aspect of the present disclosure is to provide a display device and a method of manufacturing the display device, wherein process efficiency can be improved.

[0007] One aspect of the present disclosure is to provide a display device and a method of manufacturing the display device, which can reduce manufacturing costs.

[0008] One aspect of the present disclosure is to provide a display device and a method for manufacturing the display device having excellent optical properties.

[0009] According to some embodiments of the present disclosure, a display device may include sub-pixels formed on a base layer, the sub-pixels including a first sub-pixel forming a first sub-pixel area configured to provide light of a first color, a second sub-pixel forming a second sub-pixel area configured to provide light of a second color, and a third sub-pixel forming a third sub-pixel area configured to provide light of a third color. The sub-pixels may include a display layer including a light-emitting element on the base layer; a light control layer on the display layer, the light control layer including a color conversion layer disposed within the first sub-pixel area and including a quantum dot, a first scattering layer disposed within the second sub-pixel area and including a first scatterer, and a second scattering layer disposed within the third sub-pixel area and including a second scatterer; and a color filter layer disposed on the light control layer, the color filter layer including a first color filter disposed within the first sub-pixel area, a second color filter disposed within the second sub-pixel area, and a third color filter disposed within the third sub-pixel area. The light emitted by the light-emitting element includes light of the second color and light of the third color, and at least a portion of the emitted light may be emitted through the light control layer and the color filter layer. The colors of the light transmitted through the first scattering layer and the second scattering layer may not be changed by the first scattering layer and the second scattering layer.

[0010] The display device may further include a capping layer, at least a portion of which passivates the color conversion layer. A first portion of the capping layer may be disposed on the color conversion layer within the first sub-pixel area, and a second portion of the capping layer may be disposed below the first scattering layer and the second scattering layer within each of the second sub-pixel area and the third sub-pixel area.

[0011] The display device may further include an upper layer disposed on the color filter layer and including an upper substrate. The color filter layer and the light control layer may be sequentially laminated below the upper substrate. A filling layer may be interposed between the display layer, the color conversion layer, the first scattering layer, and the second scattering layer.

[0012] The display device may further include an upper layer disposed on the color filter layer and including an upper substrate. The light control layer may be disposed on the display layer. A filling layer may be interposed between the color conversion layer, the first scattering layer, the second scattering layer, and the color filter layer.

[0013] The display device may further include an upper layer disposed on the color filter layer and including an upper film. The light control layer and the color filter layer may be sequentially laminated on the display layer.

[0014] The color conversion layer may have a first thickness. The first scattering layer may have a second thickness. The second scattering layer may have a third thickness. The first thickness may be greater than the second thickness and the third thickness. The second thickness and the third thickness may be substantially equal to each other.

[0015] Each of the first scatterer and the second scatterer may be included in the first scattering layer and the second scattering layer in a range of about 1.5 wt% to about 8.5 wt%.

[0016] The size of the first scatterer may be larger than the size of the second scatterer.

[0017] The first scattering material may be included in a first weight ratio with respect to the first scattering layer. The second scattering material may be included in a second weight ratio with respect to the second scattering layer. The first weight ratio may be greater than the second weight ratio.

[0018] The first scattering layer may include one or more scatterers having the same composition ratio as the first scatterer and a different size. The second scattering layer may include one or more scatterers having the same composition ratio as the second scatterer and a different size.

[0019] The color filter layer may further include an optical layer having a refractive index lower than that of the color conversion layer. The optical layer may be disposed between the light control layer and the first color filter, the second color filter, and the third color filters. The optical layer may be disposed only in the first sub-pixel area among the first sub-pixel area, the second sub-pixel area, and the third sub-pixel area.

[0020] The display device may further include a filling scattering layer disposed within the second sub-pixel region and the third sub-pixel region, overlapping the first scattering layer and the second scattering layer along the thickness direction, and including a filling material and a scattering substance.

[0021] The display device may further include a bank extending in the thickness direction, at least part of which surrounds the first sub-pixel area.

[0022] The bank may not be disposed between the second sub-pixel area and the third sub-pixel area. The display device may further include a black matrix layer, at least a portion of which is disposed between the second sub-pixel area and the third sub-pixel area and penetrating between the first scattering layer and the second scattering layer.

[0023] The above bank may be formed on the periphery of all sides of the first sub-pixel area when viewed on a plane, and may not be formed on a portion of the periphery of each of the second sub-pixel area and the third sub-pixel area.

[0024] At least one side of the second sub-pixel region may include an open edge portion where the bank is not arranged. The open edge portion may be formed to be oriented in a direction away from the third sub-pixel region.

[0025] The above bank may be formed around the entire sides of the first sub-pixel area and the second sub-pixel area when viewed on a plane, and may not be formed around at least a portion of the third sub-pixel area.

[0026] The display device may further include a capping layer, at least a portion of which passivates the color conversion layer and the first scattering layer. At least a portion of the capping layer may be disposed between the second scattering layer and the third color filter in the third sub-pixel area.

[0027] The thickness of the first scattering layer may be greater than the thickness of the second scattering layer.

[0028] The above bank may further include an isolated bank portion. The isolated bank portion may be positioned between the second sub-pixel area and the third sub-pixel area.

[0029] The display device may further include a spacer disposed on the bank and disposed above the color conversion layer, the first scattering layer, and the second scattering layer.

[0030] The spacer may be disposed between the first sub-pixel area and the second sub-pixel area, between the second sub-pixel area and the third sub-pixel area, and between the first sub-pixel area and the third sub-pixel area.

[0031] The first sub-pixel, the second sub-pixel, and the third sub-pixel may be adjacent to each other in a first direction and form a first pixel. The first pixel may be adjacent to the second pixel in a second direction different from the first direction. The spacer may be disposed between the first sub-pixel area of ​​the first pixel and the first sub-pixel area of ​​the second pixel, between the second sub-pixel area of ​​the first pixel and the second sub-pixel area of ​​the second pixel, and between the third sub-pixel area of ​​the first pixel and the third sub-pixel area of ​​the second pixel.

[0032] The first sub-pixel area and the third sub-pixel area may be adjacent in a first direction, and the second sub-pixel area may be adjacent to the first sub-pixel area and the third sub-pixel area in a second direction different from the first direction. The spacer may overlap the second sub-pixel area along the first direction.

[0033] The display device may further include a capping layer that passivates at least a portion of the color conversion layer, the bank, the first scattering layer, the second scattering layer, and the spacer.

[0034] The display device may further include a capping layer that at least partially passivates the color conversion layer, the bank, the first scattering layer, and the second scattering layer. The spacer may be disposed on the capping layer.

[0035] The bank may include a first bank portion spaced apart from a second bank portion by a first distance, the second sub-pixel region being disposed between the first bank portion and the second bank portion; and a third bank portion spaced apart from the second bank portion by a second distance, the third sub-pixel region being disposed between the third bank portion and the second bank portion. A thickness of the first scattering layer may be greater than a thickness of the second scattering layer.

[0036] The light-emitting element may include at least one of an organic light-emitting diode including an organic material or an inorganic light-emitting diode including an inorganic material.

[0037] According to some embodiments of the present disclosure, a method of manufacturing a display device may include: manufacturing a first panel; manufacturing a second panel; and combining the first panel and the second panel. The step of manufacturing the first panel may include providing a light-emitting element on a lower substrate. The step of manufacturing the second panel may include providing a color filter layer on an upper substrate and providing a light control layer on the color filter layer. The step of providing the light control layer may include: patterning a bank on the color filter layer; disposing a color conversion layer including quantum dots in a first sub-pixel area; disposing a first scattering layer including a first scatterer in a second sub-pixel area; and disposing a second scattering layer including a second scatterer in a third sub-pixel area. The first scattering layer and the second scattering layer may be configured to allow the applied light to transmit through the first scattering layer and the second scattering layer without changing the color of the applied light.

[0038] The step of providing the light control layer may further include a step of forming a capping layer on the color conversion layer; wherein the capping layer passivates the color conversion layer; and the step of providing the color conversion layer may include a step of patterning the color conversion layer using an inkjet process. The step of providing the first scattering layer and the step of providing the second scattering layer are performed after the step of forming the capping layer, and may be performed based on a photolithography process.

[0039] The color conversion layer, the first scattering layer, and the second scattering layer may be patterned based on a photolithography process. The step of providing the light control layer may further include the step of forming a capping layer on the color conversion layer, wherein the capping layer passivates the color conversion layer.

[0040] The color conversion layer, the first scattering layer, and the second scattering layer can be formed based on an inkjet process.

[0041] The above bonding step may further include a step of providing a filling layer between the first panel and the second panel.

[0042] According to some embodiments of the present disclosure, a method may include: manufacturing a first panel; manufacturing a second panel; and combining the first panel and the second panel. The step of manufacturing the first panel may include providing a display layer including a light-emitting element on a lower substrate and providing a light control layer on the display layer. The step of manufacturing the second panel may include providing a color filter layer on an upper substrate. The step of providing the light control layer may include: patterning a bank on the display layer; providing a color conversion layer including quantum dots in a first sub-pixel area; providing a first scattering layer including a first scatterer in a second sub-pixel area; and providing a second scattering layer including a second scatterer in a third sub-pixel area. The first scattering layer and the second scattering layer may be configured to transmit applied light through the first scattering layer and the second scattering layer without changing a color of the applied light.

[0043] The step of providing the above light control layer may further include a step of forming a capping layer on the color conversion layer, wherein the capping layer passivates the color conversion layer. The step of providing the color conversion layer may include a step of patterning the color conversion layer using an inkjet process. The step of providing the first scattering layer and the step of providing the second scattering layer are performed after the step of forming the capping layer, and may be performed based on a photolithography process.

[0044] The color conversion layer, the first scattering layer, and the second scattering layer may be patterned based on a photolithography process. The step of providing the light control layer may further include the step of forming a capping layer on the color conversion layer, wherein the capping layer passivates the color conversion layer, the first scattering layer, and the second scattering layer.

[0045] The color conversion layer, the first scattering layer, and the second scattering layer can be formed based on an inkjet process.

[0046] According to an aspect of some embodiments, a display device and a method of manufacturing the display device with improved light emission efficiency can be provided.

[0047] According to aspects of some embodiments, a display device and a method of manufacturing the display device can be provided, wherein sufficient brightness can be realized.

[0048] According to aspects of some embodiments, a display device and a method of manufacturing the display device may be provided, wherein process efficiency may be improved.

[0049] According to aspects of some embodiments, a display device and a method of manufacturing the display device may be provided, which may enable reduced manufacturing costs.

[0050] According to aspects of some embodiments, a display device and a method of manufacturing the display device having excellent optical properties can be provided.

[0051] The foregoing and other aspects and features of the present disclosure will become more clearly understood from the following detailed description of exemplary and non-limiting embodiments, taken in conjunction with the accompanying drawings.

[0052] FIG. 1 is a schematic plan view illustrating a display device according to some embodiments of the present disclosure.

[0053] FIG. 2 is a schematic cross-sectional view illustrating a display device according to some embodiments of the present disclosure.

[0054] FIG. 3 is a schematic diagram illustrating a display layer according to some embodiments of the present disclosure.

[0055] FIG. 4 is a schematic diagram illustrating optical paths for each sub-pixel according to some embodiments of the present disclosure.

[0056] FIGS. 5 to 7 are schematic cross-sectional views showing display devices according to some embodiments of the present disclosure.

[0057] FIG. 8 is a schematic cross-sectional view illustrating the thickness relationship of a first scattering layer, a second scattering layer, and a color conversion layer according to some embodiments of the present disclosure.

[0058] FIGS. 9 to 11 are schematic cross-sectional views illustrating the relationship between scatterers included in each of the first scattering layer and the second scattering layer according to some embodiments of the present disclosure.

[0059] FIGS. 12 to 15 are cross-sectional views illustrating features of a light control layer according to some embodiments of the present disclosure.

[0060] FIGS. 16 to 21 are plan views illustrating the arrangement relationship between banks and sub-pixel areas according to some embodiments of the present disclosure.

[0061] FIGS. 22 to 26 are plan views illustrating the arrangement relationship between spacers and sub-pixel areas according to some embodiments of the present disclosure.

[0062] FIG. 27 is a schematic plan view showing a display area of ​​a display device according to some embodiments of the present disclosure.

[0063] FIG. 28 is a schematic cross-sectional view along lines A to A' of FIG. 27, which is a schematic cross-sectional view showing a second panel according to some embodiments of the present disclosure.

[0064] FIGS. 29 to 31 are schematic cross-sectional views showing display devices according to some embodiments of the present disclosure.

[0065] FIGS. 32 to 34 are schematic cross-sectional views showing display devices according to some embodiments of the present disclosure.

[0066] FIG. 35 is a schematic cross-sectional view illustrating the relationship between a first scattering layer and a second scattering layer according to some embodiments of the present disclosure.

[0067] FIG. 36 is a flowchart illustrating a method of manufacturing a display device according to some embodiments of the present disclosure.

[0068] FIG. 37 is a flowchart illustrating sub-operations of an operation for manufacturing a second panel according to some embodiments of the present disclosure.

[0069] FIGS. 38 to 43 are schematic cross-sectional views for each process operation showing a method of manufacturing a display device according to some embodiments of the present disclosure.

[0070] FIG. 44 is a flowchart illustrating sub-operations of an operation for manufacturing a first panel according to some embodiments of the present disclosure.

[0071] FIGS. 45 to 48 are schematic cross-sectional views for each process operation showing a method of manufacturing a display device according to some embodiments of the present disclosure.

[0072] FIG. 49 is a flowchart illustrating a method of manufacturing a display device according to some embodiments of the present disclosure.

[0073] Hereinafter, some embodiments will be described in more detail with reference to the attached drawings. It should be noted that only portions suitable for understanding the operation of the present disclosure will be described below, and descriptions of remaining portions may not be provided so as not to obscure the gist of the present disclosure. Some embodiments are not limited to the embodiments described herein and may be implemented in other forms. Below, embodiments will be described in more detail so that those skilled in the art can appropriately implement the technical concepts of the present disclosure.

[0074] While the present disclosure allows for various modifications and numerous embodiments, specific embodiments are illustrated in the drawings and described in greater detail in the detailed description. However, it is to be understood that this disclosure is not intended to be limited to specific implementation modes, and that all modifications, equivalents, and alternatives that do not depart from the spirit and technical scope of the present disclosure are intended to be encompassed by the present disclosure.

[0075] When a part is referred to as being "connected" to another part, it will be understood that it can be "directly" connected to the other part or "indirectly" connected to the other part, including intervening parts. The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit the present disclosure. The terms "comprises," "has," or "have," as used herein, specify the presence of the described elements, but do not preclude the presence or addition of one or more other elements. "At least one of X, Y, and Z," "at least one of X, Y, or Z," and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as one X, one Y, one Z, or any combination of two or more of X, Y, and Z (e.g., XYZ, XYY, YZ, ZZ, etc.). The terms "or" and "and" as used herein include any combination of one or more elements.

[0076] Although terms such as "first," "second," etc. may be used herein to describe various components, it will be understood that these components should not be limited by these terms. These terms are only used to distinguish one component from another. For example, the first component discussed below could be referred to as the second component without departing from the teachings of this disclosure. Similarly, the second component could also be referred to as the first component. In this disclosure, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

[0077] It will be further understood that the terms "comprise," "have," and the like, as used herein, specify the presence of stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, elements, and / or combinations thereof. Furthermore, when a first part, such as a layer, film, region, or plate, is disposed (e.g., positioned or provided) on a second part, the first part may be directly on the second part, and a third part may intervene therebetween. Furthermore, when a first part, such as a layer, film, region, or plate, is expressed as being formed on a second part, the surface of the second part on which the first part is formed is not limited to the upper surface of the second part, and may include other surfaces, such as a side surface or lower surface of the second part. Conversely, when a first part, such as a layer, film, region, or plate, is beneath a second part, the first part may be directly beneath the second part, and a third part may intervene therebetween.

[0078] Spatially relative terms such as "below," "above," and the like may be used for descriptive purposes to describe the relationship between one component or feature and other component(s) or features, as illustrated in the drawings. Spatially relative terms are intended to encompass orientations of use, operation, and / or manufacture other than those depicted in the drawings. For example, when a device illustrated in the drawings is turned over, a component depicted as being located "below" another component or feature is located "above" the other component or feature. Thus, in some embodiments, the term "below" may encompass both an upward and downward orientation. In some embodiments, the device may be oriented in other orientations (e.g., rotated 90 degrees or in other directions), and spatially relative terms as used herein should be interpreted accordingly.

[0079] Some embodiments are described with reference to the accompanying drawings in relation to functional blocks, units, and / or modules. Those skilled in the art will appreciate that such blocks, units, and / or modules are physically implemented by logic circuits, discrete components, microprocessors, wired circuits, memory elements, wired connections, and other electronic circuits. This may be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units, and / or modules implemented by microprocessors or other similar hardware may be programmed and controlled using software to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. In some embodiments, each of the blocks, units, and / or modules may be implemented by dedicated hardware, or may be implemented by a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) that performs other functions. In some embodiments, the blocks, units, and / or modules may be physically separated into two or more individual blocks, units, and / or modules that interact within the scope of the present disclosure. In some embodiments, the blocks, units, and / or modules may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the present disclosure.

[0080] Various embodiments are described with reference to drawings that schematically illustrate non-limiting embodiments. Therefore, it is to be understood that shapes may vary, for example, depending on tolerances and / or manufacturing techniques. Therefore, the embodiments disclosed herein should not be construed as limited to the specific shapes illustrated, but rather to encompass, for example, variations in shapes resulting from manufacturing processes. Thus, the shapes illustrated in the drawings may not depict the actual shapes of regions of the device, and the embodiments are not limited thereto.

[0081] If a particular embodiment can be implemented differently, the order of specific processes may differ from the order described. For example, two processes described in succession may be performed identically or substantially simultaneously, or may be performed in a reverse order from the order described.

[0082] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation rather than degrees, and are intended to account for inherent variations in measured or calculated values ​​that would be recognizable by those of ordinary skill in the art. Additionally, the use of "may" when describing embodiments of the present disclosure means "one or more embodiments of the present disclosure." As used herein, "use," "using," and "used" may be considered synonymous with "utilize," "utilizing," and "utilized," respectively.

[0083] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning within the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless specifically defined herein.

[0084] Various embodiments of the present disclosure relate to display devices and methods for manufacturing such devices. Below, a display device and a method for manufacturing such a display device according to some embodiments will be described with reference to the accompanying drawings.

[0085] FIG. 1 is a schematic plan view illustrating a display device according to some embodiments of the present disclosure.

[0086] Referring to FIG. 1, the display device (DD) may include a base layer (BSL) and pixels (PXL) arranged (e.g., positioned or provided) on the base layer (BSL). Although not illustrated in the drawing, the display device (DD) may further include a driving circuit (e.g., a scan driving circuit and a data driving circuit), wires, and pads for driving the pixels (PXL).

[0087] A display device (DD) (or base layer (BSL)) may include a display area (DA) and a non-display area (NDA). For example, the display area (DA) may be configured to display an image. The non-display area (NDA) may refer to an area outside the display area (DA). The non-display area (NDA) may surround at least a portion of the display area (DA).

[0088] The base layer (BSL) may form a base surface of the display device (DD). The base layer (BSL) may be a rigid or suitably flexible substrate or film. For example, the base layer (BSL) may include a glass material. Alternatively, the base layer (BSL) may include a silicon material. Alternatively, the base layer (BSL) may include polyimide. However, the present disclosure is not limited thereto.

[0089] In some embodiments, the base layer (BSL) may be a lower substrate (BSUB). For example, the base layer (BSL) may be a first substrate. The base layer (BSL) may include a base substrate for manufacturing the first panel (PNL1) (see FIG. 5).

[0090] The display area (DA) may refer to an area where pixels (PXL) are arranged. The non-display area (NDA) may refer to an area where pixels (PXL) are not arranged. In the non-display area (NDA), driving circuits, wires, and pads connected to the pixels (PXL) of the display area (DA) may be arranged.

[0091] In some embodiments, the pixels (PXL) (or sub-pixels (SPX)) are arranged in stripes or pentiles. TM ) may be arranged according to the array structure, etc., but is not limited thereto, and various embodiments may be applied to the present disclosure.

[0092] In some embodiments, a pixel (PXL) (or sub-pixels (SPX)) may include a first sub-pixel (SPX1), a second sub-pixel (SPX2), and a third sub-pixel (SPX3). The first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) may each be a sub-pixel. At least one of the first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) may form one pixel unit capable of emitting light of various colors.

[0093] Each of the first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) can emit light of one color.

[0094] For example, the first sub-pixel (SPX1) may be a red pixel that emits red light (e.g., a first color), the second sub-pixel (SPX2) may be a green pixel that emits green light (e.g., a second color), and the third sub-pixel (SPX3) may be a blue pixel that emits blue light (e.g., a third color). The red pixel may provide light in a wavelength band of about 600 nm to about 750 nm. The green pixel may provide light in a wavelength band of about 480 nm to about 560 nm. The blue pixel may provide light in a wavelength band of about 370 nm to about 460 nm.

[0095] In some embodiments, the number of second sub-pixels (SPX2) may be greater than the number of first sub-pixels (SPX1) and the number of third sub-pixels (SPX3). However, the color, type, and / or number of the first sub-pixels (SPX1), the second sub-pixels (SPX2), and the third sub-pixels (SPX3) forming each pixel unit are not limited to a specific example.

[0096] Referring to FIGS. 2 to 4, a general structure including a cross-sectional (e.g., cross-sectional) structure of a display device (DD) according to some embodiments will be described.

[0097] FIG. 2 is a schematic cross-sectional view illustrating a display device according to some embodiments of the present disclosure. FIG. 3 is a schematic diagram illustrating a display layer according to some embodiments of the present disclosure. FIG. 4 is a schematic diagram illustrating an optical path for each sub-pixel according to some embodiments of the present disclosure.

[0098] Referring to FIGS. 2 to 4, the display device (DD) may include a display layer (DL), a light control layer (LCL), a color filter layer (CFL), and an upper layer (UPL).

[0099] The display layer (DL) may be configured to emit light. The display layer (DL) may form a base on which a light control layer (LCL) is disposed.

[0100] The display layer (DL) may include a pixel circuit layer (PCL) including a base layer (BSL) and a light-emitting element layer (LEL) including a light-emitting element (LD) to form a pixel (PXL).

[0101] The base layer (BSL) can form a base on which a pixel circuit (PXC) is disposed. The pixel circuit (PXC) can be disposed on the base layer (BSL) and can be configured to drive a light-emitting element (LD). The pixel circuit layer (PCL) can include conductive layers and insulating layers, and the conductive layers can form the pixel circuit (PXC). The pixel circuit (PXC) can include circuit elements capable of driving the sub-pixel (SPX) (or the light-emitting element (LD)). The circuit elements can include a driving transistor and may also include additional transistors and capacitors.

[0102] A light emitting element layer (LEL) may be disposed on a pixel circuit layer (PCL). According to some embodiments, the light emitting element layer (LEL) may include a light emitting element (LD).

[0103] For example (see FIG. 3), the light-emitting element (LD) may include an organic light-emitting diode (OLED) including an organic material. FIG. 3 schematically illustrates an embodiment in which the light-emitting element (LD) is an organic light-emitting diode, and schematically illustrates a cross-sectional structure of a display device (DD) within a display area (DA), and a cross-sectional structure of a display layer (DL) including a pixel circuit layer (PCL) and a light-emitting element layer (LEL).

[0104] According to some embodiments, the light emitting element layer (LEL) may further include a pixel defining layer (PDL), a capping layer (CPL), and an encapsulating layer (TFE).

[0105] According to some embodiments, the light emitting element (LD) may be disposed on the pixel circuit layer (PCL). The light emitting element (LD) may include a first light emitting element (e.g., a first portion of the light emitting element (LD)) included in a first sub-pixel (SPX1), a second light emitting element (e.g., a second portion of the light emitting element (LD)) included in a second sub-pixel (SPX2), and a third light emitting element (e.g., a third portion of the light emitting element (LD)) included in a third sub-pixel (SPX3).

[0106] According to some embodiments, the light emitting element (LD) may include a first electrode (EL1), a light emitting portion (EL), and a second electrode (EL2). According to some embodiments, the light emitting portion (EL) may be disposed in an area defined by a pixel defining layer (PDL). One surface of the light emitting portion (EL) may be electrically connected to the first electrode (EL1), and the other surface of the light emitting portion (EL) may be electrically connected to the second electrode (EL2).

[0107] The first electrode (EL1) may be an anode electrode for the light-emitting portion (EL), and the second electrode (EL2) may be a cathode electrode for the light-emitting portion (EL). According to some embodiments, the first electrode (EL1) and the second electrode (EL2) may include a conductive material. For example, the conductive material may include one or more of gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or platinum (Pt). In some examples, according to some embodiments, according to an embodiment, the conductive material may include one or more of silver nanowires (AgNWs), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes (CNTs), or graphene. However, the present disclosure is not limited to the above-described examples.

[0108] The light emitting portion (EL) can emit light based on an electrical signal provided from an anode electrode (e.g., a first electrode (EL1)) and a cathode electrode (e.g., a second electrode (EL2)).

[0109] The light-emitting element (EL) may include a multilayer structure. For example, the light-emitting element (EL) may include a plurality of light-emitting structures, each of which includes a hole transport element, an emission layer (or light-generating layer), and an electron transport element. Each layer forming the light-emitting structure may include an organic material, and in some embodiments, may further include an inorganic material such as a metal-containing compound or a quantum dot.

[0110] According to some embodiments, the light emitting unit (EL) may include a tandem structure. For example, the light emitting unit (EL) may emit light of a single color including a light component of a second color and a light component of a third color. For example, the plurality of light emitting structures may include a first light emitting structure and a second light emitting structure. The first light emitting structure may include a multilayer structure that emits light of a second color. The second light emitting structure may include a multilayer structure that emits light of a third color. Accordingly, the light emitted by the light emitting unit (EL) may be a mixed light of the second color and the third color.

[0111] The hole transport unit may include a multilayer structure having a plurality of layers each including different materials. For example, the hole transport unit may include at least one of a hole injection layer and a hole transport layer, and according to some embodiments, may further include an emission auxiliary layer, an electron blocking layer, and / or the like. For example, the hole transport unit may have a multilayer structure of hole injection layer / hole transport layer, hole injection layer / hole transport layer / emission auxiliary layer, hole injection layer / emission auxiliary layer, hole transport layer / emission auxiliary layer, electron blocking layer / hole injection layer / hole transport layer, hole transport layers sequentially arranged including different materials, or hole injection layer / hole transport layer / electron blocking layer. However, the present disclosure is not limited to specific examples.

[0112] The light-emitting layer may include a material capable of emitting light of a single color. The light-emitting layer may include a host and a dopant. The host of the light-emitting layer is a light-emitting material capable of capturing carriers (e.g., electrons and holes) for generating light, and may induce efficient generation of excitons. The dopant may include a phosphorescent dopant or a fluorescent dopant. According to some embodiments, examples of the dopant are not particularly limited. According to some embodiments, the dopant may include an organic material, a metal complex, and / or the like.

[0113] The electron transport unit may include a multilayer structure having a plurality of layers each including different materials. The electron transport unit may include at least one of an electron injection layer and / or an electron transport layer, and according to some embodiments, may further include an electron buffer layer, a hole blocking layer, etc. For example, the electron transport unit may have a multilayer structure such as an electron transport layer / electron injection layer, a hole blocking layer / electron transport layer / electron injection layer, an electron control layer / electron transport layer / electron injection layer, or a buffer layer / electron transport layer / electron injection layer. However, the present disclosure is not limited to specific examples.

[0114] A pixel defining layer (PDL) may be disposed on a pixel circuit layer (PCL) to define a position at which an EL is arranged. The pixel defining layer (PDL) may include an organic material. For example, the pixel defining layer (PDL) may include one or more of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, or a polyimide resin. However, the present disclosure is not limited thereto. According to some embodiments, the pixel defining layer (PDL) may include an inorganic material. For example, the pixel defining layer (PDL) may include one or more of silicon oxide (SiOx) or silicon nitride (SiNx). According to some embodiments, the pixel defining layer (PDL) may have a multilayer structure in which a layer including silicon oxide (SiOx) and / or a layer including silicon nitride (SiNx) are stacked.

[0115] A capping layer (CPL) may be disposed on the second electrode (EL2). The capping layer (CPL) may cap the second electrode (EL2). The capping layer (CPL) may include an inorganic material.

[0116] An encapsulation film (TFE) may be disposed on a light-emitting element (LD) (e.g., a second electrode (EL2)). The encapsulation film (TFE) may offset a step difference generated by the light-emitting element (LD) and a pixel definition film (PDL). The encapsulation film (TFE) may include a plurality of insulating films covering the light-emitting element (LD). According to some embodiments, the encapsulation film (TFE) may have a structure in which inorganic films and organic films are alternately laminated. According to some embodiments, the encapsulation film (TFE) may be a thin film encapsulation film.

[0117] According to some embodiments, the light emitting element (LD) may be an inorganic light emitting diode including an inorganic material. For example, the display device (DD) may include a structure in which the light emitting elements (LD) including the inorganic material are aligned between a plurality of spaced electrodes. According to some embodiments, the display device (DD) may include a structure in which the light emitting element (LD) is a micro LED (Light Emitting Diode) and is transferred to a pixel circuit layer (PCL) based on a transfer method. The transfer method may be one of a transfer method using a stamp, a transfer method using a laser, a transfer method using an electrostatic force, a transfer method using a magnetic force and an electromagnetic force, or a transfer method using an adhesive. However, the present disclosure is not limited to the above-described examples.

[0118] Even when the light-emitting element (LD) includes an inorganic material, it may be configured to emit light including a second color light component and a third color light component, according to some embodiments. For example, a portion of the light-emitting element (LD) may be configured to emit light including a second color light component, and another portion of the light-emitting element (LD) may be configured to emit light including a third color light component.

[0119] The light control layer (LCL) may be disposed on the display layer (DL) (e.g., the light emitting element layer (LEL)). For example, the light control layer (LCL) may be disposed on the upper side of the display layer (DL) based on the display direction (e.g., the third direction (DR3))—the display direction may also be referred to as the thickness direction.

[0120] According to some embodiments, the light control layer (LCL) can be a layer that can change the color of the applied light and scatter the applied light. For example, the light control layer (LCL) can include a color conversion layer (CCL) (see FIG. 5) and a scattering layer (SCT) (see FIG. 5). For example, a portion of the light control layer (LCL) corresponding to the color conversion layer (CCL) can be provided to change the color of the applied light, and another portion corresponding to the scattering layer (SCT) can be provided to scatter the applied light.

[0121] A color filter layer (CFL) may be disposed on the light control layer (LCL). For example, the color filter layer (CFL) may be disposed on the upper side of the light control layer (LCL) with respect to the display direction (e.g., the third direction (DR3)).

[0122] According to some embodiments, the color filter layer (CFL) may include color filters (CF) (FIG. 5) that can selectively transmit light of one color.

[0123] The upper layer (UPL) may be disposed on the color filter layer (CFL). For example, the upper layer (UPL) may be disposed above the color filter layer (CFL) with respect to the display direction (e.g., the third direction (DR3)).

[0124] According to some embodiments, the upper layer (UPL) may include an upper substrate (USUB) (see FIG. 5). Alternatively, the upper layer (UPL) may include an upper film layer (UFM) (see FIG. 7). According to some embodiments, the upper substrate (USUB) may be a second substrate.

[0125] Referring to FIG. 4, structural features of a display device (DD) that implements a full-color display according to some embodiments are described. Content that may overlap with the above description is briefly described or not repeated.

[0126] FIG. 4 is a schematic block diagram showing the path of light provided by each sub-pixel of a display device according to some embodiments of the present disclosure.

[0127] Referring to FIG. 4, the display device (DD) may include a sub-pixel area (SPXA) and a non-sub-pixel area (NSPXA).

[0128] A sub-pixel area (SPXA) may be an area formed by sub-pixels (SPX) and provided with light of a single color. A non-sub-pixel area (NSPXA) may be an area formed between adjacent sub-pixel areas (SPXA) and provided with light of a single color.

[0129] The sub-pixel area (SPXA) may include a first sub-pixel area (SPXA1) defined by a first sub-pixel (SPX1) and providing light of a first color, a second sub-pixel area (SPXA2) defined by a second sub-pixel (SPX2) and providing light of a second color, and a third sub-pixel area (SPXA3) defined by a third sub-pixel (SPX3) and providing light of a third color.

[0130] According to some embodiments, a light control layer (LCL) and a color filter layer (CFL) may be sequentially arranged on a display layer (DL) (e.g., may be sequentially provided), and first to third sub-pixels (SPX1 to SPX3) may be defined.

[0131] According to some embodiments, a light emitting element (LD) may be disposed in each of the first to third sub-pixel areas (SPXA1 to SPXA3). For example, a first portion of the light emitting element (LD) may be provided in the first sub-pixel area (SPXA1), a second portion of the light emitting element (LD) may be provided in the second sub-pixel area (SPXA2), and a third portion of the light emitting element (LD) may be provided in the third sub-pixel area (SPXA3). According to some embodiments, the light emitting element (LD) may emit light of a predetermined color. For example, the light emitting elements (LD) disposed in each of the first to third sub-pixel areas (SPXA1 to SPXA3) may emit light of the same color.

[0132] According to some embodiments, the light emitted by the light emitting elements (LD) arranged in the sub-pixel areas (SPXA) may include a light component of a third color and a light component of a second color. For example, the light emitted by the light emitting elements (LD) may be a mixture of light corresponding to the light spectrum of the third color and light corresponding to the light spectrum of the second color.

[0133] According to some embodiments, the light control layer (LCL) may include a color conversion layer (CCL) disposed within a first sub-pixel area (SPXA1) and a scattering layer (SCT) disposed within each of a second sub-pixel area (SPXA2) and a third sub-pixel area (SPXA3). For example, the scattering layer (SCT) may include a first scattering layer (SCT1) disposed within the second sub-pixel area (SPXA2) and a second scattering layer (SCT2) disposed within the third sub-pixel area (SPXA3).

[0134] According to some embodiments, the color filter layer (CFL) may include a color filter (CF), and the color filter (CF) may include a first color filter (CF1) disposed within a first sub-pixel area (SPXA1), a second color filter (CF2) disposed within a second sub-pixel area (SPXA2), and a third color filter (CF3) disposed within a third sub-pixel area (SPXA3).

[0135] Within the first sub-pixel area (SPXA1), light emitted by the light emitting element (LD) can be provided as light of a first color by transmitting through the color conversion layer (CCL). For example, the color conversion layer (CCL) can convert light of a third color (or a second color) into light of a first color. In addition, light provided as light of the first color by transmitting through the color conversion layer (CCL) can be provided as light of the first color by transmitting through the first color filter (CF1). Accordingly, the first sub-pixel (SPX1) can be configured to provide light of the first color.

[0136] Within the second sub-pixel area (SPXA2), light emitted by the light emitting element (LD) can transmit through the first scattering layer (SCT1) and be provided as light of the same color as the emitted light. In addition, light provided of the same color as the emitted light by transmitting through the first scattering layer (SCT1) can transmit through the second color filter (CF2) and be provided as light of the second color. For example, the second color filter (CF2) can selectively transmit light of the second color. Accordingly, the second sub-pixel (SPX2) can be configured to provide light of the second color.

[0137] Within the third sub-pixel area (SPXA3), light emitted by the light emitting element (LD) can transmit through the second scattering layer (SCT2) and be provided as light of the same color as the emitted light. In addition, light provided of the same color as the emitted light by transmitting through the second scattering layer (SCT2) can transmit through the third color filter (CF3) and be provided as light of a third color. For example, the third color filter (CF3) can selectively transmit light of a third color. Accordingly, the third sub-pixel (SPX3) can be configured to provide light of a third color.

[0138] That is, according to some embodiments, a color conversion layer (CCL) that changes the color of light of a single color as a component included in the light control layer (LCL) may be formed only in the first sub-pixel (SPX1). In this case, a technical effect of simplifying process operations while sufficiently securing light emission efficiency and brightness can be provided.

[0139] According to some embodiments, when a display device (DD) implements a full-color display structure including red / green / blue sub-pixels (SPX), respectively, even when a color conversion layer (CCL) including quantum dots (QD) is formed only in the first sub-pixel (SPX1) for displaying red light without forming a color conversion structure including quantum dots in the second and third sub-pixels (SPX2, SPX3) for displaying green and blue light, respectively, the display device (DD) may be provided with desirable structural features to ensure sufficient light efficiency. For example, the display device (DD) may be configured to have a simplified (e.g., cost-effective) design while providing sufficient light efficiency by using the color conversion layer (CCL) only for one type of sub-pixel (e.g., red sub-pixels) among three types of sub-pixels (e.g., red sub-pixels, green sub-pixels, and blue sub-pixels).

[0140] First, the reason why it is suitable to form the first sub-pixel (SPX1) using a color conversion layer (CCL) is as follows. Experimentally, when the light-emitting element (LD) emits light including a red light component, the red light component emitted by the light-emitting element (LD) may have a relatively wide wavelength spectrum. In this case, even if the red light component emitted by the light-emitting element (LD) transmits through the first color filter (CF1), it may be difficult to secure sufficient light efficiency. For example, even if the red light component emitted by the light-emitting element (LD) transmits through the first color filter (CF1), it may be difficult to secure sufficient color purity. Accordingly, in order to form a first sub-pixel (SPX1) that secures sufficient light efficiency (e.g., sufficient color purity), it may be appropriate for the light emitted by the light-emitting element (LD) to include a blue light component, and for a color conversion layer (CCL) to be formed in the first sub-pixel (SPX1) so as to convert the blue light into red light. Accordingly, in some embodiments, the first sub-pixel (SPX1) may be implemented using a color conversion layer (CCL) and a first color filter (CF1), whereby (e.g.,) the first sub-pixel (SPX1) may provide (e.g., guarantee) sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or color purity).

[0141] Next, the reason why the second sub-pixel (SPX2) can be formed without forming a color conversion structure including a quantum dot is as follows. Experimentally, when the light-emitting element (LD) emits light including a green light component, the green light component emitted by the light-emitting element (LD) can have a relatively narrow wavelength spectrum. In this case, even if the green light component emitted by the light-emitting element (LD) passes through the second color filter (CF2) without passing through the color conversion structure, light efficiency and / or color purity (e.g., high light efficiency and / or sufficiently high color purity) for providing green light to the second sub-pixel area (SPXA2) can be provided (e.g., secured). Based on this principle, the light emitting element (LD) according to some embodiments may be configured to emit light including a green light component, and a second sub-pixel (SPX2) providing green light may be provided by including a second color filter (CF2) without including a color conversion structure. Accordingly, the second sub-pixel (SPX2) according to some embodiments may have sufficient light efficiency and / or color purity (e.g., may have sufficiently high light efficiency and / or may have high color purity characteristics).

[0142] Similarly, the light emitted by the light emitting element (LD) may include a blue light component. The blue light component emitted from the light emitting element (LD) may also have a relatively narrow wavelength spectrum. In this case, the third sub-pixel (SPX3) may not include a color conversion structure having quantum dots. For example, even if the blue light component emitted from the light emitting element (LD) passes through the third color filter (CF3) without passing through the color conversion structure, the third sub-pixel area (SPXA3) may provide (e.g., sufficiently secure) sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or sufficiently high color purity) to emit blue light.

[0143] In summary, based on the optical spectrum characteristics of red / green / blue, the color conversion structure may be applicable only to some color sub-pixels (SPX). According to some embodiments, a display device (DD) may be provided in which each of the first to third sub-pixels (SPX1 to SPX3) includes a color conversion layer (CCL) / a first scattering layer (SCT1) / a second scattering layer (SCT2). In some embodiments, the display device (DD) may be configured such that only the first sub-pixels (SPX1) among the first, second, and third sub-pixels (SPX1 to SPX3) include the color conversion layer (CCL). Consequently, the display device (DD) according to some embodiments may have sufficient light efficiency, and the manufacturing method of the display device (DD) according to some embodiments may be provided such that some process operations are simplified to reduce process costs (e.g., reduce process costs).

[0144] Referring to FIGS. 5 to 27, display devices (DD) according to some embodiments are discussed in more detail below. Content that may overlap with the above will be briefly described or not repeated.

[0145] The display device (DD) according to the embodiments illustrated in FIGS. 5 to 27 may be such that the color conversion layer (CCL) is manufactured by an inkjet process, and at least one of the first scattering layer (SCT1) and the second scattering layer (SCT2) is manufactured by a photolithography process using a mask. For example, the color conversion layer (CCL) may be manufactured by an inkjet process, and the first scattering layer (SCT1) and / or the second scattering layer (SCT2) may be manufactured by a photolithography process.

[0146] FIGS. 5 to 7 are schematic cross-sectional views showing display devices according to some embodiments of the present disclosure.

[0147] According to some embodiments, the layers of the display device (DD) may be manufactured on the same substrate or may be manufactured on different substrates and then bonded together.

[0148] For example (see FIG. 5), a first panel (PNL1) may be manufactured by forming a display layer (DL) on a lower substrate (BSUB), a second panel (PNL2) may be manufactured by forming a color filter layer (CFL) and a light control layer (LCL) on an upper substrate (USUB), and a filling layer (FIL) may be interposed between the first panel (PNL1) and the second panel (PNL2) so that the first panel (PNL1) and the second panel (PNL2) may be combined, thereby providing a display device (DD). According to some embodiments, the first panel (PNL1) and / or the second panel (PNL2) may further include a dam structure to reduce (e.g., prevent) the risk of the filling layer (FIL) diffusing to the outside.

[0149] According to some embodiments, the light control layer (LCL) is formed under the color filter layer (CFL) and may include a bank (QBNK), a color conversion layer (CCL), a first capping layer (QCP1), a first scattering layer (SCT1), a second scattering layer (SCT2), a spacer (CS), and a second capping layer (QCP2).

[0150] For example, a light control layer (LCL) can be formed on an upper substrate (USUB) and manufactured to be included in a second panel (PNL2), and thus can be placed under a color filter layer (CFL).

[0151] According to some embodiments, the bank (QBNK) may be disposed under the color filter layer (CFL). For example, the bank (QBNK) may be disposed directly on the optical capping layer (LCP). According to some embodiments, when the optical capping layer (LCP) is not formed, the bank (QBNK) may be disposed directly on the optical layer (LR).

[0152] A bank (QBNK) may be positioned between adjacent sub-pixel areas (SPXA) when viewed on a plane. For example, the bank (QBNK) may overlap a non-sub-pixel area (NSPXA) along a third direction (DR3) (e.g., when viewed on a corresponding plane in FIG. 16).

[0153] The bank (QBNK) can surround at least a portion of an area. For example, the bank (QBNK) can surround at least a portion of an area for forming a sub-pixel area (SPXA) and can protrude in a thickness direction (e.g., a third direction (DR3)) of a lower substrate (BSUB) (e.g., a base layer (BSL)). Accordingly, the bank (BNK) can form a space in which a color conversion layer (CCL) and a scattering layer (SCT) can be arranged (e.g., accommodated).

[0154] The plane defined in this specification may be defined based on a plane on which the base layer (BSL) is arranged, as a direction extending in a first direction (DR1) and a second direction (DR2) (see FIG. 1). According to some embodiments, the third direction (DR3) may be a thickness direction of the base layer (BSL), and the third direction (DR3) may be a light emission direction of the display device (DD).

[0155] In some embodiments, the bank (QBNK) may include a tapered side surface, with the side adjacent to the surface on which the bank (QBNK) is positioned being recessed. In this case, the area of ​​the region surrounded by the bank (QBNK) may increase as it moves outward relative to the direction in which light is emitted. For example, the area surrounded by the lower portion of the bank (QBNK) may be smaller than the area surrounded by the upper portion of the bank (QBNK).

[0156] The bank (QBNK) may include various materials. For example, the bank (QBNK) may include an organic material. According to some embodiments, the bank (QBNK) may include one or more of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, or a polyimide resin. According to some embodiments, the bank (QBNK) may further include a scattering material (e.g., titanium oxide (TiOx)). However, the present disclosure is not limited thereto.

[0157] The color conversion layer (CCL) may be disposed beneath the color filter layer (CFL). For example, the color conversion layer (CCL) may be disposed directly on the optical capping layer (LCP). In some embodiments, when the optical capping layer (LCP) is not formed, the color conversion layer (CCL) may be disposed directly on the optical layer (LR).

[0158] The color conversion layer (CCL) may be formed within the first sub-pixel area (SPXA1). When viewed in a plane (e.g., in the third direction (DR3)), the color conversion layer (CCL) may overlap the first sub-pixel area (SPXA1) and may not overlap the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3).

[0159] The color conversion layer (CCL) may be configured to form a first sub-pixel (SPX1). For example, the color conversion layer (CCL) may include first color conversion particles that convert light provided from a light emitting element (LD) (e.g., light including a light component of a second color and a light component of a third color) into a first color. For example, the color conversion layer (CCL) may include quantum dots (QDs) that convert light of a third color into light of a first color. The quantum dots (QDs) may absorb light of the third color and shift a wavelength according to an energy transition to emit light of the first color. The quantum dots (QDs) may be dispersed and provided within a matrix layer of an organic material or the like.

[0160] The first capping layer (QCP1) may be disposed across the sub-pixel areas (SPXA) and the non-sub-pixel areas (NSPXA). The first capping layer (QCP1) may be disposed on at least a portion of the bank (QBNK), the color conversion layer (CCL), and the optical capping layer (LCP).

[0161] The first capping layer (QCP1) may be disposed on the color conversion layer (CCL) based on a base (e.g., a color conversion layer (CFL), an optical layer (LR), or an optical capping layer (LCP)) on which the light control layer (LCL) (e.g., a color conversion layer (CCL)) is disposed within the first sub-pixel area (SPXA1). The first capping layer (QCP1) may be disposed on (e.g., under) the first and second scattering layers (SCT1, SCT2) based on a base (e.g., a color conversion layer (CFL), an optical layer (LR), or an optical capping layer (LCP)) on which the light control layer (LCL) (e.g., a first and second scattering layers (SCT1, SCT2)) is disposed within the second and third sub-pixel areas (SPXA2, SPXA3). For example, the first capping layer (QCP1) may passivate the color conversion layer (CCL). The first capping layer (QCP1) may be disposed (e.g., directly disposed) on the optical capping layer (LCP) in the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3). In some embodiments, when the optical capping layer (LCP) is not formed, the first capping layer (QCP1) may also be disposed (e.g., directly disposed) on the optical layer (LR) in the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3).

[0162] Here, the first capping layer (QCP1) may be referred to as a “capping layer.”

[0163] The first capping layer (QCP1) may be manufactured after the inkjet process for manufacturing the color conversion layer (CCL) and before the photolithography process for manufacturing the first scattering layer (SCT1) and the second scattering layer (SCT2). Accordingly, the first capping layer (QCP1) may be disposed below the color conversion layer (CCL) and above the first scattering layer (SCT1) and the second scattering layer (SCT2).

[0164] The first capping layer (QCP1) is an inorganic layer and may include one or more of silicon nitride (SiNx), aluminum nitride (AlNx), titanium nitride (TiNx), silicon oxide (SiOx), aluminum oxide (AlxOy), titanium oxide (TiOx), silicon oxycarbide (SiOxCy), or silicon oxynitride (SiOxNy). However, the present disclosure is not limited to these examples.

[0165] The first scattering layer (SCT1) and the second scattering layer (SCT2) may be disposed under the color filter layer (CFL). For example, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be disposed (e.g., directly disposed) on the first capping layer (QCP1). For example, the process for forming the first scattering layer (SCT1) and the second scattering layer (SCT2) may be manufactured after the first capping layer (QCP1) is manufactured (e.g., after the first capping layer (QCP1) passivates the color conversion layer (CCL), and thus, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be directly adjacent to the first capping layer (QCP1).

[0166] The first scattering layer (SCT1) may be formed within the second sub-pixel area (SPXA2), and the second scattering layer (SCT2) may be formed within the third sub-pixel area (SPXA3). The first scattering layer (SCT1) may overlap the second sub-pixel area (SPXA2) when viewed in a plan view (e.g., along the third direction (DR3)), and the second scattering layer (SCT2) may overlap the third sub-pixel area (SPXA3) when viewed in a plan view (e.g., along the third direction (DR3)). The first scattering layer (SCT1) and the second scattering layer (SCT2) may not overlap the first sub-pixel area (SPXA1).

[0167] The first scattering layer (SCT1) and the second scattering layer (SCT2) may be layers provided to improve light emission efficiency (e.g., brightness) and to improve viewing angle characteristics. For example, each of the first scattering layer (SCT1) and the second scattering layer (SCT2) may include a scatterer (SC). The scatterer (SC) may be provided dispersed in a matrix such as an organic material (e.g., a transparent organic material). According to some embodiments, the scatterer (SC) may include a first scatterer (SC1) included in the first scattering layer (SCT1) and a second scatterer (SC2) included in the second scattering layer (SCT2).

[0168] According to some embodiments, the concentration of the first scatterer (SC1) within the first scattering layer (SCT1) and the concentration of the second scatterer (SC2) within the second scattering layer (SCT2) may be different. Accordingly, the optical characteristic relationship of the second and third sub-pixels (SPX2, SPX3) may be adjusted based on the concentration of the first and second scatterers (SC1, SC2).

[0169] According to some embodiments, the scatterer (SC) may include various light-scattering particles. For example, the scatterer (SC) may include one or more of titanium oxide (TiOx), silica (SiOx) (e.g., silica beads, hollow silica, etc.), zirconium oxide (ZrOx), aluminum oxide (AlxOy), indium oxide (InxOy), zinc oxide (ZnOx), tin oxide (SnOx), or antimony oxide (SbxOy). However, the present disclosure is not limited thereto.

[0170] According to some embodiments, the scatterer (SC) may be included in a range of about 0.1 wt% to about 8.5 wt% with respect to the scattering layer (SCT). According to some embodiments, the scatterer (SC) may be included in a range of about 1.5 wt% to about 8.5 wt% with respect to the scattering layer (SCT). According to some embodiments, the scatterer (SC) may be included in a range of about 4.0 wt% to about 7.5 wt% with respect to the scattering layer (SCT). The above-described numerical ranges may be applied independently to each of the first scattering layer (SCT1) and the second scattering layer (SCT2). However, the present disclosure is not limited to the examples.

[0171] The first scattering layer (SCT1) and the second scattering layer (SCT2) may not include quantum dots as color conversion particles. For example, the first scattering layer (SCT1) may not include quantum dots for providing green light. The second scattering layer (SCT2) may not include quantum dots for providing blue light. Accordingly, the first scattering layer (SCT1) and the second scattering layer (SCT2) may transmit applied light without changing the color of the applied light.

[0172] In the present specification, “without changing the color of light applied to the first scattering layer (SCT1) and the second scattering layer (SCT2)” may mean that the color of light before and after transmission through the first scattering layer (SCT1) and the second scattering layer (SCT2) is substantially in the same range. For example, the light before transmission through the first scattering layer (SCT1) may include light that is a mixture of green light and blue light (or may have a wavelength band that includes a green light component and a blue light component), and the light after transmission through the first scattering layer (SCT1) may include light that is a mixture of green light and blue light (or may have a wavelength band that includes a green light component and a blue light component). Before transmitting through the second scattering layer (SCT2), the light may include a mixture of green light and blue light (or may have a wavelength band including a green light component and a blue light component), and after transmitting through the second scattering layer (SCT2), the light may include a mixture of green light and blue light (or may have a wavelength band including a green light component and a blue light component).

[0173] According to some embodiments, the color conversion layer (CCL) may also include a scatterer (SC). In this case, light emitted by the light emitting element (LD) may be scattered in the area where the color conversion layer (CCL) is formed, and the viewing angle characteristics of the first sub-pixel (SPX1) may be improved.

[0174] According to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be manufactured in the same photolithography process. In this case, at least some of the process operations for manufacturing the second sub-pixel (SPX2) and the third sub-pixel (SPX3) may be simplified. However, the present disclosure is not limited thereto. In some examples, the first photolithography process for manufacturing the first scattering layer (SCT1) may be performed followed by the second photolithography process for manufacturing the second scattering layer (SCT2), and the first photolithography process for manufacturing the first scattering layer (SCT1) may be performed followed by the second photolithography process for manufacturing the second scattering layer (SCT2).

[0175] According to some embodiments, as the first scattering layer (SCT1) and the second scattering layer (SCT2) are manufactured based on a photolithography process, the sub-pixels (SPX) can be manufactured to be finer, and thus a display device (DD) having high performance (e.g., high resolution, etc.) can be manufactured.

[0176] The spacer (CS) may be positioned within the non-sub-pixel area (NSPXA). In some embodiments, the spacer (CS) may not overlap the sub-pixel area (SPXA) when viewed in a plane (e.g., along the third direction (DR3)).

[0177] The spacer (CS) may be positioned on the bank (QBNK). For example, the spacer (CS) may be positioned between the bank (QBNK) and the display layer (DL). The spacer (CS) may be positioned directly on the first capping layer (QCP1).

[0178] The spacer (CS) may be disposed above the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) based on the base on which the light control layer (LCL) is disposed. For example, the spacer (CS) may protrude in the thickness direction (e.g., the third direction (DR3)) of the lower substrate (BSUB) (e.g., the base layer (BSL)). The spacer (CS) may form a separation distance between other components of the light control layer (LCL) and the display layer (DL) when a process of bonding the first panel (PNL1) and the second panel (PNL2) is performed. For this purpose, the spacer (CS) may be closest to the display layer (DL) compared to the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2).

[0179] The spacer (CS) can be manufactured in the same photolithography process as at least one of the first scattering layer (SCT1) and the second scattering layer (SCT2). Accordingly, the process operation for forming the spacer (CS) can be simplified, thereby reducing the process cost. In some examples, the spacer (CS) can be formed in the same process as the first scattering layer (SCT1), the spacer (CS) can be formed in the same process as the second scattering layer (SCT2), or the spacer (CS) can be formed in the same process as the first scattering layer (SCT1) and the second scattering layer (SCT2).

[0180] The spacer (CS) may be manufactured in the same process as at least one of the first scattering layer (SCT1) and the second scattering layer (SCT2), may include the same material as at least one of them, and may also include a scatterer (SC).

[0181] The second capping layer (QCP2) may be disposed across the sub-pixel areas (SPXA) and the non-sub-pixel areas (NSPXA). The second capping layer (QCP2) may be disposed on the first capping layer (QCP1), the first scattering layer (SCT1), the second scattering layer (SCT2), and the spacer (CS). The second capping layer (QCP2) may passivate the first scattering layer (SCT1) and the second scattering layer (SCT2).

[0182] The second capping layer (QCP2) can be manufactured after the photolithography process for manufacturing the first scattering layer (SCT1) and the second scattering layer (SCT2).

[0183] The second capping layer (QCP2) is an inorganic layer and may include one or more of silicon nitride (SiNx), aluminum nitride (AlNx), titanium nitride (TiNx), silicon oxide (SiOx), aluminum oxide (AlxOy), titanium oxide (TiOx), silicon oxycarbide (SiOxCy), or silicon oxynitride (SiOxNy). However, the present disclosure is not limited thereto.

[0184] As described above, a filling layer (FIL) may be interposed between the first panel (PNL1) and the second panel (PNL2). The filling layer (FIL) may include various transparent organic materials, examples of which are not particularly limited.

[0185] According to some embodiments, the color filter layer (CFL) is formed on the lower portion of the upper layer (UPL) and may include color filters (CF), an optical layer (LR), and an optical capping layer (LCP).

[0186] For example, a color filter layer (CFL) can be formed on an upper substrate (USUB) and manufactured to be included in a second panel (PNL2), and thus can be placed under the upper layer (UPL).

[0187] According to some embodiments, the color filters (CF) may include a first color filter (CF1) for forming a first sub-pixel (SPX1), a second color filter (CF2) for forming a second sub-pixel (SPX2), and a third color filter (CF3) for forming a third sub-pixel (SPX3).

[0188] The color filters (CF) may be positioned on the lower portion of the upper substrate (USUB). For example, the color filters (CF) may be positioned directly on the upper capping layer (UCP).

[0189] A first color filter (CF1) may be positioned within the first sub-pixel area (SPXA1). The first color filter (CF1) may include a color filter material (e.g., a dye or pigment) that transmits (e.g., selectively transmits) light of a first color (e.g., red).

[0190] The second color filter (CF2) may be positioned within the second sub-pixel area (SPXA2). The second color filter (CF2) may include a color filter material (e.g., a dye or pigment) that transmits (e.g., selectively transmits) light of a second color (e.g., green).

[0191] A third color filter (CF3) may be positioned within the third sub-pixel area (SPXA3). The third color filter (CF3) may include a color filter material (e.g., a dye or pigment) that transmits (e.g., selectively transmits) light of a third color (e.g., blue).

[0192] According to some embodiments, a non-sub-pixel area (SPXA) may be formed between the sub-pixel areas (SPXA) where light of a single color may not be recognized. According to some embodiments, a first color filter (CF1), a second color filter (CF2), and a third color filter (CF3) may overlap when viewed in a plane (along the third direction (DR3)) within the non-sub-pixel area (SPXA).

[0193] The optical layer (LR) may be disposed on the color filters (CF). The optical layer (LR) may be disposed across the sub-pixel areas (SPXA) and the non-sub-pixel areas (NSPXA).

[0194] The optical layer (LR) may have a higher refractive index than the layers forming the color filters (CF). The optical layer (LR) may have a lower refractive index than the color conversion layer (CCL) and may form a light recycling structure.

[0195] The optical layer (LR) may include various materials to have a single refractive index. For example, the optical layer (LR) may include various resins and hollow silica. In some examples, the optical layer (LR) may include zirconium oxide (ZrOx). However, the present disclosure is not limited to these examples.

[0196] Here, the optical layer (LR) may be referred to as a low-refractive layer.

[0197] An optical capping layer (LCP) may be disposed on the optical layer (LR). The optical capping layer (LCP) may be disposed across the sub-pixel areas (SPXA) and the non-sub-pixel areas (NSPXA). The optical capping layer (LCP) may passivate the optical layer (LR).

[0198] The optical capping layer (LCP) may include one or more of the examples described above with reference to the first capping layer (QCP1). According to some embodiments, the optical capping layer (LCP) may be omitted (e.g., may not be provided).

[0199] According to some embodiments, an upper substrate (USUB) may be disposed on the color filter layer (CFL) as a base member for manufacturing a second panel (PNL2), and according to some embodiments, an upper capping layer (UCP) may be disposed on the upper substrate (USUB).

[0200] The upper substrate (USUB) may be a manufacturing substrate for manufacturing the second panel (PNL2) and may include one or more of the materials described above with reference to the lower substrate (BSUB) (e.g., the base layer (BSL)). For example, the upper substrate (USUB) may include an organic substrate.

[0201] The upper capping layer (UCP) may be disposed between the upper substrate (USUB) and the color filters (CF) and may include one or more of the examples (e.g., materials) described above with reference to the first capping layer (QCP1).

[0202] According to some embodiments (see FIG. 6), a first panel (PNL1) may be manufactured by forming a display layer (DL) and a light control layer (LCL) on a lower substrate (BSUB), a second panel (PNL2) may be manufactured by forming a color filter layer (CFL) on an upper substrate (USUB), and a filling layer (FIL) may be interposed between the first panel (PNL1) and the second panel (PNL2) so that the first panel (PNL1) and the second panel (PNL2) may be combined, thereby providing a display device (DD).

[0203] For example, the display device (DD) illustrated in FIG. 6 is different from the display device (DD) illustrated in FIG. 5 in that the configurations for forming the light control layer (LCL) (e.g., bank (QBNK), color conversion layer (CCL), first capping layer (QCP1), first scattering layer (SCT1), second scattering layer (SCT2), spacer (CS), second capping layer (QCP2)) are arranged on the lower substrate (BSUB) (e.g., even before the first panel (PNL1) and the second panel (PNL2) are bonded).

[0204] Accordingly, the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) may be arranged adjacent to the display layer (DL) and included in the first panel (PNL1). In addition, the filling layer (FIL) may be interposed between the layers forming the light control layer (LCL) and the color filter layer (CFL).

[0205] According to some embodiments (see FIG. 7), the first panel (PNL1) may be manufactured by forming a display layer (DL), a light control layer (LCL), a color filter layer (CFL), and an upper layer (UPL) on a lower substrate (BSUB) without separately providing an upper substrate (USUB), and the display device (DD) may be provided without a separate process of combining the panels.

[0206] In this case, the display device (DD) illustrated in FIG. 7 is different from the display device (DD) illustrated in FIG. 6 in that the color filter layer (CFL) and the upper layer (UPL) are also disposed on the lower substrate (BSUB).

[0207] In this case, an optical layer (LR) and a color filter layer (CF) may be sequentially disposed on a light control layer (LCL). In addition, according to some embodiments, a planarization layer (PLA) including an organic material may be further disposed on the color filter layer (CF). According to some embodiments, the upper substrate (USUB) may not be formed, and an upper film layer (UFM) may be disposed on the upper capping layer (UCP). According to some embodiments, the upper film layer (UFM) may include one or more of a polyethyleneterephthalate (PET) film, a low-reflection film, a polarizing film, or a transmittance controllable film. However, the present disclosure is not limited thereto.

[0208] With reference to FIGS. 8 to 27, various technical features related to the light control layer (LCL) will be described below.

[0209] FIG. 8 is a schematic cross-sectional view illustrating the thickness relationship of a first scattering layer, a second scattering layer, and a color conversion layer according to some embodiments.

[0210] FIGS. 9 to 11 are schematic cross-sectional views illustrating the relationship between scatterers included in each of the first scattering layer and the second scattering layer according to some embodiments of the present disclosure.

[0211] FIG. 8 illustrates a first sub-pixel area (SPXA1), a second sub-pixel area (SPXA2), a third sub-pixel area (SPXA3), and adjacent areas thereof according to some embodiments of the present disclosure. For example, FIG. 8 illustrates a color conversion layer (CCL) disposed in the first sub-pixel area (SPXA1), a first scattering layer (SCT1) and a second scattering layer (SCT2) disposed in the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), and illustrates a bank (QBNK) surrounding the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2). Referring to FIG. 8, the color conversion layer (CCL) may have a thickness greater than the first and second scattering layers (SCT1, SCT2). In this specification, the thickness may be defined based on the thickness direction of the base layer (BSL) (e.g., the third direction (DR3)).

[0212] For example, the color conversion layer (CCL) may have a first thickness (T1). The first scattering layer (SCT1) may have a second thickness (T2). The second scattering layer (SCT2) may have a third thickness (T3). The first thickness (T1) may be greater than the second thickness (T2) and the third thickness (T3). In some embodiments, the second thickness (T2) and the third thickness (T3) may be substantially equal to each other.

[0213] According to some embodiments, it may be desirable for the sub-pixels (SPX) to have substantially uniform light emission efficiencies. For example, it may be appropriate for the first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) to have light emission efficiencies that correspond to each other (e.g., are substantially the same).

[0214] Since the first sub-pixel (SPX1) for emitting the first color can be implemented by a color conversion layer (CCL), the color implementation efficiency (e.g., current efficiency) can be relatively low compared to the second and third sub-pixels (SPX1, SPX2).

[0215] According to some embodiments, a first thickness (T1) of a color conversion layer (CCL) included in a first sub-pixel (SPX1) may be defined to be greater than a second and third thicknesses (T2, T3) of the first and second scattering layers (SCT1, SCT2) included in a second and third sub-pixel (SPX2). In this case, the color conversion layer (CCL) may be defined to be relatively thick, so that a large amount of scatterers (SC) may be included compared to the first and second scattering layers (SCT1, SCT2), and a difference in color expression efficiency between the first to third sub-pixels (SPX1 to SPX3) may be compensated for.

[0216] In addition, since the first and second scattering layers (SCT1, SCT2), each of which does not include a single quantum dot, can have corresponding thicknesses (e.g., substantially the same thickness), process convenience can be improved.

[0217] FIGS. 9 to 11 illustrate a second sub-pixel area (SPXA2), a third sub-pixel area (SPXA3), and adjacent areas thereof according to some embodiments of the present disclosure. For example, FIGS. 9 to 11 illustrate a first scattering layer (SCT1) and a second scattering layer (SCT2) disposed in the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), and illustrate a bank (QBNK) surrounding the first scattering layer (SCT1) and the second scattering layer (SCT2).

[0218] According to some embodiments, adjacent banks (QBNK) surrounding a first scattering layer (SCT1) may be spaced apart by a first distance (L1). Adjacent banks (QBNK) surrounding a second scattering layer (SCT2) may be spaced apart by a second distance (L2).

[0219] Referring to FIG. 9, according to some embodiments, the first scatterer (SC1) may have a larger size than the second scatterer (SC2). In this case, according to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be manufactured by separate processes.

[0220] In this specification, the size of the scatterers (SC) may mean the largest diameter that can be defined in the particle for the scatterers (SC).

[0221] For example, in some embodiments, when the scatterer (SC) has an elliptical shape, the size of the scatterer (SC) may be the semi-major axis of the ellipse. For example, in some embodiments, when the scatterer (SC) has a circular shape, the size of the scatterer (SC) may be the diameter. For example, in some embodiments, when the scatterer (SC) has a shape including an irregular protrusion structure, the size of the scatterer (SC) may be the distance between the ends that are most spaced apart from each other within the shape of the scatterer (SC).

[0222] A scatterer (SC) can most efficiently scatter light having a wavelength band that is twice the size of the scatterer (SC).

[0223] For example, in some embodiments, when the diameter of the scatterer (SC) is about 300 nm to about 375 nm, light in a wavelength band of about 600 nm to about 750 nm can be efficiently scattered. According to some embodiments, when the diameter of the scatterer (SC) is about 240 nm to about 280 nm, light in a wavelength band of about 480 nm to about 560 nm can be efficiently scattered. According to some embodiments, when the diameter of the scatterer (SC) is about 185 nm to about 230 nm, light in a wavelength band of about 370 nm to about 460 nm can be efficiently scattered.

[0224] Accordingly, according to some embodiments, the size of the first scatterer (SC1) may be arranged to correspond to the wavelength band of light provided by the second sub-pixel (SPX2), and the size of the second scatterer (SC2) may be arranged to correspond to the wavelength band of light provided by the third sub-pixel (SPX3).

[0225] For example, the first scatterer (SC1) may have a size in the range of about 240 nm to about 280 nm. The second scatterer (SC2) may have a size in the range of about 185 nm to about 230 nm.

[0226] Accordingly, in some embodiments, the scattering performance of the first scattering layer (SCT1) and the second scattering layer (SCT2) can be provided (e.g., optimized) for each sub-pixel (SPX).

[0227] Referring to FIG. 10, according to some embodiments, the first scatterer (SC1) and the second scatterer (SC2) may have the same size, the first scatterer (SC1) may be included in the first scattering layer (SCT1) at a first weight ratio, the second scatterer (SC2) may be included in the second scattering layer (SCT2) at a second weight ratio, and the first weight ratio may be greater than the second weight ratio. For example, the number of the first scatterers (SC1) in the first scattering layer (SCT1) may be greater than the number of the second scatterers (SC2) in the second scattering layer (SCT2).

[0228] As described above, it may be desirable for the sub-pixels (SPX) to have substantially uniform light output efficiencies. It may be appropriate for the second sub-pixel (SPX2) and the third sub-pixel (SPX3) to have light output efficiencies that correspond to each other (e.g., have substantially the same light output efficiencies). For example, the light emitted by the light-emitting element (LD) disposed in each of the sub-pixel areas (SPXA) may include a light component of a second color and a light component of a third color, and the light component of the third color may be for forming a third sub-pixel (SPX3) that provides light of the third color and a first sub-pixel (SPX1) that provides light of the first color by the color conversion layer (CCL). Accordingly, when comparing the second sub-pixel (SPX2) and the third sub-pixel (SPX3), the third sub-pixel (SPX3) may have a higher light output efficiency than the second sub-pixel (SPX2), so it may be desirable to compensate for the light output efficiency of the second sub-pixel (SPX2) so that the light output efficiencies of the second sub-pixel (SPX2) and the third sub-pixel (SPX3) correspond to each other (for example, are substantially the same).

[0229] Since the scatterer (SC) can improve the light output efficiency by scattering the applied light, the higher the ratio of the scatterer (SC) included in the scattering layer (SCT), the better the light output efficiency of the corresponding sub-pixel (SPX).

[0230] According to some embodiments, the first scatterer (SC1) in the first scattering layer (SCT1) may be included at a higher weight ratio than the second scatterer (SC2) in the second scattering layer (SCT2), and the difference in light emission efficiency may be compensated, so that the second sub-pixel (SPX2) and the third sub-pixel (SPX3) may have light emission efficiency that is generally uniform with each other.

[0231] Referring to FIG. 11, according to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be formed by the same process and may include materials having the same composition. In addition, the first scattering body (SC1) and the second scattering body (SC2) may each include scattering bodies having different sizes. For example, the first scattering body (SC1) and the second scattering body (SC2) may each include scattering bodies having different sizes at the same composition ratio.

[0232] A scatterer (SC) can relatively efficiently scatter light having a wavelength band twice the size of the scatterer (SC).

[0233] According to some embodiments, each of the first scatterer (SC1) and the second scatterer (SC2) may include both a scatterer having a relatively large size for efficiently scattering light of a second color and a scatterer having a relatively small size for efficiently scattering light of a third color. Accordingly, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be manufactured in the same process, thereby simplifying the process, while improving the light output efficiency for each sub-pixel (SPX).

[0234] FIGS. 12 to 15 are cross-sectional views illustrating features of a light control layer according to some embodiments of the present disclosure.

[0235] For convenience of explanation, FIGS. 12 to 15 illustrate a light control layer (LCL) and the like based on the cross-sectional structure described above with reference to FIG. 5. For convenience of explanation, FIGS. 12 to 15 illustrate a color filter layer (CFL) and a light control layer (LCL) arranged on an upper substrate (USUB). For example, FIGS. 12 to 15 illustrate a second panel (PNL2), and in order to explain a structure in which the second panel (PNL2) is formed, the upper substrate (USUB) is arranged below, and a structure in which a color filter layer (CFL) and a light control layer (LCL) are sequentially arranged on the upper substrate (USUB) is illustrated.

[0236] Referring to FIG. 12, the optical layer (LR) according to some embodiments may be placed (e.g., selectively placed) only in some of the sub-pixel areas (SPXA).

[0237] For example, the optical layer (LR) may be disposed within the first sub-pixel area (SPXA1). The optical layer (LR) may not be disposed within the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3). Accordingly, according to some embodiments, the first capping layer (QCP1) may be directly adjacent to (e.g., in contact with) the second and third color filters (CF2, CF3) in the second and third sub-pixel areas (SPXA2, SPXA3), respectively.

[0238] According to some embodiments, the optical layer (LR) may be a low-refractive layer and have a lower refractive index than the color conversion layer (CCL). Accordingly, light provided from the color conversion layer (CCL) may be reflected by the optical layer (LR) and provided back to the color conversion layer (CCL), thereby forming a light recycling structure.

[0239] According to some embodiments, since quantum dots (QDs) configured to change the color of light can be disposed in the first sub-pixel area (SPXA1) without being disposed in the second and third sub-pixel areas (SPXA2, SPXA3), it may be particularly preferable for the light recycling structure to be formed in the first sub-pixel area (SPXA1).

[0240] Accordingly, according to some embodiments, since the optical layer (LR) is selectively disposed only in some areas, the process cost for manufacturing the display device (DD) may be reduced. In addition, since the scattering layers (SCT) may be disposed in the second and third sub-pixel areas (SPXA2, SPXA3) where the optical layer (LR) is not disposed, in the range of the thickness of the optical layer (LR), the scattering performance of the scattering layers (SCT) may be further improved in the second and third sub-pixel areas (SPXA2, SPXA3).

[0241] Referring to FIG. 13, the display device (DD) according to some embodiments may further include a black matrix layer (BM), and the black matrix layer (BM) may be disposed in the non-sub pixel areas (NSPXA) adjacent to the second and third sub pixel areas (SPXA2, SPXA3) without the bank (QBNK). For example, the black matrix layer (BM) may be provided instead of providing the bank (QBNK) between the second and third sub pixel areas (SPXA2, SPXA3) in some embodiments. The black matrix layer (BM) may penetrate between the first scattering layer (SCT1) and the second scattering layer (SCT2).

[0242] According to some embodiments, a bank (QBNK) may be patterned in a non-sub-pixel area (NSPXA) adjacent to a first sub-pixel area (SPXA1), and a black matrix layer (BM) may be disposed in a non-sub-pixel area (NSPXA) that is not directly adjacent to the first sub-pixel area (SPXA1). The black matrix layer (BM) may be disposed within the non-sub-pixel area (NSPXA) when viewed in a plan view and may not overlap with the sub-pixel areas (SPXA). According to some embodiments, the black matrix layer (BM) may be directly adjacent to (e.g., in contact with) the first capping layer (QCP1). However, the present disclosure is not limited to these examples.

[0243] According to some embodiments, the second scattering layer (SCT2) and the third scattering layer (SCT3) can be manufactured by a photolithography process rather than an inkjet process, so that even when the bank (QBNK) is not disposed adjacent to the second scattering layer (SCT2) and the third scattering layer (SCT3), the second scattering layer (SCT2) and the third scattering layer (SCT3) can be suitably patterned.

[0244] For example, according to some embodiments, in order to manufacture the first scattering layer (SCT1) and the second scattering layer (SCT2), a base scattering layer including scatterers (SC) can be disposed across the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), and a black matrix layer (BM) penetrating the base scattering layer can be patterned in an area adjacent to the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3).

[0245] According to some embodiments, the black matrix layer (BM) may include a dye or pigment capable of blocking or absorbing light. For example, the black matrix layer (BM) may include carbon black or the like. However, the present disclosure is not limited to these examples.

[0246] Referring to FIGS. 14 and 15 , a display device (DD) (e.g., a light control layer (LCL)) according to some embodiments may further include a filling scattering layer (FSCT) including a filling scatterer (FSC). The filling scatterer (FSC) may include a first filling scatterer (FSC1) and a second filling scatterer (FSC2). The filling scattering layer (FSCT) may include a first filling scattering layer (FSCT1) in which the first filling scatterer (FSC1) is disposed and a second filling scattering layer (FSCT2) in which the second filling scatterer (FSC2) is disposed. The filling scattering layer (FSCT) may refer to a material including a filling scatterer (FSC) including a scattering material in a filling material.

[0247] According to some embodiments, the first filling scattering layer (FSCT1) can be disposed within the second sub-pixel area (SPXA2). The first filling scattering layer (FSCT1) can overlap the first scattering layer (SCT1) when viewed in a plan view (along the third direction (DR3)). The second filling scattering layer (FSCT2) can be disposed within the third sub-pixel area (SPXA3). The second filling scattering layer (FSCT2) can overlap the second scattering layer (SCT2) when viewed in a plan view (along the third direction (DR3)).

[0248] For example (see FIG. 14), the first filled scattering layer (FSCT1) may be disposed on the first scattering layer (SCT1) and may be passivated (e.g., coated or protected) by the second capping layer (QCP2). The second filled scattering layer (FSCT2) may be disposed on the second scattering layer (SCT2) and may be passivated by the second capping layer (QCP2). In some embodiments, after the first scattering layer (SCT1) and the second scattering layer (SCT2) are patterned, the first filled scattering layer (FSCT1) and the second filled scattering layer (FSCT2) may be patterned.

[0249] In another example (see FIG. 15), the first fill scattering layer (FSCT1) may be disposed between the first scattering layer (SCT1) and the second color filter (CF2), and may be adjacent (e.g., directly adjacent) to the first capping layer (QCP1) in some embodiments. The second fill scattering layer (FSCT2) may be disposed between the second scattering layer (SCT2) and the third color filter (CF3), and may be adjacent (e.g., directly adjacent) to the first capping layer (QCP1) in some embodiments. In some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be patterned after the first fill scattering layer (FSCT1) and the second fill scattering layer (FSCT2) are patterned.

[0250] According to some embodiments, a plurality of scattering structures having various scattering characteristics are formed in the second and third sub-pixel areas (SPXA2, SPXA3), so that scattering performance can be further improved, and thus the light output efficiency of the display device (DD) can be improved.

[0251] FIGS. 16 to 21 are plan views illustrating the arrangement relationship between banks and sub-pixel areas according to some embodiments of the present disclosure.

[0252] For convenience of explanation, FIGS. 16 to 21 illustrate some areas of the display area (DA), and illustrate sub-pixel areas (SPXA) and banks (QBNK) arranged adjacent thereto. FIGS. 16 to 19 illustrate a structure in which a first sub-pixel area (SPXA1) and a second sub-pixel area (SPXA2) are adjacent in a second direction (DR2), and a third sub-pixel area (SPXA3) is adjacent to the first sub-pixel area (SPXA1) in a first direction (DR1), according to some embodiments of the present disclosure. FIGS. 17 to 19 illustrate pixels (PXL) adjacent to each other within the display area (DA) according to embodiments of the present disclosure. For example, FIGS. 17 to 19 illustrate a first pixel (PXL1) and a second pixel (PXL2) adjacent to each other in a first direction (DR1) among the pixels (PXL). FIG. 20 and FIG. 21 illustrate a structure in which sub-pixel areas (SPXA) are sequentially arranged in a first direction (DR1) according to embodiments of the present disclosure.

[0253] Referring to FIG. 16, a bank (QBNK) may surround at least a portion of each of the sub-pixel areas (SPXA). FIG. 16 illustrates one pixel (PXL) within a display area (DA) according to some embodiments of the present disclosure.

[0254] According to some embodiments, the bank (QBNK) may form a closed loop for each of the sub-pixel areas (SPXA). For example, the bank (QBNK) may entirely surround (e.g., surround all sides of) a first sub-pixel area (SPXA1) (e.g., the color conversion layer (CCL)) when viewed in a plan view. The bank (QBNK) may entirely surround a second sub-pixel area (SPXA2) (e.g., the first scattering layer (SCT1)) when viewed in a plan view. The bank (QBNK) may entirely surround a third sub-pixel area (SPXA3) (e.g., the second scattering layer (SCT2)) when viewed in a plan view.

[0255] Referring to FIG. 17, a bank (BNK) can surround only one of the sub-pixel areas (SPXA) (e.g., one of three sub-pixel areas (SPXA)) when viewed on a plane.

[0256] According to some embodiments, the bank (QBNK) may entirely surround the first sub-pixel area (SPXA1) (e.g., the color conversion layer (CCL)). Accordingly, the bank (QBNK) may form a closed-loop structure, and an inkjet process for manufacturing the color conversion layer (CCL) may be performed.

[0257] Additionally, according to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) can be manufactured by a photolithography process rather than an inkjet process, so that the first scattering layer (SCT1) and the second scattering layer (SCT2) can be suitably manufactured even when the bank (QBNK) does not directly surround the second and third sub-pixel areas (SPXA2, SPXA3).

[0258] According to some embodiments, the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), which are not directly surrounded by the bank (QBNK), may be spaced apart from each other by a greater distance than the spacing distance for the first sub-pixel area (SPXA1).

[0259] For example, the distance between the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3) may be greater than the distance between the first sub-pixel area (SPXA1) and the third sub-pixel area (SPXA3) and the distance between the first sub-pixel area (SPXA1) and the second sub-pixel area (SPXA2).

[0260] Accordingly, even if the bank (QBNK) is not formed directly adjacent to the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), the risk of color mixing between the second sub-pixel (SPX2) and the third sub-pixel (SPX3) can be reduced.

[0261] Referring to FIG. 18, according to some embodiments, similar to FIG. 17, the bank (QBNK) may entirely surround the first sub-pixel area (SPXA1) (e.g., the color conversion layer (CCL)), but may surround only at least a portion of the second sub-pixel area (SPXA2) (e.g., the first scattering layer (SCT1)), and may open at least another portion of the second sub-pixel area (SPXA2) (e.g., the first scattering layer (SCT1)). Accordingly, at least one side of the second sub-pixel area (SPXA2) may include an open edge portion (OEDG) where the bank (QBNK) is not arranged.

[0262] According to some embodiments, the bank (QBNK) may be positioned in an area adjacent to the third sub-pixel area (SPXA3) (e.g., the second scattering layer (SCT2)) and may not directly surround the third sub-pixel area (SPXA3) (e.g., the second scattering layer (SCT2)). Accordingly, the periphery of the third sub-pixel area (SPXA3) may be open.

[0263] According to some embodiments, the open edge (OEDG) may be formed to face in a different direction from the direction toward the third sub-pixel area (SPXA3) with respect to the second sub-pixel area (SPXA2). For example, the open edge (OEDG) may be formed away from the third sub-pixel area (SPXA3) such that the bank (QBNK) is formed around a second side of the second sub-pixel area (SPXA2) that is closer to the third sub-pixel area (SPXA3) than the open edge (OEDG).

[0264] For example, the open edge region (OEDG) may be positioned above the second sub-pixel region (SPXA2) in the second direction (DR2), and the third sub-pixel region (SPXA3) may be positioned at the lower right of the second sub-pixel region (SPXA2) in the second direction (DR2).

[0265] In this case, the risk of color mixing between the second sub-pixel (SPX2) and the third sub-pixel (SPX3) can be reduced.

[0266] In some embodiments, as described above, the bank (QBNK) does not directly surround the third sub-pixel area (SPXA3), but may be disposed adjacent to the first and second sub-pixel areas (SPXA1, SPXA2), and thus may be generally adjacent to the third sub-pixel area (SPXA3). For example, the third sub-pixel area (SPXA3) of the first pixel (PXL1) may be disposed between a portion of the bank (QBNK) of the first pixel (PXL1) and a portion of the bank (QBNK) of the second pixel (PXL2).

[0267] Accordingly, a distance between the bank (QBNK) and the second and third sub-pixel areas (SPXA2, SPXA3) can be defined. According to some embodiments, the shortest distance between the bank (QBNK) and the second sub-pixel area (SPXA2) can be smaller than the shortest distance between the bank (QBNK) and the third sub-pixel area (SPXA3).

[0268] In addition, according to some embodiments, the bank (QBNK) may surround the areas where the first scattering layer (SCT1) and the second scattering layer (SCT2) are disposed to different extents, respectively. In this case, the thicknesses of each of the first scattering layer (SCT1) and the second scattering layer (SCT2) may be manufactured to be substantially uniform without requiring a separate additional process. Furthermore, since the first scattering layer (SCT1) and the second scattering layer (SCT2) may be patterned based on a photolithography process rather than an inkjet process, the uniformity (e.g., thickness uniformity, etc.) of the first scattering layer (SCT1) and the second scattering layer (SCT2) may be improved. In addition, process operations may be simplified, so that sufficient process margin may be secured and process costs may be reduced.

[0269] Referring to FIG. 19, according to some embodiments, similar to FIG. 18, the bank (QBNK) may be positioned directly adjacent to the first and second sub-pixel areas (SPXA2) and relatively spaced apart from the third sub-pixel area (SPXA3), but the bank (QBNK) may entirely surround the second sub-pixel area (SPXA2) when viewed in plan view.

[0270] For example, the bank (QBNK) can form a closed-loop structure surrounding the second sub-pixel area (SPXA2).

[0271] In this case, when patterning the transparent organic material including the scatterers (SC) to form the first scattering layer (SCT1) and the second scattering layer (SCT2), the thickness of the second scattering layer (SCT2) may be manufactured to be relatively thinner than that of the first scattering layer (SCT1). For example, since the first scattering layer (SCT1) and the second scattering layer (SCT2) include organic materials, a phenomenon in which the first scattering layer (SCT1) and the second scattering layer (SCT2) are diffused (e.g., spread out) may occur. According to some embodiments, since the second sub-pixel area (SPXA2) is entirely surrounded by the bank (QBNK), the first scattering layer (SCT1) may not substantially be diffused, and a portion of the second scattering layer (SCT2) may be diffused over a relatively wide area. Due to this, the second scattering layer (SCT2) can be provided with a thinner thickness than the first scattering layer (SCT1).

[0272] According to some embodiments, as described above, it may be appropriate for the first scattering layer (SCT1) to include a larger amount of scatterers (SC) than the second scattering layer (SCT2) so that the second sub-pixel (SPX2) and the third sub-pixel (SPX3) can have relatively corresponding light output efficiencies. According to an embodiment, the second scattering layer (SCT2) may be formed to have a smaller thickness than the first scattering layer (SCT1), and thus the second scattering layer (SCT2) may include a relatively larger amount of scatterers (SC) than the first scattering layer (SCT1). Accordingly, according to the structure of the bank (QBNK) according to some embodiments, the second sub-pixel (SPX2) and the third sub-pixel (SPX3) may be formed to have relatively corresponding light output efficiencies (e.g., substantially the same light output efficiencies).

[0273] Referring to FIGS. 20 and 21, the first sub-pixel area (SPXA1), the second sub-pixel area (SPXA2), and the third sub-pixel area (SPXA3) can be sequentially arranged along the first direction (DR1), and the bank (QBNK) can surround at least a portion of the sub-pixel areas (SPXA).

[0274] For example (see FIG. 20), the bank (QBNK) can form a closed-loop structure surrounding each of the first sub-pixel area (SPXA1), the second sub-pixel area (SPXA2), and the third sub-pixel area (SPXA3).

[0275] In another example (see FIG. 21), the bank (QBNK) may entirely surround the first sub-pixel area (SPXA1) and open at least a portion of each of the second and third sub-pixel areas (SPXA2, SPXA3). For example, the bank (QBNK) may not be positioned on at least one side of each of the second and third sub-pixel areas (SPXA2, SPXA3).

[0276] According to some embodiments, the bank (QBNK) may include an isolated bank portion (QBNK_I). The isolated bank portion (QBNK_I) may be a portion of the bank (QBNK) that is spaced apart from other banks (QBNK). The isolated bank portion (QBNK_I) may be positioned between the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3).

[0277] According to some embodiments, the isolated bank portion (QBNK_I) may extend in a direction different from the direction in which the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3) are spaced from each other (e.g., in the second direction (DR2)).

[0278] According to some embodiments, the first scatterer (SCT1) and the second scatterer (SCT2) may not be manufactured by an ink process, so that the bank (QBNK) may open one side of each of the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3).

[0279] According to some embodiments, the area where the bank (QBNK) is placed can be minimized, thereby reducing process costs. In addition, since the first scattering layer (SCT1) and the second scattering layer (SCT2) can be patterned based on a photolithography process rather than an inkjet process, the uniformity (e.g., thickness uniformity, etc.) of the first scattering layer (SCT1) and the second scattering layer (SCT2) can be improved.

[0280] According to some embodiments, an isolated bank portion (QBNK_I) that is part of a bank (QBNK) may be positioned (e.g., optionally positioned) between the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), so that the risk of color mixing between the second sub-pixel (SPX2) and the third sub-pixel (SPX3) may be reduced.

[0281] According to some embodiments, the isolated bank portion (QBNK_I), which is part of the bank (QBNK), may not be disposed between the first pixel (PXL1) and the second pixel (PXL2) that are spaced apart from each other by a relatively large distance (e.g., between the second and third sub-pixel areas (SPXA2, SPXA3) of the first pixel (PXL1) and the second and third sub-pixel areas (SPXA2, SPXA3) of the second pixel (PXL2). That is, the isolated bank portion (QBNK_I) may not be disposed in areas where the risk of color mixing is relatively low, and thus, the cost of process materials may be reduced.

[0282] FIGS. 22 to 26 are plan views illustrating the arrangement relationship between spacers and sub-pixel areas according to some embodiments of the present disclosure.

[0283] For convenience of explanation, FIGS. 22 to 26 illustrate some areas of the display area (DA), and illustrate sub-pixel areas (SPXA) and spacers (CS) arranged adjacent thereto.

[0284] FIGS. 22 to 24 illustrate a planar structure in which sub-pixel areas (SPXA) are sequentially arranged along a first direction (DR1). For convenience of explanation, FIGS. 22 to 24 illustrate a planar structure in which a first pixel (PXL1) and a second pixel (PXL2) are adjacent in the second direction (DR2). FIGS. 25 and 26 illustrate a planar structure in which a first sub-pixel area (SPXA1) and a third sub-pixel area (SPXA3) are adjacent in the first direction (DR1), and a second sub-pixel area (SPXA2) is spaced apart from the first sub-pixel area (SPXA1) and the third sub-pixel area (SPXA3) in the second direction (DR2). For convenience of explanation, FIGS. 25 and 26 illustrate a planar structure in which a first pixel (PXL1) and a second pixel (PXL2) are adjacent in the first direction (DR1) according to some embodiments of the present disclosure.

[0285] Referring to FIGS. 22 to 24, spacers (CS) may be placed in an area where sub-pixel areas (SPXA) are not formed (e.g., non-sub-pixel areas (NSPXA)). Spacers (CS) may be placed adjacent to each other between sub-pixel areas (SPXA).

[0286] According to some embodiments (see FIG. 22), spacers (CS) may be arranged between sub-pixel areas (SPXA) with respect to the first direction (DR1). For example, the spacer (CS) may be arranged between the first sub-pixel area (SPXA1) and the second sub-pixel area (SPXA2). The spacer (CS) may be arranged between the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3). The spacer (CS) may be arranged between the first sub-pixel area (SPXA1) and the third sub-pixel area (SPXA3). Accordingly, the spacers (CS) may be arranged sequentially in the first direction (DR1) and may be arranged sequentially along the second direction (DR2).

[0287] According to some embodiments (see FIG. 23), spacers (CS) may be disposed between sub-pixel areas (SPXA) with respect to the second direction (DR2). The spacers (CS) may be disposed between different pixels (PXL) that are adjacent in the second direction (DR2). For example, the spacer (CS) may be disposed between the first sub-pixel area (SPXA1) of the first pixel (PXL1) and the first sub-pixel area (SPXA1) of the second pixel (PXL2). The spacer (CS) may be disposed between the second sub-pixel area (SPXA2) of the first pixel (PXL1) and the second sub-pixel area (SPXA2) of the second pixel (PXL2). The spacer (CS) may be disposed between the third sub-pixel area (SPXA3) of the first pixel (PXL1) and the third sub-pixel area (SPXA3) of the second pixel (PXL2).

[0288] According to some embodiments (see FIG. 24), the spacers (CS) may not overlap the sub-pixel areas (SPXA) along the first direction (DR1) or the second direction (DR2). For example, the spacer (CS) may be positioned between the first pixel (PXL1) and the second pixel (PXL2) along the first direction (DR1), and may be positioned so as not to overlap the sub-pixel areas (SPXA) along the second direction (DR2).

[0289] Referring to FIGS. 25 and 26, the spacer (CS) may be placed within a relatively wide area among areas where the sub-pixel areas (SPXA) are not placed. According to some embodiments, the spacer (CS) may be placed within a relatively wide area where the sub-pixel areas (SPXA) are not formed, as part of an area where the pixel (PXL) is formed, and thus the display area (DA) may be utilized more efficiently.

[0290] According to some embodiments (see FIG. 25), a spacer (CS) may be disposed between different pixels (PXL). For example, the spacer (CS) may be disposed between a second sub-pixel area (SPXA2) of a first pixel (PXL1) and a second sub-pixel area (SPXA2) of a second pixel (PXL2) along a first direction (DR1). The spacer (CS) may not overlap the sub-pixel areas (SPXA) in a direction different from the direction in which the first pixel (PXL1) and the second pixel (PXL2) are spaced from each other (e.g., in the second direction (DR2)).

[0291] According to some embodiments, the sub-pixel areas (SPXA) may be spaced apart from each other by a predetermined distance. In this case, a spacer (CS) may be disposed between the sub-pixel areas (SPXAs) spaced apart by a relatively large distance. For example, in one pixel (PXL), a first sub-pixel area (SPXA1) and a second sub-pixel area (SPXA2) may be spaced apart from each other by a first separation distance (PL1). A second sub-pixel area (SPXA2) of the first pixel (PXL1) and a second sub-pixel area (SPXA2) of the second pixel (PXL2) may be spaced apart from each other by a second separation distance (PL2) greater than the first separation distance (PL1). According to some embodiments, the second separation distance (PL2) may be the largest separation distance among the separation distances between the sub-pixel areas (SPXAs) defined within the display area (DA). According to some embodiments, the spacer (CS) may be positioned within an area where a second spacing distance (PL2) is defined.

[0292] According to some embodiments (see FIG. 26), a spacer (CS) may be disposed between second sub-pixel areas (SPXA2) of different pixels (PXL) along the first direction (DR1). For example, the spacer (CS) may overlap the second sub-pixel area (SPXA2) of the first pixel (PXL1) and the second sub-pixel area (SPXA2) of the second pixel (PXL2) along the first direction (DR1). For example, the spacers (CS) and the second sub-pixel areas (SPXA2) may be arranged alternately along the first direction (DR1).

[0293] According to some embodiments, the spacer (CS) may overlap the third sub-pixel area (SPXA3) along the second direction (DR2). Accordingly, the spacer (CS) may not overlap the first sub-pixel area (SPXA1) along each of the first direction (DR1) and the second direction (DR2).

[0294] According to some embodiments (see FIGS. 27 and 28), the color conversion layer (CCL) and the first scattering layer (SCT1) may be manufactured by an inkjet process, while the second scattering layer (SCT2) may be manufactured by a photolithography process using a mask.

[0295] Fig. 27 is a schematic plan view showing a display area of ​​a display device according to some embodiments. Fig. 28 is a schematic cross-sectional view taken along lines A to A' of Fig. 27, which is a schematic cross-sectional view showing a second panel. According to some embodiments of the present disclosure, for convenience of explanation, Fig. 28 shows an embodiment in which a light control layer (LCL) is included in the second panel (PNL2), and shows a structure in which a color filter layer (CFL) and a light control layer (LCL) are arranged on an upper substrate (USUB).

[0296] Referring to FIGS. 27 and 28, the bank (QBNK) can form a closed-loop structure surrounding each of the first sub-pixel area (SPXA1) and the second sub-pixel area (SPXA2). Accordingly, the color conversion layer (CCL) and the first scattering layer (SCT1) can be manufactured by an inkjet process.

[0297] According to some embodiments, after the color conversion layer (CCL) and the first scattering layer (SCT1) are manufactured by an inkjet process, a first capping layer (QCP1) can be manufactured, and after the first capping layer (QCP1) is disposed, a second scattering layer (SCT2) can be patterned. Accordingly, the first capping layer (QCP1) can passivate the color conversion layer (CCL) and the first scattering layer (SCT1), and the second scattering layer (SCT2) can be disposed on the first capping layer (QCP1).

[0298] According to some embodiments, similarly to the above, the bank (QBNK) may open at least a portion of the side edges of the third sub-pixel area (SPXA3) when viewed in a plan view, so that the second scattering layer (SCT2) patterned in the third sub-pixel area (SPXA3) or the like may extend (e.g., spread) beyond the area in which the third sub-pixel area (SPXA3) is defined, and thus the second scattering layer (SCT2) may be provided to have a relatively thin thickness compared to the first scattering layer (SCT1).

[0299] Next, a display device (DD) according to some embodiments will be described with reference to FIGS. 29 to 31 . Any content that may overlap with the above will be briefly described or not repeated. For example, the technical features described with reference to FIGS. 5 to 28 can be applied to the display device (DD) according to the embodiments described with reference to FIGS. 29 to 31 , as long as they do not contradict the features discussed in the embodiments described below.

[0300] The display device (DD) according to the embodiments illustrated in FIGS. 29 to 31 differs from the display device (DD) according to the previously described embodiment in that the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) are manufactured by a photolithography process.

[0301] FIGS. 29 to 31 are schematic cross-sectional views illustrating display devices according to some embodiments of the present disclosure. According to some embodiments, FIG. 29 may illustrate a planar structure of a display device (DD) similar to FIG. 5 described above. FIG. 30 may illustrate a planar structure of a display device (DD) similar to FIG. 6 described above. FIG. 31 may illustrate a planar structure of a display device (DD) similar to FIG. 7 described above.

[0302] According to some embodiments, the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) can be manufactured without performing an inkjet process. Accordingly, after the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) are manufactured, the first capping layer (QCP1) can be disposed, and the first capping layer (QCP1) can passivate each of the bank (QBNK), the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2).

[0303] According to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be patterned after the color conversion layer (CCL) is patterned, and according to some embodiments, the color conversion layer (CCL) may be patterned after the first scattering layer (SCT1) and the second scattering layer (SCT2) are patterned. According to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may have similar (e.g., substantially the same) thicknesses.

[0304] According to some embodiments (see FIG. 29), a light control layer (LCL) may be arranged to be included in the second panel (PNL2). For example, the light control layer (LCL) may be arranged on a color filter layer (CFL) arranged on the upper substrate (USUB).

[0305] According to some embodiments (see FIG. 30), a light control layer (LCL) may be arranged to be included in the first panel (PNL1). For example, the light control layer (LCL) may be arranged on a display layer (DL) arranged on a lower substrate (BSUB).

[0306] According to some embodiments (FIGS. 29 and 30), the spacer (CS) may be patterned in the same process as the first scattering layer (SCT1) and the second scattering layer (SCT2) and may include the same material. According to an embodiment, the spacer (CS) may be passivated by the first capping layer (QCP1).

[0307] According to some embodiments (see FIG. 31), the second panel (PNL2) may not be manufactured separately, but a display layer (DL), a light control layer (LCL), an optical layer (LR), a color filter layer (CFL), a planarization layer (PLA), and an upper layer (UPL) may be sequentially disposed on a lower substrate (BSUB) to manufacture the first panel (PNL), and the display device (DD) may be manufactured without performing a separate bonding process between the panels. In this case, when patterning the first scattering layer (SCT1) and the second scattering layer (SCT2), the spacer (CS) may not be formed.

[0308] Next, a display device (DD) according to some embodiments of the present disclosure will be described with reference to FIGS. 32 to 35 . Any content that may overlap with the above will be briefly described or not repeated. For example, the technical features described with reference to FIGS. 5 to 31 can be applied to the display device (DD) according to the embodiments described with reference to FIGS. 32 to 35 , as long as they do not contradict the features discussed in the embodiments described below.

[0309] The display device (DD) according to the embodiments illustrated in FIGS. 32 to 35 differs from the display device (DD) according to the previously described embodiment in that the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) are manufactured by an inkjet process.

[0310] FIGS. 32 to 34 are schematic cross-sectional views illustrating display devices according to some embodiments of the present disclosure. FIG. 35 is a schematic cross-sectional view for explaining a relationship between a first scattering layer and a second scattering layer according to some embodiments of the present disclosure. According to some embodiments, FIG. 32 may illustrate a planar structure of a display device (DD) similar to FIG. 5 described above. FIG. 33 may illustrate a planar structure of a display device (DD) similar to FIG. 8 described above. FIG. 34 may illustrate a planar structure of a display device (DD) similar to FIG. 7 described above. FIG. 35 illustrates a second sub-pixel area (SPXA2), a third sub-pixel area (SPXA3), and banks (QBNK) adjacent thereto.

[0311] According to some embodiments, the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) can be manufactured without performing a photolithography process. Accordingly, each of the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) can be manufactured by an inkjet process. According to some embodiments, the inkjet process for manufacturing each of the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) is performed within an area surrounded by a bank (QBNK), and then a first capping layer (QCP1) can passivate the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2).

[0312] According to some embodiments, the inkjet process for the first scattering layer (SCT1) and the second scattering layer (SCT2) may be performed after the inkjet process for manufacturing the color conversion layer (CCL) is performed, and according to some embodiments, the inkjet process for the color conversion layer (CCL) may be performed after the inkjet process for manufacturing the first scattering layer (SCT1) and the second scattering layer (SCT2) is performed.

[0313] According to some embodiments (see FIG. 32), a light control layer (LCL) may be arranged to be included in the second panel (PNL2). For example, the light control layer (LCL) may be arranged on a color filter layer (CFL) arranged on the upper substrate (USUB).

[0314] According to some embodiments (see FIG. 33), a light control layer (LCL) may be arranged to be included in the first panel (PNL1). For example, the light control layer (LCL) may be arranged on a display layer (DL) arranged on a lower substrate (BSUB).

[0315] According to some embodiments (FIGS. 32 and 33), the spacer (CS) can be patterned (e.g., by a photolithography process) within the non-sub-pixel area (NSPXA) after the color conversion layer (CCL), the first scattering layer (SCT1) and the second scattering layer (SCT2) are fabricated (e.g., after the first capping layer (QCP1) is fabricated).

[0316] According to some embodiments (see FIG. 34), the second panel (PNL2) may not be manufactured separately, but a display layer (DL), a light control layer (LCL), an optical layer (LR), a color filter layer (CFL), a planarization layer (PLA), and an upper layer (UPL) may be sequentially disposed on a lower substrate (BSUB) to manufacture the first panel (PNL), and the display device (DD) may be manufactured without performing a separate bonding process between the panels. In this case, after performing an inkjet process for the first scattering layer (SCT1) and the second scattering layer (SCT2), a process for forming a spacer (CS) may not be performed.

[0317] According to some embodiments (see FIG. 35), a first distance L1, which is a spacing between banks QBNK1 (e.g., first bank portions) that can define a second sub-pixel area SPXA2, may be smaller than a second distance L2, which is a spacing between banks QBNK1 (e.g., second bank portions) that can define a third sub-pixel area SPXA3. For example, the first distance L1 may correspond to a distance between the first bank portion and the second bank portion, and the second distance L2 may correspond to a distance between the third bank portion and the second bank portion.

[0318] For example, the first distance (L1) may be the shortest distance between the banks (QBNK) adjacent (e.g., directly adjacent) to the second sub-pixel area (SPXA2) (or the first scattering layer (SCT1)). The second distance (L2) may be the shortest distance between the banks (QBNK) adjacent (e.g., directly adjacent) to the third sub-pixel area (SPXA3) (or the second scattering layer (SCT2)).

[0319] According to some embodiments, the first scattering layer (SCT1) and the second scattering layer (SCT2) may be formed within the same inkjet process and may include materials having the same composition. In addition, the bank (QBNK) may be patterned such that the first distance (L1) is smaller than the second distance (L2), so that the first scattering layer (SCT1) may be manufactured to have a thickness greater than that of the second scattering layer (SCT2).

[0320] Experimentally, the scattering efficiency in each of the first scattering layer (SCT1) and the second scattering layer (SCT2) can generally increase as the thickness of each of the first scattering layer (SCT1) and the second scattering layer (SCT2) increases.

[0321] As described above, it may be desirable for the second sub-pixel (SPX2) and the third sub-pixel (SPX3) to have light emission efficiencies that correspond to each other. Accordingly, the first scattering layer (SCT1) may be manufactured to have a relatively thicker thickness than the second scattering layer (SCT2). In this case, since the first scattering layer (SCT1) is manufactured to be relatively thick, even when the light efficiency for the second color is relatively low, the difference in light emission efficiency between the second sub-pixel (SPX2) and the third sub-pixel (SPX3) is compensated, so that the second sub-pixel (SPX2) and the third sub-pixel (SPX3) can have light emission efficiencies that are relatively similar to each other.

[0322] According to some embodiments, the processes for manufacturing the first scattering layer (SCT1) and the second scattering layer (SCT2) may not be performed separately, and the first scattering layer (SCT1) and the second scattering layer (SCT2) may be manufactured by the same inkjet process. According to some embodiments, since the first distance (L1) is smaller than the second distance (L2), the space in which the first scattering layer (SCT1) defined by surrounding the bank (QBNK) is disposed may be smaller than the space in which the second scattering layer (SCT2) defined by surrounding the bank (QBNK) is disposed. In this case, when performing the inkjet process, even when the volume of the ink drop including the scatterer (SC) provided to each area is not further separately controlled, the thickness of the ink supplied within the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3) may be defined differently.

[0323] Finally, according to some embodiments, the display device (DD) can be manufactured so that the difference in light emission efficiency between the sub-pixels (SPX) is compensated for while improving process convenience, so that the sub-pixels (SPX) have uniform light emission efficiency.

[0324] Referring to FIGS. 36 to 49, a method for manufacturing a display device (DD) according to some embodiments will be described below. Content that may overlap with the above will be briefly described or not repeated.

[0325] FIGS. 36 to 43 may illustrate operations of a method for manufacturing a display device (DD), in which a first panel (PNL1) and a second panel (PNL2) are separately provided and the first panel (PNL1) and the second panel (PNL2) are combined with each other to manufacture the display device (DD). According to some embodiments of the present disclosure, a light control layer (LCL) may be manufactured by being included in the second panel (PNL2).

[0326] FIG. 36 is a flowchart illustrating a method for manufacturing a display device according to some embodiments of the present disclosure. FIG. 37 is a flowchart illustrating detailed operations of an operation for manufacturing a second panel according to some embodiments of the present disclosure. FIGS. 38 to 43 are schematic cross-sectional views illustrating process operations of a method for manufacturing a display device according to some embodiments of the present disclosure.

[0327] A method of manufacturing a display device (DD) according to some embodiments may include an operation (S100) of manufacturing a first panel, an operation (S200) of manufacturing a second panel, and an operation (S300) of combining the first panel and the second panel.

[0328] According to some embodiments, an operation (S200) for manufacturing a second panel may be performed after an operation (S100) for manufacturing a first panel is performed. Alternatively, an operation (S100) for manufacturing a second panel may be performed after an operation (S200) for manufacturing a first panel is performed. In some examples, an operation (S100) for manufacturing a first panel and an operation (S200) for manufacturing a second panel may be performed within substantially the same time section. For convenience of explanation, a method for manufacturing a display device (DD) will be described based on an embodiment in which an operation (S200) for manufacturing a second panel is performed after an operation (S100) for manufacturing a first panel is performed.

[0329] Referring to FIG. 36 and FIG. 38, in the operation (S100) of manufacturing the first panel, a first panel (PNL1) including a display layer (DL) can be provided.

[0330] In this operation (S100), layers forming a display layer (DL) can be placed on a lower substrate (BSUB) forming a base layer (BSL).

[0331] According to some embodiments, the conductive layer or insulating layer on the lower substrate (BSUB) or the upper substrate (USUB) may be formed based on a process for manufacturing a semiconductor device. For example, the conductive layer or insulating layer on the base layer (BSL) may be formed by a photolithography process, etched by various methods (e.g., wet etching, dry etching), or deposited by various methods (e.g., sputtering, chemical vapor deposition). The present disclosure is not necessarily limited to specific examples.

[0332] In this operation (S100), a pixel circuit (PXC) may be patterned on a lower substrate (BSUB) to form a pixel circuit layer (PCL), and light-emitting elements (LD) may be arranged on the pixel circuit layer (PCL). According to some embodiments, in this operation (S100), the light-emitting elements (LD) may be arranged on the lower substrate (BSUB) (e.g., the pixel circuit layer (PCL)) by various methods.

[0333] For example, referring to FIG. 3, the light-emitting element (LD) may include an organic light-emitting diode, and the light-emitting element (LD) may be manufactured by a deposition process on the lower substrate (BSUB).

[0334] According to some embodiments, the light emitting element (LD) may include an inorganic light emitting diode, and a device ink including the light emitting element (LD) may be supplied on the lower substrate (BSUB), and an alignment signal may be supplied to each of the first alignment electrode and the second alignment electrode, and the light emitting element (LD) may be aligned between the first alignment electrode and the second alignment electrode based on an electric field formed thereby.

[0335] According to some embodiments, the light emitting element (LD) may include an inorganic light emitting diode, and the light emitting element (LD) may be transferred onto the pixel circuit layer (PCL) by various methods.

[0336] Referring to FIG. 36, an operation (S200) for manufacturing a second panel may be performed. According to some embodiments, and in conjunction with FIG. 37, the operation (S200) for manufacturing a second panel may include an operation (S220) for placing a color filter layer on an upper substrate and an operation (S240) for placing a light control layer on the color filter layer.

[0337] Referring to FIGS. 36, 37, and 39, in the operation (S220) of placing a color filter layer on the upper substrate, color filters (CF) may be patterned (e.g., sequentially patterned) on the upper substrate (USUB), and an optical layer (LR) and an optical capping layer (LCP) may be placed on the color filters (CF).

[0338] In this operation (S220), a third color filter (CF3), a second color filter (CF2), and a first color filter (CF1) may be arranged on the upper substrate (USUB). The color filters (CF) may be formed by various processes, such as a photolithography process. According to some embodiments, the formation order of the color filters (CF) is not particularly limited.

[0339] In this operation (S220), an optical layer (LR) may be formed (e.g., deposited) to cover the color filters (CF). According to some embodiments, as described above, the optical layer (LR) may be optionally disposed within the first sub-pixel area (SPXA1).

[0340] In this operation (S220), the optical capping layer (LCP) can cover the optical layer (LR) to passivate the optical layer (LR).

[0341] Referring to FIGS. 36, 37, and 39 to 42, in the operation (S240) of placing a light control layer on a color filter layer, configurations for forming a light control layer (LCL) on a color filter layer (CFL) can be placed.

[0342] Referring to FIG. 39, in the present operation (S240), a bank (QBNK) may be patterned on the color filter layer (CFL). The bank (QBNK) may be arranged to surround at least a portion of each of the regions.

[0343] In this operation (S240), after the bank (QBNK) is patterned, a color conversion layer (CCL) including quantum dots (QDs) may be disposed on the color filter layer (CFL) by an inkjet process. Accordingly, the color conversion layer (CCL) in the first sub-pixel area (SPXA1) may be patterned. For example, ink including materials for forming the color conversion layer (CCL) may be supplied within an area surrounded by the bank (QBNK). However, the present disclosure is not limited thereto, and according to some embodiments, the color conversion layer (CCL) may be patterned based on a photolithography process. Thereafter, a first capping layer (QCP1) for passivating (e.g., capping) the color conversion layer (CCL) may be formed (e.g., deposited) over the entire upper substrate (USUB).

[0344] Referring to FIGS. 40 to 42, in the present operation (S240), a process of forming a first scattering layer (SCT1) and a second scattering layer (SCT2) can be performed.

[0345] For example, referring to FIG. 40, a first scattering layer (SCT1) and a second scattering layer (SCT2) can be patterned in each of the second sub-pixel area (SPXA2) and the third sub-pixel area (SPXA3), and a spacer (CS) can be formed (e.g., formed simultaneously) in the non-sub-pixel area (NSPXA).

[0346] According to some embodiments, the first scattering layer (SCT1), the second scattering layer (SCT2), and the spacer (CS) may be patterned based on a photolithography process. Subsequently, although not shown in FIG. 40, a second capping layer (QCP2) that passivates the first scattering layer (SCT1), the second scattering layer (SCT2), and the spacer (CS) may be formed (e.g., deposited).

[0347] According to some embodiments, the spacer (CS) may be suitably spaced apart from the upper substrate (USUB) compared to the configurations of other light control layers (LCL), such as the first scattering layer (SCT1) and the second scattering layer (SCT2). Accordingly, the spacer (CS) may be disposed on the bank (QBNK) forming a relatively high base, thereby forming a protruding structure. According to some embodiments, if the height of the spacer (CS) is excessive, an excessive cell gap may be formed between the first panel (PNL1) and the second panel (PNL2) in a subsequent process, and therefore, according to some embodiments, a process of removing at least a portion of the spacer (CS) may be further performed.

[0348] In another example, referring to FIG. 41, after the color conversion layer (CCL) is manufactured based on a photolithography process, the first scattering layer (SCT1) and the second scattering layer (SCT2) can be patterned before the first capping layer (QCP1) is formed. For example, the first scattering layer (SCT1) and the second scattering layer (SCT2) can be manufactured based on a photolithography process, and the spacer (CS) can be patterned within the same process as the first scattering layer (SCT1) and the second scattering layer (SCT2). Then, after the first scattering layer (SCT1) and the second scattering layer (SCT2) are formed, the first capping layer (QCP1) can be manufactured.

[0349] In another example, referring to FIG. 42, before the first capping layer (QCP1) is formed, the first scattering layer (SCT1) and the second scattering layer (SCT2) can be manufactured by an inkjet process. Thereafter, the first capping layer (QCP1) covering the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) can be formed. Then, the spacer (CS) can be patterned in a separate photolithography process. Thereafter, although not shown in FIG. 42, the second capping layer (QCP2) passivating the first scattering layer (SCT1), the second scattering layer (SCT2), and the spacer (CS) can be formed (e.g., deposited).

[0350] Referring to FIG. 36 and FIG. 43, in the operation (S300) of combining the first panel and the second panel, a filling layer (FIL) may be interposed between the first panel (PNL1) and the second panel (PNL2), and the first panel (PNL1) and the second panel (PNL2) may be adjacent to each other.

[0351] In the present operation (S300), a first panel (PNL1) including a display layer (DL) may be combined with a second panel (PNL2) including an upper layer (UPL), a color filter layer (CFL), and a light control layer (LCL). According to some embodiments, a spacer (CS) may be formed so that the first panel (PNL1) and the second panel (PNL2) can be suitably combined with each other.

[0352] FIG. 36, FIG. 44 to FIG. 48 illustrate a method for manufacturing a display device (DD) in which a first panel (PNL1) and a second panel (PNL2) are separately provided and the first panel (PNL1) and the second panel (PNL2) are combined with each other to manufacture the display device (DD), and illustrate an embodiment in which a light control layer (LCL) is manufactured by being included in the first panel (PNL1).

[0353] FIG. 44 is a flowchart illustrating detailed operations of an operation for manufacturing a first panel according to some embodiments. FIGS. 45 to 48 are schematic cross-sectional views illustrating process operations for a method for manufacturing a display device according to some embodiments.

[0354] Referring to FIGS. 36 to 43, a method of manufacturing a display device (DD) according to some embodiments will be described, focusing on differences compared to the previously described manufacturing method.

[0355] According to some embodiments, a method of manufacturing a display device (DD) may include an operation (S100) of manufacturing a first panel, an operation (S200) of manufacturing a second panel, and an operation (S300) of combining the first panel and the second panel. Referring to FIG. 44, the operation (S100) of manufacturing the first panel may include an operation (S120) of arranging a pixel circuit layer and a light emitting element layer on a lower substrate, and an operation (S140) of arranging a light control layer on the light emitting element layer.

[0356] According to some embodiments, after the operation (S120) of placing a pixel circuit layer and a light emitting element layer on a lower substrate is performed, layers forming a light control layer (LCL) may be placed on the manufactured display layer (DL) (e.g., light emitting element layer (LEL)).

[0357] For example, referring to FIGS. 45 to 46, in the present operation (S140), a color conversion layer (CCL), a first scattering layer (SCT1), and a second scattering layer (SCT2) may be respectively disposed on the display layer (DL) so that a first panel (PNL1) is manufactured.

[0358] According to some embodiments (see FIG. 45), in the operation (S140), a color conversion layer (CCL) may be manufactured on the display layer (DL) by an inkjet process, and after a first capping layer (QCP1) passivating the color conversion layer (CCL) is formed, a first scattering layer (SCT1), a second scattering layer (SCT2), and a spacer (CS) may be manufactured by a photolithography process.

[0359] According to some embodiments (see FIG. 46), in the operation (S140), the color conversion layer (CCL) may be manufactured by an inkjet process, the first scattering layer (SCT1), the second scattering layer (SCT2), and the spacer (CS) may be manufactured by a photolithography process, and then the first capping layer (QCP1) may be formed.

[0360] According to some embodiments (see FIG. 47), in the operation (S140), the color conversion layer (CCL), the first scattering layer (SCT1), and the second scattering layer (SCT2) may be manufactured by an inkjet process, and after the first capping layer (QCP1) is formed, the spacer (CS) may be manufactured by a photolithography process.

[0361] According to some embodiments, an operation (S200) for manufacturing a second panel may be performed to provide a second panel (PNL2) having a color filter layer (CFL) disposed on an upper substrate (USUB).

[0362] Referring to FIG. 36 and FIG. 48, in the operation (S300) of combining the first panel and the second panel, a filling layer (FIL) may be interposed between the first panel (PNL1) and the second panel (PNL2), and the first panel (PNL1) and the second panel (PNL2) may be adjacent to each other.

[0363] In this operation (S300), a first panel (PNL1) including a display layer (DL) and a light control layer (LCL) can be combined with a second panel (PNL2) including an upper layer (UPL) and a color filter layer (CFL).

[0364] Figure 49 shows a method for manufacturing a display device (DD) in which layers of the display device (DD) are sequentially arranged on a lower substrate (BSUB) without manufacturing a second panel (PNL2).

[0365] Figure 49 is a flowchart illustrating a method of manufacturing a display device according to some embodiments.

[0366] Referring to FIGS. 36 to 48, a method of manufacturing a display device (DD) according to some embodiments will be described, focusing on differences compared to the previously described manufacturing method.

[0367] According to some embodiments, a method of manufacturing a display device (DD) may include an operation (S1000) of placing a pixel circuit layer on a lower substrate, an operation (S2000) of placing a light-emitting element layer on the pixel circuit layer, an operation (S3000) of placing a light-emitting element layer on the light-emitting element layer, an operation (S4000) of placing a color filter layer on the light-control layer, and an operation (S5000) of placing an upper film on the color filter layer.

[0368] That is, according to some embodiments, a display layer (DL), a light control layer (LCL), a color filter layer (CFL), and an upper layer (UPL) may be sequentially formed on the lower substrate (BSUB) without providing an upper substrate (USUB). According to some embodiments, a process for manufacturing each layer may be specified with reference to the above. For example, various processes such as an inkjet process and / or a photolithography process may be utilized (e.g., used) to form the light control layer (LCL).

[0369] While various embodiments have been described above, those skilled in the art will recognize that various modifications, additions, and substitutions are possible without departing from the scope and spirit of the present disclosure.

[0370] Accordingly, the embodiments disclosed herein are intended to be illustrative only, rather than limiting, the technical scope of the present disclosure. The scope of the present disclosure should be defined by the appended claims.

Claims

1. Sub-pixels including a first sub-pixel formed on a base layer and configured to provide light of a first color, a second sub-pixel formed a second sub-pixel formed a second sub-pixel formed a third sub-pixel formed a third sub-pixel formed a third sub-pixel formed a third color; The above sub-pixels are, A display layer including a light-emitting element on the base layer; A light control layer on the display layer, wherein the light control layer comprises a color conversion layer disposed within the first sub-pixel area and including quantum dots, a first scattering layer disposed within the second sub-pixel area and including a first scatterer, and a second scattering layer disposed within the third sub-pixel area and including a second scatterer; and A color filter layer disposed on the light control layer, comprising a first color filter disposed within a first sub-pixel area, a second color filter disposed within a second sub-pixel area, and a third color filter disposed within a third sub-pixel area; The light emitted by the light emitting element includes light of the second color and light of the third color, and at least a portion of the emitted light passes through the light control layer and the color filter layer and is emitted, The colors of the light transmitted through the first scattering layer and the second scattering layer are not changed by the first scattering layer and the second scattering layer. Display device.

2. In paragraph 1, further comprising a capping layer, at least a portion of which passivates the color conversion layer; The first part of the capping layer is disposed on the color conversion layer within the first sub-pixel area, and the second part of the capping layer is disposed below the first scattering layer and the second scattering layer within each of the second sub-pixel area and the third sub-pixel area. Display device.

3. In paragraph 2, Further comprising an upper layer disposed on the color filter layer and including an upper substrate; The above color filter layer and the above light control layer are sequentially laminated on the lower side of the upper substrate, A filling layer is interposed between the display layer, the color conversion layer, the first scattering layer, and the second scattering layer. Display device.

4. In paragraph 2, Further comprising an upper layer disposed on the color filter layer and including an upper substrate; The above light control layer is disposed on the display layer, A filling layer is interposed between the color conversion layer, the first scattering layer, the second scattering layer and the color filter layer. Display device.

5. In paragraph 2, Further comprising an upper layer disposed on the color filter layer and including an upper film; The above light control layer and the color filter layer are sequentially laminated on the display layer. Display device.

6. In paragraph 1, The above color conversion layer has a first thickness, The above first scattering layer has a second thickness, The second scattering layer has a third thickness, The above first thickness is greater than the above second thickness and the above third thickness, The second thickness and the third thickness are substantially the same, Display device.

7. In paragraph 1, Each of the first scattering body and the second scattering body is included in a range of about 1.5 wt% to about 8.5 wt% with respect to the first scattering layer and the second scattering layer. Display device.

8. In paragraph 1, The size of the first scatterer is larger than the size of the second scatterer. Display device.

9. In paragraph 1, The first scattering body is included in the first scattering layer at a first weight ratio, The second scattering body is included in the second weight ratio with respect to the second scattering layer, The above first weight ratio is greater than the above second weight ratio, Display device.

10. In paragraph 1, The first scattering layer includes one or more scatterers having the same composition ratio and different sizes as the first scatterer, The second scattering layer comprises one or more scattering bodies having the same composition ratio as the second scattering bodies and different sizes. Display device.

11. In paragraph 1, The color filter layer further includes an optical layer having a refractive index smaller than that of the color conversion layer, and the optical layer is disposed between the light control layer and the first color filter, the second color filter, and the third color filter. The optical layer is disposed only in the first sub-pixel area among the first sub-pixel area, the second sub-pixel area, and the third sub-pixel area. Display device.

12. In paragraph 1, A filling scattering layer, which is arranged in the second sub-pixel area and the third sub-pixel area, overlaps the first scattering layer and the second scattering layer along the thickness direction, and further includes a filling material and a scattering substance; Display device.

13. In paragraph 1, further comprising a bank extending in the thickness direction, at least part of which surrounds the first sub-pixel area; Display device.

14. In paragraph 13, The above bank is not placed between the second sub-pixel area and the third sub-pixel area, The display device further includes a black matrix layer, at least a portion of which is disposed between the second sub-pixel area and the third sub-pixel area and penetrating between the first scattering layer and the second scattering layer; Display device.

15. In paragraph 13, The above bank is formed on the periphery of all sides of the first sub-pixel area when viewed on a plane, and is not formed on a part of the periphery of each of the second sub-pixel area and the third sub-pixel area. Display device.

16. In paragraph 15, At least one side of the second sub-pixel area includes an open edge portion where the bank is not arranged, The above open edge portion is formed to be oriented in a direction away from the third sub-pixel area. Display device.

17. In paragraph 13, The above bank is formed around the entire sides of the first sub-pixel area and the second sub-pixel area when viewed on a plane, and is not formed around at least a part of the third sub-pixel area. Display device.

18. In paragraph 17, further comprising a capping layer, at least a portion of which passivates the color conversion layer and the first scattering layer; At least a portion of the capping layer is disposed between the second scattering layer and the third color filter in the third sub-pixel area. Display device.

19. In paragraph 18, The thickness of the first scattering layer is greater than the thickness of the second scattering layer. Display device.

20. In paragraph 13, The above bank further includes an isolated bank portion; The above-mentioned isolated bank portion is positioned between the second sub-pixel area and the third sub-pixel area. Display device.

21. In paragraph 13, A spacer disposed on the bank and positioned above the color conversion layer, the first scattering layer, and the second scattering layer; further comprising: Display device.

22. In paragraph 21, The spacer is disposed between the first sub-pixel area and the second sub-pixel area, between the second sub-pixel area and the third sub-pixel area, and between the first sub-pixel area and the third sub-pixel area. Display device.

23. In paragraph 21, The first sub-pixel, the second sub-pixel, and the third sub-pixel are adjacent to each other in a first direction and form a first pixel, The first pixel is adjacent to the second pixel in a second direction different from the first direction, The spacer is arranged between the first sub-pixel area of ​​the first pixel and the first sub-pixel area of ​​the second pixel, between the second sub-pixel area of ​​the first pixel and the second sub-pixel area of ​​the second pixel, and between the third sub-pixel area of ​​the first pixel and the third sub-pixel area of ​​the second pixel. Display device.

24. In paragraph 21, The first sub-pixel area and the third sub-pixel area are adjacent in a first direction, and the second sub-pixel area is adjacent to the first sub-pixel area and the third sub-pixel area in a second direction different from the first direction. The above spacer overlaps the second sub-pixel area along the first direction, Display device.

25. In paragraph 21, At least a portion of the color conversion layer, the bank, the first scattering layer, the second scattering layer, and the capping layer further comprising a passivating layer; Display device.

26. In paragraph 21, Further comprising a capping layer, at least part of which passivates the color conversion layer, the bank, the first scattering layer, and the second scattering layer; The above spacer is disposed on the capping layer, Display device.

27. In paragraph 26, The above bank, a first bank portion spaced apart from a second bank portion by a first distance, wherein the second sub-pixel region is disposed between the first bank portion and the second bank portion; and a third bank portion spaced apart from the second bank portion by a second distance, wherein the third sub-pixel region is disposed between the third bank portion and the second bank portion; The thickness of the first scattering layer is greater than the thickness of the second scattering layer. Display device.

28. In paragraph 1, The light-emitting element comprises at least one of an organic light-emitting diode including an organic material or an inorganic light-emitting diode including an inorganic material. Display device.

29. Step of manufacturing the first panel; a step of manufacturing a second panel; and A step of combining the first panel and the second panel; comprising; The step of manufacturing the first panel includes the step of providing a light-emitting element on a lower substrate, The step of manufacturing the second panel includes the step of providing a color filter layer on an upper substrate and the step of providing a light control layer on the color filter layer. The step of providing the above optical control layer is: A step of patterning a bank on the above color filter layer; A step of arranging a color conversion layer including quantum dots within a first sub-pixel area; A step of arranging a first scattering layer including a first scatterer within a second sub-pixel area; and A step of arranging a second scattering layer including a second scatterer within a third sub-pixel area; comprising: The first scattering layer and the second scattering layer are configured to allow the applied light to transmit through the first scattering layer and the second scattering layer without changing the color of the applied light. A method for manufacturing a display device.

30. In paragraph 29, The step of providing the above light control layer further includes the step of forming a capping layer on the color conversion layer; wherein the capping layer passivates the color conversion layer; The step of providing the color conversion layer includes the step of patterning the color conversion layer using an inkjet process, The step of providing the first scattering layer and the step of providing the second scattering layer are performed after the step of forming the capping layer, and are performed based on a photolithography process. A method for manufacturing a display device.

31. In paragraph 29, The color conversion layer, the first scattering layer, and the second scattering layer are patterned based on a photolithography process, The step of providing the above light control layer further includes the step of forming a capping layer on the color conversion layer, wherein the capping layer passivates the color conversion layer; A method for manufacturing a display device.

32. In paragraph 29, The color conversion layer, the first scattering layer, and the second scattering layer are formed based on an inkjet process. A method for manufacturing a display device.

33. In paragraph 29, The step of combining further comprises the step of providing a filling layer between the first panel and the second panel; A method for manufacturing a display device.

34. Step of manufacturing the first panel; a step of manufacturing a second panel; and A step of combining the first panel and the second panel; comprising; The step of manufacturing the first panel includes the step of providing a display layer including a light-emitting element on a lower substrate and the step of providing a light control layer on the display layer. The step of manufacturing the second panel comprises the step of providing a color filter layer on the upper substrate, The step of providing the above optical control layer is: A step of patterning a bank on the above display layer; A step of providing a color conversion layer including quantum dots within a first sub-pixel area; providing a first scattering layer including a first scatterer within a second sub-pixel area; and A step of providing a second scattering layer including a second scatterer within a third sub-pixel area; comprising: The first scattering layer and the second scattering layer are configured to transmit the applied light through the first scattering layer and the second scattering layer without changing the color of the applied light. A method for manufacturing a display device.

35. In paragraph 34, The step of providing the above light control layer further includes the step of forming a capping layer on the color conversion layer, wherein the capping layer passivates the color conversion layer; The step of providing the color conversion layer includes the step of patterning the color conversion layer using an inkjet process, The step of providing the first scattering layer and the step of providing the second scattering layer are performed after the step of forming the capping layer, and are performed based on a photolithography process. A method for manufacturing a display device.

36. In paragraph 34, The color conversion layer, the first scattering layer, and the second scattering layer are patterned based on a photolithography process, The step of providing the above light control layer further includes the step of forming a capping layer on the color conversion layer, wherein the capping layer passivates the color conversion layer, the first scattering layer, and the second scattering layer; A method for manufacturing a display device.

37. In paragraph 34, The color conversion layer, the first scattering layer, and the second scattering layer are formed based on an inkjet process. A method for manufacturing a display device.

Images